CN104647868B - 一种聚四氟乙烯覆铜板的制作方法 - Google Patents

一种聚四氟乙烯覆铜板的制作方法 Download PDF

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CN104647868B
CN104647868B CN201510067300.6A CN201510067300A CN104647868B CN 104647868 B CN104647868 B CN 104647868B CN 201510067300 A CN201510067300 A CN 201510067300A CN 104647868 B CN104647868 B CN 104647868B
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ptfe emulsion
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陈功田
吴娟英
李海林
高绍兵
陈建
何艳红
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CHENZHOU GONGTIAN ELECTRONIC CERAMICS TECHNOLOGY Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18Homopolymers or copolymers or tetrafluoroethene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/73Hydrophobic

Abstract

本发明公开一种聚四氟乙烯覆铜板的制作方法,该制作方法包括树脂组合物以及制作工艺。该树脂组合物,以重量份计,其组分包括:聚四氟乙烯乳液20‑100重量份、陶瓷粉0‑200重量份。该制作工艺包括:在90~100Kpa的真空条件下,于温度350~450℃、压力90~100Mpa的热压机中保压3~6小时。用上述树脂组合物及其制作工艺制成的覆铜板具有不同的介电常数(2.2‑10.2)、低介质损耗,高耐热性,低吸水率等优异性能。

Description

一种聚四氟乙烯覆铜板的制作方法
技术领域
本发明涉及一种聚四氟乙烯覆铜板的制作方法。
背景技术
信息电子产品逐渐向着高频化、高速化方向发展,传统的基板材料将被高速化、高可靠性基板材料代替,其市场需求迅速增长。聚四氟乙烯(PTFE)具有抗酸抗碱、抗各种有机溶剂的特点,几乎不溶于所有的溶剂。同时,聚四氟乙烯具有耐高温的特点,它的摩擦系数极低,公知技术的用途可作润滑作用之余,亦成为了易清洁水管内层的理想涂料;即“不粘涂层”或“易清洁物料;经研究表明:聚四氟乙烯(PTFE)具有优良的电气性能,耐化学腐蚀,耐热,使用温度范围广,吸水性低,高频率范围内介电常数、介质损耗变化少,非常适用于作为高速数字化和高频的基板材料,尤其是地面微波视讯、卫星通信、移动手机、军工雷达、航天航空、导弹导航等领域的广泛需求应用。
信息技术发展日新月异,相对于超高频电子产品而言,对于其承载体线路板有着不同的要求,尤其是介电常数,不同介电常数的线路板材有其不同的应用,如信号传输速度快需要低的介电常数,埋电容电子产品则需要较高的介电常数,故开发出不同介电常数、低介质损耗的聚四氟乙烯覆铜板是高频电子产品的发展形势所趋。
发明内容
本发明目的在于提供一种聚四氟乙烯覆铜板的制作方法,其制成的覆铜板具有不同介电常数(2.2-10.2)、低介质损耗,高耐热性,低吸水率等优点。
为实现上述目的,本发明采用如下之技术方案:一种聚四氟乙烯覆铜板的制作方法,包括有:
(1)树脂组合物:
聚四氟乙烯乳液 30-100重量份 ;
陶瓷粉 0-200重量份;
(2)制作工艺:
上述树脂组合物经搅拌均匀,含浸,上胶,加热烘干,层压合步骤制得;压合使用的铜箔厚度为18um;其中层压工艺为:在90~100Kpa的真空条件下,于温度350~450℃,压力15~20Mpa,电加热层压机中保压3~6小时。
所述的聚四氟乙烯乳液为四氟乙烯聚合后在非离子型表面活性剂存在下的分散浓缩液,其中固体含量在60%(wt)左右。
所述陶瓷粉为二氧化硅、氧化铝、氮化铝、二氧化锆、氧化镁、钛酸钡、钛酸钙、碳酸钙、二氧化钛、二氧化锡、氧化镧等其中的一种或几种。
本发明具有明显的优点和有益效果,本发明的有益效果:
(1)聚四氟乙烯具有优良的电气性能, 耐化学腐蚀, 耐热, 高频率范围内介电常数、介质损耗因数变化少,作为高速数字化和高频微波线路板的基体树脂,用其制作成的覆铜板介电常数最低可至2.2,介质损耗可至0.0010以下,并具有高耐热性,完全可适应目前无铅焊接工艺;
(2)本发明改变不同聚四氟乙烯配比,可以制作成不同的低介电常数覆铜板;
(3)本发明加入陶瓷粉料,所选用的陶瓷粉等无机填料可降低膨胀系数,提高耐热性等作用,并弥补聚四氟乙烯热膨胀系数大, 质地柔软, 产品抗弯强度小、机械性能差等缺失,大大提高聚四氟乙烯覆铜板的可靠性、稳定性。
具体实施方式
对于以上所述相关性能,可以根据如下实施例及比较例进行说明和描述,有如下实施例1-7及比较例1-2。
其相关物质之比例为以组分中以A1为100重量份计算,其他组分占的比例为A1总重量之比例。
(A1) 聚四氟乙烯乳液
(B1) 二氧化硅
(B2) 氧化铝
(B3) 钛酸钡
(B4) 钛酸钙
(B5) 二氧化锡
(B6) 二氧化钛
(B7) 二氧化锆
本发明的层压板基材是使用上述树脂组合物经搅拌均匀,含浸,上胶,加热烘干,层压合步骤制得;压合使用的铜箔厚度为18um(0.5盎司);其中层压工艺为:在90~100Kpa的真空条件下,于温度350~450℃,压力15~20Mpa,保压3~6小时。经电加热层压机压合而成。
表一 组合物(一) 以重量份算
表二 组合物(二) 以重量份算
以上配方性能评估表一
以上配方性能评估表二
根据上述结果可知,使用本发明制作的覆铜板具有高耐热性,不同的低介电常数,低介电损耗,低吸水率等性能,能够满足高频传输系统对印刷电路板不同的的高要求。
以上所述,仅是本发明的较佳实施例而已,并非对本发明的技术范围作任何限制,故凡是依据本发明的技术实质对以上实施例所做的任何细微修改、等同变化和修饰,均仍属于本发明技术方案的范围内。

Claims (2)

1.一种聚四氟乙烯覆铜板的制作方法,其特征在于,包括有:
(1)树脂组合物:
聚四氟乙烯乳液 60重量份,二氧化硅20重量份,氧化铝20重量份;或聚四氟乙烯乳液50重量份,钛酸钡50重量份;或聚四氟乙烯乳液50重量份,钛酸钡30重量份,钛酸钙20重量份;或聚四氟乙烯乳液40重量份,二氧化硅20重量份,钛酸钡10重量份,二氧化锡20重量份,二氧化钛10重量份;或聚四氟乙烯乳液30重量份,钛酸钙50重量份,二氧化钛20重量份;
(2)制作工艺:
上述树脂组合物经搅拌均匀、含浸、上胶、加热烘干和层压合步骤制得;压合使用的铜箔厚度为18um;其中层压工艺为:在90~100Kpa的真空条件下,于温度450℃,压力15~20Mpa,保压3~6小时;制得介电常数3.5,或5.0,或5.5,或6.5,或10.2的覆铜板;
所述的聚四氟乙烯乳液为四氟乙烯聚合后在非离子型表面活性剂存在下的分散浓缩液,其中固体含量为60%(wt)。
2.根据权利要求1所述一种聚四氟乙烯覆铜板的制作方法,其特征在于,所述的制作工艺为使用电加热层压机压制而成。
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