CN113930062A - 半固化片及其制作方法、和覆铜板的制作方法 - Google Patents
半固化片及其制作方法、和覆铜板的制作方法 Download PDFInfo
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Abstract
半固化片及其制作方法、和覆铜板的制作方法。本发明提供了一种半固化片,包含:纤维,所述纤维的介电常数小于4,由纤维纺织成纤维布;胶液,纤维布在胶液中浸渍,烘烤,制成半固化片。本发明还提供了一种半固化片的制作方法,用于制作前述半固化片,将纤维布在胶液中浸渍,在120℃~180℃下烘烤3~8分钟制得半固化片。本发明还提供了一种覆铜板的制作方法,采用前述半固化片制作覆铜板,在半固化片上覆盖铜箔,在热压机中加热、加压固化以形成覆铜板。据此,本发明能够达到的技术效果在于,所制作的覆铜板具有优异的介电特性、绝缘层抗击穿强度高、绝缘性好等特点,能够保证信号的完整性和可靠性,适用于5G和6G高频、高速传输技术的需求。
Description
技术领域
本发明涉及电子材料领域,更为具体地涉及一种超低介电损耗覆铜板的制作方法。
背景技术
物联网(IoT)和第五代移动通信技术(5G技术)的飞速发展,对封装材料和元器件基材的介电性能提出了更高的要求,开发具备低介电常数以及低介电损耗的树脂成为重要的研究方向。随着PCB行业迅速发展,电子信息产品信号的高频、高速传输技术要求越来越高,不仅要求覆铜板具有低而稳定的介电常数(Dk)和尽可能低的介电损耗(Df),以保证信号的完整性和可靠性,而且电子产品高频化以及无铅制程的发展,对覆铜板提出了不同的耐热性要求。其中覆铜板作为电子元器件的载体,其性能决定了高端电子信息技术的高频、高速、及高可靠性等。
现有技术的电子玻璃纤维布在其含胶量(RC%)为46.1%(重量),其介电常数(Dk)为4.36,介电损耗(Df)为0.0057。现有的覆铜板材料已不能达到5G或未来6G对高频、高速传输技术的需求。
现有技术中存在的如下诸多问题:覆铜板的介电常数等特性不能满足高频、高速、高可靠性的信息传输的要求。
发明内容
本发明需要解决的技术问题是:如何选择合适的纤维、合适的胶液来满足信号传输的高频、高速、高可靠性的需求。
为了解决以上技术问题,本发明提供,其目的在于使得覆铜板具备优异介电特性、绝缘层抗击穿强度高、绝缘性好等优良的特点,满足高频、高速、高可靠性的信息传输的要求。
为了达到上述目的,本发明提供了一种半固化片,包含:
纤维,所述纤维的介电常数小于4,由纤维纺织成纤维布;
胶液,纤维布在胶液中浸渍,烘烤,制成半固化片。
优选地,所述纤维为介电常数小于4的电子玻璃纤维、石英纤维、液晶高分子聚合物纤维、或超高分子量聚乙烯纤维。
优选地,所述胶液包含:
树脂组合物,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份;
溶剂;
树脂组合物和溶剂混合均匀制成固含量为50%~80%(重量)的胶液。
优选地,烘烤后半固化片的固含量的含胶量40~80%(重量)。
为了达到上述目的,本发明还提供了一种半固化片的制作方法,用于制作前述半固化片,将纤维布在胶液中浸渍,在120℃~180℃下烘烤3~8分钟制得半固化片。
优选地,胶液的配置方法:
按照下述组分,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份;混合制成树脂组合物;
将树脂混合物和溶剂混合均匀制成固含量为50~80%(重量)的胶液。
优选地,纤维布的编织方法:
采用介电常数小于4的电子玻璃纤维、石英纤维、液晶高分子聚合物纤维、或超高分子量聚乙烯纤维作为经线、纬线,进行织布。
为了达到上述目的,本发明还提供了一种覆铜板的制作方法,采用前述半固化片制作覆铜板,
在半固化片上覆盖铜箔,在热压机中加热、加压固化以形成覆铜板。
优选地,在半固化片的其中一面或两面盖铜箔,半固化片数量为1~8片,当半固化片数量大于或等于2时,相邻两片半固化片中间一层铜箔;
