CN104704035B - 用于水清除层的可辐射固化的组合物及其制备方法 - Google Patents

用于水清除层的可辐射固化的组合物及其制备方法 Download PDF

Info

Publication number
CN104704035B
CN104704035B CN201380038541.7A CN201380038541A CN104704035B CN 104704035 B CN104704035 B CN 104704035B CN 201380038541 A CN201380038541 A CN 201380038541A CN 104704035 B CN104704035 B CN 104704035B
Authority
CN
China
Prior art keywords
acrylate
meth
component
organic layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380038541.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN104704035A (zh
Inventor
E·加兰德
Z·贝尔巴克拉
R·弗兰茨
Z·谢考伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Coatings GmbH
Original Assignee
BASF Coatings GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF Coatings GmbH filed Critical BASF Coatings GmbH
Publication of CN104704035A publication Critical patent/CN104704035A/zh
Application granted granted Critical
Publication of CN104704035B publication Critical patent/CN104704035B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN201380038541.7A 2012-07-19 2013-07-16 用于水清除层的可辐射固化的组合物及其制备方法 Active CN104704035B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12177006 2012-07-19
EP12177006.9 2012-07-19
PCT/EP2013/065012 WO2014012931A1 (en) 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN104704035A CN104704035A (zh) 2015-06-10
CN104704035B true CN104704035B (zh) 2018-10-19

Family

ID=48795574

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380038541.7A Active CN104704035B (zh) 2012-07-19 2013-07-16 用于水清除层的可辐射固化的组合物及其制备方法

Country Status (9)

