CN104458763A - Wide-view surface defect detector - Google Patents
Wide-view surface defect detector Download PDFInfo
- Publication number
- CN104458763A CN104458763A CN201410769209.4A CN201410769209A CN104458763A CN 104458763 A CN104458763 A CN 104458763A CN 201410769209 A CN201410769209 A CN 201410769209A CN 104458763 A CN104458763 A CN 104458763A
- Authority
- CN
- China
- Prior art keywords
- testing agency
- wafer
- surface defect
- load carrier
- visual field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a wide-view surface defect detector. The wide-view surface defect detector comprises a base, a vertical column, a bearing mechanism, a detecting mechanism, a control module and a computer system, wherein the vertical column is fixed on the base; the bearing mechanism is used for bearing and clamping a wafer, is assembled on the base, can move along the X axis, and can drive the wafer to rotate horizontally; the detecting mechanism is assembled on the vertical column, can move vertically along the vertical column, can perform amplification imaging detection on the surface of the wafer on the bearing mechanism, and can transmit a detection image back; the control module is connected with the bearing mechanism, and is used for controlling the bearing mechanism to move along the X axis and driving the wafer to rotate horizontally, so that the detecting mechanism can perform the imaging detection on each part of the surface of the wafer; the computer system is used for processing the detection image transmitted back by the detecting mechanism, and recognizing wafer surface defects in the image. The wide-view surface defect detector is suitable for the surface detection of the heavy-caliber wafers, is high in detection speed, and is high in efficiency.
Description
Technical field
The present invention relates to a kind of optical detection apparatus, especially a kind of pick-up unit for detecting wafer surface defects.
Background technology
For semiconductor photoelectric device, wafer surface defects is the key factor affecting photoelectric device performance, the emphasis of crystal column surface is the scar that the surfaceness of Nano grade and Nanoscale Surface do not observe, and major surfaces defect comprises cut, crackle, dirt, bubble and fingerprint etc.In order to ensure the performance of photoelectric device, wafer maker need implement exhaustive test to the surface of wafer.
Existing method is the defect adopting optical microscope to be identified crystal column surface by eyes, but along with the demand of heavy caliber wafer improves constantly, from 2 inches to 4 inches, even to 6 inches and 8 inches, during existing microexamination, there is the problems such as the visual field is little, the supervision time is long, efficiency is low.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of wide visual field surface defect detection apparatus, be convenient to the Surface testing of heavy caliber wafer, detection speed is fast, efficiency is high.The technical solution used in the present invention is:
A kind of wide visual field surface defect detection apparatus, comprises a base and is fixed on the column on base, also comprise:
For carrying and clamping the load carrier of wafer, this load carrier is assemblied on base, can move along X-axis, and wafer level can be driven to rotate;
Testing agency, described testing agency is assemblied on column, can move up and down along column; Testing agency can carry out amplification imaging detection to the crystal column surface on load carrier, and returns detected image;
Control module, described control module connects load carrier, to move for controlling load carrier and to drive wafer level to rotate along X-axis, thus makes that testing agency can position can image checking to crystal column surface everywhere;
Computer system, is connected with testing agency, control module respectively, processes for the detected image returned testing agency, wafer surface defects in recognition image; And make control module control the action of load carrier for output order.
Further, load carrier comprises the X-axis platform be assemblied on base, and this X-axis platform can move along X-axis on base; A universal stage is fixed with above X-axis platform; Universal stage is fixed with a loading round platform; The driving arrangement driving X-axis platform and universal stage is also comprised, driving arrangement link control module in load carrier.
Particularly, loading round platform is along the circumferential direction equipped with several threaded hole, by the multiple operation stationary fixture of screw hole, realizes the carrying clamping of wafer.Or on loading round platform, circumferentially radial direction evenly installs several fixture guide rail, and along fixture guide rail installation work stationary fixture, described operation stationary fixture can move radially along fixture guide rail.
Further, load carrier also comprises the first manual knob rotated for manual adjustments universal stage, and for the second manual knob of manual adjustments X-axis platform movement.
