CN104732902B - 显示基板、显示面板及显示装置 - Google Patents
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- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
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- 230000006835 compression Effects 0.000 description 1
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Abstract
本发明涉及一种显示基板、显示面板和显示装置。所述显示基板包括柔性电路板和测试焊盘,所述柔性电路板覆盖所述测试焊盘所在区域。上述显示基板中,柔性电路板覆盖测试焊盘所在区域,可以避免测试焊盘上的测试点与外界接触,防止测试点被腐蚀,及由此而导致的在显示过程中信号线中的信号异常;与现有技术相比,这样省去了在测试焊盘上涂覆UV胶的工艺,从而减少了工艺流程,提高了生产效率和产能,并且还可以降低显示基板的厚度,有助于使显示面板更加轻薄。
Description
技术领域
本发明涉及显示技术领域,具体地,涉及一种显示基板,包含所述显示基板的显示面板,以及包含所述显示面板的显示装置。
背景技术
在显示面板制备完成后,需要对显示面板进行检测,以确定显示面板是否存在缺陷。为便于进行检测,一般在显示基板(通常为阵列基板)上设置测试焊盘(pad),在检测时,使用测试探针与测试焊盘上的测试点接触,而所述测试点与信号线连接,从而,通过测试探针、测试点可以向信号线中输入检测信号,检测显示面板是否存在缺陷。
图1为现有的显示基板的示意图;图2为图1所示显示基板中测试焊盘的示意图。如图1和图2所示,显示基板的边缘区域设置有驱动芯片1,驱动芯片1与显示基板的像素单元之间设置有将其连接的信号线;在驱动芯片1的两侧设置有测试焊盘2,所述测试焊盘2与信号线连接。此外,显示基板的边缘还设有柔性电路板3,所述柔性电路板3用于将显示基板与印刷电路板(图中未示出)连接。
在上述显示基板中,测试焊盘2上的测试点为暴露的导电金属区,其容易在大气环境中被腐蚀,而测试点被腐蚀会导致信号线中的信号异常,从而会导致显示面板的损坏。因此,在完成对显示面板的检测后,需要在测试焊盘2处涂覆UV胶,保护电路,避免测试点被腐蚀;显然,在测试焊盘2处涂覆UV胶会降低显示面板的生产效率,降低产能,并且,还会导致显示面板的厚度增加。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一,提出了一种显示基板、显示面板及显示装置,其可以省去在显示基板上涂覆UV胶的工艺,从而提高生产效率和产能,并可以降低显示面板的厚度。
为实现本发明的目的而提供一种显示基板,包括柔性电路板和测试焊盘,所述柔性电路板覆盖所述测试焊盘所在区域。
其中,所述显示基板为阵列基板。
其中,所述柔性电路板内设置有导线,所述导线的一端与测试焊盘连接,另一端用于与测试探针连接。
其中,所述柔性电路板包括测试电路,且所述测试电路能与所述测试焊盘电连接。
其中,所述测试焊盘为正方形。
其中,所述测试焊盘的宽度与所述柔性电路板的宽度相等。
其中,所述显示基板的位于柔性电路板的两个相对侧的区域均设置有测试焊盘。
作为另一个技术方案,本发明还提供一种显示面板,所述显示面板包括本发明提供的上述显示基板。
作为另一个技术方案,本发明还提供一种显示装置,所述显示装置包括本发明提供的上述显示面板。
本发明具有以下有益效果:
本发明提供的显示基板,其柔性电路板覆盖测试焊盘所在区域,可以避免测试焊盘上的测试点与外界接触,防止测试点被腐蚀,及由此而导致的在显示过程中信号线中的信号异常;与现有技术相比,这样省去了在测试焊盘上涂覆UV胶的工艺,从而减少了工艺流程,提高了生产效率和产能,并且还可以降低显示基板的厚度,有助于使显示面板更加轻薄。
本发明提供的显示面板,其采用本发明提供的上述显示基板,可以省去在测试焊盘上涂覆胶的工艺,减少工艺流程,提高生产效率和产能,并且还可以降低显示面板的厚度,有助于使显示面板更加轻薄。
本发明提供的显示装置,其采用本发明提供的上述显示面板,可以省去在测试焊盘上涂覆胶的工艺,减少工艺流程,提高生产效率和产能,并且还可以降低显示装置的厚度,有助于使显示装置更加轻薄。
附图说明
附图是用来提供对本发明的进一步理解,并且构成说明书的一部分,与下面的具体实施方式一起用于解释本发明,但并不构成对本发明的限制。在附图中:
图1为现有的显示基板的示意图;
图2为图1所示显示基板中测试焊盘的示意图;
图3为本发明实施方式提供的显示基板的示意图;
图4为测试焊盘为正方形时显示基板的示意图;
图5为测试焊盘的宽度与柔性电路板的宽度相等时显示基板的示意图。
其中,附图标记:
1:显示基板;2:测试焊盘;3:柔性电路板;4:辅助柔性电路板。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本发明,并不用于限制本发明。
本发明提供一种显示基板的实施方式,图3为本发明实施方式提供的显示基板的示意图。如图1所示,在本实施方式中,显示基板1包括柔性电路板3和测试焊盘2,所述柔性电路板3覆盖所述测试焊盘2所在区域。具体地,所述显示基板1一般为阵列基板。
