CN104597549B - 4600 nm band-pass infrared filtering sensitive element - Google Patents

4600 nm band-pass infrared filtering sensitive element Download PDF

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Publication number
CN104597549B
CN104597549B CN201410734957.9A CN201410734957A CN104597549B CN 104597549 B CN104597549 B CN 104597549B CN 201410734957 A CN201410734957 A CN 201410734957A CN 104597549 B CN104597549 B CN 104597549B
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CN104597549A (en
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吕晶
王继平
胡伟琴
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Hangzhou Mai Peak Polytron Technologies Inc
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Hangzhou Mai Peak Polytron Technologies Inc
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/28Interference filters
    • G02B5/281Interference filters designed for the infrared light

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Light Receiving Elements (AREA)

Abstract

The invention discloses a 4600 nm band-pass infrared filtering sensitive element. The 4600 nm band-pass infrared filtering sensitive element comprises a substrate taking Si as raw material, a first film coating layer made of Ge and SiO and a second film coating layer made of Ge and SiO; the substrate is arranged between the first film coating layer and the second film coating layer. The central wavelength of the 4600 nm band-pass infrared filtering sensitive element obtained by the invention is 4600+/-40 nm; during the medical infrared gas detection analysis process, the 4700 nm band-pass infrared filtering sensitive element can greatly improve the signal-to-noise ratio and increase testing accuracy, and is applicable to popularize and use on a large scale. Tp of peak transmittance of the filtering sensitive element is not less than 70%, the band width is equal to 138+/-20 nm, 400-5500 nm (except for passing band), and Tavg is less than 0.1%.

Description

4600nm band logical infrared filtering sensing elements
Technical field
The present invention relates to medical infrared gas detection optical filtering sensing element, especially a kind of 4600nm band logicals infrared absorption filter is photosensitive Sensing unit.
Background technology
Infrared filtering sensing element is filtered, cut-off visible ray allows to pass through infrared ray simultaneously.Ultrared wavelength is easy to Penetrate any object, that is, infrared ray will not be reflected when through object.Using ultrared this characteristic, only Allow the infrared ray of long wavelength to pass through, filter the ultraviolet and visible ray of short wavelength.Many fields are applied to, it is red for medical at present The problem that optical filtering sensing element used in outer gas detecting process is present is that the signal to noise ratio of transmitance and cut-off region is not high, no High-precision measurement requirement can be met.
The content of the invention
The invention aims to solve the not enough of above-mentioned technology and provide a kind of measuring accuracy height, letter can be greatly improved Make an uproar than 4600nm band logical infrared filtering sensing elements.
In order to achieve the above object, the present invention designed by a kind of 4600nm band logicals infrared filtering sensing element, including with Si for raw material substrate, with Ge, SiO as the first filming layer and with Ge, SiO as the second film plating layer, and the substrate is located at the Between one film plating layer and the second film plating layer, it is characterized in that the first filming layer is arranged in order from inside to outside that to include 120nm thick The Ge layers of degree, the SiO layer of 257nm thickness, the Ge layers of 110nm thickness, the SiO layer of 267nm thickness, the Ge layers of 112nm thickness, The SiO layer of 278nm thickness, the Ge layers of 161nm thickness, the SiO layer of 282nm thickness, the Ge layers of 110nm thickness, 239nm thickness SiO layer, the Ge layers of 201nm thickness, the SiO layer of 294nm thickness, the Ge layers of 233nm thickness, the SiO layer of 287nm thickness, 240nm The Ge layers of thickness, the SiO layer of 393nm thickness, the Ge layers of 257nm thickness, the SiO layer of 201nm thickness, the Ge layers of 270nm thickness, The SiO layer of 303nm thickness, the Ge layers of 325nm thickness, the SiO layer of 284nm thickness, the Ge layers of 71nm thickness, 180nm thickness SiO layer;The second described film plating layer be arranged in order from inside to outside include the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, The Ge layers of 283nm thickness, the SiO layer of 1308nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, 283nm thickness Ge layers, the SiO layer of 654nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, the Ge layers of 566nm thickness, The SiO layer of 602nm thickness, the Ge layers of 259nm thickness, the SiO layer of 150nm thickness.
The corresponding thickness of above-mentioned each material, it allows to change in the margin of tolerance, and scope of its change belongs to this patent guarantor The scope of shield, is identity relation.Generally the tolerance of thickness is in 10nm or so.
A kind of 4600nm band logicals infrared filtering sensing element obtained by the present invention, 4600 ± 40nm of its centre wavelength, its During the analysis of medical infrared gas detection, signal to noise ratio can be greatly improved, improve accurate testing degree, be suitable on a large scale Promote and use.Peak transmittance Tp >=70% of the optical filtering sensing element, bandwidth=138 ± 20nm, 400~5500nm(Except logical Band is outer), Tavg<0.1%.
Description of the drawings
Fig. 1 is embodiment overall structure diagram.
Fig. 2 is the infrared spectrum transmitance measured curve figure that embodiment is provided.
In figure:The first filming layer 1, substrate 2, the second film plating layer 3.
Specific embodiment
The invention will be further described to combine accompanying drawing below by embodiment.
Embodiment 1.
As depicted in figs. 1 and 2, a kind of 4600nm band logicals infrared filtering sensing element of the present embodiment description, including with Si For the substrate 2 of raw material, it is located at as the first filming layer 1 and by the second film plating layer 3, and the substrate 2 of Ge, SiO with Ge, SiO Between the film plating layer 3 of the first filming layer 1 and second, the first filming layer 1 is arranged in order includes 120nm thickness from inside to outside Ge layers, the SiO layer of 257nm thickness, the Ge layers of 110nm thickness, the SiO layer of 267nm thickness, the Ge layers of 112nm thickness, 278nm The SiO layer of thickness, the Ge layers of 161nm thickness, the SiO layer of 282nm thickness, the Ge layers of 110nm thickness, the SiO of 239nm thickness Layer, the Ge layers of 201nm thickness, the SiO layer of 294nm thickness, the Ge layers of 233nm thickness, the SiO layer of 287nm thickness, 240nm are thick The Ge layers of degree, the SiO layer of 393nm thickness, the Ge layers of 257nm thickness, the SiO layer of 201nm thickness, the Ge layers of 270nm thickness, The SiO layer of 303nm thickness, the Ge layers of 325nm thickness, the SiO layer of 284nm thickness, the Ge layers of 71nm thickness, 180nm thickness SiO layer;The second described film plating layer 3 is arranged in order from inside to outside Ge layers, the SiO of 654nm thickness for including 283nm thickness Layer, the Ge layers of 283nm thickness, the SiO layer of 1308nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, 283nm are thick The Ge layers of degree, the SiO layer of 654nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, the Ge layers of 566nm thickness, The SiO layer of 602nm thickness, the Ge layers of 259nm thickness, the SiO layer of 150nm thickness.

