CN104835760B - Annealing device - Google Patents
Annealing device Download PDFInfo
- Publication number
- CN104835760B CN104835760B CN201510066505.2A CN201510066505A CN104835760B CN 104835760 B CN104835760 B CN 104835760B CN 201510066505 A CN201510066505 A CN 201510066505A CN 104835760 B CN104835760 B CN 104835760B
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- China
- Prior art keywords
- door
- actuating arm
- opening
- working process
- process pipe
- Prior art date
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- 238000000137 annealing Methods 0.000 title claims abstract description 21
- 239000010453 quartz Substances 0.000 claims abstract description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 239000003708 ampul Substances 0.000 claims abstract description 27
- 239000011810 insulating material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 41
- 230000008569 process Effects 0.000 claims description 40
- 238000009792 diffusion process Methods 0.000 claims description 20
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 7
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910019213 POCl3 Inorganic materials 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Special Wing (AREA)
Abstract
The present invention provides a kind of annealing device.Wherein, the fire door of quartz ampoule is arranged in Men Yineng in such a way that switching mechanism is opened and closed.Door has the quartz plate configured in quartz ampoule side, the heat-insulating material for the inside for being maintained at door and the doorframe for keeping quartz plate and heat-insulating material.Switching mechanism has front end bearing doorframe and driven actuating arm and drives the driving device of actuating arm on the direction close to or far from quartz ampoule together with door, is opened using the drive force door of driving device or the fire door of closed quartz tube.Door tilt adjustment mechanism is supported on the front end of actuating arm in such a way that energy is inclined, and is mounted on doorframe, the supporting door in a manner of it can be carried out tilt adjustments.
Description
Technical field
The present invention relates to the annealing devices for being heat-treated to workpiece such as silicon substrates.
Background technique
In the manufacturing process of solar battery cell etc., implementation makes impurity to the silicon substrate (semiconductor die as workpiece
Piece) the heat treatment such as the DIFFUSION TREATMENT of diffusion into the surface.For carrying out the annealing device of the heat treatment, has receiving workpiece simultaneously
Implement the working process pipe (プ ロ セ ス チ ュ ー Block) and heater of heat treatment.
Working process pipe is, for example, quartz ampoule, and inside contains card (ボ ー ト), between which maintains
Multiple semiconductor wafers in gap as defined in being provided with.Heater is configured in a manner of surrounding the outside of working process pipe, will be added
The inside of work processing pipe is heated to defined temperature.
According to structure disclosed in Japanese Patent Laid-Open Publication 2001-185501, in one end shape of working process pipe
At the opening for having card to enter and leave, and it is equipped with to the door for being open and being opened and closed.By being open with door termination, working process pipe
Inside sealed.
In the DIFFUSION TREATMENT of semiconductor wafer, such as phosphorus oxychloride (POCl is imported into the working process pipe of sealing3)、
Boron tribromide (BBr3) etc. gases.
The inner surface of door exposes into the working process pipe of high temperature, and on the other hand, the outer surface of door, which exposes, is exposed on the external air
In be cooled.Therefore, if heat-insulated between the inner surface and the outer surface of door is not enough, in heat treatment process, processing
The opening for handling pipe nearby passes through door and is cooled.
In addition, if the inner surface of door and the adhesion of the end face of working process pipe are not enough, then working process pipe
The outside air that opening is nearby entered in working process pipe from the gap of the two is cooling.If at the diffusion of semiconductor wafer
The opening of working process pipe is cooled nearby in reason, then can incur and be precipitated near the inner surface of door and the opening of working process pipe
From POCl3Phosphorus pentoxide (P2O5)。
Additionally, there are following problems:Because of water vapour and working process contained by the outside air in entrance working process pipe
POCl in pipe3And P2O5Reaction and the phosphate aqueous solution that generates, make the made of metal frame of supporting door generate burn into pollution plus
Work handles the workpiece in pipe.
