CN104619117A - 电路板和电路板间的磁性组合结构 - Google Patents

电路板和电路板间的磁性组合结构 Download PDF

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Publication number
CN104619117A
CN104619117A CN201510085854.9A CN201510085854A CN104619117A CN 104619117 A CN104619117 A CN 104619117A CN 201510085854 A CN201510085854 A CN 201510085854A CN 104619117 A CN104619117 A CN 104619117A
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Prior art keywords
circuit boards
circuit board
combined
magnetic
magnetic material
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CN201510085854.9A
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王镇山
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Priority to CN201510085854.9A priority Critical patent/CN104619117A/zh
Publication of CN104619117A publication Critical patent/CN104619117A/zh
Priority to US14/721,341 priority patent/US9801300B2/en
Priority to US29/536,825 priority patent/USD838680S1/en
Priority to CN201510641115.3A priority patent/CN105206959A/zh
Priority to CN201520771856.9U priority patent/CN205069932U/zh
Priority to US29/624,178 priority patent/USD865689S1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toys (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明电路板和电路板间的磁性组合结构是一种利用磁性材料的新型连接结构，适用于电路板之间的组合连接。突破目前国内外对于电路板与电路板间传统的组合、堆叠或连接方式，本发明利用磁性材料，实现适用于电路板之间的组合连接结构。下图是含有本新型连接结构的多块电路板组合连接效果：2块电路板之间通过磁性作用相互吸引在一起，磁性材料部件（2）以特定的位置排列，以保证2个新型连接结构必须按特定的方向和角度才能靠磁性组合连接在一起，2块电路之间板通过包裹结构限位部件（4）达到2块电路板组合连接后限定位置的作用。

Description

电路板和电路板间的磁性组合结构
技术领域
本发明是一种利用磁性材料的新型连接结构，适用于电路板之间的组合连接。
背景技术
目前国内外对于电路板与电路板间的组合、堆叠或连接结构多采用的方法是使用螺丝固定、利用传统针式接插件连接，或是其他机械结构进行组合连接。本发明利用磁性材料，实现适用于电路板之间的组合连接结构。
发明内容
本发明利用磁性材料，实现适用于电路板之间的新型的组合连接结构
下面结合附图和实施例对本发明进一步说明。
部件说明：
1：电路板部分：电路功能的载体，可以被切割成特定形状，通过包裹结构，将磁性材料固定在特定的位置；
2：磁性材料部件：利用磁性材料的同性相斥、异性相吸的特性，实现电路板之间的磁性连接；其形状可以是圆柱、球体、多边形或其他形状；
3：包裹结构部件：用来固定电路板和磁性材料部件，形成稳定的结构；其材质可以是塑料、木头、金属或其他材料；
4：包裹结构的限位部件：起到两块电路板组合连接后限定相互位置的作用，达到快速定位的目的。
附图说明
图1是含有本新型连接结构的单块电路板效果示意图：
图2时含有本新型连接结构的单块电路板拆解其一边结构效果示意图：
从中可以看出：本结构由电路板部分（1）、磁性材料部件（2）、包裹结构部件（3）三部分组成组成
图3、图4分别是含有本新型连接结构的多块电路板组合连接正面、反面效果示意图：
多块电路板之间通过磁性作用相互吸引在一起；多个磁性材料部件（2）以特定的顺序位置排列，以保证多个新型连接结构必须按特定的方向和角度堆叠靠近才能靠磁性组合连接；多块电路之间板通过包裹结构限位部件（4）达到多块电路板间组合连接后限定位置的作用
图5是磁性材料部件的充磁方向示意图。
具体实施方式
单个含有本新型连接结构的电路板的组装方式：
两组磁性材料部件（2）分别由两组包裹材料部件（3）固定电路板部分（1）的左右两边
四个磁性材料（2）按照特定的顺序固定
包裹材料部件（3）上设计特定的包裹结构限位部件（4），以帮助两个连接结构间的快速定位
两个含有本新型连接结构的电路板组合连接方式：
准备两块含有本新型连接结构的电路板，将其中一块叠放在另一块的电路板上面，使两块电路板上的包裹结构限位部件（4）相结合，即可完成两块电路板的组合连接；
两块新型连接结构的电路板只能按照特定的方向和角度进行连接，否则磁性材料会试图阻止和提醒操作人员。

