CN104752386A - High reliability small outline package (SOP) lead frame and production method of packaging piece - Google Patents
High reliability small outline package (SOP) lead frame and production method of packaging piece Download PDFInfo
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- CN104752386A CN104752386A CN201310726533.3A CN201310726533A CN104752386A CN 104752386 A CN104752386 A CN 104752386A CN 201310726533 A CN201310726533 A CN 201310726533A CN 104752386 A CN104752386 A CN 104752386A
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Abstract
The invention provides a high reliability small outline package (SOP) lead frame and a production method of a packaging piece. The lead frame comprises a lead frame body with 240 packaging units in matrix arrangement. The packaging unit comprises a carrier. The back of the carrier is provided with a frame-shaped structure comprising a plurality of silver-plated rings. The frame-shaped structure is internally provided with a plurality of pits. Two sides of the carrier are provided with a plurality of inner pins with locking holes and waterproof grooves. The other two side edges of the carrier are respectively provided with a carrier connecting rod. One end of the carrier connecting rod is connected with the carrier. The other end of the carrier connecting rod is large in size and is provided with a stabilizing hole. Wafer backgrinding and scribing are performed according to an existing process; a chip is stuck on the lead frame; baking is performed through a rapid solidification anti-separation layer baking technique in seven different temperature areas; the steps of plasma cleaning, pressure welding, plastic packaging and tendon cutting are carried out; and then printing and testing are performed by a conventional SOP production technique so as to produce the SOP packaging piece. A frame material and a plastic packaging material are utilized to the greatest extent, the production efficiency and product quality are improved, error rate is lowered and safety risk is reduced.
Description
Technical field
The invention belongs to microelectronics assewbly and encapsulation technology field, relate to a kind of lead frame for matrix form SOP encapsulation, particularly a kind of high reliability SOP encapsulating lead; The invention still further relates to a kind of method that this lead frame produces packaging part.
Background technology
Little outline packages Small Outline Package(is called for short SOP) be microelectronics assewbly and the encapsulation technology of a kind of advanced person, be a kind of middle-end packing forms, be in ripe developing stage at present.This encapsulation has that failure rate is low, density is high, miniaturized, save the advantages such as space, cost are lower, time to market (TTM) can be shortened, reduce investment risk.Although SOP encapsulation technology is comparatively ripe, each encapsulation enterprise volume production all, the lead frame that this encapsulation technology uses is all 2 rows and 5 rows substantially.Consider from packaging cost angle, framework row is lower, and stock utilization is low, and cost is higher.
Summary of the invention
The object of this invention is to provide a kind of high reliability SOP encapsulating lead, for arranging matrix form framework, frame material and plastic packaging material can be utilized to the utmost more, reduce production cost.
Another object of the present invention is to provide a kind of method of producing packaging part with above-mentioned lead frame.
For achieving the above object, the technical solution adopted in the present invention is: a kind of high reliability SOP encapsulating lead, comprises lead frame body, and on lead frame body, matrix arrangement has 240 encapsulation units;
Encapsulation unit comprises carrier, the back side of carrier, is provided with the frame-shaped construction be made up of multiple silver-plated ring along the periphery of carrier, and in this frame-shaped construction, the back side of carrier is provided with multiple square pit; Carrier both sides are respectively equipped with multiple interior pin, each interior pin is equipped with the capillary groove of lock hole and V-arrangement, two other side of carrier is respectively equipped with a carrier link, one end of carrier link is connected with carrier, the size of the carrier link other end is greater than carrier link and is connected with carrier the size of one end, and the larger-size one end of carrier link is provided with the stable hole of rhombus.
Another technical scheme of the present invention is: a kind of method utilizing above-mentioned high reliability SOP encapsulating lead to produce SOP packaging part: carry out the thinning and scribing of wafer by existing SOP production process for encapsulating; By chip attach on lead frame; Baking, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, and the temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C and 160 DEG C; The cleaning of baking post plasma, adopts existing SOP production process for encapsulating to carry out pressure welding; Carry out plastic packaging after pressure welding, adopt the multistage injection moulding of vacuum suction and anti-absciss layer curing process during plastic packaging, then carry out cutting muscle, one-shot forming; Existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
High reliability SOP encapsulating lead of the present invention adopts many rows matrix frame that can meet high reliability, super large overall dimension pin cross arrangement structure, and ensure that the suitability process route of high reliability is produced, it is rational in infrastructure, process route practicality is also easy to realize, have that cost is low, energy-saving and emission-reduction, the advantages such as high reliability packaging part can be realized, contribute to SOP Realization of Product high-performance, large batch of instructions for use.
