CN116183503A - Multidirectional measuring mechanism for semiconductor material device based on intelligent blanking - Google Patents
Multidirectional measuring mechanism for semiconductor material device based on intelligent blanking Download PDFInfo
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- CN116183503A CN116183503A CN202310473823.5A CN202310473823A CN116183503A CN 116183503 A CN116183503 A CN 116183503A CN 202310473823 A CN202310473823 A CN 202310473823A CN 116183503 A CN116183503 A CN 116183503A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/34—Purifying; Cleaning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
Abstract
The invention discloses a multidirectional measuring mechanism for semiconductor material devices based on intelligent blanking, which belongs to the technical field of semiconductor material device measurement and comprises an intelligent conveying assembly, a hydraulic lifting assembly, a connecting plate, an optical measuring assembly and a dust removal box, wherein the hydraulic lifting assembly is fixedly arranged at the back of the intelligent conveying assembly. According to the invention, the lifting of the light shield and the optical measurement assembly is realized through the hydraulic lifting assembly, so that the environment light is shielded through the light shield in the process of measuring the semiconductor material device, and the measuring mechanism is further connected with the dust collection power mechanism by utilizing the kinetic energy generated by the hydraulic lifting assembly in the lifting process, and is matched with the dust removal box, the collecting pipe and the dust collection port to effectively remove dust adhered to the surface of the semiconductor material device, so that the measuring error caused by the environment light and the dust is avoided, and the structural linkage and the measuring accuracy of the multidirectional measuring mechanism of the semiconductor material device are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor material device measurement, in particular to a multidirectional measuring mechanism for a semiconductor material device based on intelligent blanking.
Background
The semiconductor material device refers to an electronic material used for manufacturing the semiconductor material device and the integrated circuit, and different morphological requirements are met on the semiconductor material device when different semiconductor material devices and integrated circuits are manufactured, including slicing, lapping, polishing, thin films and the like, and the semiconductor material device is required to be measured through an optical measurement assembly matched with an intelligent conveying assembly in the use process of the semiconductor material device so as to ensure that the semiconductor material device can adapt to the requirements of different integrated circuits, and the semiconductor material devices are different in shape, so that the semiconductor material device is required to be measured in multiple directions in the measurement process of the semiconductor material device.
However, the existing measuring mechanism for semiconductor material devices has the following problems when in use:
1. in the process of measuring the semiconductor material device through the existing semiconductor material device measuring mechanism and the intelligent conveying and blanking assembly, when the clamping and positioning assembly on the intelligent conveying assembly clamps and positions the semiconductor material device, the measuring mechanism can only carry out unidirectional measurement on the semiconductor material device, so that the semiconductor material device can be measured in multiple directions only by disassembling and reinstalling the semiconductor material device when the semiconductor material device is measured, and the using convenience of the existing semiconductor material device measuring mechanism and the using effect of the intelligent conveying assembly are reduced;
2. when measuring the semiconductor material device, the optical measurement assembly can be influenced by ambient light and bonding dust on the semiconductor material device, and errors can be caused in the measurement result, so that the use effect of the conventional semiconductor material device measurement mechanism is reduced.
In view of the above, intensive studies have been conducted to solve the above problems.
Aiming at the problems, innovative design is carried out on the basis of the original multidirectional measuring mechanism of the semiconductor material device based on intelligent blanking.
Disclosure of Invention
The invention aims to provide a multidirectional measuring mechanism for a semiconductor material device based on intelligent blanking, so as to solve the problems that the multidirectional measurement of the semiconductor material device is inconvenient and errors are caused by the influence of ambient light and dust in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the multidirectional measuring mechanism for the semiconductor material device based on intelligent blanking comprises an intelligent conveying assembly, a hydraulic lifting assembly, a connecting plate, an optical measuring assembly and a dust removal box,
the back of the intelligent conveying assembly is fixedly provided with a hydraulic lifting assembly, the top end of the hydraulic lifting assembly is fixedly connected with a connecting plate, the bottom of the connecting plate is provided with a light shield, and the bottom of the light shield is provided with a buffer mechanism;
the inner part of the connecting plate is provided with a mounting groove, an optical measurement assembly is attached to the inner part of the mounting groove, the outer ring of the optical measurement assembly is fixedly provided with a supporting seat, and the supporting seat is connected with the connecting plate through a positioning mechanism;
dust collection power mechanisms are arranged on two sides of the hydraulic lifting assembly, and the top ends of the dust collection power mechanisms are fixedly connected with the connecting plates;
one side of the dust collection power mechanism is connected with a dust collection box, a filtering mechanism is arranged in the dust collection box, a collecting pipe is connected with one side of the dust collection box in a flange manner, and dust collection openings are distributed on the collecting pipe at equal intervals;
the surface mounting of intelligence conveying subassembly has upset fixture, and intelligent conveying subassembly's top surface mid-mounting has the pinion rack to the pinion rack is connected with upset fixture meshing.