Further, testing agency comprises the photographing module be arranged on column, be positioned at camera lens module below photographing module, and camera lens module is used for realizing carrying out amplification imaging to crystal column surface.
Further, camera lens module comprises the fixed multiplying power camera lens that optical power is 0.5 times.
Further, testing agency also comprises the lighting module for Enhanced Imaging Detection results.Lighting module comprises LED light source, and the light that LED light source sends is introduced in the optical channel between photographing module and camera lens module by optical fiber.
Further, described column is provided with vertical guide, and testing agency coordinates with vertical guide on column and realizes sliding up and down of testing agency.
The invention has the advantages that:
1) the present invention adopts 2,000,000 pixel camera machines and high-brightness LED optical fiber source, and optical power is 0.5 times of ultralow multiplying power, looking away (the vertical 10.5mm of horizontal 14mm*), but can detect identical with optical power 1 times to scrape width, and detecting precision is 0.5 ~ 0.3um.
2) the present invention has the super wide visual field, is about 12 times of the field of microscope of optical power 1 times, and the supervision time of 6 inch wafer is the same with 2 inch wafer supervision time, can significantly shorten the heavy caliber wafer inspection time.And, be no matter the position of flaw, shape, length, origin-to-destination, all more easily grasp.
3) the present invention can carry out rapidly flaw labeling to a collection of detection sample, analyzes and gather at short notice, not only solve that tradition is decision making by manual detection, the error that causes of classifying and waste a large amount of labor hour, detection analysis result can be notified to produce line in time simultaneously, help produce line Timeliness coverage problem and make improvement.
4) wafer carrying mechanism of the present invention adopts the mode rotating and move along X-axis loading round platform, the automatic conversion of surveyed area can be realized, avoid staff and move wafer all around, on the one hand simple to operate, can increase work efficiency, avoid staff to move causing undetected, staff can be avoided to move the defect caused crystal column surface on the other hand.
Accompanying drawing explanation
Fig. 1 is structure of the present invention composition schematic diagram.
Fig. 2 is loading round platform vertical view of the present invention.
Fig. 3 is that the A-A of Fig. 2 is to partial sectional view.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Figure 1, wide visual field surface defect detection apparatus proposed by the invention, the column 2 comprising a base 1 and be fixed on base 1, also comprises load carrier 3, testing agency 4, control module 5 and computer system 6.Column 2 is provided with vertical guide, and testing agency 4 coordinates with vertical guide on column and realizes sliding up and down of testing agency.
Load carrier 3 is assemblied on base 1, for carrying and clamping wafer to be detected.Load carrier 3 can move along X-axis, and wafer level can be driven to rotate.In Fig. 1, the direction perpendicular to paper is X-direction, hereby illustrates.Column 3 is fixed on the side (being rear side in Fig. 1) of base 1, avoids hindering load carrier 3 to drive wafer level to rotate.
Particularly, load carrier 3 comprises the X-axis platform 301 be assemblied on base 1, and this X-axis platform 301 can move along X-axis on base 1; X-axis platform 301 is fixed with a universal stage 302 above; Universal stage 302 is fixed with a loading round platform 303, loading round platform 303 can carry clamping wafer; The driving arrangement driving X-axis platform 301 and universal stage 302 is also comprised, driving arrangement link control module 5 in load carrier 3.Driving arrangement comprises common drive motor etc., and under the control of control module 5, corresponding driven rotary platform 302 rotates or drives X-axis platform 301 to move along X-axis on base 1.Load carrier 3 also comprises the first manual knob 304 rotated for manual adjustments universal stage 302, and for the second manual knob 305 of manual adjustments X-axis platform 301 movement.
