CN202601728U - Light emitting diode (LED) packaging structure with double-layer lens structure - Google Patents
Light emitting diode (LED) packaging structure with double-layer lens structure Download PDFInfo
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- CN202601728U CN202601728U CN 201220194538 CN201220194538U CN202601728U CN 202601728 U CN202601728 U CN 202601728U CN 201220194538 CN201220194538 CN 201220194538 CN 201220194538 U CN201220194538 U CN 201220194538U CN 202601728 U CN202601728 U CN 202601728U
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- led
- double layer
- double
- led chip
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Abstract
The utility model relates to a light emitting diode (LED) packaging structure, in particular to an LED packaging structure with a double-layer lens structure. The LED packaging structure with the double-layer lens structure comprises an LED chip, an LED bracket, a first lens and a second lens, wherein the LED bracket is provided with a cup bowl, a positive conductive foot, a negative conductive foot, and a base; the cup bowl is used to place the LED chip; the positive conductive foot and the negative conductive foot extract a positive electrode and a negative electrode of the LED chip through a lead; the base is used to place the first lens and the second lens; a first slot and a second slot are arranged the base, the first slot is used to fix the first lens, and the second slot is used to fix the second lens. The LED packaging structure with the double-layer lens structure is applied to packaging of an LED.
Description
Technical field
The utility model relates to light-emitting diode (LED) encapsulating structure, the LED encapsulating structure that is specifically related to have the double layer lens structure.
Background technology
LED is a kind of semiconductor that can electric energy be converted into luminous energy.The white light LEDs of high brightness is long with its life-span, light efficiency is high, recyclablely utilize again, well conventional light source such as cracky, the radiationless and low-power consumption advantage that can't compare with it and be widely used in lighting field not of anti-seismic performance; For example in a lot of families, mechanism, government and commercial Application, white light LEDs is replacing incandescent lamp rapidly becomes main lighting source.
On the packaging technology of LED, in order to strengthen spotlight effect and led module is played the certain protection effect, led module is provided with LED lens usually, and in the practical application, and the product that LED lens form often has hot spot, and consistency is poor.
The utility model content
The utility model technical problem to be solved is that a kind of LED encapsulating structure with double layer lens structure that does not have hot spot, high conformity is provided.
In order to solve the problems of the technologies described above; The technical scheme that the utility model adopted is; A kind of LED encapsulating structure with double layer lens structure; Comprise led chip, led support, first lens and second lens, said led support is provided with: the positive and negative conductive feet of place the cup bowl of led chip, the both positive and negative polarity of led chip being drawn through lead and place first lens and the pedestal of second lens.Said pedestal is provided with first draw-in groove that is used for fixing first lens and second draw-in groove that is used for fixing second lens.
Further, said first lens are middle hollow lens, and said first lens are provided with the hole that its cavity is in communication with the outside.
Further, the shape of said first lens and/or second lens is hemisphere or semielliptical shape.
Further, said first lens and second lenticular spacing are arranged.
Further, the spacing between said first lens and second lens is 2-3mm.
Further, said first lens and/or second lens are silica-gel lens.Said second lens have spotlight effect.
The utility model adopts said structure, has the following advantages:
1. the LED encapsulating structure of the utility model has the double layer lens structure, through regulating the shape of first lens, can make product not have hot spot, solves a great problem in the industry;
2. first lens of the utility model and second lens card place on the pedestal of led support, and be easy to assembly;
3. said first lens of the utility model are middle hollow lens, and said first lens are provided with the hole that its cavity is in communication with the outside, and can encapsulate convenience simple in structure through injecting fluorescent glue in this Kong Xiangqi cavity like this;
4. the utility model makes led chip separate with fluorescent material, reduces the influence of led chip heat to fluorescent material, improves the fluorescent material life-span, and led chip can also improve light efficiency with separating of fluorescent material; In addition, product can be crossed Reflow Soldering.
Description of drawings
Fig. 1 is the sketch map of led support of the LED encapsulating structure with double layer lens structure of the utility model.
Fig. 2 is the overall schematic of the LED encapsulating structure with double layer lens structure of the utility model.
Embodiment
Combine accompanying drawing and embodiment that the utility model is further specified at present.
As shown in Figure 1; A kind of LED encapsulating structure of the utility model with double layer lens structure; Comprise led chip 1, led support 2, first lens 3 and second lens 4, said led support 2 is provided with: place the cup bowl of led chip 1, the positive conductive feet 11 negative conductive feet 12 that the both positive and negative polarity of led chip 1 is drawn through lead 13 and the pedestal 14 of placing first lens 3 and second lens 4.Said pedestal 14 is provided with first draw-in groove 15 and second draw-in groove 16 that is used for fixing second lens 4 that is used for fixing first lens 3.
Further, said first lens 3 are middle hollow lens, and said first lens 3 are provided with the hole 17 that its cavity is in communication with the outside, and like this, fluorescent glue injects the cavity of first lens through this hole 17.
The shape of said first lens 3 and/or second lens 4 is hemisphere or semielliptical shape, can certainly be other shapes, wherein, through regulating the shape of first lens 3, can make product not have hot spot, solves a great problem in the industry.
Said first lens 3 and second lens, 4 spacing arrangement.Spacing between said first lens 3 and second lens 4 is 2-3mm.
Said first lens 3 and/or second lens 4 are silica-gel lens.Said second lens 4 have spotlight effect.
