CN218101184U

CN218101184U - High-speed four-head die bonder for semiconductor

Info

Publication number: CN218101184U
Application number: CN202221762032.1U
Authority: CN
Inventors: 杨军; 李婷
Original assignee: Shenzhen Pingchen Semiconductor Technology Co ltd
Current assignee: Shenzhen Pingchen Semiconductor Technology Co ltd
Priority date: 2022-07-08
Filing date: 2022-07-08
Publication date: 2022-12-20
Anticipated expiration: 2032-07-08

Abstract

The utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor. The high-speed four-head die bonder for the semiconductor comprises: the device comprises an operating platform, a first mounting plate is fixedly mounted at the top of the operating platform, a second mounting plate is fixedly mounted on one side of the first mounting plate, and a first mounting groove is formed in the second mounting plate; the one-way threaded rod is rotatably installed in the first installation groove, and one end of the one-way threaded rod extends out of the first installation groove; the sliding block is sleeved on the one-way threaded rod in a threaded manner, and the bottom end of the sliding block extends out of the first mounting groove. The utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor has the convenience and fixes the spacing of semiconductor log, and skew when preventing solid brilliant is favorable to reducing the advantage of yields.

Description

High-speed four-head die bonder for semiconductor

Technical Field

The utility model belongs to the technical field of semiconductor processing, especially, relate to a be used for solid brilliant device of high-speed four-head of semiconductor.

Background

In the packaging process of a semiconductor device, die bonding is an extremely important link, and the die bonding process is as follows: firstly, glue is dispensed on a die bonding station of a substrate by a glue dispensing mechanism (also called a glue dispensing module), then a die bonding swing arm of the die bonding mechanism takes out a semiconductor chip from a wafer and transfers the semiconductor chip to the die bonding station with dispensed glue, and under the condition of the same die bonding yield (quality), the die bonding efficiency of the die bonding machine is an important index for evaluating the performance of the die bonding machine.

However, some conventional semiconductor die bonding equipment is lack of a fixed structure, so that the semiconductor device cannot be limited and fixed in use, die bonding failure is caused by an offset phenomenon easily occurring during die bonding, and the defective rate is increased.

Therefore, there is a need to provide a new high-speed four-head die bonding apparatus for semiconductor to solve the above-mentioned technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a convenient spacing fixed to semiconductor device, prevent solid brilliant time skew, be favorable to reducing the solid brilliant device of high-speed four-head of semiconductor of yields.

In order to solve the technical problem, the utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor includes: the top of the operating platform is fixedly provided with a first mounting plate, one side of the first mounting plate is fixedly provided with a second mounting plate, and the second mounting plate is provided with a first mounting groove; the one-way threaded rod is rotatably installed in the first installation groove, and one end of the one-way threaded rod extends out of the first installation groove; the sliding block is sleeved on the one-way threaded rod in a threaded manner, and the bottom end of the sliding block extends out of the first mounting groove; the electric telescopic rod is fixedly arranged at the bottom end of the sliding block; the glue dispensing rod is fixedly arranged on the output rod of the electric telescopic rod; the motor is fixedly arranged on one side of the second mounting plate, and an output shaft of the motor is fixedly connected with one end of the one-way threaded rod; the positioning device comprises an operating platform, a placing platform, a limiting and fixing mechanism and a control mechanism, wherein the placing platform is fixedly arranged at the top of the operating platform, the limiting and fixing mechanism comprises a bidirectional threaded rod, two limiting blocks and a hand wheel, the bidirectional threaded rod is rotatably arranged on the placing platform, the two limiting blocks are both sleeved on the bidirectional threaded rod in a threaded manner, and the hand wheel is fixedly arranged on one end of the bidirectional threaded rod; and the shielding dust collection mechanism is arranged on the operating platform.

As a further scheme of the utility model, shelter from dust absorption mechanism including sheltering from case, seal box, dust absorption fan, case lid, dust filter, connecting pipe, collecting pipe and flexible pipe, shelter from case fixed mounting in the top of operation panel, it is located outside the first mounting panel, the seal box with the equal fixed mounting of dust absorption fan is in shelter from the forehead top of case, the case lid sets up the top of seal box, dust filter sets up in the seal box, connecting pipe fixed mounting is in dust absorption fan's air inlet is served, the air inlet end of connecting pipe with the fixed intercommunication of seal box, collecting pipe fixed mounting be in on the inner wall of one side of sheltering from the case, the collecting pipe air-out end extends outside the shelter box, flexible pipe fixed mounting be in the air-out of collecting pipe is served, flexible pipe air-out end with the fixed intercommunication of case lid.

