CN104835760A - Heat treatment apparatus - Google Patents
Heat treatment apparatus Download PDFInfo
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- CN104835760A CN104835760A CN201510066505.2A CN201510066505A CN104835760A CN 104835760 A CN104835760 A CN 104835760A CN 201510066505 A CN201510066505 A CN 201510066505A CN 104835760 A CN104835760 A CN 104835760A
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- Prior art keywords
- door
- opening
- actuating arm
- doorframe
- mode
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title abstract description 4
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 239000011810 insulating material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 39
- 238000000137 annealing Methods 0.000 claims description 20
- 230000009471 action Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 abstract description 47
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 47
- 239000003708 ampul Substances 0.000 description 26
- 238000009792 diffusion process Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 13
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001574 biopsy Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 238000010010 raising Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Special Wing (AREA)
Abstract
The invention provides a heat treatment apparatus. A gate can be disposed at a fire door of a quartz tube in an opening/closing mode through an opening/closing mechanism. The gate is provided with a quartz plate disposed at a side of the quartz tube, an insulating material maintained at an inner side of the gate, and a gate frame which maintains the quartz plate and the insulating material. The opening/closing mechanism is provided with a drive arm, wherein the front end of the drive arm supports the door frame and is driven in a direction close to or far from the quartz tube along with the gate. The opening/closing mechanism is provided with a driving device which is used for driving the drive arm. The fire door of the quartz tube is opened or closed through a force of the driving device in driving the gate. A door inclination adjustment member supports the front end of the driving arm in an inclined manner, and is disposed on the door frame, so as to support the gate in a mode of inclination adjustment.
Description
Technical field
The present invention relates to the annealing device for heat-treating workpiece such as silicon substrates.
Background technology
In the manufacturing process of solar battery cell etc., implement to make impurity to heat treatments such as the DIFFUSION TREATMENT of the diffusion into the surface of the silicon substrate (semiconductor wafer) as workpiece.For carrying out described heat treated annealing device, possessing collecting workpiece and implementing heat treated processing process pipe (プ ロ セ ス チ ュ ー Block) and heater.
Processing process pipe is such as quartz ampoule, and inside contains card (ボ ー ト), this card maintains multiple semiconductor wafers in the gap being provided with regulation each other.Heater configures in the mode in the outside surrounding processing process pipe, the inside of processing process pipe is heated to the temperature of regulation.
According to structure disclosed in No. 2001-185501, Japanese Laid-Open Patent Publication, be formed with the opening that card is come in and gone out in one end of processing process pipe, and be provided with the door described opening being carried out to opening and closing.By using door termination opening, the inside of processing process pipe is sealed.
When the DIFFUSION TREATMENT of semiconductor wafer, in the processing process pipe of sealing, import such as phosphorus oxychloride (POCl
3), Boron tribromide (BBr
3) etc. gas.
The inner surface of door exposes in the processing process pipe of high temperature, and on the other hand, the outer surface of door exposes to the sun to being exposed on the external in air and is cooled.Therefore, if heat insulation abundant not between the inner surface of door and outer surface, then, in Technology for Heating Processing, be cooled by door near the opening of processing process pipe.
In addition, if the adhesion that the inner surface of door and processing process the end face of pipe is abundant not, then processes near the opening processing pipe and cooled by the extraneous air that the gap from both enters in processing process pipe.If in the DIFFUSION TREATMENT of semiconductor wafer processing process pipe opening near cooled, then can cause separating out near the opening that the inner surface of door and processing process pipe coming from POCl
3phosphorus pentoxide (P
2o
5).
In addition, there is following problems: the POCl processed in pipe with processing because of the water vapour entered contained by the extraneous air in processing process pipe
3and P
2o
5reaction and the phosphate aqueous solution that produces, make the metal framework of supporting door produce burn into and pollute workpiece in processing process pipe.
