CN112701069A - Assembling device for semiconductor light-emitting element production - Google Patents
Assembling device for semiconductor light-emitting element production Download PDFInfo
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- CN112701069A CN112701069A CN202110094159.4A CN202110094159A CN112701069A CN 112701069 A CN112701069 A CN 112701069A CN 202110094159 A CN202110094159 A CN 202110094159A CN 112701069 A CN112701069 A CN 112701069A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000428 dust Substances 0.000 claims description 95
- 238000003825 pressing Methods 0.000 claims description 35
- 238000010521 absorption reaction Methods 0.000 claims description 11
- 230000003028 elevating effect Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 description 10
- 238000003912 environmental pollution Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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Abstract
The invention discloses an assembling device for producing a semiconductor light-emitting element, and particularly relates to the technical field of semiconductor production equipment. According to the invention, the supporting block, the hydraulic cylinder, the telescopic rod, the rubber pad and the push plate are arranged, after the semiconductor on the top end of the workbench is assembled, the hydraulic cylinder on the top end of the supporting block is started, the hydraulic cylinder drives the push plate to push the semiconductor assembled on the top end of the workbench out through the telescopic rod, the rubber pad is bonded at one end of the push plate, the rubber pad has elasticity and can protect the semiconductor, the semiconductor is prevented from being damaged when the push plate pushes the semiconductor out of the top end of the workbench, the structure is simple, the assembled semiconductor is conveniently pushed out, and the assembly efficiency of the device can be.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to an assembling device for producing a semiconductor light-emitting element.
Background
With the development of society, more and more electronic devices are required to be used for semiconductor light emitting elements, semiconductors are used for generating, controlling, receiving, converting, amplifying signals and performing energy conversion, and semiconductor light emitting elements are required to be assembled when the semiconductors are produced, and the conventional assembling device for producing semiconductor light emitting elements has some problems.
In the process of implementing the invention, the inventor finds that at least the following problems in the prior art are not solved:
(1) in the traditional assembly device for producing the semiconductor light-emitting element, the pressing plate can not uniformly assemble the semiconductor light-emitting element, so that the working efficiency is lower;
(2) the traditional assembly device for producing the semiconductor light-emitting element cannot effectively limit the semiconductor light-emitting element, and a semiconductor is easy to deviate;
(3) the traditional assembly device for producing the semiconductor light-emitting element does not effectively buffer the semiconductor, and the semiconductor is easy to damage during assembly;
(4) the traditional assembling device for producing the semiconductor light-emitting element does not treat dust and impurities near the semiconductor, so that the quality of the semiconductor is easy to reduce;
(5) the traditional assembling device for producing the semiconductor light-emitting element is inconvenient for blanking the semiconductor and poor in practicability.
Disclosure of Invention
The invention aims to provide an assembling device for producing a semiconductor light-emitting element, which solves the problems that the semiconductor cannot be uniformly assembled and the working efficiency is low in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: an assembling device for semiconductor light-emitting element production comprises a bottom plate and supporting plates, wherein the supporting plates are fixedly connected to two sides of the top end of the bottom plate, a top plate is arranged at the top end of the supporting plate, a dust removing mechanism is arranged on one side of the supporting plate, a limiting mechanism is arranged inside the bottom plate, a workbench is arranged at the top end of the bottom plate, a buffer structure is arranged between the bottom plate and the workbench, a pressing plate is arranged at the top end of the workbench, limiting grooves are formed in two sides of the interior of the workbench, a blanking mechanism is arranged at one end of the top of the bottom plate, and a constant-speed lifting mechanism is;
the uniform-speed lifting mechanism comprises a bearing plate, the bearing plate is arranged between supporting plates, mounting blocks are arranged on two sides of the bearing plate, a driving motor is arranged at the top end of the bearing plate, the output end of the driving motor is provided with a connecting rod, a bottom end fixedly connected with movable block of the connecting rod is arranged on the outer portion of the movable block, and a bottom end fixedly connected with pressing rod of the movable block.