加热温度为180℃~230℃,施加的压力为1~4MPa,加热加压时间为2~6小时。
优选地,所述覆铜板的制作方法,还包括,
对覆铜板进行性能测试,测试覆铜板的如下参数:
介电常数和/或介电损耗;或,
阻燃性能;或,
玻璃化转变温度;或,
铜箔剥离强度。
与现有技术相比,本发明提供了一种半固化片,包含:纤维,所述纤维的介电常数小于4,由纤维纺织成纤维布;胶液,纤维布在胶液中浸渍,烘烤,制成半固化片。本发明还提供了一种半固化片的制作方法,用于制作前述半固化片,将纤维布在胶液中浸渍,在120℃~180℃下烘烤3~8分钟制得半固化片。本发明还提供了一种覆铜板的制作方法,采用前述半固化片制作覆铜板,在半固化片上覆盖铜箔,在热压机中加热、加压固化以形成覆铜板。据此,本发明能够达到的技术效果在于,所制作的覆铜板具有优异的介电特性、绝缘层抗击穿强度高、绝缘性好等特点,能够保证信号的完整性和可靠性,适用于5G和6G高频、高速传输技术的需求。
附图说明
图1A示出了本发明提供的覆铜板的第一实施例的结构示意图。
图1B示出了本发明提供的覆铜板的第一实施例的结构示意图。
图2示出了本发明提供的覆铜板的制作方法的一实施例的流程图。
附图标记说明:
1纤维
2纤维布
3胶液
4半固化片
5铜箔
6覆铜板。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。
参阅图1A、图1B所示,本发明提供的半固化片,包含:纤维1,纤维1的介电常数小于4,由纤维1纺织成纤维布2。胶液3,纤维布2在胶液3中浸渍,烘烤,制成半固化片4。
纤维1为介电常数小于4的电子玻璃纤维、石英纤维(Quartz fiber)、液晶高分子聚合物纤维(Liquid Crystal Polymer fiber)、或超高分子量聚乙烯纤维(Spectrafiber)。介电常数小于4的玻璃纤维也称为低介电常数玻璃纤维(Low Dk glass)。
胶液包含:树脂组合物,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份。溶剂。树脂组合物和溶剂混合均匀制成固含量为50%~80%(重量)的胶液。
烘烤后半固化片的固含量的含胶量(RC%)40~80%(重量)。
结合图2所示,本发明提供的半固化片的制作方法,用于制作前述半固化片,将纤维布在胶液中浸渍,在120℃~180℃下烘烤3~8分钟制得半固化片。
胶液的配置方法:按照下述组分,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份;混合制成树脂组合物;将树脂混合物和溶剂混合均匀制成固含量为50~80%(重量)的胶液。
纤维布的编织方法:采用介电常数小于4的电子玻璃纤维、石英纤维、液晶高分子聚合物纤维、或超高分子量聚乙烯纤维作为经线、纬线,进行织布。
结合参阅图2,本发明还提供的覆铜板的制作方法,采用前述半固化片制作覆铜板,在半固化片上覆盖铜箔,在热压机中加热、加压固化以形成覆铜板。
在半固化片的其中一面或两面盖铜箔,半固化片数量为1~8片;当半固化片数量大于或等于2时,相邻两片半固化片中间一层铜箔;加热温度为180℃~230℃,施加的压力为1~4MPa,加热加压时间为2~6小时。参阅图1A所示,半固化片数量为1片,在半固化片的两面都覆盖铜箔5(铜箔5两层)。参阅图1B所示,半固化片数量为2,在每个半固化片的两面都覆盖一层铜箔5,也就是,这两个半固化片的中间夹合有一层铜箔5,一共三层铜箔5。半固化片4中的胶液用来粘合铜箔。而,纤维布2作为增强部。胶液和纤维布共同构成了绝缘体。形成了覆铜板6。
覆铜板的制作方法,还包括,对覆铜板进行性能测试,测试覆铜板的如下参数:介电常数和/或介电损耗;或,阻燃性能;或,玻璃化转变温度;或,铜箔剥离强度。
测量介电常数和/或介电损耗的方法是采用谐振腔法在分离柱电介质谐振器(split post dielectric resonance,SPDR)中进行,频率设定为10GHz。测试环境分为标准环境和烘后环境。标准环境是指覆铜板制作完成后即在IPC标准环境下进行测试。烘后环境(After Braking,AB),对样品在105℃下进行烘烤2小时后再进行测试。