Summary of the invention
The object of this invention is to provide a kind of annealing device, by the spaced heat of the inner surface and outer surface that reliably make door and the inner surface improving door and processing process the sealing of the end face of pipe, the accessory substance of the burn into that can suppress framework and the pollution cause becoming workpiece.
Annealing device of the present invention comprises processing process pipe, door, switching mechanism and door tilt adjustment mechanism.
Processing process pipe is in tubular, and one end closes and the other end is formed with opening (fire door), is accommodated the workpiece be heat-treated by opening in inside.The opening of door to processing process pipe carries out opening and closing.
Door has inner surface component, heat-insulating material and doorframe.Inner surface component is configured in processing process pipe side.Heat-insulating material is configured in the outside of inner surface component.Doorframe is configured in the outside of heat-insulating material and keeps inner surface component and heat-insulating material.
Switching mechanism has actuating arm and drive unit.The front end supporting doorframe of actuating arm.Actuating arm together with door to processing process pipe a close direction and from processing process pipe away from another direction driven.Drive unit utilizes its drive force actuating arm, makes an action to open or to close the opening of processing process pipe.
Door tilt adjustment mechanism, can carry out the mode supporting door of tilt adjustments, is bearing in the front end of an actuating arm, and is arranged on doorframe in the mode that can tilt.
Accompanying drawing explanation
Fig. 1 is the vertical view of the major part of the annealing device representing embodiments of the present invention.
Fig. 2 is the biopsy cavity marker devices vertical view representing door and actuating arm.
Fig. 3 is arrow III-III line cutaway view that represent the structure of a tilt adjustment mechanism, Fig. 2.
Fig. 4 is the figure of the action that door tilt adjustment mechanism is described.
Fig. 5 be represent a structure of limit rotation component, the arrow V-V line cutaway view of Fig. 2.
Fig. 6 is the front view of the structure representing switching mechanism, door tilt adjustment mechanism and door limit rotation component.
Embodiment
The annealing device of embodiments of the present invention is described with reference to the accompanying drawings.
As an example, annealing device 1 is formed as horizontal type stove, using the long side direction horizontal arrangement of the quartz ampoule 2 as processing process pipe of the present invention, as shown in Figure 1, annealing device 1 has following basic structure: to use switching mechanism 20 mode of opening and closing door 10 can be arranged at opening (fire door) 2A of quartz ampoule 2, described quartz ampoule 2 forms the diffuser chamber 3 of collecting workpiece W.。Workpiece W is such as the silicon substrate of the rectangle of solar battery cell.Card 4 keeps multiple workpiece W with the state vertically arranged at equal intervals, utilizes road wheel to walk and workpiece W is transported diffuser chamber 3 by fire door 2A or transported from diffuser chamber 3 by workpiece W.
Use diffusion gas flow gatherer (not shown) containing diffuse source (such as POCl
3) diffusion import diffuser chamber 3 with gas, described diffusion gas flow gatherer arranges the end side closed of abridged quartz ampoule 2 in FIG.
Specifically, diffusion gas flow gatherer utilizes source gas (ソ ー ス ガ ス) make liquid diffusion source bubbling, make the source gas of the saturated steam comprising liquid diffusion source and carrier gas merge into diffusion gas flow, import described diffusion gas flow in mode as shown by arrow G from one end of quartz ampoule 2.
Blast pipe 5 is connected with the neighbouring side face of the fire door 2A of quartz ampoule 2.The diffusion gas being supplied to the process of workpiece W is vented to stove from blast pipe 5.In order to prevent from fire door 2A Release and dispersion gas, diffuser chamber 3 is negative pressure.
The periphery of quartz ampoule 2 is configured with heater.Heater such as adopts the formation possessing illustrated heater 7.Imported diffuse source from diffusion gas leading-in device to the action by heater by the diffuser chamber 3 heated, carry out the process that impurity (such as phosphorus) is spread to workpiece W thus.In addition, heater also can possess Thiele tube between quartz ampoule 2 and heater 7.