Summary of the invention
The object of the present invention is to provide a kind of annealing devices, by reliably making the inner surface of door and the interval of outer surface
Heat and the leakproofness for improving the inner surface of door and the end face of working process pipe are able to suppress the burn into of frame and become work
The by-product of the pollution cause of part.
The annealing device of the invention includes:Working process pipe, the closed at one end and other end are formed with opening, quilt
The workpiece of heat treatment is housed in the working process pipe by the opening;Door, opens the opening of the working process pipe
It closes;And switching mechanism, the door is acted, so that the opening is opened and closed,
The door includes:Inner surface component is configured in working process pipe side;Heat-insulating material is configured in the inner surface
The outside of component;And doorframe, the outside configured in the heat-insulating material simultaneously keep the inner surface component and the heat-insulating material,
The switching mechanism includes:Actuating arm, to a close direction of the working process pipe and from the processing
Processing is managed another separate side and is driven up;Driving device drives the actuating arm;And door tilt adjustment mechanism, with
Can inclined mode by the door bearing in the front end of the actuating arm,
It is moved by the door with the driving of the actuating arm, the opening of the working process pipe can be made to be opened and closed,
The door tilt adjustment mechanism, has:Bearing is mounted on the front end of the actuating arm;And swinging axle, one
End is equipped with the doorframe, and the other end is maintained at the inner ring of the bearing, according to the inner ring relative to the driving
Opposite swing of arm tilts together with the doorframe,
Also there is the switching mechanism door to rotate limiting member, and the door rotation limiting member limits the door and surrounds center
Rotation, door rotation limiting member is configured to the length direction for the actuating arm only relative to the swinging axle
The position of side limit the swing of the swinging axle,
When the switching mechanism keeps the door mobile and closes the opening of the working process pipe, pass through the inner surface
Component presses the periphery in the opening of the working process pipe, and the door tilt adjustment mechanism is with the inner surface component along institute
The mode for stating the periphery of the opening of working process pipe adjusts the inclination of the door, thus makes the inner surface component and the processing
Handle the periphery sealing of the opening of pipe.
Detailed description of the invention
Fig. 1 is the top view for indicating the major part of annealing device of embodiments of the present invention.
Fig. 2 is the local cutting top view for indicating door and actuating arm.
Fig. 3 is arrow III-III line cross-sectional view that indicate the structure of a tilt adjustment mechanism, Fig. 2.
Fig. 4 is the figure for illustrating the movement of a tilt adjustment mechanism.
Fig. 5 is to indicate the structure of rotation limiting member a, Fig. 2 arrow V-V line cross-sectional view.
Fig. 6 is the main view for indicating the structure of switching mechanism, door tilt adjustment mechanism and door rotation limiting member.
Specific embodiment
Illustrate the annealing device of embodiments of the present invention with reference to the accompanying drawings.
As an example, annealing device 1 is constituted as horizontal type furnace, by the quartz as working process pipe of the invention
The longitudinal direction horizontal arrangement of pipe 2, as shown in Figure 1, annealing device 1 has following basic structures:To use switching mechanism 20
Door 10 is set to opening (fire door) 2A of quartz ampoule 2 by the mode that can be opened and closed, and the quartz ampoule 2 forms the diffusion of receiving workpiece W
Room 3.Workpiece W is, for example, the silicon substrate of the rectangle of solar battery cell.Card 4 is with vertical state arranged at equal interval
Multiple workpiece W are kept, is walked using traveling wheel and passes through fire door 2A and workpiece W is transported into diffuser casing 3 or by workpiece W from diffuser casing 3
It transports.
Using diffusion with gas flow gatherer (not shown) containing diffusion source (such as POCl3) diffusion gas
Diffuser casing 3 is imported, the closed one end of the quartz ampoule 2 omitted in Fig. 1 is arranged in gas flow gatherer for the diffusion.
Specifically, diffusion utilizes source gas (ソ ー ス ガ ス with gas flow gatherer) make liquid diffusion source drum
Bubble makes the source gas of the saturated vapor comprising liquid diffusion source and carrier gas merge into diffusion gas flow, with as shown by arrow A
Mode import the diffusion gas flow from one end of quartz ampoule 2.