The packaging technology step of above-mentioned LED encapsulating structure is following:
Step 1: at first make led support 2, first lens 3 and second lens 4; This led support 2 is provided with: place the cup bowl of led chip 1, the positive conductive feet 11 negative conductive feet 12 that the both positive and negative polarity of led chip 1 is drawn through lead 13 and the pedestal 14 of placing first lens 3 and second lens 4; This pedestal 14 is provided with first draw-in groove 15 and second draw-in groove 16 that is used for fixing second lens 4 that is used for fixing first lens 3; The shape of these first lens 3 and/or second lens 4 is circular or oval, can certainly be other suitable shapes; Said first lens 3 are middle hollow lens, and said first lens 3 are provided with the hole 17 that its cavity is in communication with the outside;
Step 2: first lens 3 that will make inject fluorescent glue from the hole 17 that its cavity is in communication with the outside, and baking is solidified fluorescent glue;
Step 3: led chip 1 is fixed in the cup bowl of the led support of making 2, and the positive conductive feet 11 and negative conductive feet 12 of the both positive and negative polarity of led chip 1 being drawn through lead 13; First lens of then step 2 being processed 3 are positioned on the pedestal 14, and block fixing through first draw-in groove 15;
Step 4: install after first lens 3, the accommodation space of forming to first lens 3 and chip injects transparent silica gel, is baked to transparent silica gel again and solidifies;
Step 5: after the product cooling that step 4 is processed, second lens 4 are positioned on the pedestal 14, and block fixing through second draw-in groove 16; First lens 3 and second lens, 4 spacing arrangement; Form cavity between it, transparent silica gel is injected in this cavity, be baked to transparent silica gel again and solidify;
Step 6: product taking-up, cooling, beam split with step 5 is processed obtain final products.
The utility model can make product not have hot spot through regulating the shape of first lens 3, solves a great problem in the industry.And make led chip 1 separate with fluorescent material, reduce the influence of led chip 1 heat to fluorescent material, improve the fluorescent material life-span, chip can also improve light efficiency with separating of fluorescent material; Product could be crossed Reflow Soldering in addition!
Although specifically show and introduced the utility model in conjunction with preferred embodiment; But the those skilled in the art should be understood that; In the spirit and scope of the utility model that does not break away from appended claims and limited; Can make various variations to the utility model in form with on the details, be the protection range of the utility model.
Claims (6)
1. LED encapsulating structure with double layer lens structure; It is characterized in that: comprise led chip, led support, first lens and second lens, said led support is provided with: the positive and negative conductive feet of place the cup bowl of led chip, the both positive and negative polarity of led chip being drawn through lead and place first lens and the pedestal of second lens; Said pedestal is provided with first draw-in groove that is used for fixing first lens and second draw-in groove that is used for fixing second lens.
2. the LED encapsulating structure with double layer lens structure according to claim 1 is characterized in that: said first lens are middle hollow lens, and said first lens are provided with the hole that its cavity is in communication with the outside.
3. the LED encapsulating structure with double layer lens structure according to claim 1 is characterized in that: the shape of said first lens and/or second lens is hemisphere or semielliptical shape.
4. the LED encapsulating structure with double layer lens structure according to claim 1 is characterized in that: said first lens and second lenticular spacing are arranged.
5. the LED encapsulating structure with double layer lens structure according to claim 1 is characterized in that: the spacing between said first lens and second lens is 2-3mm.
6. the LED encapsulating structure with double layer lens structure according to claim 1 is characterized in that: said first lens and/or second lens are silica-gel lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220194538 CN202601728U (en) | 2012-05-03 | 2012-05-03 | Light emitting diode (LED) packaging structure with double-layer lens structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220194538 CN202601728U (en) | 2012-05-03 | 2012-05-03 | Light emitting diode (LED) packaging structure with double-layer lens structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202601728U true CN202601728U (en) | 2012-12-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220194538 Expired - Fee Related CN202601728U (en) | 2012-05-03 | 2012-05-03 | Light emitting diode (LED) packaging structure with double-layer lens structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202601728U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681991A (en) * | 2013-12-20 | 2014-03-26 | 纳晶科技股份有限公司 | Silicone lens for LED (Light Emitting Diode) packaging and manufacturing method thereof |
| CN103968331A (en) * | 2013-02-01 | 2014-08-06 | 胜华科技股份有限公司 | Light Guiding Apparatus And Light Source Apparatus Including The Same |
| CN104659193A (en) * | 2013-11-21 | 2015-05-27 | 武汉谋智科技信息技术有限公司 | Packaging structure suitable for outdoor LED |
-
2012
- 2012-05-03 CN CN 201220194538 patent/CN202601728U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103968331A (en) * | 2013-02-01 | 2014-08-06 | 胜华科技股份有限公司 | Light Guiding Apparatus And Light Source Apparatus Including The Same |
| CN104659193A (en) * | 2013-11-21 | 2015-05-27 | 武汉谋智科技信息技术有限公司 | Packaging structure suitable for outdoor LED |
| CN103681991A (en) * | 2013-12-20 | 2014-03-26 | 纳晶科技股份有限公司 | Silicone lens for LED (Light Emitting Diode) packaging and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Light emitting diode (LED) packaging structure with double-layer lens structure Effective date of registration: 20150923 Granted publication date: 20121212 Pledgee: China Co truction Bank Corp Xiamen branch Pledgor: Xiamen Colorful Optoelectronics Technology Co.,Ltd. Registration number: 2015350000074 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20190503 |