KR102321167B1 - 접착제 조성물 및 접속체 - Google Patents

접착제 조성물 및 접속체 Download PDF

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Publication number
KR102321167B1
KR102321167B1 KR1020140139057A KR20140139057A KR102321167B1 KR 102321167 B1 KR102321167 B1 KR 102321167B1 KR 1020140139057 A KR1020140139057 A KR 1020140139057A KR 20140139057 A KR20140139057 A KR 20140139057A KR 102321167 B1 KR102321167 B1 KR 102321167B1
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South Korea
Prior art keywords
circuit
adhesive composition
adhesive
meth
film
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KR1020140139057A
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English (en)
Korean (ko)
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KR20150044403A (ko
Inventor
스나오 구도우
도루 후지나와
아키히로 이토
도모키 모리지리
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쇼와덴코머티리얼즈가부시끼가이샤
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Publication of KR20150044403A publication Critical patent/KR20150044403A/ko
Priority to KR1020210144166A priority Critical patent/KR102478959B1/ko
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Publication of KR102321167B1 publication Critical patent/KR102321167B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020140139057A 2013-10-16 2014-10-15 접착제 조성물 및 접속체 Active KR102321167B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210144166A KR102478959B1 (ko) 2013-10-16 2021-10-27 접착제 조성물 및 접속체

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-215763 2013-10-16
JP2013215763 2013-10-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210144166A Division KR102478959B1 (ko) 2013-10-16 2021-10-27 접착제 조성물 및 접속체

Publications (2)

Publication Number Publication Date
KR20150044403A KR20150044403A (ko) 2015-04-24
KR102321167B1 true KR102321167B1 (ko) 2021-11-02

Family

ID=53036679

Family Applications (2)

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KR1020140139057A Active KR102321167B1 (ko) 2013-10-16 2014-10-15 접착제 조성물 및 접속체
KR1020210144166A Active KR102478959B1 (ko) 2013-10-16 2021-10-27 접착제 조성물 및 접속체

Family Applications After (1)

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Country Status (4)

Country Link
JP (3) JP2015098575A (enExample)
KR (2) KR102321167B1 (enExample)
CN (2) CN109609073A (enExample)
TW (1) TW201525096A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102615097B1 (ko) * 2015-11-25 2023-12-18 가부시끼가이샤 레조낙 회로 접속용 접착제 조성물 및 구조체
TWI761477B (zh) * 2017-03-30 2022-04-21 日商太陽油墨製造股份有限公司 導電性接著劑、硬化物、電子零件及電子零件之製造方法
CN111334198B (zh) * 2020-03-27 2021-10-15 顺德职业技术学院 Uv双组份双固化型结构胶
CN111286005B (zh) * 2020-04-13 2021-09-10 江苏和和新材料股份有限公司 一种功能性热塑性聚氨酯及其制备方法
JP7537218B2 (ja) * 2020-10-08 2024-08-21 株式会社レゾナック 回路接続用接着剤フィルム、回路接続構造体及びその製造方法
JP7771733B2 (ja) * 2021-12-23 2025-11-18 ａｒｔｉｅｎｃｅ株式会社 配線シート
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
KR100333456B1 (ko) 1997-03-31 2002-04-18 이사오 우치가사키 회로 접속 재료, 및 회로 단자의 접속 구조 및 접속 방법
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
WO2008139996A1 (ja) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. フィルム状回路接続材料及び回路部材の接続構造
KR101238178B1 (ko) * 2007-10-29 2013-02-28 히타치가세이가부시끼가이샤 회로 접속 재료, 접속 구조체 및 그의 제조 방법
JP5677727B2 (ja) * 2009-04-20 2015-02-25 株式会社ブリヂストン チオール基含有接着性樹脂組成物
JP2011057870A (ja) * 2009-09-10 2011-03-24 Aica Kogyo Co Ltd 樹脂組成物
JP5565277B2 (ja) * 2010-11-09 2014-08-06 デクセリアルズ株式会社 異方性導電フィルム

Also Published As

Publication number Publication date
KR102478959B1 (ko) 2022-12-16
JP2019019333A (ja) 2019-02-07
CN109609073A (zh) 2019-04-12
JP7014236B2 (ja) 2022-02-01
KR20210134875A (ko) 2021-11-11
TW201525096A (zh) 2015-07-01
CN104559898A (zh) 2015-04-29
KR20150044403A (ko) 2015-04-24
JP2015098575A (ja) 2015-05-28
JP2020109173A (ja) 2020-07-16

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