CN104425436B - Semiconductor device and flexible circuit board - Google Patents
Semiconductor device and flexible circuit board Download PDFInfo
- Publication number
- CN104425436B CN104425436B CN201410446089.4A CN201410446089A CN104425436B CN 104425436 B CN104425436 B CN 104425436B CN 201410446089 A CN201410446089 A CN 201410446089A CN 104425436 B CN104425436 B CN 104425436B
- Authority
- CN
- China
- Prior art keywords
- main body
- semiconductor device
- perforation
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Abstract
The present invention provides a kind of semiconductor device and flexible circuit board, and it suppresses solder attachment on frame.Semiconductor device (10) is with flexible circuit board (21) and semiconductor device main body (22).The pin terminals (23) that semiconductor device main body (22) is stretched out with frame (22a) and from frame (22a).Frame (22a) has recess (22c) on the surface of mounting surface (27a) side, and pin terminals (23) are stretched out from the bottom surface of recess (22c).Flexible circuit board main body (27) is with through hole (27c, 27d).The through hole (27c, 27d) runs through mounting surface (27a) and the back side (27b), forms perforation (TH1, TH2).Pin terminals 23 are inserted in perforation (TH1, TH2) respectively.Pin terminals (23) through and penetrate coating (25), coating (25) is contacted with around pin terminals (23).
Description
Technical field
The present invention relates to semiconductor device and flexible circuit board.
Background technology
At present, for example, as described in Japanese Unexamined Patent Publication 9-191170 publications are disclosed, it is known to which surface is provided with covering
The flexible circuit board of layer.Below, flexible circuit board is also referred to as the abbreviation of Flexible Printed Circuit
“FPC”.The coating of FPC involved by above-mentioned publication by basement membrane, sheet metal and as its surface protection film is laminated.
Relative to this lit-par-lit structure, at the solder position of regulation by punch press process, to specify that shape forms perforation.Installing component
Pin terminals are inserted in the perforation and carry out solder.
Assuming that adjacent position of the solder of molten condition from the outside of pin terminals flow direction.As a result, there is adjacent solder
The solder at position confluxes and forms the problem of crane span structure shape short circuit (hereinafter referred to as " solder bridge joint short circuit ") each other.This point, root
According to above-mentioned publication, 3 layers of coating are overlapped and makes gross thickness fully thickening, therefore prevent the solder abutted between position from confluxing.
As a result, being prevented from the generation of solder bridge joint short circuit.
Patent document 1：Japanese Unexamined Patent Publication 9-191170 publications
Patent document 2：Japanese Unexamined Patent Publication 7-170029 publications
Patent document 3：Japanese Unexamined Patent Publication 2007-66946 publications
Patent document 4：Japanese Unexamined Patent Publication 2008-10798 publications
Patent document 5：Japanese Unexamined Patent Publication 2008-91557 publications
Patent document 6：Japanese Unexamined Patent Publication 2010-153534 publications
In the flexible circuit board involved by above-mentioned publication, suppress along many of the in-plane adjoining of flexible circuit board
Short circuit between individual solder position.On the other hand, inventor herein is different from the solder along in-plane as described above
Outflow problem, and pay close attention to along flexible circuit board thickness direction solder outflow problem.
Semiconductor device has frame and the pin terminals stretched out from the frame.Formed on flexible circuit board and worn
Hole, pin terminals are inserted from a surface lateral of the flexible circuit board perforation.Frame is located at flexible circuit board
One face side, from another face side of flexible circuit board, pin terminals solder is in perforation.
Now, if pin terminals surface attachment solder along bore flow, flexible circuit board can be passed through
And gap between pin terminals surface and flow.As a result, there is solder outflow and reach frame, solder attachment is in framework
The problem on the surface in portion.
The content of the invention
It is of the invention to be proposed to solve above-mentioned problem, can suppress solder attachment in frame its object is to provide
Semiconductor device and flexible circuit board in body portion.
The involved semiconductor device of 1st invention of the application, it is characterised in that have：
Semiconductor device main body, it has internally house the frame of semiconductor element and stretched out from the frame
Terminal；And
Flexible circuit board, it is provided with the semiconductor device main body, with the base main body for being provided with distribution and
The coating in the base main body is arranged on,
The base main body can bend, and it has the base main body that is provided with distribution and is arranged on the substrate master
Coating on body, installs the semiconductor device main body on the flexible circuit board,
The terminal is inserted in the perforation,
The coating is arranged on the installation surface side as follows, i.e. set to the inner side at the edge of the perforation,
So as to be covered around the terminal for passing through the perforation,
The terminal is from the rear side solder in the perforation.