Assembly for clamping wafer on loading round platform 303 can have two kinds of structures, one, as shown in Figure 1, loading round platform 303 is along the circumferential direction equipped with 3 ~ 4 threaded holes, by the multiple operation stationary fixture 3031 of screw hole, realizes the carrying clamping of wafer; This kind of structure can realize the carrying of 2 ~ 8 inch wafer, simple to operation, improves detection efficiency.They are two years old, as shown in Figure 2, on loading round platform 303, circumferentially radial direction evenly installs 3 ~ 4 fixture guide rails 3032, along fixture guide rail 3032 installation exercise stationary fixture 3031, described operation stationary fixture 3031 can move radially along fixture guide rail, this kind of structure coordinates the carrying size that can change arbitrarily operation stationary fixture by guide rail, thus realizes the carrying to different size size wafer.
Control module 5 connects load carrier 3, to move for controlling load carrier 3 and to drive wafer level to rotate along X-axis, thus makes that testing agency 4 can position can image checking to crystal column surface everywhere.Control module 5 specifically can adopt PLC(programmable logic controller (PLC)).When detecting as batch sample, adopt and automatically control to save detection time, can avoiding undetected simultaneously, when there are abnormal conditions, concrete defective locations accurately can be detected, being analyzed manual operation.
Testing agency 4 is assemblied on column 2, can move up and down along column 2, shows as testing agency 4 and coordinates with vertical guide on column and realize sliding up and down of pick-up unit; Testing agency 4 can carry out amplification imaging detection to the crystal column surface on load carrier 3, and returns detected image.
Particularly, testing agency 4 comprises the photographing module 401 be arranged on column 2, be positioned at camera lens module 402 below photographing module 401, and camera lens module 402 carries out amplification imaging for realizing to crystal column surface.Camera lens module 402 preferably employing optical power is the fixed multiplying power camera lens of 0.5 times.Photographing module 401 adopts 2,000,000 pixel camera machines.In order to strengthen the image checking effect of crystal column surface, testing agency 4 can also comprise a lighting module, and the crystal column surface that lighting module is provided on loading round platform 303 is more limpid in sight.Lighting module can use a common illuminating lamp, be arranged at loading round platform 303 oblique upper to throw light on, also structure in the present embodiment can be adopted, as shown in Figure 1, lighting module 403 comprises LED light source 4031, the light that LED light source 4031 sends is introduced in the optical channel between photographing module 401 and camera lens module 402 by optical fiber 4032, thus the loading round platform 303 that indirectly throws light on.Optical fiber type short wavelength high-brightness LED light source, can operate more than 25000 hours continuously, improves detection efficiency.
Computer system 6 is connected with testing agency 4, control module 5 respectively, processes for the detected image returned testing agency, wafer surface defects in recognition image; And make control module 5 control the action of load carrier 3 for output order, to rotate as made universal stage 302 or X-axis platform 301 moves along X-axis on base 1.In Fig. 1, computer system 6 comprises the main frame 601 be connected with testing agency 4, control module 5 respectively, the display 602 be connected with main frame 601.Main frame 601 realizes the control to photographing module 401, the control to control module 5, and image procossing and identification.
Principle of work is: switch on power and start-up simulation machine system 6, wafer is placed in the operation stationary fixture of wafer carrying mechanism 3, computer system 6 realizes the rotation of wafer by control module 6 and X axis moves, now lighting module 403 realizes the real-time highlight illumination to wafer, camera lens module 402 realizes the Nonlinear magnify to wafer, then by photographing module 401, imaging is carried out to the image after amplification, last computing machine gathers the picture rich in detail that photographing module 401 imaging returns and differentiates the defect in image, provide flaw labeling, and can carry out analyzing and gathering, the image marked by display display defect, and to defect analysis, the data drawing list gathered.
Claims (10)
1. a wide visual field surface defect detection apparatus, the column (2) comprising a base (1) and be fixed on base (1), is characterized in that, also comprise:
For carrying and clamping the load carrier (3) of wafer, this load carrier (3) is assemblied on base (1), can move along X-axis, and wafer level can be driven to rotate;
Testing agency (4), described testing agency (4) is assemblied on column (2), can move up and down along column (2); Testing agency (4) can carry out amplification imaging detection to the crystal column surface on load carrier (3), and returns detected image;
Control module (5), described control module (5) connects load carrier 3, to move along X-axis for controlling load carrier (3) and to drive wafer level to rotate, thus making that testing agency (4) can position can image checking to crystal column surface everywhere;
Computer system (6), is connected with testing agency (4), control module (5) respectively, processes for the detected image returned testing agency, wafer surface defects in recognition image; And make control module (5) control the action of load carrier (3) for output order.
