CN202888141U - Semiconductor processing device - Google Patents
Semiconductor processing device Download PDFInfo
- Publication number
- CN202888141U CN202888141U CN 201220546744 CN201220546744U CN202888141U CN 202888141 U CN202888141 U CN 202888141U CN 201220546744 CN201220546744 CN 201220546744 CN 201220546744 U CN201220546744 U CN 201220546744U CN 202888141 U CN202888141 U CN 202888141U
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- Prior art keywords
- shell
- plate
- door
- bracing frame
- opening
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Abstract
The utility model discloses a semiconductor processing device. The device comprises a support frame, a door panel mechanism, a shell, a heating source assembly, a gas pipeline assembly and an automatic door panel compacting mechanism, wherein the door panel mechanism is connected with the support frame and drives the support frame to move; the shell is provided with an opening, so that the support frame can enter/exit the shell, and the support frame and the door panel mechanism form a processing cavity; the automatic door panel compacting mechanism comprises a pneumatic/hydraulic pipeline, a brake, a guidance device, sliding blocks and cams, wherein the cams are arranged on the side of a door panel and the side of the shell at the same level; and when the door panel mechanism and the shell are closed, the brake pushes the guidance device upwards and then pushes the sliding blocks to ensure that concave parts of the sliding blocks are in contact with the cams, and the clearance between the door panel mechanism and the shell is sealed, so that external air is prevented from permeating into the processing cavity to cause turbulent flow, a processing gas in the cavity is distributed more uniformly, and the processing yield is improved.
Description
Technical field
The utility model relates to a kind of manufacture of semiconductor device, especially utilizes the automatic fine and close mechanism that is installed in door-plate, makes door-plate fine and close, avoids the cavity extraneous air to infiltrate and causes flow-disturbing, and can make the process gas air-flow of inside cavity more even.
Background technology
With reference to figure 1, be the schematic diagram of prior art manufacture of semiconductor device.As shown in Figure 1, the manufacture of semiconductor device 100 of prior art comprises a bracing frame 10, a shell 20, a door-plate mechanism 30, at least one heating source assembly 40, and gas line assembly 60.Bracing frame 10 is connected with this door-plate mechanism 30, and can be placed among this shell 20 in order to bearing semiconductor wafer 500.Door-plate mechanism 30 opens when installing/taking-up wafer 500, and after installing/taking-up is finished, bracing frame 10 is entered the shell 20 from an opening, and this door-plate mechanism 30 forms processing procedure chambeies jointly with this shell 20.This at least one heating source assembly 40 is installed among this shell 20, is arranged at least the top of this bracing frame 10.Gas line assembly 60 is installed on the shell 20, in order to process gas is discharged the processing procedure chamber.
When processing procedure begins, door-plate mechanism 30 can enter shell 20 by start guide support frame 10, exist a little gap between shell 20 and the door-plate mechanism 30 this moment, and outside air is entered in the processing procedure chamber, disturb and produce flow-disturbing, this flow-disturbing may cause the each several part process conditions of whole inside cavity different, and then whole uniformity and the process rate of impact.Therefore, need a kind of device that can address the above problem.
The utility model content
Main purpose of the present utility model provides a kind of manufacture of semiconductor device, this manufacture of semiconductor device comprises the fine and close mechanism of bracing frame, door-plate mechanism, shell, heating source assembly, gas line assembly and automatic door plate, and bracing frame is in order to carry at least one semiconductor crystal wafer; Door-plate mechanism is connected with this bracing frame, moves and can drive this bracing frame; Shell has an opening, and this bracing frame can be entered this shell from this opening, and after this bracing frame can enter this shell from this opening, forms a processing procedure chamber with this door-plate mechanism, also has an air inlet, to import at least one process gas; The heating source assembly is installed among this shell, is arranged at least top, below or the side of this bracing frame; The gas line assembly is installed on the shell, in order to process gas is discharged the processing procedure chamber.
The fine and close mechanism of automatic door plate, comprise at least one pneumatic/hydraulic pipeline, at least one brake, at least one guiding device, at least one slide block, and a plurality of cams, this at least one pneumatic/hydraulic pipeline, at least one brake and at least one guiding device are installed on the door-plate of this door-plate mechanism, this pneumatic/hydraulic pipeline connects one external pressure/hydraulic power source or control source, respectively this brake with this at least one pneumatic/hydraulic pipeline and described guiding device one of them be connected, respectively this guiding device with described slide block one of them be connected, described slide block is a spill, described cam is arranged at the side of this door-plate side and this shell, and the described cam that is arranged at the side of this door-plate side and this shell is set to identical level, after this door-plate mechanism closes, the pressure that described brake utilizes described pneumatic/hydraulic to introduce promotes described guiding device upwards, and then promote described slide block upwards, make the matrix place of described slide block contact described cam, thereby make the gap driving fit between this door-plate and this shell.