Claims (5)

1.在多个电路板之间的组合连接中，利用磁性材料，完成新型的组合连接结构。
2.根据权利要求1所诉，单个本专利新型连接结构的电路板部件应有：磁性材料部件（2）、包裹材料部件（3）以及电路板部分（1）。
3.根据权利要求1所诉，单个本专利新型连接结构的电路板的装载应有：磁性材料部件（2）由包裹材料部件（3）包裹后组装在电路板部分（5）。
4.根据权利要求1所诉，两个或两个以上含本专利新型连接结构的电路板应该以图3、图4方式完成组合连接。
5.根据权利要求4所诉，包裹材料部件（3）部件中应包含有：包裹结构限位部件（4），以保证多块电路板间组合连接后限定位置的作用。
CN201510085854.9A 2015-02-20 2015-02-20 电路板和电路板间的磁性组合结构 Pending CN104619117A (zh)

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Application Number Priority Date Filing Date Title
CN201510085854.9A CN104619117A (zh) 2015-02-20 2015-02-20 电路板和电路板间的磁性组合结构
US14/721,341 US9801300B2 (en) 2015-02-20 2015-05-26 Electrical modules and modular electronic building systems
US29/536,825 USD838680S1 (en) 2015-02-20 2015-08-19 Modular electronic device
CN201510641115.3A CN105206959A (zh) 2015-02-20 2015-09-30 电子模块和模块化电子构建系统
CN201520771856.9U CN205069932U (zh) 2015-02-20 2015-09-30 一种电子模块和模块化电子构建系统
US29/624,178 USD865689S1 (en) 2015-02-20 2017-10-30 Electrical module

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CN201510641115.3A Pending CN105206959A (zh) 2015-02-20 2015-09-30 电子模块和模块化电子构建系统
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107185259A (zh) * 2017-06-30 2017-09-22 美科科技（北京）有限公司 用于多方位连接的电子模块和模块化电子构建系统

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8602833B2 (en) 2009-08-06 2013-12-10 May Patents Ltd. Puzzle with conductive path
US11330714B2 (en) 2011-08-26 2022-05-10 Sphero, Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US9019718B2 (en) * 2011-08-26 2015-04-28 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
CN104619117A (zh) * 2015-02-20 2015-05-13 王镇山 电路板和电路板间的磁性组合结构
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD817412S1 (en) * 2016-10-14 2018-05-08 Microduino Inc. Connector modules
CN106602301A (zh) * 2016-12-28 2017-04-26 李金颖 一种可自行设计的模块化电子插件
EP3449988A4 (en) * 2017-02-16 2019-12-11 Makeblockco., Ltd. ELECTRONIC TOY BOX SYSTEM
CN106997710A (zh) * 2017-06-14 2017-08-01 哈尔滨工业大学 一种积木式电子实验教具
CN107230872A (zh) * 2017-07-13 2017-10-03 上海易教信息科技有限公司 一种电子积木单体及电子积木模具
US20190091596A1 (en) * 2017-09-26 2019-03-28 Elenco Electronics, Inc. Two-sided grid with electrically conductive connections for a snap-together electronic toy set
TWI650633B (zh) 2017-10-06 2019-02-11 財團法人國家實驗研究院 模組化電子組合裝置
CN107694127A (zh) * 2017-11-06 2018-02-16 中国地质大学（武汉） 一种堆叠型拼插式电子积木
US11791589B2 (en) 2017-12-18 2023-10-17 Sphero, Inc. Modular electronic building systems and methods of using the same
US20190190193A1 (en) * 2017-12-18 2019-06-20 Littlebits Electronics Inc. Modular electronic building systems and methods of using the same
CN108126356A (zh) * 2017-12-22 2018-06-08 广州途道信息科技有限公司 电子积木系统的编程方法
US20190280421A1 (en) * 2018-03-07 2019-09-12 Xcelsis Corporation Configurable smart object system with grid or frame-based connectors
US10862252B2 (en) * 2018-05-04 2020-12-08 The Ricker Lyman Robotic Company, Inc. Surface-contact ethernet connector, network equipment chassis including the same and operating method thereof
EP3637963B1 (en) * 2018-10-12 2024-02-07 AT&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier structures connected by cooperating magnet structures
CN209169986U (zh) * 2018-11-19 2019-07-26 富士能电子(昆山)有限公司 电源供应器
USD902897S1 (en) 2019-11-13 2020-11-24 Honeywell International Building control module
US20220001292A1 (en) * 2020-06-18 2022-01-06 Saifeng Chen Programmable toy building blocks system
US20230410680A1 (en) * 2020-10-07 2023-12-21 Cartesia Solutions S.R.L. Ludic-educational modular system
USD985516S1 (en) 2021-02-26 2023-05-09 Honeywell International Inc. Building controller
USD973147S1 (en) * 2021-05-11 2022-12-20 Guangdong Qunyu Interactive Technology Co., Ltd. Toy block
USD1034490S1 (en) * 2022-05-09 2024-07-09 Shenzhen Deruisi Electronic Technology Co., Ltd. Bracket for heat sink of CPU