2. the wide visual field as claimed in claim 1 surface defect detection apparatus, is characterized in that:
Load carrier (3) comprises the X-axis platform (301) be assemblied on base (1), and this X-axis platform (301) can move along X-axis on base (1); X-axis platform (301) is fixed with a universal stage (302) above; Universal stage (302) is fixed with a loading round platform (303); The driving arrangement driving X-axis platform (301) and universal stage (302) is also comprised, driving arrangement link control module (5) in load carrier (3).
3. the wide visual field as claimed in claim 2 surface defect detection apparatus, is characterized in that:
(303) are along the circumferential direction equipped with several threaded hole to loading round platform, by the multiple operation stationary fixture (3031) of screw hole, realize the carrying clamping of wafer.
4. the wide visual field as claimed in claim 2 surface defect detection apparatus, is characterized in that:
On loading round platform (303), circumferentially radial direction evenly installs several fixture guide rail (3032), along fixture guide rail (3032) installation exercise stationary fixture (3031), described operation stationary fixture (3031) can move radially along fixture guide rail.
5. the wide visual field as claimed in claim 2 surface defect detection apparatus, is characterized in that:
Load carrier (3) also comprises the first manual knob (304) rotated for manual adjustments universal stage (302), and for the second manual knob (305) of manual adjustments X-axis platform (301) movement.
6. the wide visual field surface defect detection apparatus according to any one of Claims 1 to 5, is characterized in that:
Testing agency (4) comprises the photographing module (401) be arranged on column (2), is positioned at the camera lens module (402) of photographing module (401) below, and camera lens module (402) carries out amplification imaging for realizing to crystal column surface.
7. the wide visual field as claimed in claim 6 surface defect detection apparatus, is characterized in that:
Camera lens module (402) comprises the fixed multiplying power camera lens that optical power is 0.5 times.
8. the wide visual field as claimed in claim 6 surface defect detection apparatus, is characterized in that:
Testing agency (4) also comprises the lighting module (403) for Enhanced Imaging Detection results.
9. the wide visual field as claimed in claim 8 surface defect detection apparatus, is characterized in that:
Lighting module (403) comprises LED light source (4031), and the light that LED light source (4031) sends is introduced in the optical channel between photographing module (401) and camera lens module (402) by optical fiber (4032).
10. the wide visual field as claimed in claim 1 surface defect detection apparatus, is characterized in that:
Described column (2) is provided with vertical guide, and testing agency (4) coordinates with vertical guide on column and realizes sliding up and down of testing agency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410769209.4A CN104458763A (en) | 2014-12-12 | 2014-12-12 | Wide-view surface defect detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410769209.4A CN104458763A (en) | 2014-12-12 | 2014-12-12 | Wide-view surface defect detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104458763A true CN104458763A (en) | 2015-03-25 |
Family
ID=52905164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410769209.4A Pending CN104458763A (en) | 2014-12-12 | 2014-12-12 | Wide-view surface defect detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104458763A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783685A (en) * | 2016-12-26 | 2017-05-31 | 珠海市中芯集成电路有限公司 | A kind of device for dotting and its control method for wafer |