Country Link
US (1) US10559777B2 (https=)
EP (1) EP2875070B1 (https=)
JP (1) JP6270837B2 (https=)
KR (1) KR102108867B1 (https=)
CN (1) CN104704035B (https=)
HK (1) HK1207874A1 (https=)
MY (1) MY176545A (https=)
SG (1) SG11201500374RA (https=)
WO (1) WO2014012931A1 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201500374RA (en) 2012-07-19 2015-02-27 Rolic Ag Radiation curable composition for water scavenging layer, and method of manufacturing the same
JP6247125B2 (ja) * 2014-03-20 2017-12-13 積水化学工業株式会社 有機光デバイスの製造方法
US9909022B2 (en) 2014-07-25 2018-03-06 Kateeva, Inc. Organic thin film ink compositions and methods
ES2983074T3 (es) 2014-07-31 2024-10-21 Basf Coatings Gmbh Estructura de encapsulación para una pantalla OLED que incorpora propiedades antirreflectantes
US20170271621A1 (en) * 2014-08-22 2017-09-21 Oledworks Gmbh Light-emitting device
KR20160053750A (ko) * 2014-10-29 2016-05-13 삼성에스디아이 주식회사 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
CN107109083B (zh) * 2014-12-18 2021-01-08 巴斯夫涂料有限公司 包含亲水纳米颗粒的可辐射固化的组合物
JP2018511157A (ja) * 2015-01-29 2018-04-19 モメンティブ・パフォーマンス・マテリアルズ・コリア・カンパニー・リミテッドＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ Ｋｏｒｅａ Ｃｏ．，Ｌｔｄ 有機電子素子封止材用組成物およびこれを用いて形成された封止材
WO2016160703A1 (en) 2015-03-27 2016-10-06 Harrup Mason K All-inorganic solvents for electrolytes
EP3344712A4 (en) 2015-08-31 2019-05-15 Kateeva, Inc. DI AND MONO (METH) ACRYLATE BASED ORGANIC THIN LAYER INK COMPOSITIONS
JP2019504337A (ja) * 2015-11-20 2019-02-14 コーニング インコーポレイテッド 光拡散装置のための光変換コーティング
KR20170127263A (ko) * 2016-05-11 2017-11-21 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
KR20170127267A (ko) * 2016-05-11 2017-11-21 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
KR102406867B1 (ko) * 2016-06-16 2022-06-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노입자 충전된 배리어 접착제 조성물
KR102497896B1 (ko) * 2016-09-16 2023-02-08 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로 루미네선스 표시 소자용 봉지제
US10707531B1 (en) 2016-09-27 2020-07-07 New Dominion Enterprises Inc. All-inorganic solvents for electrolytes
WO2018074505A1 (ja) * 2016-10-19 2018-04-26 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
JP6404496B2 (ja) * 2016-10-19 2018-10-10 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
CN108781490B (zh) * 2016-10-19 2021-11-12 积水化学工业株式会社 有机el显示元件用密封剂
JP6404495B2 (ja) * 2016-10-19 2018-10-10 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
KR102416054B1 (ko) * 2016-10-19 2022-07-01 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제 및 유기 el 표시 소자용 봉지제의 제조 방법
JP6649243B2 (ja) * 2016-12-27 2020-02-19 双葉電子工業株式会社 乾燥剤組成物、封止構造、及び有機ｅｌ素子
JP6887258B2 (ja) * 2017-01-27 2021-06-16 デンカ株式会社 組成物
TWI841527B (zh) * 2017-04-21 2024-05-11 美商凱特伊夫公司 用於形成有機薄膜的組成物和技術
JP6369790B1 (ja) * 2017-08-09 2018-08-08 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP6936330B2 (ja) * 2017-10-26 2021-09-15 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP6493845B1 (ja) * 2017-12-08 2019-04-03 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
US11732074B2 (en) 2018-03-23 2023-08-22 Kateeva, Inc. Compositions and techniques for forming organic thin films
CN111937493B (zh) * 2018-04-20 2024-09-06 积水化学工业株式会社 有机el显示元件用密封剂和顶部发射型有机el显示元件
WO2019203120A1 (ja) * 2018-04-20 2019-10-24 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
JP7281758B2 (ja) * 2018-05-31 2023-05-26 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP7153870B2 (ja) * 2018-05-31 2022-10-17 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP2019212399A (ja) * 2018-05-31 2019-12-12 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
US10734605B2 (en) * 2018-07-19 2020-08-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible OLED device and manufacturing method thereof
KR102794145B1 (ko) * 2019-06-04 2025-04-11 주식회사 동진쎄미켐 광중합성 조성물 및 이를 이용한 경화막, 표시장치
GB201909269D0 (en) * 2019-06-27 2019-08-14 Johnson Matthey Plc Layered sorbent structures
JP7783184B2 (ja) * 2020-02-20 2025-12-09 ドンジン セミケム カンパニー リミテッド 光重合性組成物、これから形成された光学部材および表示装置
CN114267809B (zh) 2021-12-15 2023-11-03 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
KR20250006134A (ko) * 2022-04-29 2025-01-10 쓰리엠 이노베이티브 프로퍼티즈 컴파니 물-격리제를 갖는 경화성 고굴절률 잉크 조성물
US20240150611A1 (en) * 2022-10-17 2024-05-09 Pi Advanced Materials Co., Ltd. Polyamic acid varnish
US20240327665A1 (en) * 2023-03-28 2024-10-03 Canon Kabushiki Kaisha Photocurable composition
CN121752677A (zh) * 2023-06-27 2026-03-27 3M创新有限公司 具有水螯合剂的可固化油墨组合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050146544A1 (en) * 2001-12-21 2005-07-07 Ai Kondo Ink composition and a method for ink jet recording
CN1771127A (zh) * 2003-04-02 2006-05-10 3M创新有限公司 挠性高温超阻挡物
CN101423675A (zh) * 2008-11-25 2009-05-06 四川大学 一种用于塑料表面防静电的紫外光固化涂料及其制备方法
CN101518151A (zh) * 2006-11-06 2009-08-26 新加坡科技研究局 纳米粒子封装阻障叠层