As a further scheme of the utility model, two all be provided with the slipmat on the one side that the stopper is close to each other, two the slipmat is insulating material, place the bench and seted up the second mounting groove, the second mounting groove with two-way threaded rod and two stopper looks adaptation, two the ball has all been inlayed to the bottom of stopper, two the ball all with the bottom inner wall of second mounting groove contacts.

As a further scheme of the utility model, one side fixed mounting of first mounting panel has the light, the light is provided with the lamp shade outward, the lamp shade with first mounting panel fixed connection.

As a further proposal of the utility model, a plurality of dust-collecting hoods are fixedly arranged on the collecting pipe, and are in a horn shape.

As a further proposal of the utility model, the slider is provided with a threaded hole, the threaded hole with one-way threaded rod looks adaptation.

Compared with the prior art, the utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor has following beneficial effect:

the utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor:

1. the one-way threaded rod is matched with the sliding block, the electric telescopic rod and the dispensing rod to form a simple dispensing mechanism, the die bonding processing of the semiconductor device can be realized after simple operation, and the semiconductor device can be limited and fixed after simple operation through the arranged limiting and fixing mechanism, so that the deviation during die bonding is prevented, and the reduction of the yield is facilitated;

2. through the dust absorption mechanism that shelters from that sets up, can shelter from some dusts, also can absorb simultaneously and collect some dusts, reduce the dust and fall slowly and lightly, reduce the harmful effects that the dust caused to solid brilliant processing, through the slipmat that sets up, semiconductor device slides when can preventing to fix, through the light that sets up, can provide the illumination when opening, makes things convenient for personnel to continue to carry out solid brilliant processing when light is darker.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic front sectional view of a high-speed four-head die bonder for semiconductor devices according to the present invention;

FIG. 2 is an enlarged schematic view of portion A of FIG. 1;

fig. 3 is a schematic view of the structure of the present invention.

In the figure: 1. an operation table; 2. a first mounting plate; 3. a second mounting plate; 4. a one-way threaded rod; 5. a slider; 6. an electric telescopic rod; 7. dispensing a glue rod; 8. a motor; 9. a placing table; 10. a bidirectional threaded rod; 11. a limiting block; 12. a hand wheel; 13. a shielding box; 14. a sealing box; 15. a dust collection fan; 16. a box cover; 17. a dust filter plate; 18. a connecting pipe; 19. a collection tube; 20. a telescopic pipe; 21. a non-slip mat.

Detailed Description

Referring to fig. 1-3, fig. 1 is a schematic sectional view of a semiconductor high-speed four-head die bonder according to the present invention; FIG. 2 is an enlarged schematic view of portion A of FIG. 1; fig. 3 is a schematic view of the structure of the present invention. The high-speed four-head die bonder for semiconductors comprises: the device comprises an operating platform 1, wherein a first mounting plate 2 is fixedly mounted at the top of the operating platform 1, a second mounting plate 3 is fixedly mounted on one side of the first mounting plate 2, and a first mounting groove is formed in the second mounting plate 3; the one-way threaded rod 4 is rotatably installed in the first installation groove, and one end of the one-way threaded rod 4 extends out of the first installation groove; the sliding block 5 is sleeved on the one-way threaded rod 4 in a threaded manner, and the bottom end of the sliding block 5 extends out of the first mounting groove; the electric telescopic rod 6 is fixedly arranged at the bottom end of the sliding block 5; the glue dispensing rod 7 is fixedly arranged on the output rod of the electric telescopic rod 6; the motor 8 is fixedly arranged on one side of the second mounting plate 3, and an output shaft of the motor 8 is fixedly connected with one end of the one-way threaded rod 4; the positioning device comprises a placing table 9, wherein the placing table 9 is fixedly installed at the top of the operating table 1, a limiting and fixing mechanism is arranged on the placing table 9, the limiting and fixing mechanism comprises a bidirectional threaded rod 10, two limiting blocks 11 and a hand wheel 12, the bidirectional threaded rod 10 is rotatably installed on the placing table 9, the two limiting blocks 11 are both sleeved on the bidirectional threaded rod 10 in a threaded manner, and the hand wheel 12 is fixedly installed at one end of the bidirectional threaded rod 10; shelter from dust absorption mechanism, shelter from dust absorption mechanism and set up on operation panel 1, through 4 cooperation sliders 5 of one-way threaded rod, electric telescopic handle 6 and some glue bars 7, can constitute a simple and easy some brilliant mechanisms, can realize after the simple operation carrying out solid brilliant processing to semiconductor device, through the spacing fixed establishment who sets up, can be spacing fixed to semiconductor device after the simple operation, skew when preventing solid brilliant, is favorable to reducing the yields.