本发明的纤维与现有技术的电子玻璃纤维布制成的覆铜板进行测试比较,见表1。
表1
采用IPC-TM-650 2.3.10标准方法,进行阻燃性能测试。
采用IPC-TM-650 2.4.24.3标准方法(有机薄膜的玻璃化转变温度-TMA的方法),进行玻璃化转变温度(Tg)测试。TMA(Thermomchanical analysis)为热机械分析。
采用IPC-TM-650 2.4.8标准方法,进行铜箔剥离强度测试。
还可以进行:吸水率、25℃下拉伸剪切强度、180℃下拉伸剪切强度、热膨胀系数ppm/℃(50-260℃)、288℃耐热性。对现有技术的电子玻璃纤维和本发明提供的相关样品进行上述测试,相关指标如表2。测试环境为标准环境。
表2
以上所述即本发明提供的半固化片、半固化片的制作方法、覆铜板的制作方法具体实施方式。据此,本发明能够达到的技术效果在于,所制作的覆铜板具有优异的介电特性、绝缘层抗击穿强度高、绝缘性好等特点,能够保证信号的完整性和可靠性,适用于5G和6G高频、高速传输技术的需求。
上述具体实施例和附图说明仅为例示性说明本发明的技术方案及其技术效果,而非用于限制本发明。任何熟于此项技术的本领域技术人员均可在不违背本发明的技术原理及精神的情况下,在权利要求保护的范围内对上述实施例进行修改或变化,均属于本发明的权利保护范围。
Claims (10)
1.一种半固化片,其特征在于,包含:
纤维,所述纤维的介电常数小于4,由纤维纺织成纤维布;
胶液,纤维布在胶液中浸渍,烘烤,制成半固化片。
2.根据权利要求1所述的半固化片,其特征在于,所述纤维为介电常数小于4的电子玻璃纤维、石英纤维、液晶高分子聚合物纤维、或超高分子量聚乙烯纤维。
3.根据权利要求1所述的半固化片,其特征在于,所述胶液包含:
树脂组合物,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份;
溶剂;
树脂组合物和溶剂混合均匀制成固含量为50%~80%(重量)的胶液。
4.根据权利要求1所述的半固化片,其特征在于,烘烤后半固化片的固含量的含胶量40~80%(重量)。
5.一种半固化片的制作方法,用于制作根据权利要求1所述的半固化片,其特征在于,将纤维布在胶液中浸渍,在120℃~180℃下烘烤3~8分钟制得半固化片。
6.根据权利要求5所述的半固化片的制作方法,其特征在于,胶液的配置方法:
按照下述组分,按重量份计,包含,100份热固性聚苯醚树脂、50~110份氰酸树脂、5~30份多官能乙烯基芳香族共聚物;分散剂硅烷偶联剂0.05~3份、二氧化硅0~70份、阻燃剂0~30份、引发剂0.05~0.5份;混合制成树脂组合物;
将树脂混合物和溶剂混合均匀制成固含量为50~80%(重量)的胶液。
7.根据权利要求5所述的半固化片的制作方法,其特征在于,纤维布的编织方法:
采用介电常数小于4的电子玻璃纤维、石英纤维、液晶高分子聚合物纤维、或超高分子量聚乙烯纤维作为经线、纬线,进行织布。
8.一种覆铜板的制作方法,采用根据权利要求1至4中任一项所述的半固化片制作覆铜板,其特征在于,
在半固化片上覆盖铜箔,在热压机中加热、加压固化以形成覆铜板。
9.根据权利要求8所述的覆铜板的制作方法,其特征在于,
在半固化片的其中一面或两面盖铜箔,半固化片数量为1~8片,当半固化片数量大于或等于2时,相邻两片半固化片中间一层铜箔;
加热温度为180℃~230℃,施加的压力为1~4MPa,加热加压时间为2~6小时。
10.根据权利要求8所述的覆铜板的制作方法,其特征在于,还包括,
对覆铜板进行性能测试,测试覆铜板的如下参数:
介电常数和/或介电损耗;或,
阻燃性能;或,
玻璃化转变温度;或,
铜箔剥离强度。
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