Preferably, the mounting block is fixedly connected to one side of the supporting plate, and the movable sleeve is fixedly connected with the pressing plate through a pressing rod.
Preferably, stop gear comprises spliced pole, removal cover, servo motor, bracing piece, connecting block, gag lever post and screw axis, the screw axis sets up the inside at the bottom plate, the outside of screw axis is provided with the removal cover, the top fixedly connected with spliced pole of removal cover, one side fixedly connected with connecting block of spliced pole, one side fixed knot of connecting block has the gag lever post, bracing piece fixed connection is in the both sides of the inside bottom of bottom plate, one side of bracing piece is provided with servo motor.
Preferably, the screw threads on the two sides of the outer part of the screw shaft are opposite, and the servo motor is fixedly connected with the screw shaft through a coupler.
Preferably, buffer structure comprises sleeve, loop bar, spring groove, buffer spring and support column, sleeve fixed connection is on the top of bottom plate, four corners of loop bar fixed connection in the workstation bottom, one side of loop bar is provided with the spring groove, the inside in spring groove is provided with buffer spring, buffer spring's bottom fixedly connected with support column, spring groove fixed connection is at the both ends of workstation bottom.
Preferably, the sleeve is sleeved at the bottom end of the outer part of the loop bar, and the loop bar is symmetrically distributed around the vertical center line of the workbench.
Preferably, dust removal mechanism comprises dust removal case, dust removal net, dust absorption mouth, minute pipe, air pump, pipeline, cross fixture block, cross draw-in groove and supporting seat, supporting seat fixed connection is in one side of backup pad, the top of supporting seat is provided with the dust removal case, the top of dust removal case is provided with the air pump, the output and the input of air pump are provided with the pipeline respectively, one side fixedly connected with minute pipe of pipeline, one side fixedly connected with dust absorption mouth of minute pipe, the inside of dust removal case is provided with the dust removal net, the top fixedly connected with cross fixture block of dust removal net both sides, the inside both sides fixedly connected with cross draw-in groove of dust removal case.
Preferably, the cross-shaped fixture block is embedded in the cross-shaped clamping groove, and the cross-shaped fixture block and the cross-shaped clamping groove are connected in a clamping mode.
Preferably, the bottom of the other side of the branch pipe penetrates through the top end in the dust removal box, four groups of dust suction ports are arranged, and the dust suction ports are arranged on one side of the branch pipe at equal intervals.
Preferably, the blanking mechanism comprises a supporting block, a hydraulic cylinder, a telescopic rod, a rubber pad and a push plate, wherein the supporting block is arranged at one end of the top of the bottom plate, the hydraulic cylinder is arranged at the top end of the supporting block, the telescopic rod is arranged at the output end of the hydraulic cylinder, the push plate is fixedly connected to one end of the telescopic rod, and the rubber pad is fixedly connected to one end of the push plate.
