CN114474878A - 覆铜板及其制造方法 - Google Patents
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Abstract
本公开提供一种覆铜板。该覆铜板包括至少一层的半固化片和至少一层的聚四氟乙烯微孔膜;所述半固化片和所述聚四氟乙烯微孔膜交替叠合;所述聚四氟乙烯微孔膜的孔径为1‑10um,膜克重为20‑200g/m2。本公开提供一种覆铜板,所述覆铜板的原材料包括:玻璃纤维布、热固性树脂、硅烷偶联剂、聚四氟乙烯微孔膜和至少一层的铜箔。本公开还提供了上述覆铜板的制造方法。本公开的覆铜板能够兼具热固性树脂体系覆铜板的PCB加工优势,又具备更低的低介电损耗特性,满足高频信号的传输需求,应用前景更广。
Description
技术领域
本公开涉及电气材料技术领域,涉及一种覆铜板及其制造方法;尤其涉及一种兼具PCB可加工性和低介电损耗特性的覆铜板及其制造方法。
背景技术
印刷电路板(Printed Circuit Board,简称PCB板)是电子工业的重要部件之一,是电子元器件的支撑体,是电子元器件电气连接的载体,由于它是采用印刷术制作的,故被称为“印刷”电路板,它为覆铜板在结构组成、特性条件的确定上,起到了决定性的作用。覆铜板是电子工业的基础材料,是绝大多数电子产品达到电路互连不可缺少的主要组成部件,可分为纸基板、复合基板、FR-4覆铜板、无卤板、高频覆铜板、封装基板等。覆铜板技术演进经历了由普通板到无铅无卤板,再发展到高频高速/车用/IC封装/高导热板的逐步升级过程,其中,FR-4覆铜板和高频覆铜板是移动通信领域应用较广泛的两类覆铜板产品。随着电子信息技术发展的不断进步,覆铜板作为PCB的基本材料,由于随着应用频率的升高,PCB对覆铜板的质量要求也越来越高,高质量的覆铜板是提高PCB板性能的关键。
现有低介电常数低损耗特性的覆铜板树脂体系分为热固性和热塑性,热固性树脂有改性环氧、聚苯醚、碳氢等,而热塑性主要以聚四氟乙烯(PTFE)、氟化乙烯丙烯共聚物(或称全氟乙烯丙烯共聚物、FEP)、可溶性聚四氟乙烯(PFA、为少量全氟丙基全氟乙烯基醚与聚四氟乙烯的共聚物)等氟类树脂为主。此两种覆铜板的PCB加工特性和电性能各有优劣,其中热固性树脂体系的PCB加工性较好,但湿热环境下以及热老化后的介电损耗可靠性不足;而PTFE等氟类树脂体系热塑性覆铜板具有更低的介电常数和介电损耗,但PCB加工难度大,主要体现在钻孔不良、尺寸稳定性差、不能多层压合等。
发明内容
有鉴于此,本公开的目的在于提出一种兼具PCB可加工性和低介电损耗特性的覆铜板及生产制造方法,该覆铜板能够兼具热固性树脂体系覆铜板的PCB加工优势,又具备更低的低介电损耗特性,满足高频信号的传输需求。
基于上述目的,本公开提供了一种覆铜板,该覆铜板包括:
至少一层的半固化片和至少一层的聚四氟乙烯微孔膜;所述半固化片和所述聚四氟乙烯微孔膜交替叠合;
所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2。
上述的覆铜板中,优选的,所述半固化片是通过将玻璃纤维布浸渍热固性树脂后烘烤制得;所述半固化片中树脂含量不低于65%。
上述的覆铜板中,优选的,所述聚四氟乙烯微孔膜为经硅烷偶联剂浸渍烘干制得。
本公开还提供一种覆铜板,所述覆铜板的原材料包括:
玻璃纤维布、热固性树脂、硅烷偶联剂、聚四氟乙烯微孔膜和至少一层的铜箔。
上述的覆铜板中,优选的,所述玻璃纤维布包括电子级玻璃纤维布。
上述的覆铜板中,优选的,所述热固性树脂包括碳氢树脂胶液;所述热固性树脂的胶含量在20%-85%之间。
上述的覆铜板中,优选的,所述硅烷偶联剂包括氨基硅烷水性偶联剂、乙烯基硅烷水性偶联剂和环氧基硅烷水性偶联剂的一种或几种的组合。
本公开还提供上述的覆铜板的制造方法,该制造方法包括如下步骤:
将玻璃纤维布浸渍到热固性树脂中,取出烘烤制得半固化片;
根据覆铜板所预设的厚度、介电常数和介电损耗,选用预设层数的半固化片与预设层数的聚四氟乙烯微孔膜进行交替层叠,得到组合层;
在组合层的至少一个面覆盖铜箔,在真空条件下热压压合,得到覆铜板。
