WO2022257618A1

WO2022257618A1 - Wafer surface defect detection device and wafer surface defect detection method

Info

Publication number: WO2022257618A1
Application number: PCT/CN2022/088360
Authority: WO
Inventors: 李守龙; 刘建华; 路中升; 罗强
Original assignee: 广东奥普特科技股份有限公司
Priority date: 2021-06-10
Filing date: 2022-04-22
Publication date: 2022-12-15
Also published as: CN113358662A

Abstract

A wafer surface defect detection device and a wafer surface defect detection method. The detection device comprises a light source (1), a camera (2), a lifting assembly, a tray detection assembly (6) and a console, wherein the light source (1), the camera (2) and the tray detection assembly (6) are arranged on the lifting assembly; the light source (1), the camera (2), the tray detection assembly (6) and the lifting assembly are respectively connected to the console; the lifting assembly is used for driving the light source (1), the camera (2) and the tray detection assembly (6) to ascend and descend; the camera (2) is used for collecting, at different heights, images of a tray loaded with a wafer at a detection position; the light source (1) is used for providing, at different heights, light required for performing collection; the tray detection assembly (6) is used for detecting, at different heights, whether there is a tray at the detection position; and the console is used for determining, according to the images collected by the camera (2), whether the surface of the wafer on the tray has a defect. Wafer surface defect detection is performed mechanically instead of manually, thereby saving on labor costs, and improving the accuracy and working efficiency of wafer surface defect detection.

Description

Wafer surface defect detection device and wafer surface defect detection method

This application claims the priority of the Chinese patent application submitted to the China Patent Office on June 10, 2021, with the application number 202110651221.5, and the title of the invention is "A Wafer Surface Defect Detection Device and Wafer Surface Defect Detection Method", all of which The contents are incorporated by reference in this application.

technical field

The invention relates to the technical field of wafer defect detection, in particular to a wafer surface defect detection device and a wafer surface defect detection method.

Background technique

In today's information society, the integrated circuit industry, as a strategic basic industry, has been highly infiltrated and integrated into every field of national economy and social development. An important sign of strength. In recent years, with the rise of economy and technology, China has become the world's largest and fastest growing integrated circuit market.

The production and manufacturing of integrated circuits has a very complicated process. Among them, wafers are the main material for manufacturing chips, and their surface defects are the main root cause of affecting chip yield. In order to improve the yield rate of chips, in the chip manufacturing process, there is usually a chip inspection process to find the surface defects of the wafer in time during the manufacturing process, and improve the process in time, so that the yield rate of subsequent wafers can be improved.

At present, the existing wafer defect inspection is that inspectors use industrial microscopes to perform carpet-type manual inspection on the wafer surface. This inspection method requires repeated manual focusing to finally confirm that the human eye can see the wafer surface from the industrial microscope. Not only the detection time is too long, the detection efficiency is low, and the labor cost is high, but also it is easy to be affected by the eye fatigue caused by the inspection personnel for a long time, so it is difficult to apply to industrial large-scale Batch application scenarios.

Therefore, it is very necessary to study a new wafer defect detection technology to overcome the above defects.

The above information is presented as background information only to aid in understanding the present disclosure, and it is not a determination or admission that any of the above may be available as prior art with respect to the present disclosure.

Contents of the invention

The invention provides a wafer surface defect detection device and a wafer surface defect detection method to solve the deficiencies in the prior art.

To achieve the above object, the present invention provides the following technical solutions:

In the first aspect, an embodiment of the present invention provides a wafer surface defect detection device, including a light source, a camera, a lifting component, a tray detection component, and a console; wherein,

The light source, camera, and tray detection component are arranged on the lifting component; the light source, camera, tray detection component, and lifting component are respectively connected to the console and controlled by the console;

The lifting component is used to drive the light source, camera, and tray detection component to lift;

The camera is used to collect images of trays loaded with wafers on detection positions at different heights;

The light source is used to provide the camera with the light required for collection at different heights;

The tray detection component is used to detect whether there is a tray at the detection position at different heights;

The console is used for judging whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera.

Further, in the wafer surface defect detection device, the lifting assembly includes a servo motor, a motion module and a light shield;

The servo motor is connected to the motion module, the shading plate is set on the motion module, the light source and the camera are respectively set on the shading plate and are located between the shading plate and the detection position Between, the tray detection component is set on the motion module;

The servo motor is used to provide driving force to the motion module;

The motion module is used to drive the light source, camera, and tray detection assembly to move up and down after receiving the driving force provided by the servo motor;

The light-shielding plate is used for blocking the light irradiated to the detection position from above.

Further, in the wafer surface defect detection device, the light source is rotatably arranged on the motion module.

