CN113358662A - Wafer surface defect detection device and wafer surface defect detection method - Google Patents
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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Abstract
The invention discloses a wafer surface defect detection device and a wafer surface defect detection method, wherein the device comprises a light source, a camera, a lifting assembly, a material tray detection assembly and a control console; the light source, the camera and the material tray detection assembly are arranged on the lifting assembly; the light source, the camera, the material tray detection assembly and the lifting assembly are respectively connected with the console; the lifting assembly is used for driving the light source, the camera and the material tray detection assembly to lift; the camera is used for collecting images of a material tray loaded with wafers on the detection positions at different heights; the light source is used for providing light required by collection at different heights; the material tray detection assembly is used for detecting whether material trays exist on the detection positions at different heights; the console is used for judging whether the surface of the wafer on the material tray has defects according to the image acquired by the camera. According to the invention, the machine replaces manpower to detect the surface defects of the wafer, so that the manpower waste is greatly reduced, the manpower cost is saved, and the accuracy and the working efficiency of the surface defect detection of the wafer are improved.
Description
Technical Field
The invention relates to the technical field of wafer defect detection, in particular to a wafer surface defect detection device and a wafer surface defect detection method.
Background
In the current information society, the integrated circuit industry, as a strategic basic industry, has been highly penetrated and integrated into each field of national economy and social development, and the technical level and the industrial scale thereof have become important marks for measuring national economic development, scientific and technological progress and national defense strength. In recent years, with the rise of economy and technology, china has become the largest and fastest growing market for integrated circuits on a global scale.
The production and fabrication of integrated circuits have a very complicated process, in which the wafer is used as the main material for manufacturing the chip, and the surface defect is the main factor affecting the yield of the chip. In order to improve the yield of the chip, a chip detection process is usually performed during the manufacturing process of the chip, so as to find the surface defect of the wafer in time during the manufacturing process and improve the process in time, thereby improving the yield of the subsequent wafer.
At present, the existing wafer defect detection is implemented by performing carpet type manual detection on the surface of a wafer by using an industrial microscope by an inspector, and the detection mode needs repeated manual focusing to finally confirm that human eyes can see the defects on the surface of the wafer from the industrial microscope, so that the defects of overlong detection time, low detection efficiency and high labor cost exist, the wafer defect detection is easily influenced by eye fatigue caused by long-time eye use of the inspector to cause false detection, and the wafer defect detection is difficult to be applied to industrial large-batch application scenes.
Therefore, it is necessary to develop a new wafer defect inspection technology to overcome the above defects.
The above information is given as background information only to aid in understanding the present disclosure, and no determination or admission is made as to whether any of the above is available as prior art against the present disclosure.
Disclosure of Invention
The invention provides a wafer surface defect detection device and a wafer surface defect detection method, which are used for solving the defects of the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, an embodiment of the present invention provides a wafer surface defect detection apparatus, including a light source, a camera, a lifting assembly, a tray detection assembly, and a console; wherein the content of the first and second substances,
the light source, the camera and the material tray detection assembly are arranged on the lifting assembly; the light source, the camera, the material tray detection assembly and the lifting assembly are respectively connected with and controlled by the console;
the lifting assembly is used for driving the light source, the camera and the material tray detection assembly to lift;
the camera is used for collecting images of a material tray loaded with wafers on the detection positions at different heights;
the light source is used for providing light required for collection for the camera at different heights;
the material tray detection assembly is used for detecting whether material trays exist on the detection position at different heights;
the control console is used for judging whether the surface of the wafer on the material tray has defects according to the image acquired by the camera.
Furthermore, in the wafer surface defect detection device, the lifting assembly comprises a servo motor, a motion module and a light shielding plate;
the servo motor is connected with the motion module, the light screen is arranged on the motion module, the light source and the camera are respectively arranged on the light screen and positioned between the light screen and the detection position, and the material tray detection assembly is arranged on the motion module;
the servo motor is used for providing driving force for the motion module;
the motion module is used for driving the light source, the camera and the material tray detection assembly to do lifting motion after receiving the driving force provided by the servo motor;
the light shielding plate is used for shielding light rays irradiating the detection position from the upper part.
Further, in the wafer surface defect detecting device, the light source is rotatably arranged on the moving module.
Furthermore, in the wafer surface defect detection device, the material tray detection assembly is a material tray detection sensor.
Furthermore, in the wafer surface defect detection device, a shielding cover is arranged on the side face of the camera.
Further, the wafer surface defect detection device also comprises an indicator light;
the indicating lamp is connected with the control console and used for indicating the working state.