Accompanying drawing explanation
Fig. 1 is the structural representation of lead frame of the present invention.
Fig. 2 is the structural representation of encapsulation unit in lead frame shown in Fig. 1.
Fig. 3 is the local Fang great Tu of pin in lead frame of the present invention.
Fig. 4 is P place enlarged drawing in Fig. 2.
Fig. 5 is the structural representation of existing encapsulation unit.
In figure: 1. lead frame body, 2. encapsulation unit, 3. carrier, pin 4., 5. carrier link, 6. stable hole, 7. lock hole, 8. pit, 9. silver-plated ring, 10. capillary groove.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
As shown in Figure 1, lead frame of the present invention, comprises lead frame body 1, and the length L of lead frame body 1 is 269.6 ± 0.10mm, width H is 83.0 ± 0.05mm; Lead frame body 1 is provided with 240 encapsulation units 2, and all encapsulation units 2 are arranged on lead frame body 1 in 12 row 20 column matrix formulas.
See Fig. 2, encapsulation unit 2 in lead frame of the present invention, comprises carrier 3, the back side of carrier 3, is provided with the frame-shaped construction be made up of multiple silver-plated ring 9 along the periphery of carrier 3, this frame-shaped construction is interior, the back side of carrier 3 is provided with multiple square pit 8, the plurality of pit 8 matrix arrangement, carrier 3 both sides are respectively equipped with multiple interior pin 4, each interior pin 4 is equipped with the capillary groove 10 of the V-arrangement shown in lock hole 7 and Fig. 3, two other side of carrier 3 is respectively equipped with a carrier link 5, one end of carrier link 5 is connected with carrier 3, the size of carrier link 5 other end is greater than carrier link 5 and is connected with carrier 3 size of one end, the larger-size one end of carrier link 5 is provided with the stable hole 6 of rhombus, a diagonal of stable hole 6 and carrier link 5 axis coaxle, another cornerwise length of stable hole 6 is greater than the width of carrier link 5, to play stablizing effect better, roughening treatment is carried out on framework surface, and framework microcosmic surface is long-pending to be increased, and increases the adhesion of framework and plastic packaging material, as shown in Figure 4.
In SOP encapsulating lead of the present invention encapsulation unit 2 encapsulate with the existing SOP shown in Fig. 5 in compared with encapsulation unit, interior pin 4 has been set up lock hole 7 and capillary groove 10, the plastic packaging material on lead frame both sides is pulled in together by the plastic packaging material in lock hole 7 passing hole, framework is combined tightr with plastic packaging material; Capillary groove 10, by increasing the combination of framework and plastic packaging material, is prevented and is immersed by the moisture between framework and material, increases product reliability; Increase the size of carrier link 5 away from carrier 3 one end, and the stable hole 6 of rhombus is set at this end, to increase stability when being separated, its mechanism makes carrier more straight by stable hole 6 folding square structure, and by the lock glue effect of lock hole 7, pulling force when consumable products is separated, ensures that carrier does not stress, and increases reliability; Be provided with the pit 8 of matrix arrangement on carrier 3, substantially increase the adhesion of carrier 3 and encapsulating material, and the periphery at carrier 3 back side adopts the silver-plated ring 9 of matrix arrangement, farthest reduces silver-plated area, to reduce the probability of absciss layer; And roughening treatment is carried out to carrier element 2 surface, to reduce the absciss layer problem after encapsulating.
Multiple encapsulation unit 2 matrix arrangement is on lead frame body 1, pin in adjacent package unit 2 adopts IDF structure, namely in adjacent two encapsulation units 2, the pin of an encapsulation unit 2 extend between the pin of another encapsulation unit 2, effectively increases the utilance of frame material.