Characteristics of the present utility model are, after cutting out, door-plate further utilizes the fine and close mechanism of automatic door plate, and so that the gap driving fit between door-plate and the shell, avoided extraneous air to infiltrate the flow-disturbing that causes, thereby so that process gas is better evenly in the distribution of cavity, and then promoted the yield of processing procedure.
Description of drawings
Fig. 1 is the schematic diagram of the manufacture of semiconductor device of prior art;
Fig. 2 is the schematic diagram of manufacture of semiconductor device opening of the present utility model;
Fig. 3 A and Fig. 3 B are respectively the schematic diagram of the utility model manufacture of semiconductor device closed condition and the schematic diagram of the utility model manufacture of semiconductor device door-plate closed state;
Fig. 4 is the element exploded view of the utility model manufacture of semiconductor;
Fig. 5 is the schematic diagram of another embodiment opening of the utility model manufacture of semiconductor device.
Wherein, description of reference numerals is as follows:
1 manufacture of semiconductor device
10 bracing frames
20 shells
21 bottom shells
21G cooling water opening/refrigerating gas opening
The accommodating housing of 23 bracing frames
23A the first header board
23B the first base plate
23C the first backboard
The 23I air inlet
23O the first opening
23S the first side plate
25 middle casings
25A the second header board
25C the second backboard
25O the second opening
The 25R exhaust outlet
25S the second side plate
The 25T open back
27 upper body
27R installs opening
30 door-plate mechanisms
31 door-plates
33 pneumatic/hydraulic acting devices
35 sliding bars
37 jockeys
40 heating source assemblies
41 heating sources
43 heating source connectors
60 gas line assemblies
61 blast pipes
More than 63 arm
65 connectors
The fine and close mechanism of 70 automatic door plates
71 pneumatic/hydraulic pipelines
73 brakes
75 guiding devices
77 slide blocks
79 cams
100 manufacture of semiconductor devices
500 semiconductor crystal wafers
Embodiment
Those of ordinary skill in the art below cooperate graphic and component symbol is done more detailed description to execution mode of the present utility model, so that can implement after studying this specification carefully according to this.
With reference to figure 2, Fig. 3 A and Fig. 3 B and Fig. 4, be respectively the schematic diagram of the utility model manufacture of semiconductor device opening, the schematic diagram of the utility model manufacture of semiconductor device closed condition, the schematic diagram of the utility model manufacture of semiconductor device door-plate closed state, and the element exploded view of the utility model manufacture of semiconductor.To shown in Figure 4, manufacture of semiconductor device 1 of the present utility model comprises a bracing frame 10, a shell 20, a door-plate mechanism 30, at least one heating source assembly 40, gas line assembly 60 such as Fig. 2, and the fine and close mechanism 70 of automatic door plate.Bracing frame 10 is connected with this door-plate mechanism 30, and can be placed among this shell 20 in order to bearing semiconductor wafer 500.Door-plate mechanism 30 opens when installing/taking-up wafer 500, and after installing/taking-up is finished, bracing frame 10 is entered the shell 20 from an opening, and this door-plate mechanism 30 forms processing procedure chambeies jointly with this shell 20.This at least one heating source assembly 40 is installed among this shell 20, is arranged at least the top of this bracing frame 10.Gas line assembly 60 is installed on the shell 20, in order to process gas is discharged the processing procedure chamber.
Shell 20 comprises a bottom shell 21, the accommodating housing 23 of bracing frame, middle casing 25, an and upper body 27, the accommodating housing 23 of bracing frame, in order to accommodating this bracing frame 10, and has one first header board 23A, one first base plate 23B, one first backboard 23C, one first side plate 23S, this first base plate 23B connects this bottom shell 21, this first header board 23A, this first base plate 23B, this the first backboard 23C and this first side plate 23S connect the space of opening around a top, this first header board 23A has one first opening 23O, can make this bracing frame 10 enter/withdraw from, and the first backboard 23C has an air inlet 23I, to be connected to the exterior tubing (not shown), so that process gas is imported in the processing procedure chamber.This middle casing 25 is installed on this bottom shell 21, and have one second header board 25A, one second backboard 25C and one second a side plate 25S, this the second header board 25A and this second side plate 25S are to be arranged at respectively the periphery of this first header board 23A and this first side plate 23S, this second header board 25A has the second opening 25O that is connected with this first opening 23O, and the second backboard 25C has an open back 25T, so that the first backboard 23C of the accommodating housing 23 of this bracing frame can protrude from outside it, and make the accommodating housing 23 of this bracing frame be fixed in this middle casing 25.Upper body 27 is fixed on this middle casing 25.