Further, in the wafer surface defect detection device, the console comprises a display and an electric control button box;
the light source, the camera, the material tray detection assembly, the lifting assembly and the display are respectively connected with the electric control button box;
the electric control button box is used for controlling the cooperative operation among the light source, the camera, the material tray detection assembly, the lifting assembly and the display and judging whether the surface of the wafer on the material tray has defects or not according to the image acquired by the camera;
the display is used for displaying the judgment result.
Further, in the wafer surface defect detecting device, the electric control button box comprises a control circuit board, a touch screen and an electric control button.
The touch screen and the electric control button are respectively connected with the control circuit board.
In a second aspect, an embodiment of the present invention provides a method for detecting a defect on a wafer surface, which is performed by using the apparatus for detecting a defect on a wafer surface according to the first aspect of the present invention, and the method includes:
the material tray detection assembly detects whether a material tray loaded with wafers is arranged on the detection position and at the height of the material tray detection assembly;
if yes, the light source irradiates light required by the camera to the material tray, and the camera collects images of the material tray;
the console judges whether the surface of the wafer on the material tray has defects according to the image acquired by the camera;
the lifting component drives the light source, the camera and the material tray detection component to lift, and when a new material tray is placed on the detection position, the steps are repeated.
Further, in the method for detecting the surface defect of the wafer, after the step of judging whether the surface of the wafer on the tray has the defect by the console according to the image acquired by the camera, the method further comprises the following steps:
and the console displays the judgment result.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the wafer surface defect detection device and the wafer surface defect detection method provided by the embodiment of the invention, the robot replaces manpower to detect the wafer surface defects, so that the manpower waste is greatly reduced, the manpower cost is saved, the accuracy and the working efficiency of the wafer surface defect detection are improved, the wafer surface defect detection device and the wafer surface defect detection method have great significance for the automatic production of the wafer, and are suitable for large-scale popularization and application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural perspective view of a wafer surface defect detection apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an apparatus for detecting defects on a wafer surface according to an embodiment of the present invention;
FIG. 3 is a schematic side view of a wafer surface defect inspection apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic top view illustrating a structure of an apparatus for detecting defects on a wafer surface according to an embodiment of the present invention;
fig. 5 is a schematic flow chart illustrating a method for detecting defects on a wafer surface according to a second embodiment of the present invention.
Reference numerals:
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.
Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the referred devices or elements must have the specific orientations, be configured to operate in the specific orientations, and thus are not to be construed as limitations of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example one
In view of the above-mentioned defects of the conventional wafer surface defect inspection technology, the applicant of the present invention is based on the abundant practical experience and professional knowledge in many years of the industry, and actively performs research and innovation in cooperation with the application of theory, so as to hopefully create a technology capable of solving the defects in the prior art, and make the wafer surface defect inspection technology more practical. After continuous research and design and repeated trial production and improvement, the invention with practical value is finally created.
Referring to fig. 1 to 4, an embodiment of the invention provides a wafer surface defect detecting apparatus, which includes a light source 1, a camera 2, a lifting assembly, a tray detecting assembly 6 and a console; wherein the content of the first and second substances,
the light source 1, the camera 2 and the material tray detection assembly 6 are arranged on the lifting assembly; the light source 1, the camera 2, the material tray detection component 6 and the lifting component are respectively connected with and controlled by the console;
the lifting assembly is used for driving the light source 1, the camera 2 and the material tray detection assembly 6 to lift;
the camera 2 is used for acquiring images of a material tray loaded with wafers on the detection positions at different heights;
the light source 1 is used for providing light required for collection for the camera 2 at different heights;
the material tray detection assembly 6 is used for detecting whether material trays exist on the detection positions at different heights;
the control console is used for judging whether the surface of the wafer on the material tray has defects according to the image acquired by the camera 2.
It should be noted that, in this embodiment, the trays loaded with wafers are stacked together, and when image acquisition needs to be performed on the first tray, since the heights of the camera 2 and the light source 1 are already set, that is, the first tray is already in a focusing state, as long as the tray detection assembly 6 can detect that there is a tray in the detection position, the image of the first tray can be directly acquired, and then the console performs defect identification on the surfaces of the wafers in the trays. When the second material tray needs to be subjected to image acquisition, the second material tray is stacked on the first material tray, and the second material tray is lifted by the height of one material tray size relative to the camera 2 and the light source 1, so that the light source 1, the camera 2 and the material tray detection assembly 6 are driven by the lifting assembly to correspondingly lift by the height of one material tray size to automatically adjust the coke again, and then the image of the second material tray can be directly acquired as long as the tray detection assembly is positioned on the detection position and detects the material tray at the height of the material tray detection assembly 6, and the rest can be done in the same way. Of course, in consideration of the problems that the lifting mechanism cannot rise all the time and the trays are stacked too high and easily topple over, the embodiment sets that each stacking of five trays is a cycle, that is, after the fifth tray is detected, the stacked five trays can be transferred away by a manipulator or a human, and the lifting assembly can drive the light source 1, the camera 2 and the tray detection assembly 6 to descend to the initial height.