Exhaust pipe 5 is connect with circumferential surface near the fire door 2A of quartz ampoule 2.It is supplied to the diffusion gas of the processing of workpiece W
It is vented from exhaust pipe 5 to outside furnace.In order to prevent from fire door 2A Release and dispersion gas, diffuser casing 3 is negative pressure.
The periphery of quartz ampoule 2 is configured with heating device.Composition of the heating device for example, by using the heater 7 for having diagram.
The diffuser casing 3 being heated from diffusion gas leading-in device to the movement by heating device imports diffusion source, thus carries out
The processing for spreading impurity (such as phosphorus) to workpiece W.In addition, heating device can also have between quartz ampoule 2 and heater 7
Thiele tube.
The fire door 2A of quartz ampoule 2 is closed by the door 10 of open and close type.Door 10 is rotated using aftermentioned switching mechanism 20, thus right
Fire door 2A is opened and closed.
As shown in Fig. 2, door 10 has quartz plate 11, heat-insulating material 12 and doorframe 13.Quartz plate 11 is made of quartz
Disk is equivalent to inner surface component of the invention.Doorframe 13 keeps quartz plate and heat-insulating material.Quartz plate 11 is present in door 10
Inner surface side, pressing is on the fire door 2A of quartz ampoule 2 when door 10 is closed.
Doorframe 13 is by the component of round plate 131 and the integrated shape of cylindrical part 132.Doorframe 13 is had by stainless steel etc.
The material of rigidity is formed.Round plate 131 is present in the outer surface side of door 10.The side surface part of the composition door 10 of cylindrical part 132.
Heat-insulating material 12 is filled in the space surrounded by the cylindrical part 132 of doorframe 13.Heat-insulating material 12 is by doorframe 13
Round plate 131 and quartz plate 11 clamp, and are fixed by block 14, and the block 14 is mounted on the outer of the cylindrical part 132 of doorframe 13
The periphery of circumferential surface and quartz plate 11, multiple positions in circumferential direction.In this way, quartz plate 11 and heat-insulating material 12 are mounted on door
On frame 13.In door 10, heat-insulating material 12 is configured in quartz plate 11, opposite with diffuser casing 3 (referring to Fig.1) side.
Then illustrate the structure of switching mechanism 20.Switching mechanism 20 has actuating arm 21 and driving device 23.Actuating arm 21
By driving device 23, with door 10 together to the close direction (direction arrow R1 referring to Fig.1) of quartz ampoule 2 and from quartz
Pipe 2 is driven on another separate direction (direction arrow R2 with reference to FIG.).In this way, by driving actuating arm 21, driving gate
10 open the fire door 2A of the fire door 2A of quartz ampoule 2 or closed quartz tube 2.
In the present embodiment, it as driving device 23, is made of cylinder mechanism, the cylinder mechanism has back and forth movement
Piston rod 232 and storage piston rod 232 cylinder barrel 231, pass through the Fluid pressure for receiving to provide and keep piston rod 232 opposite
It is moved forward or back in cylinder barrel 231, thus transmits driving force.Here, using cylinder as cylinder mechanism.
Actuating arm 21 is extended in the substantially parallel mode in the fire door A with closing quartz ampoule 2, door 10 face.
The cardinal extremity of actuating arm 21 is connect by first connecting rod 26 and second connecting rod 28 with the front end of piston rod 232.
On the side of the fire door 2A of quartz ampoule 2, fixed bracket (fixing piece) 27 is fixed relative to annealing device.Fixed branch
The longitudinal direction of frame 27 is defined as along the axially vertical direction with quartz ampoule 2.Fixed bracket 27 is with one end than another
The mode of one end closer to quartz ampoule 2 is arranged.Divide on the one end of the longitudinal direction of the fixed bracket 27 and the other end
It is not provided with first rotating shaft 24 and the second shaft 25.
