CN104576572B - 包括电子装置和电子系统的集成电路芯片 - Google Patents

包括电子装置和电子系统的集成电路芯片 Download PDF

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CN104576572B
CN104576572B CN201410497513.8A CN201410497513A CN104576572B CN 104576572 B CN104576572 B CN 104576572B CN 201410497513 A CN201410497513 A CN 201410497513A CN 104576572 B CN104576572 B CN 104576572B
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electrical connection
substrate wafer
layer
groove
chip
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CN104576572A (zh
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D·奥谢尔
Y·安布斯
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STMicroelectronics International NV
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Italy Semiconductor (grenoble 2) Co
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Abstract

本公开涉及包括电子装置和电子系统的集成电路芯片。一种电子装置，包括由绝缘材料制成、并且具有电连接网络的衬底晶片。集成电路芯片安装至衬底晶片的顶侧。衬底晶片包含内部导管。导管由位于衬底晶片的顶侧中的沟槽所覆盖。沟槽包含例如为流体的导热材料。与沟槽偏离的、在衬底晶片的顶侧中的开口允许在集成电路和电连接网络之间形成电连接。

Description

包括电子装置和电子系统的集成电路芯片
优先权申明
本申请要求享有2013年10月15日提交的专利No.1360008的法国申请的优先权，其公开内容在此通过引用整体并入本文。
技术领域
本发明涉及微电子领域。
背景技术
已知制造包括堆叠彼此之上并且电连接在一起的电子装置电子系统，该电子装置分别包括至少一个集成电路。
特别地堆叠电子装置具有改进电学连接的性能以及减小占用面积的优点。然而，在某些情形下，集成电路芯片可以产生热量并且所产生的热量可以加热其他集成电路芯片并且因此降低了后者的性能。尤其是当第一电子装置包括产生热量的处理器芯片并且堆叠在第一电子装置上的第二电子装置包括存储器芯片时，当温度增高时特别是其工作退化。
上述情况是提高所述电子系统性能的障碍，诸如特别是他们运行程序的速度。然而，此时存在于所述电子系统所需性能与它们占地面积之间折衷的情形并不令人满意，尤其是在诸如移动电话的便携式装置的领域。
发明内容
根据一个实施例，提供了一种电子装置，其包括由绝缘材料制成的衬底晶片，电子装置具有电连接网络并且在至少一侧上承载了至少一个集成电路芯片，以及其中衬底晶片包含至少一个内部导管(duct)。
所述内部导管可以包含导热材料。
所述内部导管可以设置为远离电连接网络。
所述导管可以设置在衬底晶片中，并且采取沟槽的形式，并且衬底晶片可以包括覆盖该沟槽的表面层。
衬底晶片可以包含连接至所述内部导管并且连接至用于使流体流动的装置的互补的内部导管。
电连接网络可以包括在内部平面中包括电连接焊盘的金属层，并且衬底晶片可以包括在内部平面中的由所述表面层覆盖并且其中设置了所述沟槽的中间层，中间层和所述表面层包含在电连接焊盘之上的开孔，以及所述沟槽以一定距离远离这些开孔。
所述沟槽的深度可以小于金属层正面侧的深度。
所述电连接网络可以包括在所述金属层中的、由中间电连接元件连接至芯片的电连接焊盘和位于芯片周围的电连接焊盘，以及在衬底晶片另一侧上的电连接焊盘。
也提供了一种电子系统，其包括以上电子装置，并且包括位于所述电子装置上并且包括具有连接至所述电连接网络的另一电连接网络以及承载了连接至该另一电连接网络的至少一个其他集成电路芯片的另一电子装置。
所述系统可以包括借由连接至所述电连接网络的外部金属元件承载了所述电子装置的印刷电路板。
附图说明
现在将借由非限定的示例描述根据本发明特定实施例的电子装置和电子系统，这些装置和系统由附图所示，其中：
图1示出了电子装置的剖视图；
图2示出了不具有表面层的图1中电子装置的顶视图；
图3示出了图1中电子装置的放大剖视图；以及