上述的制造方法中,优选的,在选用预设层数的半固化片与预设层数的聚四氟乙烯微孔膜进行交替层叠的步骤前,所述制造方法还包括对聚四氟乙烯微孔膜浸渍硅烷偶联剂溶液的步骤。
本公开的上述覆铜板的制造方法中,根据厚度、介电常数、介电损耗的要求,搭配不同规格的半固化片和PTFE微孔膜进行设计,即根据预设的厚度、介电常数、介电损耗的要求,通过半固化片的层数和聚四氟乙烯的层数控制两者的体积用量,实现参数功能的预设。
本公开的覆铜板可以通过调整聚四氟乙烯的体积、半固化片中的树脂体积、玻纤布体积这三者的比例,决定板材的介电常数。一般聚四氟乙烯的介电常数为2.1、树脂介电常数在2.5-6之间(和树脂体系有关)、玻纤布的介电常数为6左右。通过三种材料的体积比,可以计算出板材的介电常数。
上述的制造方法中,优选的,所述硅烷偶联剂溶液中硅烷偶联剂的质量百分比含量为0.5%-2%。
从上面所述可以看出,本公开提供的技术方案具有以下显著有益效果:本公开的覆铜板能够兼具热固性树脂体系覆铜板的PCB加工优势,又具备更低的低介电损耗特性,满足高频信号的传输需求,本公开的覆铜板的介电常数和介电损耗的均匀性和稳定性更好,应用前景更广。而覆铜板的加工方法也更加简便易用。
附图说明
为了更清楚地说明本公开或相关技术中的技术方案,下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本公开的覆铜板的结构示意图;
图2是本公开的覆铜板的半固化片和聚四氟乙烯微孔膜搭配示意图。
具体实施方式
为了对本公开的技术特征、目的和有益效果有更加清楚的理解,现对本公开的技术方案进行以下详细说明,但不能理解为对本公开的可实施范围的限定。下述实施例中所述实验方法,如无特殊说明,均为常规方法;所述试剂和材料,如无特殊说明,均可从商业途径获得。
实施例1
本实施例提供一种覆铜板,如图1、2所示,所述覆铜板包括:
多层半固化片3和多层的聚四氟乙烯微孔膜2;所述半固化片和所述聚四氟乙烯微孔膜交替叠合,形成组合层;
所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2;
所述半固化片是通过将玻璃纤维布浸渍热固性树脂后烘烤制得;所述半固化片中的树脂含量为75%。
所述覆铜板还包括2层的铜箔1,贴附在所述组合层的两面。
本实施例的覆铜板的原料包括:玻璃纤维布,碳氢树脂,聚四氟乙烯微孔膜和铜箔。
所述玻璃纤维布为1080电子玻璃纤维布;所述碳氢树脂由环氧树脂和氰酸酯组成,所述碳氢树脂的胶含量为50%;所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2。
本实施例的覆铜板是通过如下方法制备得到的:
将1080电子玻璃纤维布与碳氢树脂按照4:6的比例进行混合浸渍,浸渍3秒后拿出,进行烘烤,烘烤后制得树脂含量为75%的半固化片;
根据板材厚度0.50mm的设计要求,将半固化片和聚四氟乙烯微孔膜的片状料进行交替叠配,得到组合层;再在上表面和下表面覆上铜箔,将含有铜箔的组合层放置加热盘内,进行真空热压;加热盘内设有管路,管路内通有热油,在真空压力为30torr(毫米汞柱)的条件下,加热盘管路内的热油不断升温,导致铜箔和组合层的温度也随之上升,当温度升至150-200℃之间时,达到固化反应温度,树脂产生流动并进一步发生交联反应,温度上升至180-220℃之间时,反应停止,树脂保持不变,在此温度下,等待树脂逐步固化,完成后制得覆铜板。
实施例2
本实施例提供一种覆铜板,如图1、2所示,所述覆铜板包括:
多层半固化片3和多层的聚四氟乙烯微孔膜2;所述半固化片和所述聚四氟乙烯微孔膜交替叠合,形成组合层;
所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2;
所述半固化片是通过将玻璃纤维布浸渍热固性树脂后烘烤制得;所述半固化片中的树脂含量为80%。
所述覆铜板还包括2层的铜箔1,贴附在所述组合层的两面。
本实施例的覆铜板的原料包括:玻璃纤维布,碳氢树脂,聚四氟乙烯微孔膜,硅烷偶联剂和铜箔。