Present invention also offers a kind of method utilizing above-mentioned lead frame to produce SOP packaging part.This production method is specially: carry out the thinning and scribing of wafer by existing SOP production process for encapsulating, viscosity >=9000CP is adopted during upper core, the environment-friendly type bonding die glue of water absorption≤0.25%, by chip attach on SOP encapsulating lead of the present invention, after upper core, toast, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: be delivered in the solidification flow process case in seven different temperatures regions by the lead frame after load after upper core completes, these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C of degree, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C and 160 DEG C, product solidifies through the gradual change type of the warm area of different temperatures, carry out in product transmittance process fast fully cross-linking reaction thus when passing out consolidation zone bonding die glue obtain solidifying fast and fully, effectively improve the cavity that conventional baking process causes, climb the problem that glue etc. affects product reliability, the cleaning of baking post plasma, ensures that product is strong and closes quality, and quality problems occur to prevent that solder joint from coming off etc., existing SOP production process for encapsulating is adopted to carry out pressure welding, after pressure welding, the environment-friendly materials meeting European Union WEEE, ROHS and Sony's standard of employing coefficient of expansion α 1≤1, water absorption < 0.3% and filer content > 80% carry out plastic packaging, to improve the sticking strength of chip and framework and the affinity with plastic packaging material, reduce the generation of product absciss layer, improve product reliability, the multistage injection moulding of vacuum suction and anti-absciss layer curing process is adopted during plastic packaging, its injection pressure 1000 ~ 1200Psi, injection time 8 ~ 12s, mold temperature 160 ~ 180 DEG C, clamping pressure 115 ~ 135ton, curing time 70 ~ 100s, after plastic packaging at the temperature of 175 ~ 180 DEG C Post RDBMS 7 hours, to ensure product quality, then carry out cutting muscle, one-shot forming, effectively prevent the impact on product quality in rear processing procedure, existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
SOP packaging part production method of the present invention is the same with the production procedure of conventional SOP plastic packaged integrated circuit, during encapsulation, colloid used keeps original and meets the thick size of JEDEC standard length and width, specifically be of a size of: long × wide × high (mm)=9.9 × 3.9 × 1.4, pitted skin process is carried out on surface, single push rod, draft angle 12 °.The main distinction is between the two; Production method of the present invention is different at production line, material therefor and some processes.
Along with the raising of lead frame stamping technology and plastic package technology equipment, the production capacity of many row's frameworks possesses, and therefore Huatian Science & Technology Co., Ltd., Tianshui determines exploitation many rows matrix form framework and produces the technique of SOP packaging part.Frame material and plastic packaging material can be utilized to the utmost, improve production efficiency and product quality, reduce by mistake wrong rate and security risk, be one reduce costs, the effective way of energy-saving and emission-reduction.
embodiment 1
The wire frame body that making length L is 269.6 ± 0.10mm, width H is 83.0 ± 0.05mm, lead frame body is established 240 encapsulation units, and all encapsulation units are 12 row 20 column matrix formula arrangements.Encapsulation unit, comprises carrier, the carrier back side, is provided with the frame-shaped construction be made up of multiple silver-plated ring along the periphery of carrier, and in this frame-shaped construction, the back side of carrier is provided with the pit of multiple square matrix arrangement; Carrier both sides are respectively equipped with multiple interior pin, each interior pin is respectively equipped with the capillary groove of lock hole and V-arrangement, two other side of carrier is respectively equipped with a carrier link, one end of carrier link is connected with carrier, the size of the carrier link other end is greater than carrier link and is connected with carrier the size of one end, the larger-size one end of carrier link is provided with the stable hole of rhombus, a diagonal of stable hole and carrier link axis coaxle, another cornerwise length of stable hole is greater than the width of carrier link; Framework surface roughening treatment.Thinning and the scribing of wafer is carried out by existing SOP production process for encapsulating, adopt viscosity >=9000CP, the environment-friendly type bonding die glue of water absorption≤0.25%, by chip attach on SOP encapsulating lead of the present invention, after upper core, toast, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: be delivered in the solidification flow process case in seven different temperatures regions by the lead frame after load after upper core completes, these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C and 160 DEG C, the cleaning of baking post plasma, existing SOP production process for encapsulating is adopted to carry out pressure welding, after pressure welding, the environment-friendly materials meeting European Union WEEE, ROHS and Sony's standard of employing coefficient of expansion α 1≤1, water absorption < 0.3% and filer content > 80% carry out plastic packaging, the multistage injection moulding of vacuum suction and anti-absciss layer curing process is adopted during plastic packaging, its injection pressure 1000Psi, injection time 12s, mold temperature 160 DEG C, clamping pressure 115ton, curing time 100s, after plastic packaging at the temperature of 175 DEG C Post RDBMS 7 hours, to ensure product quality, then carry out cutting muscle, one-shot forming, effectively prevent the impact on product quality in rear processing procedure, existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
embodiment 2