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558914A (en) * 1982-09-23 1985-12-17 Gould Inc. Readily expandable input/output construction for programmable controller
USD285583S (en) * 1982-12-29 1986-09-09 Kassai Kabushiki Kaisha Construction toy
DK156244C (da) * 1984-08-03 1989-12-04 Lego As Stroemfoerende byggeelement
CA2083017C (en) * 1992-11-16 1999-02-09 Alan Walter Ainsbury Tandem circuit cards
US5565705A (en) * 1994-05-02 1996-10-15 Motorola, Inc. Electronic module for removing heat from a semiconductor die
US5677830A (en) * 1995-03-02 1997-10-14 Mitel Corporation Modular, stacking, expandable electronic enclosure system
US5838548A (en) * 1995-10-26 1998-11-17 The Whitaker Corporation Network apparatus
US5645434A (en) * 1995-12-01 1997-07-08 Asante Technologies, Inc. Connector element and component arrangement for a stackable communications network hub
JP2924829B2 (ja) * 1996-11-11 1999-07-26 日本電気株式会社 多段連結電子部品モジュール
US5841634A (en) * 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
DE29711371U1 (de) * 1997-06-30 1997-11-27 Siemens AG, 80333 München Vorrichtung zur Verbindung von Leiterplatten getrennter Geräte
US6129605A (en) * 1997-09-24 2000-10-10 Parvia Corporation Modular base units for a toy building set
US5984732A (en) * 1997-11-14 1999-11-16 Umax Computer Corporation Method and apparatus for interconnection of modular electronic components
US6137686A (en) * 1998-04-10 2000-10-24 Casio Computer Co., Ltd. Interchangeable modular arrangement of computer and accessory devices
WO2000036236A2 (en) * 1998-12-14 2000-06-22 Hexablock, Inc. Building structures
US6106316A (en) * 1999-02-10 2000-08-22 International Business Machines Corporation Multistage connector for carriers with combined pin-array and pad-array
JP2001044660A (ja) * 1999-07-27 2001-02-16 Mitsumi Electric Co Ltd 電子機器
US6431879B2 (en) * 2000-02-10 2002-08-13 Tyco Electronics Corporation Printed circuit board connector
US6759155B2 (en) * 2000-05-01 2004-07-06 Delphi Technologies, Inc. Plate construction of high temperature air-to-air heat exchanger
US6420953B1 (en) * 2000-05-19 2002-07-16 Pulse Engineering. Inc. Multi-layer, multi-functioning printed circuit board
US6573592B2 (en) * 2001-08-21 2003-06-03 Micron Technology, Inc. Semiconductor die packages with standard ball grid array footprint and method for assembling the same
US7184272B1 (en) * 2002-04-05 2007-02-27 Itt Manufacturing Enterprises, Inc. Modular RF terminal having integrated bus structure
US7144830B2 (en) * 2002-05-10 2006-12-05 Sarnoff Corporation Plural layer woven electronic textile, article and method
US7099158B1 (en) * 2003-02-13 2006-08-29 Bellsouth Intellectual Property Corp. Housing for modules
US7241680B2 (en) * 2004-04-30 2007-07-10 Intel Corporation Electronic packaging using conductive interposer connector
PL1617485T3 (pl) * 2004-07-12 2007-10-31 Haeberlein Lehr Ulla Modułowy system wtykowy do bezpiecznego składowania poziomo ułożonych w stosy modułów fotowoltaicznych podczas transportu
CN2854735Y (zh) * 2005-12-12 2007-01-03 郑昭明 积木式电子元器件
US20070173095A1 (en) * 2006-01-20 2007-07-26 Rifael Bin-Nun Reusable block and fastener system
US7589974B2 (en) * 2006-04-21 2009-09-15 Helwett-Packard Development Company, L.P. Modular server and method
