CN104659193A - Packaging structure suitable for outdoor LED - Google Patents
Packaging structure suitable for outdoor LED Download PDFInfo
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- CN104659193A CN104659193A CN201310584389.4A CN201310584389A CN104659193A CN 104659193 A CN104659193 A CN 104659193A CN 201310584389 A CN201310584389 A CN 201310584389A CN 104659193 A CN104659193 A CN 104659193A
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- led
- sphere lens
- led chip
- spherical lens
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Abstract
The invention relates to an LED chip installation apparatus, especially a packaging structure suitable for an outdoor LED. The packaging structure comprises a lead-out pin; the lower layer of a silicon substrate is provided with a heat interface material layer and is then fixed to a thickened Cu heat sink; the upper layer of the silicon substrate is provided with a metal reflection layer; a LED chip is fixed on the metal reflection layer; the lower sides of the P electrode and N electrode of the LED chip are respectively welded with two gold wires through a wire bounder; the outside of the LED chip is fixedly provided with an inner layer spherical lens and an outer layer spherical lens which are prepared by hydrogenated epoxy resin materials. The inner surface of the inner layer spherical lens is provided with a fluorescent powder layer; the inner layer spherical lens is filled with organic silica gel; and two sides on the bottom of the outer layer spherical lens are provided with gas-tight rings. The packaging structure has reasonable structural design, can enhance heat dissipation and prolong the service life of an LED, and meanwhile can raise luminous efficiency and LED luminance.
Description
Technical field
The present invention relates to a kind of LED chip erecting device, particularly a kind of encapsulating structure being applicable to outdoor LED.
Background technology
In recent years, along with developing rapidly of China's LED industry, the application of LED constantly expands. requirements at the higher level are proposed to the packing forms of LED component and performance.For meeting the different requirements of various LED application, each LED enterprise is proposed the LED of varied encapsulating structure.But, the closer chip of phosphor powder layer in current most of LED is near LED chip, the heat that LED chip so not only can be made to produce directly conducts to phosphor powder layer, phosphor powder layer can be subject to heat ageing gradually, affect the useful life of LED, and easily absorbed LED amount of emitted light by phosphor powder layer, reduce actual light extraction efficiency, greatly reduce the luminous intensity of LED.
Summary of the invention
The present invention aims to provide a kind of enhancing and dispels the heat, and improves a kind of encapsulating structure being applicable to outdoor LED of light extraction efficiency
Technical scheme of the present invention is achieved like this: a kind of encapsulating structure being applicable to outdoor LED, comprise leading foot, it is characterized in that: silicon substrate lower floor be fixed on after thermal interface material layer is set thicken Cu heat sink on, silicon substrate upper strata arranges metallic reflective layer, fixed L ED chip on metallic reflective layer, two spun golds are welded with respectively by gold thread bonding equipment below the P pole of LED chip and N pole, internal layer sphere lens is fixed in the outside of LED chip, outer sphere lens, internal layer sphere lens, outer sphere lens adopts hydrogenated epoxy resin material to make, internal layer sphere lens inner surface arranges phosphor powder layer, the inner embedding organic silica gel of internal layer sphere lens, outer sphere lens two bottom sides arranges gas-tight ring.
The present invention by increase key sequence boundary layer in LED and silicon substrate and thicken Cu heat sink between space, add thermal interface material layer between, reach and strengthen heat radiation object, the heat-conducting glue that simultaneously the thermal interface material layer thermal conductivity abandoning commonly using is lower, and adopt low temperature tin cream to make, interface resistance is greatly reduced, and then obtains better radiating effect.
Utilize internal layer sphere lens inner surface arranges phosphor powder layer make the uniformity of emergent light and colour temperature better, phosphor powder layer is away from LED chip, significantly decrease and be reflected back chip and absorbed light quantity by phosphor powder layer, thus improve light extraction efficiency, improve the luminous intensity of LED.Inside and outside layer sphere lens adopts hydrogenated epoxy resin material to make, hydrogenated epoxy resin is formed by bisphenol-A, bisphenol-f type, phenolic aldehyde or cresol novolak epoxy hydrogenation, it is high temperature resistant, uvioresistant irradiation, electrical insulating property are good, is suitable for outdoor LED package application.
Accompanying drawing explanation
Fig. 1 is main TV structure figure of the present invention.