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19716239A1 (de) * 1997-04-18 1998-10-22 Basf Ag Verfahren zur Polymerisation von alpha-Olefinen in der Gasphase
US6950534B2 (en) * 1998-08-10 2005-09-27 Cybernet Systems Corporation Gesture-controlled interfaces for self-service machines and other applications
US6618866B1 (en) * 2000-02-08 2003-09-16 Sealand Technology, Inc. Vacuum tank construction
AU2002221022A1 (en) * 2000-12-06 2002-06-18 Printar Ltd. Uv curable ink-jet legend ink for printing on printed circuit boards
DE602004018231D1 (de) * 2003-06-10 2009-01-22 Dainippon Printing Co Ltd Projektionsschirm und Projektionssystem
US7123280B2 (en) * 2003-09-29 2006-10-17 Konica Minolta Photo Imaging, Inc. Thermal transfer image receiving sheet and image forming method using the same
JP5062648B2 (ja) * 2004-04-08 2012-10-31 双葉電子工業株式会社 有機ｅｌ素子用水分吸収剤
US20060134400A1 (en) * 2004-12-17 2006-06-22 Nitto Denko Corporation Hard-coated film and method of manufacturing the same
US8053984B2 (en) 2008-05-26 2011-11-08 Lg Display Co., Ltd. Organic light emitting diode display
JP5596920B2 (ja) 2008-11-28 2014-09-24 日揮触媒化成株式会社 透明被膜形成用塗料および透明被膜付基材
US8331750B2 (en) * 2010-02-01 2012-12-11 Enlighting Inc Optical fibers having a surface light field emulation (s-LiFE) segment and method of making the same
EP2445029A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Multilayered protective layer, organic opto-electric device and method of manufacturing the same
SG11201500374RA (en) 2012-07-19 2015-02-27 Rolic Ag Radiation curable composition for water scavenging layer, and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050146544A1 (en) * 2001-12-21 2005-07-07 Ai Kondo Ink composition and a method for ink jet recording
CN1771127A (zh) * 2003-04-02 2006-05-10 3M创新有限公司 挠性高温超阻挡物
CN101518151A (zh) * 2006-11-06 2009-08-26 新加坡科技研究局 纳米粒子封装阻障叠层
CN101423675A (zh) * 2008-11-25 2009-05-06 四川大学 一种用于塑料表面防静电的紫外光固化涂料及其制备方法

Also Published As

Publication number Publication date
EP2875070B1 (en) 2020-09-09
JP2015524494A (ja) 2015-08-24
KR20150038183A (ko) 2015-04-08
JP6270837B2 (ja) 2018-01-31
US20150179976A1 (en) 2015-06-25
WO2014012931A1 (en) 2014-01-23
HK1207874A1 (en) 2016-02-12
US10559777B2 (en) 2020-02-11
CN104704035A (zh) 2015-06-10
KR102108867B1 (ko) 2020-05-12
EP2875070A1 (en) 2015-05-27
SG11201500374RA (en) 2015-02-27
MY176545A (en) 2020-08-16

Similar Documents

Publication Publication Date Title
CN104704035B (zh) 用于水清除层的可辐射固化的组合物及其制备方法
KR102574682B1 (ko) 친수성 나노입자를 포함하는 방사선 경화성 조성물
EP2445029A1 (en) Multilayered protective layer, organic opto-electric device and method of manufacturing the same
EP2633567B1 (en) Opto-electric device and method of manufacturing an opto-electric device
CN106415875B (zh) 封装膜及包括该封装膜的有机电子装置
JP6623505B2 (ja) 無機微粒子分散体の製造方法、無機微粒子分散体、塗膜、および積層体
KR20150105897A (ko) 경화성 수지 조성물을 포함하는 배리어 적층체 및 이의 제조방법
Kovrov et al. Novel acrylic monomers for organic photovoltaics encapsulation
TWI758502B (zh) 組成物、膜、積層構造體、發光裝置、顯示器及組成物的製造方法
EP3660109A1 (en) Ink composition, film, and display
JP2011070821A (ja) 透明異方導電性フィルム
CN110382561B (zh) 密封用的组合物
JP2015114588A (ja) 光散乱層用樹脂組成物、光散乱層、および有機エレクトロルミネッセンス装置
CN114307565B (zh) 干燥剂组合物、密封结构体、有机el器件、及制造有机el器件的方法
JP6826190B2 (ja) 光拡散機能を付与した封止層組成物及びこれを用いて製造された有機発光素子
JP2011124186A (ja) 発光表示素子保護材料及び発光表示素子保護シート
KR20060082446A (ko) 오가노클레이를 함유한 자외선 경화형 무기 전계발광소자보호재료 조성물 및 이를 이용하여 제조된 무기전계발광소자

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1207874

Country of ref document: HK

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20180906

Address after: Muenster

Applicant after: BASF Coatings GmbH

Address before: Swiss Swiss

Applicant before: Rolic AG

GR01 Patent grant
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1207874

Country of ref document: HK