CN104736469B - 用于形成埋式下电极连同封装的mems装置的系统和方法 - Google Patents

用于形成埋式下电极连同封装的mems装置的系统和方法 Download PDF

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Publication number
CN104736469B
CN104736469B CN201380048541.5A CN201380048541A CN104736469B CN 104736469 B CN104736469 B CN 104736469B CN 201380048541 A CN201380048541 A CN 201380048541A CN 104736469 B CN104736469 B CN 104736469B
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China
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layer
contact
electrode
silicon
wafer
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Chinese (zh)
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CN104736469A (zh
Inventor
A·B·格雷厄姆
A·费伊
G·奥布赖恩
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092—Buried interconnects in the substrate or in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201380048541.5A 2012-08-21 2013-08-20 用于形成埋式下电极连同封装的mems装置的系统和方法 Active CN104736469B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261691662P 2012-08-21 2012-08-21
US61/691,662 2012-08-21
PCT/US2013/055668 WO2014031570A1 (en) 2012-08-21 2013-08-20 System and method for forming a buried lower electrode in conjunction with an encapsulated mems device

Publications (2)

Publication Number Publication Date
CN104736469A CN104736469A (zh) 2015-06-24
CN104736469B true CN104736469B (zh) 2017-12-26

Family

ID=49085201

Family Applications (1)

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CN201380048541.5A Active CN104736469B (zh) 2012-08-21 2013-08-20 用于形成埋式下电极连同封装的mems装置的系统和方法

Country Status (6)

Country Link
US (1) US10160632B2 (https=)
JP (1) JP6272329B2 (https=)
CN (1) CN104736469B (https=)
DE (1) DE112013004119B4 (https=)
TW (1) TWI623027B (https=)
WO (1) WO2014031570A1 (https=)

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DE102012210049A1 (de) * 2012-06-14 2013-12-19 Robert Bosch Gmbh Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
CN105174203B (zh) * 2014-05-28 2016-09-28 无锡华润上华半导体有限公司 基于mems的传感器的制作方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
DE102015203393A1 (de) * 2015-02-25 2016-08-25 Infineon Technologies Ag Halbleiterelement und Verfahren zu Herstellen von diesem
CN105540528A (zh) * 2015-12-14 2016-05-04 中国科学院半导体研究所 Mems电容式超声波传感器及其制备方法
EP3397587B1 (en) * 2015-12-30 2019-11-20 Robert Bosch GmbH System and method for maintaining a smoothed surface on a mems device
US10513429B2 (en) * 2016-07-27 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US10466126B2 (en) * 2018-02-27 2019-11-05 Globalfoundries Inc. MEMS capacitive pressure sensors in fully depleted semiconductor on insulator (FDSOI)
DE102018210815A1 (de) * 2018-06-30 2020-01-02 Robert Bosch Gmbh Elektrische Kontaktierung, Verfahren zur Herstellung einer elektrischen Kontaktierung, System
EP3885042A1 (en) 2020-03-24 2021-09-29 Imec VZW Method for fabricating a microfluidic device
IT202000011755A1 (it) * 2020-05-20 2021-11-20 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo micro-elettro-meccanico, in particolare sensore di movimento con comando/rilevazione di tipo capacitivo, e relativo dispositivo mems
DE102022208515A1 (de) * 2022-08-17 2024-02-22 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Siliziumschichtsystems mit elektrischen Verbindungen
DE102022208514A1 (de) * 2022-08-17 2024-02-22 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von mikroelektromechanischen Strukturen

Citations (6)

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CN1577856A (zh) * 2003-07-25 2005-02-09 台湾积体电路制造股份有限公司 电容装置及其制造方法
CN1964044A (zh) * 2005-11-11 2007-05-16 台湾积体电路制造股份有限公司 半导体结构与隔绝一第一电路和一第二电路的方法
WO2007135682A2 (en) * 2006-05-22 2007-11-29 Audio Pixels Ltd. Apparatus for generating pressure and methods of manufacture thereof
CN101953174A (zh) * 2007-11-21 2011-01-19 奥迪欧彼塞尔斯有限公司 数字扬声器装置
DE102010062555A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Mikromechanische Membranvorrichtung und entsprechendes Herstellungsverfahren
CN102602877A (zh) * 2006-10-20 2012-07-25 精工爱普生株式会社 Mems器件

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ES2342872B1 (es) 2009-05-20 2011-05-30 Baolab Microsystems S.L. Chip que comprende un mems dispuesto en un circuito integrado y procedimiento de fabricacion correspondiente.
US8563345B2 (en) * 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
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IT1400096B1 (it) * 2010-05-12 2013-05-17 St Microelectronics Srl Processo di fabbricazione di circuiti elettronici integrati e circuiti cosi' ottenuti
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Publication number Priority date Publication date Assignee Title
CN1577856A (zh) * 2003-07-25 2005-02-09 台湾积体电路制造股份有限公司 电容装置及其制造方法
CN1964044A (zh) * 2005-11-11 2007-05-16 台湾积体电路制造股份有限公司 半导体结构与隔绝一第一电路和一第二电路的方法
WO2007135682A2 (en) * 2006-05-22 2007-11-29 Audio Pixels Ltd. Apparatus for generating pressure and methods of manufacture thereof
CN102602877A (zh) * 2006-10-20 2012-07-25 精工爱普生株式会社 Mems器件
CN101953174A (zh) * 2007-11-21 2011-01-19 奥迪欧彼塞尔斯有限公司 数字扬声器装置
DE102010062555A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Mikromechanische Membranvorrichtung und entsprechendes Herstellungsverfahren

Also Published As

Publication number Publication date
DE112013004119T5 (de) 2015-05-28
JP6272329B2 (ja) 2018-01-31
CN104736469A (zh) 2015-06-24
US20140054730A1 (en) 2014-02-27
WO2014031570A1 (en) 2014-02-27
JP2015527211A (ja) 2015-09-17
TWI623027B (zh) 2018-05-01
TW201417152A (zh) 2014-05-01
US10160632B2 (en) 2018-12-25
DE112013004119B4 (de) 2024-09-19

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