图4示出了包括图1中电子装置的电子系统。
具体实施方式
如图1所示，电子装置1包括由绝缘材料制成的衬底晶片2，其中晶片2具有从一侧连接至另一侧的集成金属电连接网络3.
电连接网络3包括金属层M1，金属层M1形成在衬底晶片2的内部背平面4上，并且包括设置在平面4的中心区域上的多个电连接焊盘和/或线条5，多个电连接焊盘和/或线条5包括设置在平面4的中心区域上的电连接焊盘5a的矩阵以及设置在包围该中心区域的区域上的电连接焊盘5b的矩阵。
衬底晶片2包括形成在平面4上并且覆盖了金属层5的中间层6。
在中间层6中，衬底晶片2包含了在深度方向上从该层6的表面8延伸的沟槽7a。这些沟槽7a形成在并未穿过以上电连接焊盘5a和5b的位置中。
衬底晶片2进一步包括形成在层6的表面8上并且覆盖了沟槽7a以便于提供形成在衬底晶片2中的内部导管7的表面层10.
内部导管7采用导热或者传热流体9填充。对于热传输流体而言，可以使用根据商标Galden HT售出的那些。
根据变型实施例，可以使用注射器穿过表面层10而将导热流体9注入穿过表面层10的导管中，以便于允许执行该填充操作。由注射器留下的孔洞以及该导管随后可以由粘附剂球珠封堵。
层6和表面层10包含分别至少部分地暴露了电连接焊盘5a和5b的开孔11a和11b。
电子装置1进一步包括在与表面层10相同侧上的布置在衬底晶片2上集成电路12，并且包括例如采取了列柱形式、与开孔11a接合并且插入在芯片12和电连接焊盘5a之间的金属电连接元件13，以便于连接芯片12和电连接网络3。
电子装置1也包括填充了芯片12和衬底晶片2之间空间的绝缘封装材料14。可选地，电子装置1可以包括在衬底晶片2的正面侧上由绝缘材料制成并且包围了芯片12的层15。例如，该层15与芯片12的正面背面侧齐平。
在层15中，开孔16设置为暴露了层6和10的开孔11b。诸如凸块之类的电连接元件17可以放置在电连接焊盘11a上以及由开孔11b和16形成的孔洞中。
如图2所示，导管7可以设置为位于电连接焊盘5a和5b的行之间，由此在周边形成了闭合回路。其他设置是可能的。特别地，可以提供多于一个闭合回路。
根据一个变型实施例，如图2所示，导管7可以连接至设置在衬底晶片2的层6中的互补的导管18，例如供应/返回导管，这些导管18横向地从衬底晶片2露出并且可能连接至用于使冷却流体9的流动的外部装置。
根据另一变型实施例，电子装置1可以具有包括微凸块的部件，该部件可以例如通过接合而固定至装置的一侧，该微凸块通过表面层10例如在两个远端位置处连接至内部导管7，以便于使热传输流体9流动穿过这些内部导管7。
如图3所示，沟槽7a的深度P1小于金属层M1的正面侧的深度P2，使得可以设置沟槽7a以便于越过金属层M1的电连接线条之上而不暴露它们。
根据一个实施例，可以是处理器芯片的集成电路芯片12可以产生热量。所产生热量的至少一些可以优选地由材料9所捕获，材料9填充了内部导管7并且分散至基本上衬底晶片2的整个空间，也即分散至芯片12的区域以及后者的周围区域。因此，导热材料9形成了用于捕获由芯片12产生的至少一些热量并且将热量分散至衬底晶片2的大部分的装置。
如图4所示，电子装置1可以包括在电子系统100中，电子系统100进一步包括在与芯片12相同侧上以一定距离堆叠在电子装置1上的另一电子装置101.
电子装置101可以包括由绝缘材料制成的晶片12所承载的、具有电连接网络103的集成电路芯片104，集成电路芯片104由嵌入在晶片102中的电连接引线105而电连接至电连接网络103。
电子装置101借由诸如金属凸块之类的电连接元件106安装在电子装置1上，其中元件106插入在所述装置之间，并且通过焊接至放置在焊盘5b上的电连接元件17而将电子装置101的电连接网络103电连接并且选择性连接至电子装置1的电连接网络3。
此外，电子装置1以及因此的电子系统100借由插入在电连接网络3的电连接焊盘19与印刷电路板107的电连接焊盘109之间的、诸如金属凸块之类的电连接元件108安装在印刷电路板107上。
如上所述设置例如具有以下优点。
由芯片4所产生的以及如上所述的由于导管7以及导管7包含的材料9的存在而传输并且分散至衬底晶片2的热量可以借由电连接元件108而至少部分地传输至印刷电路板107。
衬底晶片2的电连接网络3将由芯片12产生的热量传输至印刷电路板107。
此外，由芯片4产生的热量也扩散进入分隔了电子装置1和电子装置101的空间中，以便于向外部排出。
至于材料9借由互补导管18而形成为通过外部机制流过导管7，由芯片4产生的热量可以因此至少部分的由该机制排出。
因此，冷却了芯片12，并且以如此方式限制了由电子装置1的芯片12产生的热量沿电子装置101的芯片104的方向扩散，以使得保护了芯片104避免其温度过分升高。
本发明不限于如上所述示例。电子装置以及热传输和冷却机制的许多变型实施例是可能的而并未脱离本发明的范围。