It includes sheltering from case 13, seal box 14, dust absorption fan 15, case lid 16, dust filter 17, connecting pipe 18, collecting pipe 19 and flexible pipe 20 to shelter from dust absorption mechanism, shelter from case 13 fixed mounting in the top of operation panel 1, shelter from case 13 and be located outside the first mounting panel 2, seal box 14 with dust absorption fan 15 all fixed mounting is in shelter from the volume top of case 13, case lid 16 sets up the top of seal box 14, dust filter 17 sets up in the seal box 14, connecting pipe 18 fixed mounting is in on dust absorption fan 15's the air inlet end, the air inlet end of connecting pipe 18 with seal box 14 fixed communication, collecting pipe 19 fixed mounting be in on the inner wall of one side of shelter from case 13, collecting pipe 19 air-out end extends shelter from outside the case 13, flexible pipe 20 fixed mounting is in the air-out end of collecting pipe 19, the air-out end of flexible pipe 20 with case lid 16 fixed communication, through the dust absorption mechanism that shelters from that sets up, can shelter from the dust, also can adsorb simultaneously and collect some dust, reduces the dust and falls, reduces the bad influence that the dust causes the solid crystal processing.

The two anti-slip pads 21 are arranged on one sides, close to each other, of the limiting blocks 11, the two anti-slip pads 21 are made of insulating materials, a second mounting groove is formed in the placing table 9, the second mounting groove is matched with the two-way threaded rod 10 and the two limiting blocks 11, balls are inlaid at the bottom ends of the limiting blocks 11, the two balls are in contact with the inner wall of the bottom of the second mounting groove, and the semiconductor device can be prevented from sliding during fixing through the arranged anti-slip pads 21.

One side fixed mounting of first mounting panel 2 has the light, the light is provided with the lamp shade outward, the lamp shade with 2 fixed connection of first mounting panel, through the light that sets up, can provide the illumination when opening, make things convenient for personnel to continue to carry out solid brilliant processing when light is darker.

The collecting pipe 19 is fixedly provided with a plurality of dust collecting covers which are all in a horn shape.

And a threaded hole is formed in the sliding block 5, and the threaded hole is matched with the one-way threaded rod 4.

The utility model provides a theory of operation for solid brilliant device of high-speed four-head of semiconductor is as follows:

during die bonding, a person can place a semiconductor device on the placing table 9 firstly, then the hand wheel 12 is rotated, the hand wheel 12 drives the bidirectional threaded rod 10 to rotate, the bidirectional threaded rod 10 drives the two limiting blocks 11 to move close to each other in a rotating mode, the two anti-slip pads 21 can be attached to the semiconductor device, the semiconductor device can be fixed on the operating table 1 in a limiting mode through operation according to the method, deviation during die bonding can be prevented, accurate die bonding is facilitated, the reject ratio can be effectively reduced, after fixing is completed, the motor 8 can be started later, the output shaft drives the one-way threaded rod 4 to rotate when the motor 8 operates, the one-way threaded rod 4 drives the sliding block 5 to move, then the electric telescopic rod 6 is started, the output rod extends out to drive the dispensing rod 7 to move downwards, die bonding processing can be performed on the semiconductor device through the dispensing rod 7, during die bonding, the shielding box 13 can shield some dust, meanwhile, the person can also start the dust collection fan 15, when the dust collection fan 15 operates, some scattered dust can be absorbed and enter the expansion pipe 20, dust can enter the sealing box 14, and the dust can be shielded by the dust collection fan, and the dust can be conveniently reduced when the dust collection box can be used for processing, and the lighting lamp can be used for further used for reducing the dust collection in the sealing box.

the utility model provides a be used for solid brilliant device of high-speed four-head of semiconductor, through 4 cooperation sliders 5 of one-way threaded rod, electric telescopic handle 6 and some gluing pole 7, can constitute a simple and easy some brilliant mechanisms of point, can realize carrying out solid brilliant processing to semiconductor device after the simple operation, spacing fixed establishment through setting up, after the simple operation, can be spacing fixed to semiconductor device, prevent to squint when solid brilliant, be favorable to reducing the yields, through the dust absorption mechanism that shelters from that sets up, can shelter from some dusts, also can inhale simultaneously and collect some dusts, reduce the dust and waft, reduce the harmful effects that the dust caused to solid brilliant processing, slipmat 21 through setting up, semiconductor device slides when can preventing to fix, through the light that sets up, can provide the illumination when opening, make things convenient for personnel to continue to carry out solid brilliant processing when light is dark.