The wire frame body that making length L is 269.6 ± 0.10mm, width H is 83.0 ± 0.05mm, lead frame body is established 240 encapsulation units, and all encapsulation units are 12 row 20 column matrix formula arrangements.Encapsulation unit, comprises carrier, the carrier back side, is provided with the frame-shaped construction be made up of multiple silver-plated ring along the periphery of carrier, and in this frame-shaped construction, the back side of carrier is provided with the pit of multiple square matrix arrangement; Carrier both sides are respectively equipped with multiple interior pin, each interior pin is respectively equipped with the capillary groove of lock hole and V-arrangement, two other side of carrier is respectively equipped with a carrier link, one end of carrier link is connected with carrier, the size of the carrier link other end is greater than carrier link and is connected with carrier the size of one end, the larger-size one end of carrier link is provided with the stable hole of rhombus, a diagonal of stable hole and carrier link axis coaxle, another cornerwise length of stable hole is greater than the width of carrier link; Framework surface roughening treatment.Thinning and the scribing of wafer is carried out by existing SOP production process for encapsulating, adopt viscosity >=9000CP, the environment-friendly type bonding die glue of water absorption≤0.25%, by chip attach on SOP encapsulating lead of the present invention, after upper core, toast, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: be delivered in the solidification flow process case in seven different temperatures regions by the lead frame after load after upper core completes, these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C and 160 DEG C, the cleaning of baking post plasma, existing SOP production process for encapsulating is adopted to carry out pressure welding, after pressure welding, the environment-friendly materials meeting European Union WEEE, ROHS and Sony's standard of employing coefficient of expansion α 1≤1, water absorption < 0.3% and filer content > 80% carry out plastic packaging, the multistage injection moulding of vacuum suction and anti-absciss layer curing process is adopted during plastic packaging, its injection pressure 1200Psi, injection time 8s, mold temperature 180 DEG C, clamping pressure 135ton, curing time 70s, after plastic packaging at the temperature of 180 DEG C Post RDBMS 7 hours, to ensure product quality, then carry out cutting muscle, one-shot forming, effectively prevent the impact on product quality in rear processing procedure, existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
embodiment 3
The wire frame body that making length L is 269.6 ± 0.10mm, width H is 83.0 ± 0.05mm, lead frame body is established 240 encapsulation units, and all encapsulation units are 12 row 20 column matrix formula arrangements.Encapsulation unit, comprises carrier, the carrier back side, is provided with the frame-shaped construction be made up of multiple silver-plated ring along the periphery of carrier, and in this frame-shaped construction, the back side of carrier is provided with the pit of multiple square matrix arrangement; Carrier both sides are respectively equipped with multiple interior pin, each interior pin is respectively equipped with the capillary groove of lock hole and V-arrangement, two other side of carrier is respectively equipped with a carrier link, one end of carrier link is connected with carrier, the size of the carrier link other end is greater than carrier link and is connected with carrier the size of one end, the larger-size one end of carrier link is provided with the stable hole of rhombus, a diagonal of stable hole and carrier link axis coaxle, another cornerwise length of stable hole is greater than the width of carrier link; Framework surface roughening treatment.Thinning and the scribing of wafer is carried out by existing SOP production process for encapsulating, adopt viscosity >=9000CP, the environment-friendly type bonding die glue of water absorption≤0.25%, by chip attach on SOP encapsulating lead of the present invention, after upper core, toast, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: be delivered in the solidification flow process case in seven different temperatures regions by the lead frame after load after upper core completes, these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C and 160 DEG C, the cleaning of baking post plasma, existing SOP production process for encapsulating is adopted to carry out pressure welding, after pressure welding, the environment-friendly materials meeting European Union WEEE, ROHS and Sony's standard of employing coefficient of expansion α 1≤1, water absorption < 0.3% and filer content > 80% carry out plastic packaging, the multistage injection moulding of vacuum suction and anti-absciss layer curing process is adopted during plastic packaging, its injection pressure 1100Psi, injection time 10s, mold temperature 170 DEG C, clamping pressure 125ton, curing time 85s, after plastic packaging at the temperature of 178 DEG C Post RDBMS 7 hours, to ensure product quality, then carry out cutting muscle, one-shot forming, effectively prevent the impact on product quality in rear processing procedure, existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
Claims (8)
1. a high reliability SOP encapsulating lead, is characterized in that, comprises lead frame body (1), and lead frame body (1) matrix arrangement has 240 encapsulation units (2);
Encapsulation unit (2), comprises carrier (3), the back side of carrier (3), is provided with the frame-shaped construction be made up of multiple silver-plated ring (9) along the periphery of carrier (3), and in this frame-shaped construction, the back side of carrier (3) is provided with multiple square pit (8); Carrier (3) both sides are respectively equipped with multiple interior pin (4), each interior pin (4) is equipped with the capillary groove (10) of lock hole (7) and V-arrangement, carrier (3) two other side is respectively equipped with a carrier link (5), one end of carrier link (5) is connected with carrier (3), the size of carrier link (5) other end is greater than carrier link (5) and is connected with carrier (3) size of one end, and carrier link (5) larger-size one end is provided with the stable hole (6) of rhombus.