Door-plate mechanism 30 comprises a door-plate 31, at least one pneumatic/hydraulic acting device 33, at least one sliding bar 35, an and jockey 37, jockey 37 is installed in the inside of door-plate 31, in order to connect this bracing frame 10, door-plate 31 covers this first opening 23O and the second opening 25O, this pneumatic/hydraulic acting device 33 is installed under the bottom shell 21, sliding bar 35 is installed on the door-plate 31, and be installed in the pneumatic/hydraulic acting device 33, when semiconductor crystal wafer 500 is furnished behind bracing frame 10,33 starts of pneumatic/hydraulic acting device, and pulling sliding bar 35 moves towards shell 20 directions, and then the movement of drive door-plate 31, make door-plate 31 cover the opening of shell 20, and can reach the effect of quick location.
Shown in Fig. 2, Fig. 3 A and Fig. 3 B, the fine and close mechanism 70 of automatic door plate comprises at least one pneumatic/hydraulic pipeline 71, at least one brake 73, at least one guiding device 75, at least one slide block 77, and a plurality of cam 79.This at least one pneumatic/hydraulic pipeline 71, at least one brake 73 and at least one guiding device 75 are installed on the door-plate 31 of door-plate mechanism 30, this pneumatic/hydraulic pipeline 71 connects one external pressure/hydraulic power source (not shown), this brake 73 is connected with this pneumatic/hydraulic pipeline 71 and this guiding device 75, guiding device 75 is connected with slide block 77, and slide block 77 is a spill.After door-plate mechanism 30 is airtight, the pressure that brake 73 utilizes pneumatic/hydraulic pipeline 71 to introduce promotes guiding device 75 upwards, and then promote slide block 77 upwards, and make slide block 77 spill places be adjacent to a cam 79 with the par that is installed in respectively door-plate 31 sides and shell 20 sides, thereby make the gap driving fit between door-plate 31 and the shell 20.
Further, in this bottom shell 21, comprise a cooling water opening and/or refrigerating gas opening 21G, in order to connect an installing cold water pipe in the inner, and/or refrigerating gas pipe (not shown), with cold water source and/or the cold gas body source (not shown) of outside.
With reference to figure 5, be the schematic diagram of another embodiment opening of the utility model manufacture of semiconductor device.As described in Figure 5, the utility model manufacture of semiconductor device 2 is similar to the embodiment that shows among Fig. 2 in fact, and it does not exist together and only is bracing frame 15, and bracing frame 15 can carry a plurality of wafers 500, and can increase speed and the production capacity of processing procedure.
Characteristics of the present utility model are, after cutting out, door-plate further utilizes the fine and close mechanism of automatic door plate, and so that the gap driving fit between door-plate and the shell, the flow-disturbing of having avoided extraneous air to cause, thereby so that process gas is better evenly in the distribution of cavity, and then promoted the yield of processing procedure.
The above in order to explain preferred embodiment of the present utility model, is not that attempt is done any pro forma restriction to the utility model according to this only.Therefore, all have in that identical utility model spirit is lower do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.
Claims (6)
1. a manufacture of semiconductor device is characterized in that, this device comprises:
One bracing frame is in order to carry at least one semiconductor crystal wafer;
One door-plate mechanism is connected with this bracing frame, moves and can drive this bracing frame;
One shell has an opening, and this bracing frame can be entered this shell from this opening, and after this bracing frame can enter this shell from this opening, forms a processing procedure chamber with this door-plate mechanism, also comprises an air inlet to import at least one process gas;
At least one heating source assembly is installed among this shell, is arranged at least top, below or the side of this bracing frame;
One gas line assembly is installed on the shell, in order to this process gas is expelled to the outside; And
The fine and close mechanism of one automatic door plate, comprise at least one pneumatic/hydraulic pipeline, at least one brake, at least one guiding device, at least one slide block, and a plurality of cams, this at least one pneumatic/hydraulic pipeline, at least one brake and at least one guiding device are installed on the door-plate of this door-plate mechanism, this at least one pneumatic/hydraulic pipeline connects one external pressure/hydraulic power source or control source, respectively this brake with this at least one pneumatic/hydraulic pipeline and this guiding device one of them be connected, respectively this guiding device with this slide block one of them be connected, described slide block is a spill, described cam is arranged at the side of this door-plate side and this shell, and the described cam that is arranged at the side of this door-plate side and this shell is set to identical level, after this door-plate mechanism is airtight, the pressure that described brake utilizes pneumatic/hydraulic to introduce promotes described guiding device upwards, and then promote described slide block upwards, make the matrix place of described slide block contact described cam, thereby make the gap driving fit between this door-plate and this shell.