| CN108120665A (en) * | 2017-12-28 | 2018-06-05 | 无锡奥芬光电科技有限公司 | The method and apparatus of monochromatic structure optical test molecule |
| CN108169131A (en) * | 2017-12-28 | 2018-06-15 | 无锡奥芬光电科技有限公司 | Molecule inspection method and equipment based on white light grating interferometry |
| CN109406542A (en) * | 2017-08-16 | 2019-03-01 | 旺矽科技股份有限公司 | Optical detection system |
| CN113358662A (en) * | 2021-06-10 | 2021-09-07 | 广东奥普特科技股份有限公司 | Wafer surface defect detection device and wafer surface defect detection method |
| CN113484325A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Wafer dispensing defect detection device and wafer dispensing defect detection method |
| CN114235840A (en) * | 2021-12-29 | 2022-03-25 | 复旦大学 | Wafer surface defect detection method based on light-section microscope |
| CN115753817A (en) * | 2022-11-17 | 2023-03-07 | 无锡联发易创科技有限公司 | Visual inspection equipment and method for surface defects of silicon wafers |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157837A (en) * | 1984-08-30 | 1986-03-24 | Toshiba Corp | Inspecting device for outer appearance |
| JPH11211669A (en) * | 1998-01-23 | 1999-08-06 | Hitachi Electron Eng Co Ltd | Surface inspection apparatus for electronic circuit element |
| JPH11304721A (en) * | 1998-04-23 | 1999-11-05 | Sony Corp | Visual inspection device |
| CN2363282Y (en) * | 1998-07-03 | 2000-02-09 | 北京大学 | Silicon/silicon bonding quality tester |
| CN1556920A (en) * | 2001-09-21 | 2004-12-22 | ���ְ�˹��ʽ���� | Defect inspection apparatus |
| CN1809744A (en) * | 2003-05-19 | 2006-07-26 | 微-埃普西龙测量技术有限两合公司 | Method and apparatus for optically controlling the quality of objects having a circular edge |
| CN101000311A (en) * | 2006-01-11 | 2007-07-18 | 索尼株式会社 | Defects detection device and method |
| CN201434842Y (en) * | 2009-05-27 | 2010-03-31 | 华南理工大学 | Automatic chip appearance defect detection system |
| CN202189022U (en) * | 2011-07-22 | 2012-04-11 | 格兰达技术（深圳）有限公司 | Optical detecting device of full-automatic tertiary photodetector |
| CN202204782U (en) * | 2011-08-05 | 2012-04-25 | 东莞市神州视觉科技有限公司 | PCB (printed circuit board) bilateral fixture |
| CN204287067U (en) * | 2014-12-12 | 2015-04-22 | 元亮科技有限公司 | Wide visual field surface defect detection apparatus |
-
2014
- 2014-12-12 CN CN201410769209.4A patent/CN104458763A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157837A (en) * | 1984-08-30 | 1986-03-24 | Toshiba Corp | Inspecting device for outer appearance |
| JPH11211669A (en) * | 1998-01-23 | 1999-08-06 | Hitachi Electron Eng Co Ltd | Surface inspection apparatus for electronic circuit element |
| JPH11304721A (en) * | 1998-04-23 | 1999-11-05 | Sony Corp | Visual inspection device |
| CN2363282Y (en) * | 1998-07-03 | 2000-02-09 | 北京大学 | Silicon/silicon bonding quality tester |
| CN1556920A (en) * | 2001-09-21 | 2004-12-22 | ���ְ�˹��ʽ���� | Defect inspection apparatus |
| CN1809744A (en) * | 2003-05-19 | 2006-07-26 | 微-埃普西龙测量技术有限两合公司 | Method and apparatus for optically controlling the quality of objects having a circular edge |
| CN101000311A (en) * | 2006-01-11 | 2007-07-18 | 索尼株式会社 | Defects detection device and method |
| CN201434842Y (en) * | 2009-05-27 | 2010-03-31 | 华南理工大学 | Automatic chip appearance defect detection system |
| CN202189022U (en) * | 2011-07-22 | 2012-04-11 | 格兰达技术（深圳）有限公司 | Optical detecting device of full-automatic tertiary photodetector |
| CN202204782U (en) * | 2011-08-05 | 2012-04-25 | 东莞市神州视觉科技有限公司 | PCB (printed circuit board) bilateral fixture |
| CN204287067U (en) * | 2014-12-12 | 2015-04-22 | 元亮科技有限公司 | Wide visual field surface defect detection apparatus |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783685A (en) * | 2016-12-26 | 2017-05-31 | 珠海市中芯集成电路有限公司 | A kind of device for dotting and its control method for wafer |