First rotating shaft 24 is made of columned pillar 241 and columnar casing 242, and the pillar 241 is fixed on
On fixed rack 27, described sleeve pipe 242 is arranged in a rotatable manner around pillar 241.Pass through first rotating shaft 24, driving
The base end part of arm 21 and the one end of first connecting rod 26 are supported on the one end of fixed bracket 27 in a manner of being able to rotate, so that
Actuating arm 21 and first connecting rod 26 rotate together.
The other end of first connecting rod 26 is connect in a manner of being able to rotate each other with the front end of piston rod 232.First connects
The other end of bar 26 and the front end of piston rod 232 are connected by the second connecting rod 28 being able to rotate relative to first connecting rod 26.
It can be by being provided projectingly pin on fixed bracket 27, and setting hole chimeric with pin etc. is simple on cylinder barrel 231
Single bumps are fitted into realize the second shaft 25.Cylinder barrel 231 is supported on fixation the second shaft 25 in a manner of being able to rotate
The other end of bracket 27.
Driving device 23 is the rotation automation equipment for making actuating arm 21.In addition, about driving device 23, if piston
Bar 232 advances from cylinder barrel 231, then actuating arm 21 is rotated in the close mode of the fire door 2A to quartz ampoule 2, and door 10 is with closing
Mode rotates.Then, the pressing of door 10 is sealed in quartz ampoule 2 on fire door 2A.
On the other hand, if piston rod 232 is retreated relative to cylinder barrel 231, actuating arm 21 is with from the fire door of quartz ampoule 2
2A separate mode rotates, and door 10 is rotated in a manner of opening.In addition, if being filled by the controller control driving being not particularly illustrated
23 are set, then can automatically control the driving of actuating arm 21.
Doorframe 13 utilizes the door tilt adjustment mechanism 30 that the front end of actuating arm 21 is arranged in, with the side of inclination (swing) freely
Formula is supported.
Specifically, as shown in figure 3, door tilt adjustment mechanism 30 has rod end bearing 31 and swinging axle 32.Rod end bearing
31 are mounted on the front end of actuating arm 21.Swinging axle 32 is supported in such a way that axle center energy is inclined by rod end bearing 31.Swinging axle 32 makes
The center of doorframe 13 is fixed on part 321.Swinging axle 32 on doorframe 13 is fixed on by part 321, perforation is installed on driving
The spherical surface inner ring 311 of rod end bearing 31 on face on the upside of the front end of arm 21.
Rod end bearing 31 can by well known rod end bearing (Japanese Patent Laid-Open Publication 2003-247540, Japan
Patent Laid Beneficial 2-78808) it constitutes, spherical surface inner ring 311 is maintained in a manner of it can swing is formed in rod end axis
In the mounting hole for holding the dome shape of 31 inside.Swinging axle 32 by can with spherical surface inner ring 311 it is inclined together in a manner of be kept.
On the other end in swinging axle 32, with the one end opposite side being mounted on doorframe 13, it is arranged angled
Adjust head 33.Angle-regulating block 34 is mounted on the front end of actuating arm 21.It is formed on angle-regulating block 34 and is angularly adjusted head
The opening 34A of 33 perforations.Opening 34A is sized to that the inclined size of angle adjusting head 33 can be allowed.
As shown in figure 4, door 10 relative to actuating arm 21 according to the structure of above door tilt adjustment mechanism 30 to tilt certainly
Mode such as is supported.The maximum angle α of the tilt angle of door 10, by the outer diameter of angle adjusting head 33 and opening for angle-regulating block
The relativeness of the internal diameter of mouth 34A limits (adjusting).
In addition, being equipped with door on doorframe 13 and actuating arm 21 rotates limiting member 40, the door rotation limiting member 40 is limited
The rotation around center of door 10 processed.As shown in fig. 6, door rotation limiting member 40 be arranged in it is from door 10, closed quartz tube 2
On the position of the center deviation in the face of fire door 2A, the rotation of door 10 is limited.