Embodiment
As shown in Figure 1, comprise leading foot 11, be fixed on after silicon substrate 1 lower floor arranges thermal interface material layer 2 and thicken on Cu heat sink 3, thickening Cu thermosphere 3 is more than 50 microns.Silicon substrate 1 upper strata arranges metallic reflective layer 4, fixed L ED chip 5 on metallic reflective layer 4, is welded with two spun golds 6 below the P pole of LED chip 5 and N pole respectively by gold thread bonding equipment, and internal layer sphere lens 12, outer sphere lens 9 are fixed in the outside of LED chip 5; Internal layer sphere lens 12 inner surface arranges phosphor powder layer 7, the inner embedding organic silica gel 8 of internal layer sphere lens 12, outer sphere lens 9 two bottom sides arranges gas-tight ring 10.Internal layer sphere lens 12 inner surface arranges phosphor powder layer 7, make the uniformity of emergent light and colour temperature better, phosphor powder layer 7, away from LED chip 5, significantly decreases and is reflected back chip and absorbed light quantity by phosphor powder layer, thus improve light extraction efficiency.Simultaneously, internal layer sphere lens 12, outer sphere lens 9 adopt hydrogenated epoxy resin material to make, hydrogenated epoxy resin is formed by bisphenol-A, bisphenol-f type, phenolic aldehyde or cresol novolak epoxy hydrogenation, and it is high temperature resistant, uvioresistant irradiation, electrical insulating property are good, is suitable for outdoor LED package application.Phosphor powder layer 7 and LED chip 5 are without directly contacting, and the heat that LED chip 5 produces can not be delivered to phosphor powder layer 7, thus extends the useful life of phosphor powder layer.
Because LED interface is to the influence of thermal resistance, the present invention is by increasing the key sequence boundary layer in LED and the space between silicon substrate 1 and thickening Cu heat sink 3, add thermal interface material layer 2 between, reach and strengthen heat radiation object, the heat-conducting glue that simultaneously thermal interface material layer 2 thermal conductivity abandoning commonly using is lower, and adopt low temperature tin cream to make, interface resistance is greatly reduced, and then obtains better radiating effect.
Claims (3)
1. one kind is applicable to the encapsulating structure of outdoor LED, comprise leading foot (11), it is characterized in that: silicon substrate (1) lower floor is fixed on after arranging thermal interface material layer (2) and thickeies on Cu heat sink (3), silicon substrate (1) upper strata arranges metallic reflective layer (4), the upper fixed L ED chip (5) of metallic reflective layer (4), be welded with two spun golds (6) respectively by gold thread bonding equipment below the P pole of LED chip (5) and N pole, internal layer sphere lens (12) is fixed in the outside of LED chip (5); Outer sphere lens (9), internal layer sphere lens (12), outer sphere lens (9) adopt hydrogenated epoxy resin material to make, internal layer sphere lens (12) inner surface is arranged phosphor powder layer (7), the inner embedding organic silica gel (8) of internal layer sphere lens (12), outer sphere lens (9) two bottom sides arranges gas-tight ring (10).
2. a kind of encapsulating structure being applicable to outdoor LED according to claim 1, is characterized in that described thermal interface material layer (2) adopts low temperature tin cream to make.
3. a kind of encapsulating structure being applicable to outdoor LED according to claim 1, is characterized in that described thickening Cu heat sink (3) is more than 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310584389.4A CN104659193A (en) | 2013-11-21 | 2013-11-21 | Packaging structure suitable for outdoor LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310584389.4A CN104659193A (en) | 2013-11-21 | 2013-11-21 | Packaging structure suitable for outdoor LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104659193A true CN104659193A (en) | 2015-05-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310584389.4A Pending CN104659193A (en) | 2013-11-21 | 2013-11-21 | Packaging structure suitable for outdoor LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104659193A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005106A (en) * | 2006-01-18 | 2007-07-25 | 财团法人工业技术研究院 | No-base light emitting diode and its producing method |
| CN202495474U (en) * | 2012-03-19 | 2012-10-17 | 佛山市国星光电股份有限公司 | Light emitting diode (LED) encapsulation structure |
| CN202601728U (en) * | 2012-05-03 | 2012-12-12 | 厦门多彩光电子科技有限公司 | Light emitting diode (LED) packaging structure with double-layer lens structure |
| CN103094254A (en) * | 2012-06-08 | 2013-05-08 | 逢甲大学 | Light emitting diode module |
-
2013
- 2013-11-21 CN CN201310584389.4A patent/CN104659193A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005106A (en) * | 2006-01-18 | 2007-07-25 | 财团法人工业技术研究院 | No-base light emitting diode and its producing method |
| CN202495474U (en) * | 2012-03-19 | 2012-10-17 | 佛山市国星光电股份有限公司 | Light emitting diode (LED) encapsulation structure |
| CN202601728U (en) * | 2012-05-03 | 2012-12-12 | 厦门多彩光电子科技有限公司 | Light emitting diode (LED) packaging structure with double-layer lens structure |
| CN103094254A (en) * | 2012-06-08 | 2013-05-08 | 逢甲大学 | Light emitting diode module |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150527 |
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| WD01 | Invention patent application deemed withdrawn after publication |