| CN106783685B (en) * | 2016-12-26 | 2023-04-25 | 珠海市中芯集成电路有限公司 | Dotting device for wafer and control method thereof |
| CN109406542A (en) * | 2017-08-16 | 2019-03-01 | 旺矽科技股份有限公司 | Optical detection system |
| CN108120665A (en) * | 2017-12-28 | 2018-06-05 | 无锡奥芬光电科技有限公司 | The method and apparatus of monochromatic structure optical test molecule |
| CN108169131A (en) * | 2017-12-28 | 2018-06-15 | 无锡奥芬光电科技有限公司 | Molecule inspection method and equipment based on white light grating interferometry |
| CN113358662A (en) * | 2021-06-10 | 2021-09-07 | 广东奥普特科技股份有限公司 | Wafer surface defect detection device and wafer surface defect detection method |
| WO2022257618A1 (en) * | 2021-06-10 | 2022-12-15 | 广东奥普特科技股份有限公司 | Wafer surface defect detection device and wafer surface defect detection method |
| CN113484325A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Wafer dispensing defect detection device and wafer dispensing defect detection method |
| CN114235840A (en) * | 2021-12-29 | 2022-03-25 | 复旦大学 | Wafer surface defect detection method based on light-section microscope |
| CN114235840B (en) * | 2021-12-29 | 2024-03-08 | 复旦大学 | Wafer surface defect detection method based on light cutting microscope |
| CN115753817A (en) * | 2022-11-17 | 2023-03-07 | 无锡联发易创科技有限公司 | Visual inspection equipment and method for surface defects of silicon wafers |
| CN115753817B (en) * | 2022-11-17 | 2023-09-26 | 无锡联发易创科技有限公司 | Visual inspection equipment for surface defects of silicon wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104458763A (en) | Wide-view surface defect detector | |
| CN102221563B (en) | Apparatus for automatically inspecting defects of PCB (printed circuit board) | |
| CN103175847B (en) | Grating surface defect detecting device | |
| CN209736110U (en) | CCD visual detection equipment | |
| CN204287067U (en) | Wide visual field surface defect detection apparatus | |
| CN203688459U (en) | On-line fabric quality detection system based on image recognition | |
| CN203824934U (en) | Optical system for mirror appearance inspection of trademark | |
| CN205146712U (en) | Piston ring automated inspection equipment | |
| CN106525869A (en) | Glass edge defect detection method, as well as device and system thereof | |
| CN203455286U (en) | Cell phone outer shell edge quality detection device based on machine vision | |
| CN113899752B (en) | Method for detecting crack of chain plate by adopting visual detection device for crack of inner chain plate of double-row chain scraper conveyor | |
| CN105548217A (en) | Appearance inspection device and method of film coating product | |
| CN109433631A (en) | The integrated device that more sized bolt degree of injury detect and classify automatically | |
| CN110044926A (en) | A kind of lens defect detection device | |
| CN114878587B (en) | A two-sided flaw cloth inspection machine for weaving cloth | |
| CN203288214U (en) | OLED detecting device | |
| CN104199229A (en) | Semiautomatic focusing machine and operation method thereof | |
| CN206411025U (en) | A kind of workpiece, defect automatic checkout system | |
| CN208661986U (en) | All-in-one machine is examined in full automatic lens cleaning | |
| CN204255875U (en) | Butyl rubber plug surface defects detection screening installation | |
| CN202305422U (en) | Silicon wafer and silicon solar cell wafer defect detector | |
| CN206146852U (en) | Glass limit defect detecting of portion device and system | |
| CN204064971U (en) | backlight module quality detection device | |
| CN108273768B (en) | Polaroid screening device and method | |
| JP2007184529A (en) | Inspection apparatus for semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
|
| RJ01 | Rejection of invention patent application after publication |