Further, in the wafer surface defect detection device, the tray detection component is a tray detection sensor.

Further, in the wafer surface defect detection device, a shielding cover is provided on the side of the camera.

Further, the wafer surface defect detection device also includes an indicator light;

The indicator light is connected with the console to indicate the working state.

Further, in the wafer surface defect detection device, the console includes a display and an electric control button box;

The light source, camera, tray detection component, lifting component, and display are respectively connected to the electric control button box;

The electric control button box is used to control the cooperative operation between the light source, camera, tray detection component, lifting component, and display, and judge whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera ;

The display is used to display the judgment result.

Further, in the wafer surface defect detection device, the electric control button box includes a control circuit board, a touch screen and electric control buttons.

The touch screen and the electric control buttons are respectively connected with the control circuit board.

In the second aspect, an embodiment of the present invention provides a wafer surface defect detection method, which is implemented by using the wafer surface defect detection device described in the first aspect of the present invention, and the method includes:

The tray detection component detects whether there is a tray loaded with wafers at the detection position and at the height where the tray detection component is located;

If so, the light source illuminates the light required for the camera to collect the light on the tray, and the camera collects the image of the tray;

The console judges whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera;

The lifting component drives the light source, camera, and tray detection component to lift up and down, wait until a new tray is placed on the detection position, and repeat the above steps.

Further, in the wafer surface defect detection method, after the step of the console judging whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera, the method further includes:

The console displays the judgment result.

Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

The wafer surface defect detection device and the wafer surface defect detection method provided by the embodiments of the present invention use machines instead of manual labor to detect wafer surface defects, which not only greatly reduces the waste of manpower, saves labor costs, but also improves It improves the accuracy and work efficiency of wafer surface defect detection, is of great significance to the automatic production of wafers, and is suitable for large-scale promotion and application.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings on the premise of not paying creative efforts.

FIG. 1 is a schematic perspective view of the structure of a wafer surface defect detection device provided in Embodiment 1 of the present invention;

FIG. 2 is a schematic front view of a wafer surface defect detection device and its structure provided in Embodiment 1 of the present invention;

3 is a schematic side view of the structure of a wafer surface defect detection device provided in Embodiment 1 of the present invention;

4 is a schematic top view of a wafer surface defect detection device provided in Embodiment 1 of the present invention;

FIG. 5 is a schematic flowchart of a wafer surface defect detection method provided by Embodiment 2 of the present invention.

Reference signs:

Light source 1, camera 2, servo motor 3, motion module 4, shading plate 5, tray detection component 6, display 7, electric control button box 8, indicator light 9.

Detailed ways

In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following description The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that when a component is said to be "connected" to another component, it may be directly connected to the other component or there may be an intervening component at the same time. When a component is said to be "set on" another component, it can be set directly on another component or there may be a centered component at the same time.

In addition, the terms "long", "short", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or implying the referred device Or that the original must have this particular orientation, operate in a particular orientation configuration, and this should not be construed as a limitation of the invention.

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

Embodiment one

In view of the above-mentioned defects existing in the existing wafer surface defect detection technology, the applicant, based on his rich practical experience and professional knowledge in this industry for many years, combined with the application of academic theory, actively researched and innovated, hoping to create a solution that can solve the existing The technology of defects in the technology makes the wafer surface defect detection technology more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Please refer to FIGS. 1-4 , an embodiment of the present invention provides a wafer surface defect detection device, which includes a light source 1, a camera 2, a lifting component, a tray detection component 6 and a console; wherein,

The light source 1, camera 2, and tray detection assembly 6 are arranged on the lifting assembly; the light source 1, camera 2, tray detection assembly 6, and lifting assembly are respectively connected to the console and controlled by the console;

The lifting component is used to drive the light source 1, the camera 2, and the tray detection component 6 up and down;

The camera 2 is used to collect images of trays loaded with wafers on detection positions at different heights;

The light source 1 is used to provide the camera 2 with the light required for collection at different heights;

The tray detection assembly 6 is used to detect whether there is a tray at the detection position at different heights;

The console is used to determine whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera 2 .

