CN104559898A - 粘接剂组合物和连接体 - Google Patents

粘接剂组合物和连接体 Download PDF

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Publication number
CN104559898A
CN104559898A CN201410546529.3A CN201410546529A CN104559898A CN 104559898 A CN104559898 A CN 104559898A CN 201410546529 A CN201410546529 A CN 201410546529A CN 104559898 A CN104559898 A CN 104559898A
Authority
CN
China
Prior art keywords
circuit
adhesive composition
adhesive
film
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410546529.3A
Other languages
English (en)
Chinese (zh)
Inventor
工藤直
藤绳贡
伊藤彰浩
森尻智树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201811479821.2A priority Critical patent/CN109609073A/zh
Publication of CN104559898A publication Critical patent/CN104559898A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201410546529.3A 2013-10-16 2014-10-15 粘接剂组合物和连接体 Pending CN104559898A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811479821.2A CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-215763 2013-10-16
JP2013215763 2013-10-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811479821.2A Division CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Publications (1)

Publication Number Publication Date
CN104559898A true CN104559898A (zh) 2015-04-29

Family

ID=53036679

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811479821.2A Pending CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体
CN201410546529.3A Pending CN104559898A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201811479821.2A Pending CN109609073A (zh) 2013-10-16 2014-10-15 粘接剂组合物和连接体

Country Status (4)

Country Link
JP (3) JP2015098575A (enExample)
KR (2) KR102321167B1 (enExample)
CN (2) CN109609073A (enExample)
TW (1) TW201525096A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111286005A (zh) * 2020-04-13 2020-06-16 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6870618B2 (ja) * 2015-11-25 2021-05-12 昭和電工マテリアルズ株式会社 回路接続用接着剤組成物及び構造体
TWI761477B (zh) * 2017-03-30 2022-04-21 日商太陽油墨製造股份有限公司 導電性接著劑、硬化物、電子零件及電子零件之製造方法
CN111334198B (zh) * 2020-03-27 2021-10-15 顺德职业技术学院 Uv双组份双固化型结构胶
JP7537218B2 (ja) * 2020-10-08 2024-08-21 株式会社レゾナック 回路接続用接着剤フィルム、回路接続構造体及びその製造方法
JP7771733B2 (ja) * 2021-12-23 2025-11-18 ａｒｔｉｅｎｃｅ株式会社 配線シート
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081713A (ja) * 2006-08-29 2008-04-10 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2008139996A1 (ja) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. フィルム状回路接続材料及び回路部材の接続構造
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜
CN102803417A (zh) * 2009-04-20 2012-11-28 株式会社普利司通 含硫羟基粘合性树脂组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
EP1542273B1 (en) 1997-03-31 2013-09-25 Hitachi Chemical Co., Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
KR101145605B1 (ko) 2007-10-29 2012-05-16 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 접속 구조체 및 그의 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081713A (ja) * 2006-08-29 2008-04-10 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2008139996A1 (ja) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. フィルム状回路接続材料及び回路部材の接続構造
CN102803417A (zh) * 2009-04-20 2012-11-28 株式会社普利司通 含硫羟基粘合性树脂组合物
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物
CN102763283A (zh) * 2010-11-09 2012-10-31 索尼化学&信息部件株式会社 各向异性导电膜

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
贾红兵等: "《高分子材料》", 30 November 2009 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111286005A (zh) * 2020-04-13 2020-06-16 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法

Also Published As

Publication number Publication date
KR102478959B1 (ko) 2022-12-16
JP2020109173A (ja) 2020-07-16
TW201525096A (zh) 2015-07-01
JP2015098575A (ja) 2015-05-28
KR20150044403A (ko) 2015-04-24
JP2019019333A (ja) 2019-02-07
KR20210134875A (ko) 2021-11-11
KR102321167B1 (ko) 2021-11-02
CN109609073A (zh) 2019-04-12
JP7014236B2 (ja) 2022-02-01

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Application publication date: 20150429