In this embodiment, the lifting assembly comprises a servo motor 3, a motion module 4 and a shading plate 5;
the servo motor 3 is connected with the motion module 4, the light screen 5 is arranged on the motion module 4, the light source 1 and the camera 2 are respectively arranged on the light screen 5 and positioned between the light screen 5 and the detection position, and the material tray detection assembly 6 is arranged on the motion module 4;
the servo motor 3 is used for providing driving force for the motion module 4;
the motion module 4 is used for driving the light source 1, the camera 2 and the material tray detection assembly 6 to do lifting motion after receiving the driving force provided by the servo motor 3;
the light shielding plate 5 is used to shield light rays irradiated from above to the detection position, which are light rays different from the lamp light emitted from the light source 1 in the present embodiment.
It should be noted that the motion module 4 includes a screw, a base, a slider, etc., and no further description is given here in view of the fact that this part is already implemented in the prior art and is not the main point of the design of the present solution.
In this embodiment, the light source 1 is rotatably disposed on the moving module 4, and can adjust the angle of the light irradiating the tray. Preferably, the light source 1 is a bar light source.
In this embodiment, the tray detection assembly 6 is a tray detection sensor.
It should be noted that the type of the sensor may be a laser sensor, that is, specifically, the tray detection sensor may include a transmitter for transmitting a detection beam and a receiver for receiving the detection beam; because the emitter emits the detection light beam towards the direction of the material tray, the detection light beam can be shielded certainly as long as the material tray exists on the detection position and at the height of the emitter, and therefore the material tray on the detection position can be confirmed.
In this embodiment, a shielding cover is provided on a side surface of the camera 2.
It should be noted that the shielding cover can shield the light irradiated from the side of the camera 2 to the camera 2, so as to prevent the image collected by the camera 2 from being affected.
In this embodiment, the wafer surface defect detecting apparatus further includes an indicator lamp 9;
the pilot lamp 9 with the control cabinet is connected for instruct operating condition, for example normal operating condition shows green light, and the trouble shows the red light, shuts down the maintenance and shows the yellow light.
In this embodiment, the console comprises a display 7 and an electronic control button box 8;
the light source 1, the camera 2, the material tray detection component 6, the lifting component and the display 7 are respectively connected with the electric control button box 8;
the electric control button box 8 is used for controlling the cooperative operation among the light source 1, the camera 2, the material tray detection assembly 6, the lifting assembly and the display 7 and judging whether the surface of a wafer on the material tray has defects or not according to the image acquired by the camera 2;
the display 7 is used for displaying the judgment result.
In this embodiment, the electronic control button box 8 includes a control circuit board, a touch screen and an electronic control button;
the touch screen and the electric control button are respectively connected with the control circuit board.
It should be noted that the control circuit board stores the SciSmart intelligent vision software which is self-developed, and can judge whether the surface of the wafer on the tray has defects according to the image collected by the camera 2. In view of the fact that this section is disclosed as prior art and is not part of the design of this solution, it is not further described herein.
According to the wafer surface defect detection device provided by the embodiment of the invention, the robot replaces manpower to detect the wafer surface defects, so that the manpower waste is greatly reduced, the manpower cost is saved, the accuracy and the working efficiency of the wafer surface defect detection are improved, the wafer surface defect detection device has an important significance for the automatic production of wafers, and is suitable for large-scale popularization and application.
Example two
Fig. 5 is a schematic flow chart of a method for detecting defects on a wafer surface according to a second embodiment of the present invention. The method is executed by the wafer surface defect detection device provided by the embodiment of the invention, and comprises the following steps:
s201, the tray detection assembly detects whether a tray loaded with wafers is on the detection position and at the height of the tray detection assembly; if so, step S202 is executed, otherwise, step S201 is continuously executed.
S202, the light source irradiates light required by the camera to the material tray, and the camera collects images of the material tray.
And S203, the console judges whether the surface of the wafer on the material tray has defects according to the image acquired by the camera.
Preferably, after the step S203, the method further comprises:
and the console displays the judgment result.
And S204, the lifting assembly drives the light source, the camera and the material tray detection assembly to lift until a new material tray is arranged on the detection position, and the step S201 is executed in a returning mode.
It should be noted that, in consideration of the problems that the lifting mechanism cannot lift all the time and the trays are stacked too high and prone to toppling, this embodiment may also set that a cycle is performed every five times of lifting, that is, every five times of stacking, that is, five stacked trays are transferred away, and the lifting assembly drives the light source, the camera, and the tray detecting assembly to drop to the initial height.