所述玻璃纤维布为1080电子玻璃纤维布;所述碳氢树脂由环氧树脂和氰酸酯组成,所述碳氢树脂的胶含量为85%;所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2,所述硅烷偶联剂为氨基硅烷水性偶联剂。
本实施例的覆铜板是通过如下方法制备得到的:
将1080电子玻璃纤维布与碳氢树脂按照4:6的比例进行混合浸渍,浸渍5秒后拿出,进行烘烤,烘烤后制得树脂含量为80%的半固化片;
将聚四氟乙烯微孔膜浸渍入质量百分比含量为0.5%的氨基硅烷水性偶联剂溶液后取出,烘干水分,使用氨基硅烷偶联剂能够提高聚四氟乙烯微孔膜和碳氢树脂界面的结合力。
根据板材厚度0.50mm的设计要求,将半固化片和聚四氟乙烯微孔膜的片状料进行交替叠配,得到组合层;再在上表面和下表面覆上铜箔,将含有铜箔的组合层放置加热盘内,进行真空热压;加热盘内设有管路,管路内通有热油,在真空压力为30torr(毫米汞柱)的条件下,加热盘管路内的热油不断升温,导致铜箔和组合层的温度也随之上升,当温度升至150-200℃之间时,达到固化反应温度,树脂产生流动并进一步发生交联反应,温度上升至180-220℃之间时,反应停止,树脂保持不变,在此温度下,等待树脂逐步固化,完成后制得覆铜板。
实施例3
本实施例提供一种覆铜板,如图1、2所示,所述覆铜板包括:
多层半固化片3和多层的聚四氟乙烯微孔膜2;所述半固化片和所述聚四氟乙烯微孔膜交替叠合,形成组合层;
所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2;
所述半固化片是通过将玻璃纤维布浸渍热固性树脂后烘烤制得;所述半固化片中的树脂含量为65%。
所述覆铜板还包括2层的铜箔1,贴附在所述组合层的两面。
本实施例的覆铜板的原料包括:玻璃纤维布,碳氢树脂,聚四氟乙烯微孔膜,硅烷偶联剂和铜箔。
所述玻璃纤维布为1080电子玻璃纤维布;所述碳氢树脂由环氧树脂和氰酸酯组成,所述碳氢树脂的胶含量为20%;所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2,所述硅烷偶联剂为乙烯基硅烷水性偶联剂。
本实施例的覆铜板是通过如下方法制备得到的:
将1080电子玻璃纤维布与碳氢树脂按照4:6的比例进行混合浸渍,浸渍2秒后拿出,进行烘烤,烘烤后制得树脂含量为65%的半固化片;
将聚四氟乙烯微孔膜浸渍入质量百分比含量为2%的乙烯基硅烷水性偶联剂溶液后取出,烘干水分,使用乙烯基硅烷水性偶联剂能够提高聚四氟乙烯微孔膜和碳氢树脂界面的结合力。
根据板材厚度0.50mm的设计要求,将半固化片和聚四氟乙烯微孔膜的片状料进行交替叠配,得到组合层;再在上表面和下表面覆上铜箔,将含有铜箔的组合层放置加热盘内,进行真空热压;加热盘内设有管路,管路内通有热油,在真空压力为30torr(毫米汞柱)的条件下,加热盘管路内的热油不断升温,导致铜箔和组合层的温度也随之上升,当温度升至150-200℃之间时,达到固化反应温度,树脂产生流动并进一步发生交联反应,温度上升至180-220℃之间时,反应停止,树脂保持不变,在此温度下,等待树脂逐步固化,完成后制得覆铜板。
对本公开实施例得到的覆铜板的性能进行对比验证。验证结果如表1所示。表1中,常规覆铜板是从市面上购买所得的常规热固性覆铜板;所述聚四氟乙烯覆铜板是从市面上购买所得的常规热塑性覆铜板。
表1
上述检测方法均按照国家检验标准进行检验测试。
上述覆铜板的对比数据中,根据厚度、介电常数、介电损耗的要求,搭配不同规格的半固化片和PTFE微孔膜进行设计,通过调整聚四氟乙烯的体积、半固化片中的树脂体积、玻纤布体积这三者的比例,决定板材的介电常数。一般聚四氟乙烯的介电常数为2.1、树脂介电常数在2.5-6之间(和树脂体系有关)、玻纤布的介电常数为6左右。通过三种材料的体积比,即根据预设的厚度、介电常数、介电损耗的要求,通过半固化片的层数和聚四氟乙烯的层数控制两者的体积用量,可以计算出板材的介电常数,实现参数功能的预设。如上述的介电常数DK,实施例2、3的介电常数为3-10,即是通过调整多层的半固化片及聚四氟乙烯微孔膜的层数设置后得到的可调整的范围。