The door 10 that the fire door 2A of quartz ampoule 2 is opened and closed formula is closed.Door 10 utilizes switching mechanism 20 described later to rotate, and carries out opening and closing thus to fire door 2A.
As shown in Figure 2, door 10 possesses quartz plate 11, heat-insulating material 12 and doorframe 13.Quartz plate 11 is the disks made with quartz, is equivalent to inner surface component of the present invention.Doorframe 13 keeps quartz plate and heat-insulating material.Quartz plate 11 is present in the inner surface side of door 10, by being pressed on the fire door 2A of quartz ampoule 2 when door 10 is closed.
Doorframe 13 is by the component of the shape of round plate 131 and cylindrical part 132 integration.The material that doorframe 13 has rigidity by stainless steel etc. is formed.Round plate 131 is present in the outer surface side of door 10.Cylindrical part 132 forms the side surface part of door 10.
Heat-insulating material 12 is filled in the space surrounded by the cylindrical part 132 of doorframe 13.Heat-insulating material 12 is clamped by the round plate 131 of doorframe 13 and quartz plate 11, and is fixed by block 14, described block 14 be arranged on the outer peripheral face of the cylindrical part 132 of doorframe 13 and the periphery of quartz plate 11, multiple positions in circumference.So, quartz plate 11 and heat-insulating material 12 are arranged on doorframe 13.In door 10, that heat-insulating material 12 is configured in quartz plate 11, contrary with diffuser chamber 3 (with reference to Fig. 1) side.
The structure of switching mechanism 20 is then described.Switching mechanism 20 possesses actuating arm 21 and drive unit 23.Actuating arm 21 by drive unit 23, together with door 10 a direction (with reference to Fig. 1 arrow R1 direction) close to quartz ampoule 2 and from quartz ampoule 2 away from another direction (with reference to FIG. arrow R2 direction) driven.Like this, by driving actuating arm 21, driving gate 10 opens the fire door 2A of the quartz ampoule 2 or fire door 2A of closed quartz tube 2.
In the present embodiment, as drive unit 23, be made up of cylinder mechanism, described cylinder mechanism possesses the piston rod 232 of back and forth movement and the cylinder barrel 231 of storage piston rod 232, the fluid pressure provided by acceptance also makes piston rod 232 advance relative to cylinder barrel 231 or retreat, transmission of drive force thus.At this, use cylinder as cylinder mechanism.
Actuating arm 21 with close quartz ampoule 2 fire door A, mode that the face of door 10 is almost parallel is extended.
The cardinal extremity of actuating arm 21 is connected with the front end of second connecting rod 28 with piston rod 232 by first connecting rod 26.
On the side of the fire door 2A of quartz ampoule 2, fixed support (fixture) 27 is fixed relative to annealing device.The long side direction of fixed support 27 is defined as along the direction vertical with the axis of quartz ampoule 2.Fixed support 27 is arranged than the mode of the other end closer to quartz ampoule 2 with one end.One end of the long side direction of described fixed support 27 and the other end are respectively arranged with the first rotating shaft 24 and the second rotating shaft 25.
First rotating shaft 24 is made up of columned pillar 241 and columnar sleeve pipe 242, and described pillar 241 is fixed on fixed support 27, and described sleeve pipe 242 is arranged on pillar 241 around in a rotatable manner.By the first rotating shaft 24, the base end part of actuating arm 21 and an end of first connecting rod 26 are bearing on an end of fixed support 27 in the mode that can rotate, and actuating arm 21 is rotated together with first connecting rod 26.
The other end of first connecting rod 26 is connected with the leading section of the mode can rotated each other with piston rod 232.The other end of first connecting rod 26 and the leading section of piston rod 232, connected by the second connecting rod 28 that can rotate relative to first connecting rod 26.
Projecting pin on fixed support 27 can be passed through, and simple concavo-convex being fitted together to such as the hole that setting is chimeric with pin on cylinder barrel 231 realize the second rotating shaft 25.Cylinder barrel 231 is bearing in the other end of fixed support 27 in the mode that can rotate by the second rotating shaft 25.