In the present embodiment, as shown in figure 5, door rotation limiting member 40 has rotation limitation head 42 and rotation restriction plate
41.Rotation limitation head 42 is fixed on actuating arm 21.Rotation restriction plate 41 is fixed on doorframe 13.In addition, in contrast, it can also
The structure that restriction plate 41 is fixed on actuating arm 21 is fixed on doorframe 13, rotated using rotation limitation head 42.
It is, for example, substantially z-shaped by implementing band-like metal plate at two positions of its longitudinal direction for rotating restriction plate 41
Bending machining be made.Rotation limitation head 42 by the direction of door 10 it is outstanding in a manner of be mounted on rest pad 43, institute
Rest pad 43 is stated to be vertically fixed on actuating arm 21, opposite with door 10 side.
Restriction plate 41 is rotated using the dististyle 411 of the side in two dististyles 411,412 parallel to each other, is consolidated by screw
It is fixed etc. to be fixed on the round plate 131 of doorframe 13.Rotation limitation head 42 is formed through at the end of another party of rotation restriction plate 41
Opening 41A on piece 412.Opening 41A is sized to the rotation of rotation limitation head 42 can be limited in a certain range of
Size.Specifically, so that rotation limitation head 42 is so that the side that the tilt angle of door 10 can change in the range of the angle [alpha]
The mode of formula pass through openings 41A, adjustment rotation limitation head 42 and opening 41A.
Using the structure of above door rotation limiting member 40, the rotation around swinging axle 32 of door 10 is restricted.By
This, is able to maintain the reproducibility of the sliding fit (folding り closes わ せ) of the fire door 2A of quartz ampoule 2 and the quartz plate 11 of door inner surface.
According to the present invention, since door 10 is built-in with heat-insulating material 12, so even if there are temperature for the inner and outer of door 10
Difference can also inhibit the temperature of the quartz plate 11 of an inner surface to reduce.Thereby, it is possible to prevent near the fire door 2A of quartz ampoule 2
Separate out the by-product derived from diffusion gas.
Door 10 is the structure being clipped in heat-insulating material between doorframe 13 and quartz plate 11.Therefore, although door 10 is that have absolutely
The structure of hot material 12, can also be by supporting the doorframe 13 of door exterior surface with actuating arm 21 and making what doorframe 13 rotated freely to open
Mechanism 20 is closed, 10 is opened and closed on the door without barrier.
In addition, 21 driven device 23 of actuating arm applies active force to the side fire door 2A of quartz ampoule 2, by the drive is arranged in
The door tilt adjustment mechanism 30 of the front end of swing arm 21 supports doorframe 13, thus, it is possible to so that the quartz plate 11 of door inner surface along quartz
The form of the product having shape-following-up of the fire door 2A of pipe 2 improves the leakproofness of the two.Thereby, it is possible to prevent atmosphere from the fire door of quartz ampoule 2
2A enters, and can prevent the generation for reacting the by-product generated with atmosphere, can prevent the pollution in the corrosion and furnace of door, energy
Enough extend the maintenance period.
The explanation of above embodiment is all example in all aspects, and should not be considered limiting explanation.
The scope of the present invention is not limited to above-mentioned embodiment, but is indicated by the scope of the claims.In addition, the scope of the present invention is also
Including all deformed in content identical with the scope of the claims substance and range.