Compared with the prior art, the invention has the beneficial effects that: the assembling device for producing the semiconductor light-emitting element not only realizes the improvement of the working efficiency of semiconductor assembling, the limitation of the semiconductor, the buffering of the semiconductor, the prevention of the damage of the semiconductor, the adsorption of dust around the semiconductor and the convenience of semiconductor blanking;
(1) the movable sleeve is provided with a pressure rod, a movable sleeve, a connecting rod, a driving motor and a movable block, the driving motor is started, the driving motor drives the movable block to rotate in the movable sleeve through the connecting rod, the pressure rod at the bottom end of the movable sleeve drives the pressure plate to lift, and the semiconductor is assembled through lifting of the pressure plate;
(2) the screw shaft is started by the aid of the connecting column, the moving sleeve, the servo motor, the supporting rod, the connecting block, the limiting rod and the screw shaft, the servo motor drives the screw shaft to rotate, so that the moving sleeve on two sides of the outside of the screw shaft moves outside the screw shaft, the limiting rod on one side of the connecting column limits the semiconductor on the top end of the workbench in the limiting groove by moving the moving sleeve, the semiconductors with different sizes can be limited by adjusting the diameter between the limiting rods, and the supporting rod supports the screw shaft to prevent the screw shaft from being bent;
(3) by arranging the sleeve, the loop bar, the spring groove, the buffer spring and the support column, when the semiconductor at the top end of the workbench is assembled by the pressing plate, the pressing plate needs to extrude the semiconductor, when the semiconductor is extruded by the pressing plate, the buffer spring in the spring groove can be extruded by the workbench, the semiconductor is buffered by the elasticity of the buffer spring, the semiconductor is prevented from being damaged due to the excessive extrusion of the pressing plate on the semiconductor, the spring groove outside the buffer spring can prevent the workbench from shaking left and right, the stability of the workbench is further improved by the sleeve and the loop bar on two sides of the spring groove, the semiconductor can be prevented from being damaged during the assembly by arranging the buffer spring, and the cost of the semiconductor can be reduced;
(4) the air pump is started by arranging the dust removing box, the dust removing net, the dust suction port, the branch pipe, the air pump, the pipeline, the cross-shaped clamping block, the cross-shaped clamping groove and the supporting seat, the air pump sucks dust and impurities around the semiconductor into the dust removing net through the dust suction port on one side of the branch pipe, the dust and the impurities are prevented from being assembled into the semiconductor when the semiconductor is assembled, the dust absorption range of the air pump can be increased by arranging a plurality of dust absorption ports, the dust absorption efficiency is improved, when the dust in the dust removing net is more, the cross-shaped fixture blocks at the top ends of the two sides of the dust removing net are taken out from the inside of the cross-shaped clamping grooves, the dust removing net is disassembled, then the dust and impurities in the dust removing net are treated in a unified way, so that the environmental pollution is prevented, the quality of the semiconductor can be improved and the service life of the semiconductor can be prolonged by adsorbing dust around the semiconductor;
(5) through being provided with the supporting shoe, hydraulic cylinder, the telescopic link, rubber pad and push pedal, after the semiconductor equipment on workstation top is accomplished, start the hydraulic cylinder on supporting shoe top, hydraulic cylinder drives the push pedal through the telescopic link and releases the semiconductor that the equipment of workstation top was accomplished, the one end bonding of push pedal has the rubber pad, rubber pad has elasticity and can protect the semiconductor, semiconductor can be lost when preventing the push pedal to release the semiconductor from the top of workstation, simple structure conveniently releases the semiconductor of equipment completion, can improve the packaging efficiency of device.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic top view of the blanking mechanism of the present invention;
FIG. 3 is a schematic top view of the worktable according to the present invention;
FIG. 4 is a schematic view of a front-view partial enlarged structure of the dust removing mechanism of the present invention;
FIG. 5 is an enlarged partial cross-sectional view taken at A in FIG. 2 according to the present invention;
fig. 6 is a schematic front view of a partially enlarged buffer structure according to the present invention.