Drive unit 23 is the rotation automation equipments making actuating arm 21.In addition, about drive unit 23, if piston rod 232 advances from cylinder barrel 231, then actuating arm 21 rotates in the mode that the fire door 2A to quartz ampoule 2 is close, and door 10 rotates in the mode of closing.Then, door 10, by being pressed on fire door 2A, is sealed in quartz ampoule 2.
On the other hand, if piston rod 232 retreats relative to cylinder barrel 231, then actuating arm 21 with from the fire door 2A of quartz ampoule 2 away from mode rotate, door 10 rotates in the mode opened.In addition, if by the controller accessory drive 23 be not particularly illustrated, then the driving of actuating arm 21 can automatically be controlled.
Doorframe 13 utilizes the door tilt adjustment mechanism 30 being arranged on the front end of actuating arm 21, and to tilt, (swing) mode is freely supported.
Specifically, as shown in Figure 3, door tilt adjustment mechanism 30 possesses rod end bearing 31 and swinging axle 32.Rod end bearing 31 is arranged on the front end of actuating arm 21.The mode that swinging axle 32 can tilt with axle center is supported by rod end bearing 31.Swinging axle 32 uses part 321 to be fixed on the center of doorframe 13.The swinging axle 32 on doorframe 13 is fixed on, the sphere inner ring 311 of the rod end bearing 31 on the face on the upside of the through front end being installed on actuating arm 21 by part 321.
Rod end bearing 31 can by known rod end bearing (No. 2003-247540, Japanese Laid-Open Patent Publication, No. 2-78808, Japanese Laid Open Patent Beneficial) form, sphere inner ring 311 is maintained in the installing hole of the dome shape of the inner side being formed in rod end bearing 31 can swing mode.Swinging axle 32 is kept in the mode that can tilt together with sphere inner ring 311.
Swinging axle 32, be arranged on the other end of the end opposite side on doorframe 13, be provided with angle adjusting head 33.Angle-regulating block 34 is arranged on the front end of actuating arm 21.Angle-regulating block 34 is formed by the through opening 34A of angle adjusting head 33.Opening 34A is sized to the size of the inclination allowing angle adjusting head 33.
As shown in Figure 4, according to the structure of above door tilt adjustment mechanism 30, door 10 is supported in the mode tilted freely relative to actuating arm 21.The maximum angle α at angle of inclination of door 10, is limited (adjustment) by the relativeness of the internal diameter of the external diameter of angle adjusting head 33 and the opening 34A of angle-regulating block.
In addition, doorframe 13 and actuating arm 21 are provided with a limit rotation component 40, the rotation around center of described door limit rotation component 40 limiting door 10.As shown in Figure 6, door limit rotation component 40 be arranged on from door 10, the position of the misalignment in the face of the fire door 2A of closed quartz tube 2, the rotation of limiting door 10.
In the present embodiment, as shown in Figure 5, door limit rotation component 40 possesses limit rotation 42 and limit rotation plate 41.Limit rotation 42 is fixed on actuating arm 21.Limit rotation plate 41 is fixed on doorframe 13.In addition, on the other hand, also can adopt that limit rotation 42 is fixed on doorframe 13, limit rotation plate 41 is fixed on structure on actuating arm 21.
Limit rotation plate 41 is such as be made by the metallic plate of band shape is implemented roughly Z-shaped bending machining at two positions of its long side direction.Limit rotation 42 is arranged on rest pad 43 in the mode that the direction to door 10 is outstanding, on that described rest pad 43 is vertically fixed on actuating arm 21, contrary with door 10 side.