Preferably, the buffer mechanism comprises a limit rod, the bottom end of the light shield is internally and slidably connected with the limit rod, a first spring is sleeved on the surface of the limit rod, a buffer pad is fixedly connected with the bottom end of the limit rod, and the buffer pad and the light shield form a telescopic structure through the first spring and the limit rod.
Adopt above-mentioned technical scheme for buffer gear's setting can drive the lens hood at hydraulic lifting unit and overturn fixture carries out the in-process of docking and cushion, avoids both to produce direct rigid contact and produces the damage, and the setting of lens hood can carry out effectual shielding to the ambient light in the measurement simultaneously, has improved the measurement accuracy of this diversified measuring mechanism of semiconductor material device.
Preferably, the positioning mechanism comprises a fixed shaft, the fixed shaft is installed to one side of connecting plate, the one end of fixed shaft rotates and is connected with the regulation pole, the surface cover of adjusting the pole is equipped with the fly leaf, the spread groove has been seted up to the inside of fly leaf, and spread groove and regulation pole threaded connection, the top fixed mounting of fly leaf has the dislocation board, and dislocation board and supporting seat dislocation block are connected.
By adopting the technical scheme, the optical measuring assembly and the supporting seat which are damaged and have reduced precision can be conveniently replaced conveniently by controlling the positioning mechanism, and convenience and accuracy of replacement of the optical measuring assembly and the supporting seat of the multi-azimuth measuring mechanism of the semiconductor material device are improved.
Preferably, the dust collection power mechanism comprises a linkage plate, linkage plates are fixedly connected to two sides of the connecting plate, a piston rod is fixedly installed in the linkage plates, a piston plate is installed at the bottom end of the piston rod, a piston pipe is sleeved on the surface of the piston plate, a sealing sleeve is embedded in the top end of the piston pipe, an air outlet valve and an air inlet valve are symmetrically distributed at the top end of the piston pipe, and one end of the air inlet valve is connected with the dust collection box.
By adopting the technical scheme, the hydraulic lifting assembly can be utilized to drive the dust collection power mechanism to operate by utilizing the kinetic energy generated in the lifting process of the light shield and the optical measurement assembly, so that the semiconductor material device to be measured is conveniently cleaned by the dust removal box, the collecting pipe and the dust collection port, the measurement accuracy is prevented from being influenced by dust, and the structural linkage of the semiconductor material device multi-azimuth measurement mechanism is improved.
Preferably, the piston rod and the piston tube form a piston structure through a piston plate, and the sealing sleeve is in sliding connection with the piston rod.
By adopting the technical scheme, the sealing sleeve can be arranged to improve the tightness of the dust collection power mechanism, the joint of the piston rod and the piston tube is prevented from leaking, the using effect of the dust collection power mechanism is improved, meanwhile, the piston structure can fully utilize the lifting kinetic energy of the hydraulic lifting assembly, and the resource utilization rate of the multi-azimuth measuring mechanism for the semiconductor material device is improved.
Preferably, the filter mechanism comprises a top plate, the inside gomphosis in top of dust removal case has the roof, the bottom surface mid-mounting of roof has the filter screen, the top surface fixed mounting of roof has the locating plate, the inside sliding connection of locating plate has the locating lever, the one end surface cover of locating lever is equipped with the second spring, and the locating lever passes through second spring and locating plate telescopic connection, the other end fixed mounting of locating lever has the clamping plate, the block groove that corresponds with the clamping plate has been seted up to one side of dust removal case, and the clamping plate is connected with the block groove block.