In the figure: 1. a base plate; 2. a limiting mechanism; 201. connecting columns; 202. moving the sleeve; 203. a servo motor; 204. a support bar; 205. connecting blocks; 206. a limiting rod; 207. a screw shaft; 3. a buffer structure; 301. a sleeve; 302. a loop bar; 303. a spring slot; 304. a buffer spring; 305. a support pillar; 4. a dust removal mechanism; 401. a dust removal box; 402. a dust removal net; 403. a dust suction port; 404. pipe distribution; 405. an air pump; 406. a pipeline; 407. a cross-shaped fixture block; 408. a cross clamping groove; 409. a supporting seat; 5. pressing a plate; 6. a pressure lever; 7. a movable sleeve; 8. a bearing plate; 9. a top plate; 10. a connecting rod; 11. a drive motor; 12. a movable block; 13. a support plate; 14. mounting blocks; 15. a work table; 16. a blanking mechanism; 1601. a support block; 1602. a hydraulic cylinder; 1603. a telescopic rod; 1604. a rubber pad; 1605. pushing the plate; 17. a limiting groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to fig. 1-6, an assembling device for producing a semiconductor light-emitting element comprises a bottom plate 1 and supporting plates 13, wherein the supporting plates 13 are fixedly connected to two sides of the top end of the bottom plate 1, a top plate 9 is arranged at the top end of the supporting plates 13, a dust removing mechanism 4 is arranged on one side of each supporting plate 13, a limiting mechanism 2 is arranged inside the bottom plate 1, a workbench 15 is arranged at the top end of the bottom plate 1, a buffer structure 3 is arranged between the bottom plate 1 and the workbench 15, a pressing plate 5 is arranged at the top end of the workbench 15, limiting grooves 17 are arranged on two sides inside the workbench 15, a blanking mechanism 16 is arranged at one end of the top of the bottom plate 1;
referring to fig. 1-6, an assembling device for producing a semiconductor light-emitting element further comprises a uniform-speed lifting mechanism, the uniform-speed lifting mechanism comprises a bearing plate 8, the bearing plate 8 is arranged between supporting plates 13, mounting blocks 14 are arranged on two sides of the bearing plate 8, a driving motor 11 is arranged at the top end of the bearing plate 8, a connecting rod 10 is arranged at the output end of the driving motor 11, the model of the driving motor 11 is Y90L-2, a movable block 12 is fixedly connected to the bottom end of the connecting rod 10, a movable sleeve 7 is arranged outside the movable block 12, and a pressure rod 6 is fixedly connected to the bottom end of the movable sleeve 7;
the mounting block 14 is fixedly connected to one side of the supporting plate 13, and the movable sleeve 7 is fixedly connected with the pressing plate 5 through the pressing rod 6;
specifically, as shown in fig. 1, a driving motor 11 is started, the driving motor 11 drives a movable block 12 to rotate inside a movable sleeve 7 through a connecting rod 10, so that a pressing rod 6 at the bottom end of the movable sleeve 7 drives a pressing plate 5 to lift, and the semiconductor is assembled by lifting the pressing plate 5, and the movable block 12 rotates inside the movable sleeve 7, so that the pressing plate 5 can uniformly lift, the efficiency of assembling the semiconductor can be improved, and the stability of the pressing plate 5 during lifting can also be improved.
Example 2: the limiting mechanism 2 comprises a connecting column 201, a moving sleeve 202, a servo motor 203, a supporting rod 204, a connecting block 205, a limiting rod 206 and a screw shaft 207, wherein the screw shaft 207 is arranged inside the bottom plate 1, the moving sleeve 202 is arranged outside the screw shaft 207, the connecting column 201 is fixedly connected to the top end of the moving sleeve 202, the connecting block 205 is fixedly connected to one side of the connecting column 201, the limiting rod 206 is fixedly connected to one side of the connecting block 205, the supporting rod 204 is fixedly connected to two sides of the bottom end inside the bottom plate 1, the servo motor 203 is arranged on one side of the supporting rod 204, and the type of the servo motor 203 is 80 HB-;
the screw threads on the two sides of the outer part of the screw shaft 207 are opposite, and the servo motor 203 is fixedly connected with the screw shaft 207 through a coupler;
specifically, as shown in fig. 1, the servo motor 203 is started, the servo motor 203 drives the screw shaft 207 to rotate, so that the movable sleeves 202 on the two sides of the outside of the screw shaft 207 move outside the screw shaft 207, the limiting rods 206 on one side of the connecting columns 201 are enabled to limit the semiconductors on the top end of the worktable 15 inside the limiting grooves 17 by moving the movable sleeves 202, the semiconductors with different sizes can be limited by adjusting the diameter between the limiting rods 206, and the supporting rods 204 support the screw shaft 207 to prevent the screw shaft 207 from being bent.