It should be noted that the device structure and the accompanying drawings of the present invention mainly describe the principle of the present invention, and in the design principle, the settings of the power mechanism, the power supply system, the control system, etc. of the device are not completely described, and on the premise that the skilled person understands the principle of the present invention, the details of the power mechanism, the power supply system, and the control system can be clearly known, the control mode of the application file is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the skilled person in the art;

the standard parts used in the method can be purchased from the market, and can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts conventional means such as mature bolts, rivets, welding and the like in the prior art, the machines, parts and equipment adopt conventional models in the prior art, and the structure and the principle of the parts known by the skilled person can be known by technical manuals or conventional experimental methods.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made herein without departing from the principles and spirit of the invention, and it is intended that in other related fields of technology, the scope of the invention be limited only by the claims and their equivalents, all of which are included within the scope of the present invention as defined in the appended claims.

Claims

1. A high-speed four-head die bonder for semiconductors is characterized by comprising the following components:

the top of the operating platform is fixedly provided with a first mounting plate, one side of the first mounting plate is fixedly provided with a second mounting plate, and the second mounting plate is provided with a first mounting groove;

the one-way threaded rod is rotatably installed in the first installation groove, and one end of the one-way threaded rod extends out of the first installation groove;

the sliding block is sleeved on the one-way threaded rod in a threaded manner, and the bottom end of the sliding block extends out of the first mounting groove;

the electric telescopic rod is fixedly arranged at the bottom end of the sliding block;

the glue dispensing rod is fixedly arranged on the output rod of the electric telescopic rod;

the motor is fixedly installed on one side of the second installation plate, and an output shaft of the motor is fixedly connected with one end of the one-way threaded rod;

the device comprises an operation table, a placing table, a limiting and fixing mechanism and a hand wheel, wherein the placing table is fixedly installed at the top of the operation table, the limiting and fixing mechanism comprises a bidirectional threaded rod, two limiting blocks and the hand wheel, the bidirectional threaded rod is rotatably installed on the placing table, the two limiting blocks are both sleeved on the bidirectional threaded rod in a threaded manner, and the hand wheel is fixedly installed at one end of the bidirectional threaded rod;

and the shielding dust collection mechanism is arranged on the operating platform.

2. The high-speed four-head die bonder for semiconductors according to claim 1, wherein the dust-shielding mechanism comprises a shielding box, a sealing box, a dust-sucking fan, a box cover, a dust-filtering plate, a connecting pipe, a collecting pipe and a telescopic pipe, the shielding box is fixedly mounted on the top of the operating platform, the shielding box is located outside the first mounting plate, the sealing box and the dust-sucking fan are both fixedly mounted on the top of the forehead of the shielding box, the box cover is disposed on the top of the sealing box, the dust-filtering plate is disposed inside the sealing box, the connecting pipe is fixedly mounted on an air inlet end of the dust-sucking fan, an air inlet end of the connecting pipe is fixedly communicated with the sealing box, the collecting pipe is fixedly mounted on an inner wall of one side of the shielding box, an air outlet end of the collecting pipe extends out of the shielding box, the air outlet end of the telescopic pipe is fixedly mounted on an air outlet end of the telescopic pipe, and an air outlet end of the telescopic pipe is fixedly communicated with the box cover.

3. The high-speed four-head die bonder for semiconductors according to claim 1, wherein anti-slip pads are disposed on the sides of the two limiting blocks, the two limiting blocks are made of insulating materials, a second mounting groove is formed in the placement platform, the second mounting groove is matched with the two-way threaded rod and the two limiting blocks, rolling balls are inlaid at the bottom ends of the two limiting blocks, and the two rolling balls are in contact with the inner wall of the bottom of the second mounting groove.

4. The high-speed four-head die bonder for semiconductors according to claim 1, wherein an illuminating lamp is fixedly mounted on one side of the first mounting plate, a lampshade is arranged outside the illuminating lamp, and the lampshade is fixedly connected with the first mounting plate.

5. The high-speed four-head die bonder for semiconductors according to claim 2, wherein a plurality of dust hoods are fixedly mounted on the collection pipe, and each of the dust hoods is in a horn shape.

6. The high-speed four-head die bonder for semiconductors according to claim 1, wherein a threaded hole is formed in the slider, and the threaded hole is matched with the one-way threaded rod.