By adopting the technical scheme, the setting of the filtering mechanism can prevent absorbed dust from entering the dust collection power mechanism to generate influence, and meanwhile, the filtering mechanism is convenient to install and detach, so that the convenience of cleaning work of the filtering mechanism and the dust collection box is improved.
Preferably, the overturning and clamping mechanism comprises a fixed frame, the fixed frame is fixedly arranged on the surface of the intelligent conveying assembly, connecting shafts are embedded in two sides of the fixed frame, connecting rods penetrate through the connecting shafts on one side, air cylinders are connected to the connecting shafts on the other side, clamping plates are arranged at one ends of the air cylinders and the connecting rods, and gears are arranged at one ends of the air cylinders.
Adopt above-mentioned technical scheme for upset fixture cooperation pinion rack and intelligent conveying subassembly can realize automatic upset in the in-process of going up unloading and measuring in moving the semiconductor material device, have improved the linkage between this semiconductor material device diversified measuring mechanism and the intelligent conveying subassembly, have improved the use convenience of this semiconductor material device diversified measuring mechanism simultaneously.
Preferably, the cylinder and the connecting rod form a rotary structure with the fixed frame through a connecting shaft, and the cylinder is meshed and connected with the toothed plate through a gear.
By adopting the technical scheme, the cylinder can be matched with the connecting rod to stably clamp the semiconductor material device through the clamping plate in the rotating process, and meanwhile, the stability of the semiconductor material device in the overturning process is improved.
Compared with the prior art, the invention has the beneficial effects that: according to the intelligent blanking-based multidirectional measurement mechanism for the semiconductor material device, lifting of the light shield and the optical measurement assembly is realized through the hydraulic lifting assembly, so that the environment light is shielded through the light shield in the process of measuring the semiconductor material device, the measurement mechanism also utilizes the kinetic energy generated by the hydraulic lifting assembly in the lifting process to link with the dust collection power mechanism, and the dust collection box, the collecting pipe and the dust collection opening are matched to effectively remove dust adhered to the surface of the semiconductor material device, so that measurement errors caused by the environment light and the dust are avoided, and the structural linkage property and the measurement accuracy of the multidirectional measurement mechanism for the semiconductor material device are improved;
meanwhile, the intelligent conveying assembly is utilized to drive the semiconductor material device to move and feed and discharge, the overturning clamping mechanism and the toothed plate are matched, and the semiconductor material device can be overturned in the moving process, so that the semiconductor material device can be overturned conveniently and measured in multiple directions, the using effect of the semiconductor material device measuring mechanism is improved, and the linkage between the semiconductor material device measuring mechanism and the intelligent conveying assembly is improved.
Drawings
FIG. 1 is a schematic diagram of a side view of the present invention;
FIG. 2 is a schematic diagram of the distribution structure of the positioning mechanism and the filtering mechanism of the present invention;
FIG. 3 is a schematic diagram of the distribution structure of the buffer mechanism and the positioning mechanism of the present invention;
FIG. 4 is a schematic side sectional view of a positioning mechanism according to the present invention;
FIG. 5 is a schematic side sectional view of the dust absorbing power mechanism of the present invention;
FIG. 6 is an exploded view of the filter mechanism of the present invention;
fig. 7 is a schematic side sectional view of the turnover clamping mechanism of the present invention.