Example 3: the buffer structure 3 consists of a sleeve 301, a loop bar 302, a spring groove 303, a buffer spring 304 and a support column 305, wherein the sleeve 301 is fixedly connected to the top end of the bottom plate 1, the loop bar 302 is fixedly connected to four corners of the bottom end of the workbench 15, the spring groove 303 is arranged on one side of the loop bar 302, the buffer spring 304 is arranged in the spring groove 303, the support column 305 is fixedly connected to the bottom end of the buffer spring 304, and the spring groove 303 is fixedly connected to two ends of the bottom end of the workbench 15;
the sleeve 301 is sleeved at the bottom end of the outer part of the loop bar 302, and the loop bar 302 is symmetrically distributed around the vertical center line of the workbench 15;
specifically, as shown in fig. 1 and 6, when the pressing plate 5 assembles the semiconductor on the top of the worktable 15, the pressing plate 5 needs to press the semiconductor, when the pressing plate 5 presses the semiconductor, the worktable 15 presses the buffer spring 304 inside the spring slot 303 to buffer the semiconductor through the elasticity of the buffer spring 304, so as to prevent the semiconductor from being damaged due to the excessive pressing of the pressing plate 5 on the semiconductor, the spring slot 303 outside the buffer spring 304 can prevent the worktable 15 from shaking left and right, the sleeves 301 and the loop bars 302 on the two sides of the spring slot 303 further improve the stability of the worktable 15, and the semiconductor can be prevented from being damaged during assembly by the arrangement of the buffer spring 304, so that the cost of the semiconductor can be reduced.
Example 4: the dust removing mechanism 4 comprises a dust removing box 401, a dust removing net 402, a dust suction port 403, a branch pipe 404, an air pump 405, a pipeline 406, a cross-shaped fixture block 407, a cross-shaped clamping groove 408 and a supporting seat 409, wherein the supporting seat 409 is fixedly connected to one side of the supporting plate 13, the dust removing box 401 is arranged at the top end of the supporting seat 409, the air pump 405 is arranged at the top end of the dust removing box 401, the type of the air pump 405 is AQ, the pipeline 406 is respectively arranged at the output end and the input end of the air pump 405, the branch pipe 404 is fixedly connected to one side of the pipeline 406, the dust suction port 403 is fixedly connected to one side of the branch pipe 404, the dust removing net 402 is arranged in the dust removing box 401, the cross-shaped;
the cross clamping block 407 is embedded in the cross clamping groove 408, and the cross clamping block 407 is clamped with the cross clamping groove 408;
the bottom end of the other side of the branch pipe 404 penetrates through the top end of the interior of the dust removing box 401, four groups of dust suction ports 403 are arranged, and the dust suction ports 403 are arranged on one side of the branch pipe 404 at equal intervals;
specifically, as shown in fig. 1, 4 and 5, the air pump 405 is started, the air pump 405 sucks dust and impurities around the semiconductor into the dust removal net 402 through the dust suction port 403 on one side of the branch pipe 404, so as to prevent the dust and the impurities from being assembled into the semiconductor when the semiconductor is assembled, the range of dust absorption of the air pump 405 can be increased by arranging a plurality of dust suction ports 403, the dust absorption efficiency is improved, when more dust is in the dust removal net 402, the cross clamping blocks 407 on the top ends of two sides of the dust removal net 402 are taken out from the inside of the cross clamping grooves 408, the dust removal net 402 is disassembled, then the dust and the impurities in the dust removal net 402 are uniformly processed, so that environmental pollution is prevented, and half dust is absorbed.