Claims (16)

1.一种电子装置，包括：
衬底晶片，由绝缘材料制成并且包括电连接网络；
其中所述电连接网络包括在平面上的金属层，并且所述平面包括电连接焊盘；
集成电路芯片，安装在所述衬底晶片的顶侧上；
其中，所述衬底晶片包括至少一个内部导管，所述至少一个内部导管由沟槽形成在衬底晶片中，所述沟槽由表面层覆盖；以及
中间层，在所述平面上并且由所述表面层覆盖；
其中所述沟槽被形成在所述中间层中，所述中间层和所述表面层包括在电连接焊盘上方的通孔，以及所述沟槽与所述通孔间隔开一段距离；以及
其中所述沟槽的深度小于所述中间层的深度。
2.根据权利要求1所述的装置，其中，所述内部导管包含导热材料。
3.根据权利要求1所述的装置，其中，所述内部导管以一定距离与所述电连接网络分隔。
4.根据权利要求1所述的装置，其中，所述衬底晶片进一步包含互补的内部导管，所述互补的内部导管连接至所述内部导管并且被配置用于连接至用于使流体流动的装置。
5.根据权利要求1所述的装置，其中，所述沟槽延伸至并未到达所述金属层的正面侧的深度。
6.根据权利要求1所述的装置，其中，所述电连接网络包括在所述金属层中的、通过中间电连接元件以及位于所述芯片周围的电连接焊盘而连接至所述芯片的电连接焊盘，以及在所述衬底晶片的另一侧上的电连接焊盘。
7.根据权利要求1所述的装置，进一步包括，具有另一电连接网络的另一晶片，所述另一电连接网络连接至所述电连接网络以及连接至该另一电连接网络的另一集成电路芯片。
8.根据权利要求7所述的装置，进一步包括印刷电路板，所述衬底晶片借由连接至所述电连接网络的外部金属元件安装至所述印刷电路板。
9.一种电子装置，包括：
包括具有连接元件的表面的集成电路；以及
衬底晶片，包括：
绝缘材料层，包括电连接网络；
金属层，包括在所述绝缘层的顶表面上的、并且与所述电连接网络电接触的电连接焊盘；
中间层，在所述金属层和所述绝缘材料层之上；
多个沟槽，形成在所述中间层的顶表面中；
多个开口，形成在所述中间层的顶表面中并且定位在所述沟槽之间；以及
表面层，在所述中间层的顶表面上并且被配置用于封闭所述沟槽以形成至少一个内部导管；
其中，利用所述连接元件将所述集成电路的表面安装至所述衬底晶片，并且所述连接元件延伸进所述开口中。
10.根据权利要求9所述的装置，进一步包括，包含在所述沟槽内的导热材料。
11.根据权利要求10所述的装置，其中，所述导热材料是流体。
12.根据权利要求11所述的装置，进一步包括，形成在所述衬底晶片中与所述沟槽流体联通的互补的内部导管。
13.根据权利要求12所述的装置，其中，所述互补的内部导管被配置用于连接至用于使所述流体流动的装置。
14.根据权利要求9所述的装置，其中形成在所述中间层的顶表面中的所述多个开口暴露所述金属层的所述电连接焊盘，以及其中所述集成电路的连接元件通过所述开口电连接至所述电连接焊盘。
15.根据权利要求14所述的装置，其中，所述开口与所述沟槽分隔。
16.根据权利要求14所述的装置，其中，每个开口完全延伸穿过所述表面层。
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