Limit rotation plate 41 uses the dististyle 411 of the side in two dististyles 411,412 parallel to each other, to be screwed etc. to be fixed on the round plate 131 of doorframe 13.Limit rotation 42 is formed through the opening 41A on the dististyle 412 of the opposing party of limit rotation plate 41.Opening 41A is sized to can the size of the limit rotation of limit rotation 42 in certain limit.Specifically, to make limit rotation 42 in the mode of the mode pass through openings 41A making the angle of inclination of door 10 can change in the scope of described angle [alpha], adjustment limit rotation 42 and opening 41A.
Utilize the structure of above door limit rotation component 40, the rotation around swinging axle 32 of door 10 is restricted.Thereby, it is possible to keep the reproducibility of the sliding fit (folding り closes わ せ) of the fire door 2A of quartz ampoule 2 and the quartz plate 11 of door inner surface.
According to the present invention, because door 10 is built-in with heat-insulating material 12, even if so the inner and outer of door 10 exists temperature difference, the temperature of the quartz plate 11 of an inner surface also can be suppressed to reduce.Thereby, it is possible to prevent from separating out the accessory substance coming from diffusion gas near the fire door 2A of quartz ampoule 2.
Door 10 is the structures be clipped in by heat-insulating material between doorframe 13 and quartz plate 11.Therefore, although door 10 is the structures possessing heat-insulating material 12, also can pass through the doorframe 13 with actuating arm 21 supporting door outer surface and the switching mechanism 20 that doorframe 13 is rotated freely, opposite house 10 carries out opening and closing without barrier.
In addition, actuating arm 21 driven device 23 applies active force to the fire door 2A side of quartz ampoule 2, doorframe 13 is supported by the door tilt adjustment mechanism 30 of the front end being arranged on described actuating arm 21, thus can to make the quartz plate 11 of an inner surface along the sealing of both form raisings of the product having shape-following-up of the fire door 2A of quartz ampoule 2.Thereby, it is possible to prevent air from entering from the fire door 2A of quartz ampoule 2, the generation of the accessory substance produced with the reaction of air can be prevented, the pollution in the corrosion of door and stove can be prevented, the repair and maintenance cycle can be extended.
The explanation of above-mentioned execution mode is all example in all, and should not be considered to restrictive explanation.Scope of the present invention is not limited to above-mentioned execution mode, but by the Range Representation of claim.In addition, scope of the present invention also comprises the whole distortion in the content substantive identical with the scope of claim and scope.
Claims (7)
1. an annealing device, is characterized in that,
Described annealing device comprises: processing process pipe, and one end closes and the other end is formed with opening, accommodates by the opening of the described other end workpiece be heat-treated; Door, carries out opening and closing to the opening of described processing process pipe; And switching mechanism, make described door action, make to carry out opening and closing to described opening,
Described door comprises: inner surface component, is configured in described processing process pipe side; Heat-insulating material, is configured in the outside of described inner surface component; And doorframe, be configured in the outside of described heat-insulating material and keep described inner surface component and described heat-insulating material,
Described switching mechanism comprises: actuating arm, doorframe described in front end bearing, together with described door to described process process manage a close direction and from described process process pipe away from another direction driven; And drive unit, drive described actuating arm, the opening of described processing process pipe is opened or closed to described switching mechanism, by door described in the drive force that utilizes described drive unit,
Described annealing device also comprises a tilt adjustment mechanism, and described door tilt adjustment mechanism is bearing in the front end of described actuating arm in the mode that can tilt, and is arranged on described doorframe, supports described door in the mode carrying out tilt adjustments.
2. annealing device according to claim 1, is characterized in that, described door tilt adjustment mechanism comprises: rod end bearing, is arranged on the front end of described actuating arm; And swinging axle, supported by described rod end bearing in the mode that axle center can tilt, described swinging axle is arranged on described doorframe.
3. annealing device according to claim 2, is characterized in that,
Described swinging axle, be arranged on the other end of the end opposite side on doorframe, be provided with angle adjusting head,
The front end of described actuating arm is provided with angle-regulating block, and described angle-regulating block is formed with opening, described angle adjusting head this opening through, and the size of this opening can allow described angular adjustment head tilt.