Example 5: the blanking mechanism 16 comprises a supporting block 1601, a hydraulic cylinder 1602, an expansion link 1603, a rubber pad 1604 and a push plate 1605, wherein the supporting block 1601 is arranged at one end of the top of the bottom plate 1, the hydraulic cylinder 1602 is arranged at the top end of the supporting block 1601, the hydraulic cylinder 1602 is MPT in type, the expansion link 1603 is arranged at the output end of the hydraulic cylinder 1602, one end of the expansion link 1603 is fixedly connected with the push plate 1605, and one end of the push plate 1605 is fixedly connected with the rubber pad 1604;
specifically, as shown in fig. 1 and fig. 2, after the semiconductor assembly at the top end of the workbench 15 is completed, the hydraulic cylinder 1602 at the top end of the supporting block 1601 is started, the hydraulic cylinder 1602 drives the push plate 1605 to push out the semiconductor assembled at the top end of the workbench 15 through the telescopic rod 1603, a rubber pad 1604 is bonded at one end of the push plate 1605, the rubber pad 1604 has elasticity to protect the semiconductor, the semiconductor is prevented from being damaged when the push plate 1605 pushes out the semiconductor from the top end of the workbench 15, the structure is simple and convenient to push out the semiconductor assembled, and the assembly efficiency of the device can be improved.
The working principle is as follows: when the semiconductor assembling device is used, firstly, the driving motor 11 is started, the driving motor 11 drives the movable block 12 to rotate in the movable sleeve 7 through the connecting rod 10, the pressing rod 6 at the bottom end of the movable sleeve 7 drives the pressing plate 5 to lift, and the semiconductor is assembled through the lifting of the pressing plate 5, and the pressing plate 5 can lift uniformly because the movable block 12 rotates in the movable sleeve 7, so that the efficiency of assembling the semiconductor is improved, and the stability of the pressing plate 5 during lifting is also improved.
Then, the servo motor 203 is started, the servo motor 203 drives the screw shaft 207 to rotate, so that the movable sleeves 202 on two sides of the outer portion of the screw shaft 207 move on the outer portion of the screw shaft 207, the limiting rods 206 on one side of the connecting columns 201 are enabled to limit the semiconductors on the top end of the workbench 15 in the limiting grooves 17 by moving the movable sleeves 202, the semiconductors with different sizes can be limited by adjusting the diameters between the limiting rods 206, and the supporting rods 204 play a supporting role in the screw shaft 207 to prevent the screw shaft 207 from being bent.
Then, when the pressing plate 5 assembles the semiconductor on the top of the workbench 15, the pressing plate 5 needs to extrude the semiconductor, when the pressing plate 5 extrudes the semiconductor, the workbench 15 can extrude the buffer spring 304 inside the spring groove 303 to buffer the semiconductor through the elasticity of the buffer spring 304, the semiconductor is prevented from being excessively damaged due to the extrusion of the pressing plate 5 on the semiconductor, the spring groove 303 outside the buffer spring 304 can prevent the workbench 15 from shaking left and right, the sleeve 301 and the loop bar 302 on the two sides of the spring groove 303 further improve the stability of the workbench 15, the semiconductor can be prevented from being damaged during the assembly by arranging the buffer spring 304, and the cost of the semiconductor can be reduced.
After, start air pump 405, air pump 405 inhales the inside of dust and impurity suction dust removal net 402 around the semiconductor through the dust absorption mouth 403 of minute pipe 404 one side, prevent to assemble the inside of semiconductor dust and impurity when assembling the semiconductor, can increase the scope that air pump 405 adsorbs the dust through setting up a plurality of dust absorption mouths 403, improve the efficiency of adsorbing the dust, when the inside dust of dust removal net 402 is more, take out the inside of cross fixture block 407 from cross draw-in groove 408 to the top of dust removal net 402 both sides, the dismantlement of completion dust removal net 402 then is unified to the inside dust and the impurity of dust removal net 402 and is handled, prevent to cause environmental pollution, through adsorbing half.