In the figure: 1. an intelligent transfer assembly; 2. a hydraulic lifting assembly; 3. a connecting plate; 4. a light shield; 5. a buffer mechanism; 501. a limit rod; 502. a first spring; 503. a cushion pad; 6. a mounting groove; 7. an optical measurement assembly; 8. a support base; 9. a positioning mechanism; 901. a fixed shaft; 902. an adjusting rod; 903. a movable plate; 904. a connecting groove; 905. a dislocation plate; 10. a dust collection power mechanism; 1001. a linkage plate; 1002. a piston rod; 1003. a piston plate; 1004. a piston tube; 1005. sealing sleeve; 1006. an air outlet valve; 1007. an intake valve; 11. a dust removal box; 12. a filtering mechanism; 1201. a top plate; 1202. a filter screen; 1203. a positioning plate; 1204. a positioning rod; 1205. a second spring; 1206. a clamping plate; 1207. a clamping groove; 13. collecting pipes; 14. a dust collection port; 15. the overturning clamping mechanism; 1501. a fixed frame; 1502. a connecting shaft; 1503. a connecting rod; 1504. a clamping plate; 1505. a cylinder; 1506. a gear; 16. toothed plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a semiconductor materials device diversified measuring mechanism based on intelligence unloading, including intelligent transport subassembly 1, hydraulic lifting unit 2, the connecting plate 3, optical measurement subassembly 7 and dust bin 11, intelligent transport subassembly 1's back fixed mounting has hydraulic lifting unit 2, hydraulic lifting unit 2's top fixedly connected with connecting plate 3, the lens hood 4 is installed to connecting plate 3's bottom, lens hood 4's bottom is provided with buffer gear 5, buffer gear 5 includes gag lever post 501, the inside sliding connection in bottom of lens hood 4 has gag lever post 501, first spring 502 has been cup jointed on the surface of gag lever post 501, the bottom fixedly connected with blotter 503 of gag lever post 501, and the blotter 503 constitutes extending structure through first spring 502 and gag lever post 501 and lens hood 4, above-mentioned make hydraulic lifting unit 2 can drive lens hood 4 and optical measurement subassembly 7 through connecting plate 3 go up and down, thereby can drive lens hood 4 and upset fixture 15 in the in-process of measuring to dock, so as to shelter from ambient light, the elastic potential energy cooperation of first spring 502's elastic structure itself can carry out the bump pad 503 and carry out the direct contact between the elastic structure of tilting mechanism 15, the semiconductor materials of this bump pad 503 has avoided the effect of producing the impact pad, wherein the effect of the flexible device is avoided producing the dislocation and the limit device is directly to the limit device is directly contacted, the limit device has been avoided.
As shown in fig. 1-4, the mounting groove 6 is formed in the connecting plate 3, the optical measurement assembly 7 is attached to the mounting groove 6, the supporting seat 8 is fixedly mounted on the outer ring of the optical measurement assembly 7, the supporting seat 8 is connected with the connecting plate 3 through the positioning mechanism 9, the positioning mechanism 9 comprises a fixed shaft 901, the fixed shaft 901 is mounted on one side of the connecting plate 3, an adjusting rod 902 is rotatably connected to one end of the fixed shaft 901, a movable plate 903 is sleeved on the surface of the adjusting rod 902, a connecting groove 904 is formed in the movable plate 903, the connecting groove 904 is in threaded connection with the adjusting rod 902, a dislocation plate 905 is fixedly mounted on the top of the movable plate 903, the dislocation plate 905 is in dislocation clamping connection with the supporting seat 8, when the optical measurement assembly 7 is reduced in precision and damaged, the optical measurement assembly is required to be replaced, the movable plate 903 is rotated at one end of the fixed shaft 901 through the rotation of the adjusting rod 902, the movable plate 903 and the dislocation plate 905 are driven to be connected with and separated from the supporting seat 8 through the threaded connection of the movable plate 903 in the rotation process, and then the optical measurement assembly 7 and the supporting seat 8 can be detached when the movable plate 903 is connected, and the optical measurement assembly 7 and the supporting seat 8 are replaced conveniently and the optical measurement assembly 7 and the optical measurement assembly 8 are replaced conveniently.
As shown in fig. 1-2 and fig. 5, dust collection power mechanism 10 is installed on both sides of hydraulic lifting assembly 2, dust collection power mechanism 10 includes linkage plate 1001, linkage plate 1001 is fixedly connected on both sides of connecting plate 3, piston rod 1002 is fixedly installed in the inside of linkage plate 1001, piston plate 1003 is installed to the bottom of piston rod 1002, piston pipe 1004 has been cup jointed on the surface of piston plate 1003, piston rod 1002 constitutes the piston structure through piston plate 1003 and piston pipe 1004, seal cover 1005 has been embedded inside at the top of piston pipe 1004, and seal cover 1005 and piston rod 1002 sliding connection, the top symmetric distribution of piston pipe 1004 has air outlet valve 1006 and admission valve 1007, the one end and the dust collection box 11 interconnect of admission valve 1007, one side of dust collection power mechanism 10 is connected with dust collection box 11, one side flange joint of dust collection box 11 has collecting pipe 13, equidistant distribution has dust collection opening 14 on the collecting pipe 13, above-mentioned make hydraulic lifting assembly 2 can drive piston rod 1002 and piston plate 1003 through linkage plate 1001 and descend in piston pipe 1004's inside in the process of driving connecting plate 3 and optical measurement assembly 7, and make piston pipe 1004 inside produce negative pressure in the process that descends, and make the inside of piston pipe 1004 produce accurate pressure, and the accuracy is glued to the semiconductor device that has been measured by the dust collection efficiency has been avoided to the dust collection efficiency to the dust collection device to the measurement accuracy.