According to the wafer surface defect detection method provided by the embodiment of the invention, the robot replaces manpower to detect the wafer surface defects, so that the manpower waste is greatly reduced, the manpower cost is saved, the accuracy and the working efficiency of the wafer surface defect detection are improved, the method has an important significance for the automatic production of the wafer, and is suitable for large-scale popularization and application.
The foregoing description of the embodiments has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same elements or features may also vary in many respects. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
Example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous details are set forth, such as examples of specific parts, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.
Claims (10)
1. A wafer surface defect detection device is characterized by comprising a light source, a camera, a lifting assembly, a material tray detection assembly and a control console; wherein the content of the first and second substances,
the light source, the camera and the material tray detection assembly are arranged on the lifting assembly; the light source, the camera, the material tray detection assembly and the lifting assembly are respectively connected with and controlled by the console;
the lifting assembly is used for driving the light source, the camera and the material tray detection assembly to lift;
the camera is used for collecting images of a material tray loaded with wafers on the detection positions at different heights;
the light source is used for providing light required for collection for the camera at different heights;
the material tray detection assembly is used for detecting whether material trays exist on the detection position at different heights;
the control console is used for judging whether the surface of the wafer on the material tray has defects according to the image acquired by the camera.
2. The apparatus of claim 1, wherein the lift assembly comprises a servo motor, a motion module and a shutter;
the servo motor is connected with the motion module, the light screen is arranged on the motion module, the light source and the camera are respectively arranged on the light screen and positioned between the light screen and the detection position, and the material tray detection assembly is arranged on the motion module;
the servo motor is used for providing driving force for the motion module;
the motion module is used for driving the light source, the camera and the material tray detection assembly to do lifting motion after receiving the driving force provided by the servo motor;
the light shielding plate is used for shielding light rays irradiating the detection position from the upper part.
3. The wafer surface defect detecting apparatus of claim 2, wherein the light source is rotatably disposed on the motion module.
4. The wafer surface defect detecting device of claim 1, wherein the tray detecting component is a tray detecting sensor.
5. The wafer surface defect detecting apparatus as claimed in claim 1, wherein a shielding cover is disposed on a side surface of the camera.
6. The wafer surface defect detecting apparatus of claim 1, further comprising an indicator light;
the indicating lamp is connected with the control console and used for indicating the working state.
7. The wafer surface defect detecting apparatus of claim 1, wherein the console comprises a display and an electric control button box;
the light source, the camera, the material tray detection assembly, the lifting assembly and the display are respectively connected with the electric control button box;
the electric control button box is used for controlling the cooperative operation among the light source, the camera, the material tray detection assembly, the lifting assembly and the display and judging whether the surface of the wafer on the material tray has defects or not according to the image acquired by the camera;
the display is used for displaying the judgment result.
8. The wafer surface defect detecting device of claim 7, wherein the electric control button box comprises a control circuit board, a touch screen and an electric control button;
the touch screen and the electric control button are respectively connected with the control circuit board.
9. A method for detecting defects on a wafer surface, which is performed by using the apparatus for detecting defects on a wafer surface according to claims 1 to 8, the method comprising:
the material tray detection assembly detects whether a material tray loaded with wafers is arranged on the detection position and at the height of the material tray detection assembly;
if yes, the light source irradiates light required by the camera to the material tray, and the camera collects images of the material tray;
the console judges whether the surface of the wafer on the material tray has defects according to the image acquired by the camera;
the lifting component drives the light source, the camera and the material tray detection component to lift, and when a new material tray is placed on the detection position, the steps are repeated.
10. The method for detecting the surface defects of the wafer as claimed in claim 9, wherein after the step of judging whether the surface of the wafer on the tray has the defects or not by the console according to the image acquired by the camera, the method further comprises the following steps:
and the console displays the judgment result.
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| CN202110651221.5A CN113358662A (en) | 2021-06-10 | 2021-06-10 | Wafer surface defect detection device and wafer surface defect detection method |
| PCT/CN2022/088360 WO2022257618A1 (en) | 2021-06-10 | 2022-04-22 | Wafer surface defect detection device and wafer surface defect detection method |
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| CN202110651221.5A CN113358662A (en) | 2021-06-10 | 2021-06-10 | Wafer surface defect detection device and wafer surface defect detection method |
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Cited By (1)
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| WO2022257618A1 (en) * | 2021-06-10 | 2022-12-15 | 广东奥普特科技股份有限公司 | Wafer surface defect detection device and wafer surface defect detection method |
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| CN116759330A (en) * | 2023-04-07 | 2023-09-15 | 上海感图网络科技有限公司 | Data processing method, device and storage medium |
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