Claims (8)
1. a kind of annealing device, which is characterized in that
The annealing device includes:Working process pipe, the closed at one end and other end are formed with opening, the workpiece being heat-treated
It is housed in the working process pipe by the opening;Door, is opened and closed the opening of the working process pipe;And opening/closing machine
Structure acts the door, so that the opening is opened and closed,
The door includes:Inner surface component is configured in working process pipe side;Heat-insulating material is configured in the inner surface component
Outside;And doorframe, the outside configured in the heat-insulating material simultaneously keep the inner surface component and the heat-insulating material,
The switching mechanism includes:Actuating arm, to a close direction of the working process pipe and from the working process
Another separate side is managed to be driven up;Driving device drives the actuating arm;And door tilt adjustment mechanism, can incline
Oblique mode by the door bearing in the front end of the actuating arm,
The door is moved with the driving of the actuating arm, and the opening of the working process pipe can be made to be opened and closed,
The door tilt adjustment mechanism, has:Bearing is mounted on the front end of the actuating arm;And swinging axle, portion at one end
The doorframe is installed, and the other end is maintained at the inner ring of the bearing, according to the inner ring relative to the actuating arm
Opposite swing tilts together with the doorframe,
Also there is the switching mechanism door to rotate limiting member, and the door rotation limiting member limits the door and turns around center
Dynamic, the door rotation limiting member is configured to the length direction for the actuating arm only in one relative to the swinging axle
The position of side limits the swing of the swinging axle,
When the switching mechanism keeps the door mobile and closes the opening of the working process pipe, pass through the inner surface component
The periphery in the opening of the working process pipe is pressed, the door tilt adjustment mechanism is added with the inner surface component along described
The mode of the periphery of the opening of work processing pipe adjusts the inclination of the door, thus makes the inner surface component and the working process
The periphery of the opening of pipe seals.
2. annealing device according to claim 1, which is characterized in that the working process pipe is quartz ampoule.
3. annealing device according to claim 1, which is characterized in that
Diffusion gas is imported in the working process pipe, the diffusion includes for being heat-treated to workpiece with gas
Phosphorus oxychloride or Boron tribromide.
4. annealing device according to claim 1, which is characterized in that the bearing is rod end bearing.
5. annealing device described in any one of -4 according to claim 1, which is characterized in that
The door tilt adjustment mechanism further includes:The other end of the swinging axle is arranged in angle adjusting head;And
Angle-regulating block, is arranged in the front end of the actuating arm, and is formed with the opening of the angle adjusting head perforation, and
The size of the opening is to allow the inclined size of the angle adjusting head.
6. annealing device described in any one of -4 according to claim 1, which is characterized in that the door rotation limiting member is also
Including:Rotation limitation head, is arranged on the side in the doorframe and the actuating arm;And rotation restriction plate, it is arranged in institute
It states on another party in doorframe and the actuating arm, and is formed with opening, the rotation limitation head penetrates through the opening, and this is opened
The rotation of the rotation limitation head can be limited in the size of prescribed limit by the size of mouth.
7. annealing device described according to claim 1~any one of 4, which is characterized in that
The driving device is cylinder mechanism, and the cylinder mechanism has the piston rod of back and forth movement and stores the piston rod
Cylinder barrel passes through the Fluid pressure for receiving to provide and moves forward or back the piston rod relative to the cylinder barrel to transmit and drive
Power,
The base end part of the actuating arm is connect with the piston rod.
8. annealing device according to claim 7, which is characterized in that
The actuating arm and the face for the opening for closing the working process pipe extend parallel to,
The base end part of the actuating arm and the one end of first connecting rod are supported on support bracket fastened one end in a manner of being able to rotate,
So that the actuating arm and the first connecting rod rotate together,
The cylinder barrel is supported on described support bracket fastened the other end in a manner of being able to rotate, and the first connecting rod is another
One end is rotatably connect with the front end of the piston rod,
The fixed bracket by the support bracket fastened one end than the other end closer to the working process pipe in a manner of be arranged.