2. high reliability SOP encapsulating lead according to claim 1, is characterized in that, the length of described lead frame body (1) is 269.6 ± 0.10mm, width is 83.0 ± 0.05mm.
3. high reliability SOP encapsulating lead according to claim 1, it is characterized in that, all encapsulation units (2) are arranged on lead frame body (1) in 12 row 20 column matrix formulas.
4. high reliability SOP encapsulating lead according to claim 1, it is characterized in that, a diagonal of stable hole (6) and carrier link (5) axis coaxle, another cornerwise length of stable hole (6) is greater than the width of carrier link (5).
5. utilize high reliability SOP encapsulating lead described in claim 1 to produce a method for SOP packaging part, it is characterized in that, the method is specially: carry out the thinning and scribing of wafer by existing SOP production process for encapsulating; Get lead frame, this lead frame comprises lead frame body (1), and lead frame body (1) matrix arrangement has 240 encapsulation units (2);
Encapsulation unit (2), comprises carrier (3), the back side of carrier (3), is provided with the frame-shaped construction be made up of multiple silver-plated ring (9) along the periphery of carrier (3), and in this frame-shaped construction, the back side of carrier (3) is provided with multiple square pit (8); Carrier (3) both sides are respectively equipped with multiple interior pin (4), each interior pin (4) is equipped with the capillary groove (10) of lock hole (7) and V-arrangement, carrier (3) two other side is respectively equipped with a carrier link (5), one end of carrier link (5) is connected with carrier (3), the size of carrier link (5) other end is greater than carrier link (5) and is connected with carrier (3) size of one end, and carrier link (5) larger-size one end is provided with the stable hole (6) of rhombus;
By chip attach on got lead frame; Toast, seven different warm area rapid curing anti-absciss layer baking process are adopted during baking, the detailed process of the anti-absciss layer baking process of this rapid curing is: these seven temperature provinces are arranged up and down, framework is delivered to the first warm area after upper core, through the primary solidification of the first warm area, be delivered to second warm area, until outlet product has obtained sufficient cross-linking reaction, the temperature of each consolidation zone adopts the gradual change type temperature difference, and the temperature from the first temperature province to the 7th temperature province is respectively 160 DEG C, 180 DEG C, 200 DEG C, 200 DEG C, 200 DEG C, 180 DEG C, 160 DEG C; The cleaning of baking post plasma, adopts existing SOP production process for encapsulating to carry out pressure welding; Carry out plastic packaging after pressure welding, adopt the multistage injection moulding of vacuum suction and anti-absciss layer curing process during plastic packaging, then carry out cutting muscle, one-shot forming; Existing SOP production process for encapsulating is adopted to carry out printing, testing again, obtained SOP packaging part.
6. the production method of SOP packaging part according to claim 5, is characterized in that, adopts the environment-friendly type bonding die glue of viscosity >=9000CP, water absorption≤0.25% by chip attach on lead frame.
7. adopt the environment-friendly materials meeting European Union WEEE, ROHS and Sony's standard to carry out plastic packaging.
8. the production method of SOP packaging part according to claim 5, it is characterized in that, during plastic packaging: injection pressure 1000 ~ 1200Psi, injection time 8 ~ 12s, mold temperature 160 ~ 180 DEG C, clamping pressure 115 ~ 135ton, curing time 70 ~ 100s, after plastic packaging at the temperature of 175 ~ 180 DEG C Post RDBMS 7 hours.
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