It should be noted that, in this embodiment, the trays loaded with wafers are stacked together. When it is necessary to collect images of the first tray, since the heights of the camera 2 and the light source 1 have been set Set, that is, the state of focusing is already adjusted, so as long as the tray detection component 6 can detect that there is indeed a tray on the detection position, the image of the first tray can be directly collected, and then the control panel can adjust the material. The surface of the wafer in the tray is subjected to defect identification. When it is necessary to collect images of the second tray, since the second tray is stacked on the first tray, the second tray is raised by one step relative to the camera 2 and the light source 1. Therefore, at this time, it is necessary to drive the light source 1, camera 2, and tray detection assembly 6 through the lifting assembly to correspondingly raise the height of a tray size, so as to automatically adjust the focus again, and then as long as the tray detects When the component is at the detection position and detects a tray at the height where the tray detection component 6 is located, the image of the second tray can be collected directly, and so on. Of course, considering that the lifting mechanism cannot go up all the time and the trays are stacked too high and easy to fall over, this embodiment sets that each stack of five trays is a cycle, that is, after the fifth tray is detected, the stacked The five trays will be transferred away by manipulator or manually, and the lifting assembly will drive the light source 1, camera 2, and tray detection assembly 6 down to the initial height.

In this embodiment, the lift assembly includes a servo motor 3, a motion module 4 and a visor 5;

The servo motor 3 is connected to the motion module 4, the shading plate 5 is arranged on the motion module 4, and the light source 1 and the camera 2 are respectively arranged on the shading plate 5 and positioned on the shading plate 5. Between the plate 5 and the detection position, the tray detection assembly 6 is arranged on the motion module 4;

The servo motor 3 is used to provide driving force to the motion module 4;

The motion module 4 is used to drive the light source 1, the camera 2, and the tray detection assembly 6 to move up and down after receiving the driving force provided by the servo motor 3;

The shading plate 5 is used to block the light irradiated to the detection position from above, which is different from the light emitted by the light source 1 in this embodiment.

It should be noted that the motion module 4 includes screw rods, bases, sliders, etc., and in view of the fact that this part of the content has been realized in the prior art, and it is not the focus of the design of this scheme, no further details will be made here. elaborate.

In this embodiment, the light source 1 is rotatably arranged on the moving module 4, and the angle of the light irradiated to the material tray can be adjusted. Preferably, the light source 1 is a strip light source.

In this embodiment, the tray detection component 6 is a tray detection sensor.

It should be noted that the type of sensor can be a laser sensor, that is, specifically, the tray detection sensor can include an emitter that emits a detection beam and a receiver that receives the detection beam; since the emitter emits a detection beam toward the direction of the tray, then As long as there is a tray at the detection position and at the height of the transmitter, the detection beam must be blocked, so that it can be confirmed that there is a tray at the detection position.

In this embodiment, a shield is provided on the side of the camera 2 .

It should be noted that the shielding cover can block the light irradiated from the side of the camera 2 to the camera 2, so as to prevent the images collected by the camera 2 from being affected.

In this embodiment, the wafer surface defect detection device further includes an indicator light 9;

The indicator light 9 is connected with the console and is used to indicate the working state, such as a green light in normal working state, a red light in failure, and a yellow light in shutdown for maintenance.

In this embodiment, the console includes a display 7 and an electric control button box 8;

The light source 1, the camera 2, the tray detection component 6, the lifting component, and the display 7 are respectively connected to the electric control button box 8;

The electric control button box 8 is used to control the cooperative operation between the light source 1, the camera 2, the tray detection component 6, the lifting component, and the display 7, and to judge the crystal on the tray according to the image collected by the camera 2. Whether there are defects on the round surface;

The display 7 is used to display the judgment result.

In this embodiment, the electric control button box 8 includes a control circuit board, a touch screen and electric control buttons;

It should be noted that the self-developed SciSmart intelligent vision software is stored on the control circuit board, which can judge whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera 2 . Since this part of the content has been disclosed as prior art and is not the focus of the design of this solution, no in-depth elaboration will be made here.

The wafer surface defect detection device provided by the embodiment of the present invention uses a machine to replace manual detection of wafer surface defects, which not only greatly reduces the waste of manpower, saves labor costs, but also improves the efficiency of wafer surface defect detection. Accuracy and work efficiency are of great significance to the automatic production of wafers, and are suitable for large-scale promotion and application.

Embodiment two

Please refer to FIG. 5 , which is a schematic flowchart of a wafer surface defect detection method provided by Embodiment 2 of the present invention. The method is performed by the wafer surface defect detection device provided in the embodiment of the present invention, and the steps are as follows:

S201. The tray detection component detects whether there is a tray loaded with wafers at the detection position and at the height of the tray detection component; if yes, execute step S202; if not, continue to execute steps S201.

S202. The light source irradiates the light required for the camera to collect light on the tray, and the camera collects an image of the tray.

S203. The console determines whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera.

Preferably, after the step S203, the method further includes:

The console displays the judgment result.

S204. The lifting component drives the light source, camera, and tray detection component to lift up and down, wait until a new tray is placed on the detection position, and return to step S201.