1-2 and 5-6 show, the internally mounted of dust collection box 11 has filter mechanism 12, filter mechanism 12 includes roof 1201, the inside gomphosis in top of dust collection box 11 has roof 1201, the bottom surface mid-mounting of roof 1201 has filter screen 1202, the top surface fixed mounting of roof 1201 has locating plate 1203, the inside sliding connection of locating plate 1203 has locating lever 1204, the one end surface cover of locating lever 1204 is equipped with second spring 1205, and locating lever 1204 passes through second spring 1205 and locating plate 1203 telescopic connection, the other end fixed mounting of locating lever 1204 has clamping plate 1206, the block groove 1207 that corresponds with clamping plate 1206 has been seted up to one side of dust collection box 11, and clamping plate 1206 and block groove 1207 block are connected, above-mentioned make collecting main 13 and dust absorption mouth 14 when the dust that bonds on the semiconductor material device absorbs, the setting of filter screen 1202 can prevent that the dust from getting into inside dust absorption power mechanism 10, and through the pulling to clamping plate 1206 can make it separate with clamping plate 1207, and be convenient for dismantle the effectual clearance to 1202 to roof 1201, second clamping plate 1205 and filter screen 1202, simultaneously, the clamping plate 1206 can be driven at clamping plate 1206 and clamping plate 1207 when installing and the clamping plate 1206 and can drive the filter mechanism 12 and change and install and replace conveniently and replace the filter mechanism 12.
As shown in fig. 1 and 7, the surface mounting of the intelligent conveying component 1 is provided with the overturning clamping mechanism 15, the overturning clamping mechanism 15 comprises a fixed frame 1501, the surface of the intelligent conveying component 1 is fixedly provided with the fixed frame 1501, the inside of two sides of the fixed frame 1501 is embedded with a connecting shaft 1502, a connecting rod 1503 penetrates through the inside of one side of the connecting shaft 1502, the inside of the other side of the connecting shaft 1502 is connected with a cylinder 1505, the cylinder 1505 and the connecting rod 1503 form a rotating structure through the connecting shaft 1502 and the fixed frame 1501, one ends of the cylinder 1505 and the connecting rod 1503 are respectively provided with a clamping plate 1504, one end of the cylinder 1505 is provided with a gear 1506, and the cylinder 1505 is connected with a toothed plate 16 through the gear 1506 in a meshing manner.
What is not described in detail in this specification is prior art known to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Multidirectional measuring mechanism of semiconductor material device based on intelligence unloading, including intelligent conveying subassembly (1), hydraulic lifting subassembly (2), connecting plate (3), optical measurement subassembly (7) and dust removal case (11), its characterized in that:
the intelligent conveying device is characterized in that a hydraulic lifting assembly (2) is fixedly arranged at the back of the intelligent conveying assembly (1), a connecting plate (3) is fixedly connected to the top end of the hydraulic lifting assembly (2), a light shield (4) is arranged at the bottom of the connecting plate (3), and a buffer mechanism (5) is arranged at the bottom of the light shield (4);
the device is characterized in that a mounting groove (6) is formed in the connecting plate (3), an optical measurement assembly (7) is attached to the mounting groove (6), a supporting seat (8) is fixedly arranged on the outer ring of the optical measurement assembly (7), and the supporting seat (8) and the connecting plate (3) are connected with each other through a positioning mechanism (9);
the two sides of the hydraulic lifting assembly (2) are provided with dust collection power mechanisms (10), and the top ends of the dust collection power mechanisms (10) are fixedly connected with the connecting plates (3);
one side of the dust collection power mechanism (10) is connected with a dust collection box (11), a filter mechanism (12) is arranged in the dust collection box (11), a collecting pipe (13) is connected to one side flange of the dust collection box (11), and dust collection openings (14) are distributed on the collecting pipe (13) at equal intervals;
the intelligent conveying assembly is characterized in that an overturning clamping mechanism (15) is arranged on the surface of the intelligent conveying assembly (1), a toothed plate (16) is arranged in the middle of the top surface of the intelligent conveying assembly (1), and the toothed plate (16) is meshed with the overturning clamping mechanism (15).
2. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 1, wherein: the buffering mechanism (5) comprises a limiting rod (501), the limiting rod (501) is connected to the bottom end of the light shield (4) in a sliding mode, a first spring (502) is sleeved on the surface of the limiting rod (501), a buffering pad (503) is fixedly connected to the bottom end of the limiting rod (501), and the buffering pad (503) and the light shield (4) form a telescopic structure through the first spring (502) and the limiting rod (501).
3. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 1, wherein: positioning mechanism (9) are including fixed axle (901), fixed axle (901) is installed to one side of connecting plate (3), one end rotation of fixed axle (901) is connected with regulation pole (902), the surface cover of adjusting pole (902) is equipped with fly leaf (903), spread groove (904) have been seted up to the inside of fly leaf (903), and spread groove (904) and regulation pole (902) threaded connection, the top fixed mounting of fly leaf (903) has dislocation board (905), and dislocation board (905) are connected with supporting seat (8) dislocation block.
4. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 1, wherein: the dust collection power mechanism (10) comprises a linkage plate (1001), two sides of the connecting plate (3) are fixedly connected with the linkage plate (1001), a piston rod (1002) is fixedly installed in the linkage plate (1001), a piston plate (1003) is installed at the bottom end of the piston rod (1002), a piston pipe (1004) is sleeved on the surface of the piston plate (1003), a sealing sleeve (1005) is embedded in the top end of the piston pipe (1004), an air outlet valve (1006) and an air inlet valve (1007) are symmetrically distributed in the top end of the piston pipe (1004), and one end of the air inlet valve (1007) is connected with the dust collection box (11) in an interconnecting mode.
5. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 4, wherein: the piston rod (1002) and the piston tube (1004) form a piston structure through the piston plate (1003), and the sealing sleeve (1005) is in sliding connection with the piston rod (1002).
6. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 1, wherein: the utility model provides a filter mechanism (12) is including roof (1201), the inside gomphosis in top of dust removal case (11) has roof (1201), the bottom surface mid-mounting of roof (1201) has filter screen (1202), the top surface fixed mounting of roof (1201) has locating plate (1203), the inside sliding connection of locating plate (1203) has locating lever (1204), the one end surface cover of locating lever (1204) is equipped with second spring (1205), and locating lever (1204) pass through second spring (1205) and locating plate (1203) telescopic connection, the other end fixed mounting of locating lever (1204) has clamping plate (1206), clamping groove (1207) that corresponds with clamping plate (1206) have been seted up to one side of dust removal case (11), and clamping plate (1206) are connected with clamping groove (1207) block.
7. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 1, wherein: the turnover clamping mechanism (15) comprises a fixed frame (1501), the fixed frame (1501) is fixedly arranged on the surface of the intelligent conveying assembly (1), connecting shafts (1502) are embedded in the two sides of the fixed frame (1501), connecting rods (1503) penetrate through the connecting shafts (1502) on one side, air cylinders (1505) are connected to the connecting shafts (1502) on the other side, clamping plates (1504) are arranged at one ends of the air cylinders (1505) and the connecting rods (1503), and gears (1506) are arranged at one ends of the air cylinders (1505).
8. The intelligent blanking-based multidirectional measuring mechanism for semiconductor material devices according to claim 7, wherein: the cylinder (1505) and the connecting rod (1503) form a rotating structure with the fixed frame (1501) through the connecting shaft (1502), and the cylinder (1505) is meshed and connected with the toothed plate (16) through the gear (1506).
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| WO2022021573A1 (en) * | 2020-07-31 | 2022-02-03 | 苏州卓罗智能科技有限公司 | Clamping mechanism for facilitating overturning of electronic component |
| CN215239968U (en) * | 2020-11-02 | 2021-12-21 | 南通大学 | A dust collector for polycrystalline silicon production |
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| CN113984775A (en) * | 2021-10-28 | 2022-01-28 | 苏州市蓝皓计算机科技有限公司 | Nut defect detection device and method based on machine vision |
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