通过表1可以看出本公开得到的覆铜板的平整度、冲孔性和尺寸稳定性均优于聚四氟乙烯覆铜板;相比于常规覆铜板,该覆铜板的介电常数要优于常规覆铜板,介电损耗小于常规覆铜板;综上所述,该覆铜板的可加工性强,介电常数稳定,介电损耗低,在PCB加工特性和电性能均有优势,可以适用于更多的环境。
所属领域的普通技术人员应当理解:以上任何实施例的讨论仅为示例性的,并非旨在暗示本公开的范围(包括权利要求)被限于这些例子;在本公开的思路下,以上实施例或者不同实施例中的技术特征之间也可以进行组合,步骤可以以任意顺序实现,并存在如上所述的本公开实施例的不同方面的许多其它变化,为了简明它们没有在细节中提供。
本公开实施例旨在涵盖落入所附权利要求的宽泛范围之内的所有这样的替换、修改和变型。因此,凡在本公开实施例的精神和原则之内,所做的任何省略、修改、等同替换、改进等,均应包含在本公开的保护范围之内。
Claims (10)
1.一种覆铜板,其特征在于,包括:
至少一层的半固化片和至少一层的聚四氟乙烯微孔膜;所述半固化片和所述聚四氟乙烯微孔膜交替叠合;
所述聚四氟乙烯微孔膜的孔径为1-10um,膜克重为20-200g/m2。
2.根据权利要求1所述的覆铜板,其特征在于,所述半固化片是通过将玻璃纤维布浸渍热固性树脂后烘烤制得;所述半固化片中树脂含量不低于65%。
3.根据权利要求1所述的覆铜板,其特征在于,所述聚四氟乙烯微孔膜为经硅烷偶联剂浸渍烘干制得。
4.一种覆铜板,其特征在于,所述覆铜板的原材料包括:
玻璃纤维布、热固性树脂、硅烷偶联剂、聚四氟乙烯微孔膜和至少一层的铜箔。
5.根据权利要求4所述的覆铜板,其特征在于,所述玻璃纤维布包括电子级玻璃纤维布。
6.根据权利要求4所述的覆铜板,其特征在于,所述热固性树脂包括碳氢树脂胶液;所述热固性树脂的胶含量在20%-85%之间。
7.根据权利要求4所述的覆铜板,其特征在于,所述硅烷偶联剂包括氨基硅烷水性偶联剂、乙烯基硅烷水性偶联剂和环氧基硅烷水性偶联剂的一种或几种的组合。
8.权利要求1-7任一项所述的覆铜板的制造方法,其特征在于,该制造方法包括如下步骤:
将玻璃纤维布浸渍到热固性树脂中,取出烘烤制得半固化片;
根据覆铜板所预设的厚度、介电常数和介电损耗,选用预设层数的半固化片与预设层数的聚四氟乙烯微孔膜进行交替层叠,得到组合层;
在组合层的至少一个面覆盖铜箔,在真空条件下热压压合,得到覆铜板。
9.根据权利要求8所述的制造方法,其特征在于,在选用预设层数的半固化片与预设层数的聚四氟乙烯微孔膜进行交替层叠的步骤前,所述制造方法还包括对聚四氟乙烯微孔膜浸渍硅烷偶联剂溶液的步骤。
10.根据权利要求9所述的制造方法,其特征在于,所述硅烷偶联剂溶液中硅烷偶联剂的质量百分比含量为0.5%-2%。
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CN102794949A (zh) * | 2012-08-09 | 2012-11-28 | 广东生益科技股份有限公司 | 覆铜板 |
CN108040423A (zh) * | 2017-12-14 | 2018-05-15 | 张玉英 | 一种覆铜板的制备工艺 |
CN113211903A (zh) * | 2021-06-03 | 2021-08-06 | 中国振华集团云科电子有限公司 | 一种陶瓷填充型碳氢树脂覆铜板的生产方法 |
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CN102794949A (zh) * | 2012-08-09 | 2012-11-28 | 广东生益科技股份有限公司 | 覆铜板 |
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CN113211903A (zh) * | 2021-06-03 | 2021-08-06 | 中国振华集团云科电子有限公司 | 一种陶瓷填充型碳氢树脂覆铜板的生产方法 |
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