Finally, after the semiconductor equipment on workstation 15 top is accomplished, start the hydraulic cylinder 1602 on supporting shoe 1601 top, hydraulic cylinder 1602 drives push pedal 1605 through telescopic link 1603 and releases the semiconductor that workstation 15 top equipment was accomplished, the one end bonding of push pedal 1605 has rubber pad 1604, rubber pad 1604 has elasticity and can protect the semiconductor, semiconductor can be damaged when preventing push pedal 1605 from releasing the semiconductor from the top of workstation 15, simple structure conveniently releases the semiconductor that the equipment was accomplished, can improve the packaging efficiency of device.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. An assembling device for producing a semiconductor light-emitting element, comprising a base plate (1) and a support plate (13), characterized in that: the dust removing device is characterized in that supporting plates (13) are fixedly connected to two sides of the top end of the bottom plate (1), a top plate (9) is arranged at the top end of the supporting plate (13), a dust removing mechanism (4) is arranged on one side of the supporting plate (13), a limiting mechanism (2) is arranged inside the bottom plate (1), a workbench (15) is arranged at the top end of the bottom plate (1), a buffer structure (3) is arranged between the bottom plate (1) and the workbench (15), a pressing plate (5) is arranged at the top end of the workbench (15), limiting grooves (17) are arranged on two sides inside the workbench (15), a blanking mechanism (16) is arranged at one end of the top of the bottom plate (1), and a uniform-speed lifting mechanism is arranged at the;
elevating system includes bearing plate (8) at the uniform velocity, bearing plate (8) set up between backup pad (13), the both sides of bearing plate (8) are provided with installation piece (14), the top of bearing plate (8) is provided with driving motor (11), the output of driving motor (11) is provided with connecting rod (10), the bottom fixedly connected with movable block (12) of connecting rod (10), the outside of movable block (12) is provided with movable sleeve (7), the bottom fixedly connected with depression bar (6) of movable sleeve (7).
2. The assembling apparatus for semiconductor light-emitting element production according to claim 1, wherein: the mounting block (14) is fixedly connected to one side of the supporting plate (13), and the movable sleeve (7) is fixedly connected with the pressing plate (5) through the pressing rod (6).
3. The assembling apparatus for semiconductor light-emitting element production according to claim 1, wherein: stop gear (2) comprise spliced pole (201), removal cover (202), servo motor (203), bracing piece (204), connecting block (205), gag lever post (206) and screw axis (207), screw axis (207) set up the inside at bottom plate (1), the outside of screw axis (207) is provided with removes cover (202), the top fixedly connected with spliced pole (201) of removal cover (202), one side fixedly connected with connecting block (205) of spliced pole (201), one side fixed knot of connecting block (205) has gag lever post (206), bracing piece (204) fixed connection is in the both sides of bottom plate (1) inside bottom, one side of bracing piece (204) is provided with servo motor (203).
4. The assembling apparatus for semiconductor light-emitting element production according to claim 3, wherein: the threads on the two sides of the outer part of the spiral shaft (207) are opposite, and the servo motor (203) is fixedly connected with the spiral shaft (207) through a coupler.
5. The assembling apparatus for semiconductor light-emitting element production according to claim 1, wherein: buffer structure (3) comprise sleeve (301), loop bar (302), spring groove (303), buffer spring (304) and support column (305), sleeve (301) fixed connection is on the top of bottom plate (1), loop bar (302) fixed connection is in four corners of workstation (15) bottom, one side of loop bar (302) is provided with spring groove (303), the inside of spring groove (303) is provided with buffer spring (304), the bottom fixedly connected with support column (305) of buffer spring (304), spring groove (303) fixed connection is at the both ends of workstation (15) bottom.
6. The assembling apparatus for semiconductor light-emitting element production according to claim 5, wherein: the sleeve (301) is sleeved at the bottom end of the outer portion of the sleeve rod (302), and the sleeve rod (302) is symmetrically distributed around the vertical center line of the workbench (15).