It should be noted that, in consideration of the fact that the lifting mechanism cannot go up all the time and the stacking of the trays is too high and easy to dump, this embodiment can also be set to rise every five times, that is, every time the trays are stacked five times, the In one cycle, the five stacked trays are transferred away, and the lifting assembly drives the light source, camera, and tray detection assembly to drop to the initial height.

The wafer surface defect detection method provided by the embodiment of the present invention replaces the manual detection of wafer surface defects with a machine, which not only greatly reduces the waste of manpower, saves labor costs, but also improves the efficiency of wafer surface defect detection. Accuracy and work efficiency are of great significance to the automatic production of wafers, and are suitable for large-scale promotion and application.

The description thus far of the foregoing embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and used in a selected embodiment, even if not specifically shown or described. In many respects, the same elements or features may also be varied. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous details are set forth, such as examples of specific parts, devices and methods, in order to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and no limitation is intended. As used herein, the singular forms "a" and "the" may be meant to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprising" and "having" are inclusive and thus specify the presence of stated features, integers, steps, operations, elements and/or components, but do not exclude the presence or additional presence of one or more other features , as a whole, steps, operations, elements, components and/or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring performance in the specific order discussed and illustrated, unless an order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on," "bonded to," "connected to," or "coupled to" another element or layer, it can be directly on, or in contact with, another element or layer. An element or layer may be bonded, connected or coupled to another element or layer, and intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on," "directly engaged with," "directly connected to," or "directly coupled to" another element or layer, there may not be intervening elements or layers in between. Other words used to describe the relationship between elements should be interpreted in a like fashion (eg, "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not constrained by these terms. limit. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Terms such as the terms "first," "second," and other numerical terms used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatial relative terms, such as "inside", "outside", "underneath", "beneath", "below", "above", "upper", etc., may be used herein for convenience of description , to describe the relationship between one element or feature and one or more other elements or features as shown in the figures. Spatially relative terms may be meant to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and interpreted in terms of the spatially relative descriptions herein.

Claims

A wafer surface defect detection device is characterized in that it includes a light source, a camera, a lifting assembly, a tray detection assembly, and a console; wherein,

The light source, camera, and tray detection component are arranged on the lifting component; the light source, camera, tray detection component, and lifting component are respectively connected to the console and controlled by the console;

The lifting component is used to drive the light source, camera, and tray detection component to lift;

The camera is used to collect images of trays loaded with wafers on detection positions at different heights;

The light source is used to provide the camera with the light required for collection at different heights;

The tray detection component is used to detect whether there is a tray at the detection position at different heights;

The console is used for judging whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera.
The wafer surface defect detection device according to claim 1, wherein the lifting assembly includes a servo motor, a motion module and a light shield;

The servo motor is connected to the motion module, the shading plate is set on the motion module, the light source and the camera are respectively set on the shading plate and are located between the shading plate and the detection position Between, the tray detection component is set on the motion module;

The servo motor is used to provide driving force to the motion module;

The motion module is used to drive the light source, camera, and tray detection assembly to move up and down after receiving the driving force provided by the servo motor;

The light-shielding plate is used for blocking the light irradiated to the detection position from above.
The wafer surface defect detection device according to claim 2, wherein the light source is rotatably arranged on the moving module.
The wafer surface defect detection device according to claim 1, wherein the tray detection component is a tray detection sensor.
The wafer surface defect detection device according to claim 1, wherein a shielding cover is arranged on a side of the camera.
The wafer surface defect detection device according to claim 1, further comprising an indicator light;

The indicator light is connected with the console to indicate the working state.
The wafer surface defect detection device according to claim 1, wherein the console comprises a display and an electric control button box;

The light source, camera, tray detection component, lifting component, and display are respectively connected to the electric control button box;

The electric control button box is used to control the cooperative operation between the light source, camera, tray detection component, lifting component, and display, and judge whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera ;

The display is used to display the judgment result.
The wafer surface defect detection device according to claim 7, wherein the electric control button box includes a control circuit board, a touch screen and an electric control button;

The touch screen and the electric control buttons are respectively connected with the control circuit board.
A method for detecting defects on a wafer surface, implemented by the device for detecting defects on a wafer surface according to claim 1-8, wherein the method comprises:

The tray detection component detects whether there is a tray loaded with wafers at the detection position and at the height where the tray detection component is located;

If so, the light source illuminates the light required for the camera to collect the light on the tray, and the camera collects the image of the tray;

The console judges whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera;

The lifting component drives the light source, camera, and tray detection component to lift up and down, wait until a new tray is placed on the detection position, and repeat the above steps.
The wafer surface defect detection method according to claim 9, characterized in that, after the step of the console judging whether there is a defect on the surface of the wafer on the tray according to the image collected by the camera, the method further include:

The console displays the judgment result.