4. annealing device according to claim 3, it is characterized in that, described doorframe and described actuating arm are provided with a limit rotation component, described door limit rotation component limits the rotation around center of described door, and is positioned at the position of the misalignment in the face of the opening from described door, closed described processing process pipe.
5. annealing device according to claim 4, is characterized in that, described door limit rotation component comprises: limit rotation head, is arranged in any one party of described doorframe or described actuating arm; And limit rotation plate, be arranged on the opposing party of described doorframe or described actuating arm, be formed with opening, described limit rotation this opening through, and the size of this opening can by the limit rotation of described limit rotation head in prescribed limit.
6., according to the annealing device in Claims 1 to 5 described in any one, it is characterized in that,
As described drive unit, be made up of cylinder mechanism, described cylinder mechanism possesses the piston rod of back and forth movement and receives the cylinder barrel of described piston rod, and the fluid pressure provided by acceptance also makes described piston rod advance relative to described cylinder barrel or retreat transmission of drive force
The cardinal extremity of described actuating arm is connected with described piston rod.
7. annealing device according to claim 6, is characterized in that,
Described actuating arm with close that described to process that process the opening of pipe, that the face of described door is almost parallel mode extended,
The base end part of described actuating arm and an end of first connecting rod are bearing in a support bracket fastened end in the mode that can rotate, and described actuating arm is rotated together with described first connecting rod, and described fixed support is fixed on described annealing device,
Described cylinder barrel is bearing in described support bracket fastened the other end in the mode that can rotate, and the other end of described first connecting rod is connected with the leading section of the mode can rotated each other with described piston rod, described fixed support is arranged than the mode of the other end closer to described processing process pipe with this support bracket fastened end.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014023743A JP6263407B2 (en) | 2014-02-10 | 2014-02-10 | Heat treatment equipment |
| JP2014-023743 | 2014-02-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104835760A true CN104835760A (en) | 2015-08-12 |
| CN104835760B CN104835760B (en) | 2018-11-23 |
Family
ID=53813552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510066505.2A Active CN104835760B (en) | 2014-02-10 | 2015-02-09 | Annealing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6263407B2 (en) |
| KR (2) | KR102272832B1 (en) |
| CN (1) | CN104835760B (en) |
| TW (1) | TWI633265B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN112747598A (en) * | 2019-10-31 | 2021-05-04 | 光洋热系统股份有限公司 | Heat treatment apparatus |
| CN114737171A (en) * | 2022-04-18 | 2022-07-12 | 北京北方华创微电子装备有限公司 | Adjusting device and semiconductor heat treatment equipment |
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| CN111480047A (en) * | 2017-09-28 | 2020-07-31 | 史杰克西股份有限公司 | Door system for opening and closing a container opening of a furnace |
| CN111480047B (en) * | 2017-09-28 | 2022-07-08 | 史杰克西股份有限公司 | Door system for opening and closing a container opening of a furnace |
| CN107860232A (en) * | 2017-12-05 | 2018-03-30 | 重庆顺博铝合金股份有限公司 | A kind of aluminum alloy smelting furnace and smelting apparatus |
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| CN114737171A (en) * | 2022-04-18 | 2022-07-12 | 北京北方华创微电子装备有限公司 | Adjusting device and semiconductor heat treatment equipment |
| CN114737171B (en) * | 2022-04-18 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjusting device and semiconductor heat treatment equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6263407B2 (en) | 2018-01-17 |
| KR102272832B1 (en) | 2021-07-05 |
| JP2015153776A (en) | 2015-08-24 |
| KR20210086587A (en) | 2021-07-08 |
| KR102293229B1 (en) | 2021-08-24 |
| TWI633265B (en) | 2018-08-21 |
| TW201531660A (en) | 2015-08-16 |
| KR20150094496A (en) | 2015-08-19 |
| CN104835760B (en) | 2018-11-23 |
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