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JP2014023743A JP6263407B2 (en) | 2014-02-10 | 2014-02-10 | Heat treatment equipment |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3462118A1 (en) * | 2017-09-28 | 2019-04-03 | StrikoWestofen GmbH | Door system for opening and closing a container opening of a furnace |
CN107860232A (en) * | 2017-12-05 | 2018-03-30 | 重庆顺博铝合金股份有限公司 | A kind of aluminum alloy smelting furnace and smelting apparatus |
CN109827438A (en) * | 2018-12-27 | 2019-05-31 | 浙江智造热成型科技有限公司 | The connecting rod rocker-arm stove-door switching mechanism of heating furnace |
CN110030834B (en) * | 2019-05-20 | 2024-01-30 | 宁波恒普技术股份有限公司 | Open-close type heat insulation door |
JP7339853B2 (en) * | 2019-10-31 | 2023-09-06 | 株式会社ジェイテクトサーモシステム | Heat treatment equipment |
JP7386045B2 (en) * | 2019-10-31 | 2023-11-24 | 株式会社ジェイテクトサーモシステム | heat treatment equipment |
JP7001726B2 (en) * | 2020-03-13 | 2022-01-20 | 光洋サーモシステム株式会社 | Heat treatment equipment |
KR102506596B1 (en) * | 2021-06-15 | 2023-03-08 | 주식회사 테크엑스 | Load port module |
JP2023024000A (en) * | 2021-08-06 | 2023-02-16 | 株式会社ジェイテクトサーモシステム | Heat treatment device |
KR102444786B1 (en) * | 2021-12-23 | 2022-09-19 | 주식회사 에이치피에스피 | High Pressure Chamber to Improve Cooling Efficiency |
KR102441994B1 (en) * | 2021-12-27 | 2022-09-08 | 주식회사 에이치피에스피 | Fast Cooling High Pressure Chamber |
CN114737171B (en) * | 2022-04-18 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjusting device and semiconductor heat treatment equipment |
KR20240034512A (en) * | 2022-09-07 | 2024-03-14 | 주식회사 한화 | Door baffle and heat treatment apparatus including the same |
KR102606702B1 (en) * | 2022-11-04 | 2023-11-29 | 주식회사 에이치피에스피 | High pressure heat treatment apparatus and process gas line used therefor |
CN116426730B (en) * | 2023-02-20 | 2024-02-02 | 娄底市利通磁电科技有限公司 | Heat treatment device for magnetic core production and use method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102693926A (en) * | 2011-03-25 | 2012-09-26 | 东京毅力科创株式会社 | Lid opening and closing device |
CN202888141U (en) * | 2012-10-24 | 2013-04-17 | 技鼎股份有限公司 | Semiconductor processing device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS589197Y2 (en) * | 1980-07-18 | 1983-02-18 | 川崎製鉄株式会社 | Lid opening/closing device |
JPS5846386Y2 (en) * | 1981-02-07 | 1983-10-21 | 株式会社 正英製作所 | gas furnace pot lid device |
JPH071790Y2 (en) * | 1987-06-17 | 1995-01-18 | 国際電気株式会社 | Automatic cap for diffuser |
JPH02306619A (en) * | 1989-05-22 | 1990-12-20 | Sharp Corp | Impurity diffusing equipment |
JPH08162421A (en) * | 1994-12-08 | 1996-06-21 | Sony Corp | Horizontal diffusion furnace |
JP2000018212A (en) * | 1998-07-02 | 2000-01-18 | Kogure Seisakusho:Kk | Fluid pressure device |
JP3662763B2 (en) * | 1999-03-05 | 2005-06-22 | シャープ株式会社 | Horizontal diffusion furnace |
JP3784596B2 (en) * | 1999-12-22 | 2006-06-14 | 三菱電機株式会社 | Horizontal diffusion furnace for semiconductor device manufacturing process |
JP5820731B2 (en) * | 2011-03-22 | 2015-11-24 | 株式会社日立国際電気 | Substrate processing apparatus and solid material replenishment method |
WO2013005363A1 (en) * | 2011-07-06 | 2013-01-10 | 平田機工株式会社 | Container opening/closing device |
-
2014
- 2014-02-10 JP JP2014023743A patent/JP6263407B2/en active Active
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102693926A (en) * | 2011-03-25 | 2012-09-26 | 东京毅力科创株式会社 | Lid opening and closing device |
CN202888141U (en) * | 2012-10-24 | 2013-04-17 | 技鼎股份有限公司 | Semiconductor processing device |
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KR20210086587A (en) | 2021-07-08 |
JP6263407B2 (en) | 2018-01-17 |
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JP2015153776A (en) | 2015-08-24 |
CN104835760A (en) | 2015-08-12 |
TW201531660A (en) | 2015-08-16 |
KR20150094496A (en) | 2015-08-19 |
KR102272832B1 (en) | 2021-07-05 |
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