在制备显示基板时,在将薄膜晶体管、像素电极,以及栅线、数据线等信号线制备完成之后,将测试探针与测试焊盘2上的测试点接触,向各信号线中输入信号,从而检测所述显示基板1是否存在缺陷。在上述检测过程完成后,将柔性电路板3安装在显示基板1上,并且使柔性电路板3覆盖测试焊盘2所在区域,从而可以避免测试焊盘2上的测试点与外界接触,防止测试点被腐蚀,及由此而导致的在显示过程中信号线中的信号异常。与现有技术相比,这样省去了在测试焊盘2上涂覆UV胶的工艺,从而减少了工艺流程,提高了生产效率和产能,并且还可以降低显示基板的厚度,有助于使显示面板更加轻薄。
优选地,所述柔性电路板3内可以设置有导线(图中未示出),所述导线的一端与测试焊盘2连接,另一端用于与测试探针连接。这样设置使在将柔性电路板3设置到显示基板1上之后,也可以进行对显示基板1的检测。
此外,所述柔性电路板3还可以包括测试电路,所述测试电路能与所述测试焊盘2电连接。在此情况下,将柔性电路板3覆盖在测试焊盘2所在区域后,使测试电路与测试焊盘2电连接之后就可以对显示基板1进行检测,这样相比上述使用测试探针进行检测的方式更加方便,且效率更高。
通过对比图2和图3可知,由于柔性电路板3需要覆盖测试焊盘2,在本实施方式中,将测试焊盘2在显示基板1上的位置移动至更边缘的区域,并将其形状设置为长条形,且其长度小于柔性电路板3的宽度(即图3中的纵向距离),这样在满足将测试焊盘2覆盖,以及将信号线的与测试焊盘2的连接点覆盖的基础上,使柔性电路板在具有较小面积,从而有助于减小显示面板的边框的尺寸,即:可以实现窄边框。
除图3所示实施例外,在本实施方式中,测试焊盘2还可以如图4所示,即:测试焊盘2为正方形;这样设置可以在测试焊盘2的宽度(即图4中的纵向距离)不变的情况下,使测试焊盘2具有较大的面积,从而便于检测,在测试焊盘2中设置较多的测试点。可以理解,在此情况下,相比测试焊盘2如图3所示的情形,在本实施例中,测试焊盘2的长度更大,相应地,为了覆盖测试焊盘2,柔性电路板3的长度也需要相应更大(即图4中横向的距离)。
此外,在本实施方式中,还可以如图5所示,即:所述测试焊盘2的宽度(即图5中的纵向距离)与所述柔性电路板3的宽度相等。容易理解,柔性电路板3仅能将测试焊盘2覆盖,在此情况下,需要设置辅助柔性电路板4将信号线的与测试焊盘2的连接点覆盖,以避免信号线被腐蚀。与测试焊盘2如图3所示的情形相比,在本实施例中,测试焊盘2的面积更大,从而可以便于检测,以及在测试焊盘2中设置较多的测试点。而与测试焊盘2如图4所示的情形相比,在本实施例中,测试焊盘2的长度更小,从而使柔性电路板3的长度可以更小。
在本实施方式中,优选地,所述显示基板1的位于柔性电路板3的两个相对侧的区域均设置有测试焊盘2。这样设置可以对显示面板的不同区域进行检测,也可以提高检测效率。
本发明实施方式提供的显示基板1,其柔性电路板3覆盖测试焊盘2所在区域,可以避免测试焊盘2上的测试点与外界接触,防止测试点被腐蚀,及由此而导致的在显示过程中信号线中的信号异常;与现有技术相比,这样省去了在测试焊盘2上涂覆UV胶的工艺,从而减少了工艺流程,提高了生产效率和产能,并且还可以降低显示基板的厚度,有助于使显示面板更加轻薄。
作为另一个技术方案,本发明还提供一种显示面板的实施方式,在本实施方式中,所述显示面板包括本发明上述实施方式提供的显示基板。
本发明实施方式提供的显示面板,其采用本发明上述实施方式提供的显示基板,可以省去在测试焊盘上涂覆胶的工艺,减少工艺流程,提高生产效率和产能,并且还可以降低显示面板的厚度,有助于使显示面板更加轻薄。
作为另一个技术方案,本发明还提供一种显示装置的实施方式,在本实施方式中,所述显示装置包括本发明上述实施方式提供的显示面板。
本发明实施方式提供的显示装置,其采用本发明上述实施方式提供的显示面板,可以省去在测试焊盘上涂覆胶的工艺,减少工艺流程,提高生产效率和产能,并且还可以降低显示装置的厚度,有助于使显示装置更加轻薄。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。
Claims (7)
1.一种显示基板,包括柔性电路板和测试焊盘,其特征在于,所述柔性电路板覆盖所述测试焊盘所在区域;
所述柔性电路板内设置有导线,所述导线的一端与测试焊盘连接,另一端用于与测试探针连接;或者
所述柔性电路板包括测试电路,且所述测试电路能与所述测试焊盘电连接。
2.根据权利要求1所述的显示基板,其特征在于,所述显示基板为阵列基板。
3.根据权利要求1所述的显示基板,其特征在于,所述测试焊盘为正方形。
4.根据权利要求1所述的显示基板,其特征在于,所述测试焊盘的宽度与所述柔性电路板的宽度相等。
5.根据权利要求1所述的显示基板,其特征在于,所述显示基板的位于柔性电路板的两个相对侧的区域均设置有测试焊盘。
6.一种显示面板,其特征在于,所述显示面板包括权利要求1~5任意一项所述的显示基板。
7.一种显示装置,其特征在于,包括权利要求6所述的显示面板。
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CN107683020A (zh) * | 2017-10-17 | 2018-02-09 | 京东方科技集团股份有限公司 | 一种显示面板、其检测方法、柔性电路板及显示装置 |
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