7. The assembling apparatus for semiconductor light-emitting element production according to claim 1, wherein: the dust removal mechanism (4) consists of a dust removal box (401), a dust removal net (402), a dust suction port (403), a branch pipe (404), an air pump (405), a pipeline (406), a cross clamping block (407), a cross clamping groove (408) and a supporting seat (409), the supporting seat (409) is fixedly connected with one side of the supporting plate (13), the top end of the supporting seat (409) is provided with a dust removing box (401), an air pump (405) is arranged at the top end of the dust removing box (401), pipelines (406) are respectively arranged at the output end and the input end of the air pump (405), one side of the pipeline (406) is fixedly connected with a branch pipe (404), one side of the branch pipe (404) is fixedly connected with a dust suction port (403), a dust removing net (402) is arranged in the dust removing box (401), cross-shaped fixture blocks (407) are fixedly connected to the top ends of the two sides of the dust removing net (402), the two sides in the dust removal box (401) are fixedly connected with cross clamping grooves (408).
8. The assembling apparatus for producing a semiconductor light-emitting element according to claim 7, wherein: the cross clamping block (407) is embedded in the cross clamping groove (408), and the cross clamping block (407) is clamped with the cross clamping groove (408).
9. The assembling apparatus for producing a semiconductor light-emitting element according to claim 7, wherein: the bottom of minute pipe (404) opposite side runs through the top at dust removal case (401) inside, dust absorption mouth (403) are provided with four groups, dust absorption mouth (403) are the equidistant range in one side of minute pipe (404).
10. The assembling method for producing a semiconductor light-emitting element according to claim 1, wherein: firstly, a driving motor (11) is started, the driving motor (11) drives a movable block (12) to rotate in a movable sleeve (7) through a connecting rod (10), so that a pressure rod (6) at the bottom end of the movable sleeve (7) drives a pressure plate (5) to lift, the semiconductor is assembled through the lifting of the pressure plate (5), and the pressure plate (5) can uniformly lift because the movable block (12) rotates in the movable sleeve (7), so that the efficiency of assembling the semiconductor can be improved, and the stability of the pressure plate (5) during lifting can also be improved;
then, a servo motor (203) is started, the servo motor (203) drives a screw shaft (207) to rotate, so that moving sleeves (202) on two sides of the outside of the screw shaft (207) move outside the screw shaft (207), a limiting rod (206) on one side of a connecting column (201) is enabled to limit a semiconductor on the top end of a workbench (15) in a limiting groove (17) by moving the moving sleeves (202), semiconductors with different sizes can be limited by adjusting the diameter between the limiting rods (206), and a supporting rod (204) plays a supporting role in the screw shaft (207) to prevent the screw shaft (207) from being bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110094159.4A CN112701069A (en) | 2021-01-25 | 2021-01-25 | Assembling device for semiconductor light-emitting element production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110094159.4A CN112701069A (en) | 2021-01-25 | 2021-01-25 | Assembling device for semiconductor light-emitting element production |
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| Publication Number | Publication Date |
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| CN112701069A true CN112701069A (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110094159.4A Withdrawn CN112701069A (en) | 2021-01-25 | 2021-01-25 | Assembling device for semiconductor light-emitting element production |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211252A (en) * | 2021-04-28 | 2021-08-06 | 安徽万马装饰工程有限公司 | Intelligent furniture production polishing device |
| CN114284537A (en) * | 2021-12-21 | 2022-04-05 | 江苏乾景新能源产业技术研究院有限公司 | Positioning tool for assembling hydrogen fuel cell and use method thereof |
| CN116183503A (en) * | 2023-04-28 | 2023-05-30 | 滨州学院 | Multidirectional measuring mechanism for semiconductor material device based on intelligent blanking |
-
2021
- 2021-01-25 CN CN202110094159.4A patent/CN112701069A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211252A (en) * | 2021-04-28 | 2021-08-06 | 安徽万马装饰工程有限公司 | Intelligent furniture production polishing device |
| CN114284537A (en) * | 2021-12-21 | 2022-04-05 | 江苏乾景新能源产业技术研究院有限公司 | Positioning tool for assembling hydrogen fuel cell and use method thereof |
| CN116183503A (en) * | 2023-04-28 | 2023-05-30 | 滨州学院 | Multidirectional measuring mechanism for semiconductor material device based on intelligent blanking |
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Application publication date: 20210423 |