2. manufacture of semiconductor device as claimed in claim 1, it is characterized in that, this door-plate mechanism comprises this door-plate, at least one pneumatic/hydraulic acting device, at least one sliding bar, an and jockey, this at least one pneumatic/hydraulic acting device is installed under this shell, this at least one sliding bar is installed on this door-plate, and be installed in the pneumatic/hydraulic acting device, this jockey is installed in the inside of this door-plate, in order to connect this bracing frame, when this at least one semiconductor crystal wafer is furnished behind this bracing frame, this pneumatic/hydraulic acting device start, and the pulling sliding bar moves towards this shell direction, and then drive the movement of this door-plate, make this door-plate cover this opening of this shell, and can reach the effect of quick location.
3. manufacture of semiconductor device as claimed in claim 1, it is characterized in that, this shell comprises a bottom shell, the accommodating housing of one bracing frame, one middle casing, an and upper body, this bracing frame putting part body and function is with accommodating this bracing frame, and has one first header board, one first base plate, one first backboard, one first side plate, this first base plate connects this bottom shell, this first header board, this first base plate, this first backboard and this first side plate connect the space of opening around a top, this first header board has one first opening, can make this bracing frame enter/withdraw from, and the first backboard has this air inlet, to be connected to an exterior tubing, to pass into this process gas to this processing procedure chamber, this middle casing is installed on this bottom shell, and has one second header board, one second backboard and one second side plate, this second header board and this second side plate are to be arranged at respectively the periphery of this first header board and this first side plate, this second header board has one second opening that is connected with this first opening, and this second backboard has an open back, so that the first backboard of the accommodating housing of this bracing frame can protrude from outside it, and make the accommodating housing of this bracing frame be fixed in this middle casing, and this upper body is fixed on this middle casing.
4. manufacture of semiconductor device as claimed in claim 3, it is characterized in that, this at least one heating source assembly, comprise a plurality of heating sources and a plurality of heating source connector, respectively this heating source passes in pairs installing opening of one on the upper body sidewall, be fixedly arranged on this upper body with a pair of this heating source connector again, and/or respectively this heating source passes a paired opening on this bottom shell sidewall, is fixedly arranged on this bottom shell with a pair of this heating source connector again.
5. manufacture of semiconductor device as claimed in claim 3, it is characterized in that, this gas line assembly comprises a blast pipe, and a plurality of connectors, described arm and this air inlet pipe form one, and are fixed in by this connector on this second header board of middle casing of this shell, thereby after processing procedure is finished, see through a plurality of exhaust outlets on this second header board, and this gas line assembly is discharged this processing procedure chamber with this process gas.
6. manufacture of semiconductor device as claimed in claim 3, it is characterized in that, in this bottom shell, further comprise a cooling water opening and/or refrigerating gas opening, be installed in a cold water pipe in this bottom shell in order to connection, with the outside cold water source of refrigerating gas Guan Yiyi and/or a cold gas body source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220546744 CN202888141U (en) | 2012-10-24 | 2012-10-24 | Semiconductor processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220546744 CN202888141U (en) | 2012-10-24 | 2012-10-24 | Semiconductor processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888141U true CN202888141U (en) | 2013-04-17 |
Family
ID=48079536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220546744 Expired - Lifetime CN202888141U (en) | 2012-10-24 | 2012-10-24 | Semiconductor processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888141U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104835760A (en) * | 2014-02-10 | 2015-08-12 | 光洋热系统株式会社 | Heat treatment apparatus |
-
2012
- 2012-10-24 CN CN 201220546744 patent/CN202888141U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104835760A (en) * | 2014-02-10 | 2015-08-12 | 光洋热系统株式会社 | Heat treatment apparatus |
| CN104835760B (en) * | 2014-02-10 | 2018-11-23 | 光洋热系统株式会社 | Annealing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Liu Jun Document name: Notice of Conformity |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130417 |