Claims (1)

1. a kind of 4600nm band logicals infrared filtering sensing element, including the substrate with Si as raw material(2), with Ge, SiO as first Film plating layer(1)With with Ge, SiO as the second film plating layer(3), and the substrate(2)Located at the first filming layer(1)With the second film plating layer (3)Between, it is characterized in that the first filming layer(1)Ge layers, the 257nm for including 120nm thickness is arranged in order from inside to outside The SiO layer of thickness, the Ge layers of 110nm thickness, the SiO layer of 267nm thickness, the Ge layers of 112nm thickness, the SiO of 278nm thickness Layer, the Ge layers of 161nm thickness, the SiO layer of 282nm thickness, the Ge layers of 110nm thickness, the SiO layer of 239nm thickness, 201nm are thick The Ge layers of degree, the SiO layer of 294nm thickness, the Ge layers of 233nm thickness, the SiO layer of 287nm thickness, the Ge layers of 240nm thickness, The SiO layer of 393nm thickness, the Ge layers of 257nm thickness, the SiO layer of 201nm thickness, the Ge layers of 270nm thickness, 303nm thickness SiO layer, the Ge layers of 325nm thickness, the SiO layer of 284nm thickness, the Ge layers of 71nm thickness, the SiO layer of 180nm thickness;Described Second film plating layer(3)Ge layers, the SiO layer of 654nm thickness, the 283nm thickness for including 283nm thickness is arranged in order from inside to outside Ge layers, the SiO layer of 1308nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, the Ge layers of 283nm thickness, The SiO layer of 654nm thickness, the Ge layers of 283nm thickness, the SiO layer of 654nm thickness, the Ge layers of 566nm thickness, 602nm thickness SiO layer, the Ge layers of 259nm thickness, the SiO layer of 150nm thickness.
CN201410734957.9A 2014-12-07 2014-12-07 4600 nm band-pass infrared filtering sensitive element Active CN104597549B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105842770B (en) * 2016-05-17 2018-06-01 江苏大学 A kind of CO2Gas detection infrared fileter and preparation method thereof
CN111323862A (en) * 2020-03-11 2020-06-23 上海翼捷工业安全设备股份有限公司 Infrared filter for sunlight interference resistance flame detection and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202305861U (en) * 2012-03-12 2012-07-04 杭州麦乐克电子科技有限公司 3,000-5,000nm band-pass infrared filter
CN202472019U (en) * 2012-03-12 2012-10-03 杭州麦乐克电子科技有限公司 5,300-nano band pass infrared optical filter
CN203551828U (en) * 2013-11-29 2014-04-16 杭州麦乐克电子科技有限公司 Astronomical optical filter with 3600-4000 nm pass band for observing graphic spectrums
CN204374467U (en) * 2014-12-07 2015-06-03 杭州麦乐克电子科技有限公司 The logical infrared filtering sensitive element of 4600nm band

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202305861U (en) * 2012-03-12 2012-07-04 杭州麦乐克电子科技有限公司 3,000-5,000nm band-pass infrared filter
CN202472019U (en) * 2012-03-12 2012-10-03 杭州麦乐克电子科技有限公司 5,300-nano band pass infrared optical filter
CN203551828U (en) * 2013-11-29 2014-04-16 杭州麦乐克电子科技有限公司 Astronomical optical filter with 3600-4000 nm pass band for observing graphic spectrums
CN204374467U (en) * 2014-12-07 2015-06-03 杭州麦乐克电子科技有限公司 The logical infrared filtering sensitive element of 4600nm band

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Address after: Xingguo Qianjiang Economic Development Zone 503-2-101 311188 Hangzhou Road, Zhejiang Province

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Applicant before: Multi IR Optoelectronics Co., Ltd.

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