US7696744B2 (en) * 2007-11-29 2010-04-13 Verigy(Singapore) Pte. Ltd. Screw-less latching system for securing load boards
US8690631B2 (en) * 2008-09-12 2014-04-08 Texas Instruments Incorporated Toy building block with embedded integrated circuit
EP2430707A4 (en) * 2009-02-02 2014-07-16 Apex Technologies Inc FLEXIBLE MAGNETIC COUPLINGS
DE102010044909A1 (de) * 2010-09-09 2012-03-15 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Schaltungsgehäuse mit einer darin über Positionierelemente positionierten Leiterplatte
CA140086S (en) * 2011-01-25 2011-11-08 Lego As Building block for a toy building set
WO2012161844A1 (en) * 2011-02-28 2012-11-29 B-Squares Electrics LLC Electronic module, control module, and electronic module set
GB201110825D0 (en) * 2011-06-27 2011-08-10 Sentec Ltd Sensors
US9597607B2 (en) * 2011-08-26 2017-03-21 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US9019718B2 (en) * 2011-08-26 2015-04-28 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US20130105975A1 (en) * 2011-10-26 2013-05-02 Rafiqul Hussain Semiconductor chip device with thermal interface material frame
US8715030B2 (en) * 2011-12-22 2014-05-06 Hsiao-Chieh Chin Toy building block
TWI433618B (zh) * 2012-02-08 2014-04-01 Universal Scient Ind Shanghai 堆疊式基板結構
GB2531959A (en) * 2012-02-24 2016-05-04 Roland Hill George Device for and method of connecting two items together
TWM444669U (zh) * 2012-07-03 2013-01-01 Sercomm Corp 多模組化組合之通訊裝置
AU347408S (en) * 2012-08-24 2013-03-04 Littlebits Electronics Inc Connector for modular electronic building system
US9407251B1 (en) * 2012-12-07 2016-08-02 Cree Fayetteville, Inc. Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration
USD740368S1 (en) * 2013-04-02 2015-10-06 Innovation First, Inc. Robotic bump switch for a robotic construction kit
CN203469483U (zh) * 2013-07-21 2014-03-12 王竹泉 用于积木构件与裸pcb板的电子部件拼接的连接装置
CN103316485A (zh) * 2013-07-21 2013-09-25 王竹泉 用于积木构件与裸pcb板的电子部件拼接的连接装置
USD758978S1 (en) * 2013-08-06 2016-06-14 Bedrock Automation Platforms, Inc. Backplane for an industrial control system (ICS)
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
JP6152893B2 (ja) * 2013-09-30 2017-06-28 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール
CN203777676U (zh) * 2013-12-18 2014-08-20 上海智位机器人有限公司 一种积木模块以及电子积木
CN203710703U (zh) * 2014-01-16 2014-07-16 东莞乐博士文教用品科技有限公司 一种多功能电子积木互搭结构
CN203710704U (zh) * 2014-01-25 2014-07-16 杭州速泽电子科技有限公司 兼容型磁吸附式电子积木
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD724028S1 (en) * 2014-04-17 2015-03-10 Innovation First, Inc. Microcontroller assembly housing for a construction kit
US9364769B2 (en) * 2014-06-18 2016-06-14 Jennifer Lynn Kosmo Surfacescape for multi-dimensional play and display
USD751984S1 (en) * 2014-09-22 2016-03-22 Limefuel, LLC Rechargeable battery device
CN104619117A (zh) * 2015-02-20 2015-05-13 王镇山 电路板和电路板间的磁性组合结构
KR102382046B1 (ko) * 2015-11-04 2022-04-04 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107185259A (zh) * 2017-06-30 2017-09-22 美科科技（北京）有限公司 用于多方位连接的电子模块和模块化电子构建系统

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US20160249478A1 (en) 2016-08-25
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USD838680S1 (en) 2019-01-22
US9801300B2 (en) 2017-10-24

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Application publication date: 20150513