CN104425436B - 半导体装置以及柔性电路基板 - Google Patents

半导体装置以及柔性电路基板 Download PDF

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Publication number
CN104425436B
CN104425436B CN201410446089.4A CN201410446089A CN104425436B CN 104425436 B CN104425436 B CN 104425436B CN 201410446089 A CN201410446089 A CN 201410446089A CN 104425436 B CN104425436 B CN 104425436B
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CN
China
Prior art keywords
main body
semiconductor device
perforation
circuit board
flexible circuit
Prior art date
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CN201410446089.4A
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English (en)
Chinese (zh)
Other versions
CN104425436A (zh
Inventor
绪方圭藏
增山祐士
畑端佳
渊孝浩
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN104425436A publication Critical patent/CN104425436A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN201410446089.4A 2013-09-04 2014-09-03 半导体装置以及柔性电路基板 Active CN104425436B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-183141 2013-09-04
JP2013183141A JP6361102B2 (ja) 2013-09-04 2013-09-04 半導体装置およびフレキシブル回路基板

Publications (2)

Publication Number Publication Date
CN104425436A CN104425436A (zh) 2015-03-18
CN104425436B true CN104425436B (zh) 2017-06-16

Family

ID=52700157

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410446089.4A Active CN104425436B (zh) 2013-09-04 2014-09-03 半导体装置以及柔性电路基板

Country Status (3)

Country Link
JP (1) JP6361102B2 (ja)
CN (1) CN104425436B (ja)
TW (1) TWI544585B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3057103B1 (fr) * 2016-09-30 2022-11-11 Safran Electronics & Defense Dispositif electronique comprenant un module raccorde a un pcb et unite electronique comportant un tel dispositif

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102986310A (zh) * 2010-07-14 2013-03-20 京瓷化成株式会社 柔性布线板、覆盖层用干膜及柔性布线板的制造方法
CN103091938A (zh) * 2011-10-28 2013-05-08 Lg伊诺特有限公司 照相机模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138370U (ja) * 1982-03-12 1983-09-17 株式会社日立製作所 Ｌｓｉパツケ−ジスペ−サ
JPH0322490A (ja) * 1989-06-19 1991-01-30 Canon Inc フレキシブル基板
JP3656304B2 (ja) * 1996-01-11 2005-06-08 住友電装株式会社 フレキシブル回路基板の製造方法
JP2004023082A (ja) * 2002-06-20 2004-01-22 Heiwa Corp プリント基板
JP3918779B2 (ja) * 2003-06-13 2007-05-23 松下電器産業株式会社 非耐熱部品のはんだ付け方法
JP2006108387A (ja) * 2004-10-05 2006-04-20 Sony Corp フレキシブルプリント配線板補強構造
JP2006156682A (ja) * 2004-11-29 2006-06-15 Sumitomo Electric Ind Ltd モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102986310A (zh) * 2010-07-14 2013-03-20 京瓷化成株式会社 柔性布线板、覆盖层用干膜及柔性布线板的制造方法
CN103091938A (zh) * 2011-10-28 2013-05-08 Lg伊诺特有限公司 照相机模块

Also Published As

Publication number Publication date
CN104425436A (zh) 2015-03-18
JP2015050423A (ja) 2015-03-16
JP6361102B2 (ja) 2018-07-25
TWI544585B (zh) 2016-08-01
TW201519374A (zh) 2015-05-16

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