The involved semiconductor device of 2nd invention of the application, it is characterised in that have：
Semiconductor device main body, it has internally house the frame of semiconductor element and stretched out from the frame
Terminal；And
Flexible circuit board, it has the base main body for being provided with distribution, and described half is installed on the flexible circuit board
Conductor apparatus main body,
The base main body can bend, and it has mounting surface, the installation towards the semiconductor device main body side
The back side of the opposition side in face and the perforation through the mounting surface and the back side,
The terminal is inserted in the perforation,
The terminal from the rear side by solder connection in the perforation,
Laying is additionally provided with the installation surface side,
The laying is present in institute in the way of the surface that the solder fillet of the solder will not reach the frame
State between flexible circuit board and the frame.
The involved flexible circuit board of 3rd invention of the application, it has：
It is provided with the base main body of distribution；And
The coating in the base main body is arranged on,
Semiconductor device main body is installed in the base main body,
The flexible circuit board is characterised by,
The base main body can bend, and it has mounting surface, the installation towards the semiconductor device main body side
The back side of the opposition side in face and the perforation through the mounting surface and the back side,
The coating is arranged on the installation surface side, covers the perforation.
The involved flexible circuit board of 4th invention of the application, it has：
It is provided with the base main body of distribution；And
The coating in the base main body is arranged on,
Semiconductor device main body is installed in the base main body,
The flexible circuit board is characterised by,
The base main body can bend, and it has mounting surface, the installation towards the semiconductor device main body side
The back side of the opposition side in face and the perforation through the mounting surface and the back side,
The coating is arranged on the installation surface side, and with opening, the opening has smaller than the penetration hole diameter straight
Footpath, the coating is by the perforation local complexity.
The effect of invention
In accordance with the invention it is possible to suppress frame of the solder attachment in the semiconductor device main body that should be installed on flexible circuit board
In body portion.
Brief description of the drawings
Fig. 1 is the figure for representing semiconductor device and flexible circuit board involved by embodiments of the present invention 1.
Fig. 2 is the figure for representing semiconductor device and flexible circuit board involved by embodiments of the present invention 2.
Fig. 3 is the figure for representing semiconductor device and flexible circuit board involved by embodiments of the present invention 3.
The semiconductor dress involved by comparative example that Fig. 4 has been expressed as illustrating the effect of embodiments of the present invention and has shown
Put and flexible circuit board figure.
The explanation of label
10 semiconductor devices, 21 flexible circuit boards, 22 semiconductor device main bodys, 22a frames, 22b low-melting glasses,
22c recesses, 23 pin terminals, 24 solders, 25 coatings, 27 flexible substrate main bodys, 27a mounting surfaces, the 27b back sides, 27c through holes,
28a conductor layers, 28b conductor layers, TH1, TH2 perforation
Specific embodiment
Implementation method 1
Fig. 1 is the figure for representing semiconductor device 10 and flexible circuit board 21 involved by embodiments of the present invention 1.
Fig. 1 represents the profile of semiconductor device 10 and flexible circuit board 21.Semiconductor device 10 has flexible circuit board
21 and semiconductor device main body 22.Semiconductor device main body 22 is, for example, high speed optical communication device.
Semiconductor device main body 22 has frame 22a and the pin terminals 23 stretched out from frame 22a.For example,
When CAN components, frame 22a is base.Semiconductor element etc. is contained in the inside of frame 22a.Leads ends
Son 23 is electrically connected via wire etc. with the circuit element of the inside for being present in frame 22a.
Frame 22a and pin terminals 23 are formed by conductive materials such as metals respectively, in frame 22a and leads ends
Insulating barrier has been suitably present between son 23.Additionally, frame 22a can also be formed by the nonisulated property material such as moulding resin.
Frame 22a has recess 22c on the surface of mounting surface 27a sides, and pin terminals 23 are stretched out from the bottom surface of recess 22c.
Flexible circuit board 21 is with the flexible circuit board main body 27 for being provided with distribution and is arranged on flexible electrical roadbed
Coating 25 in plate main body 27.Semiconductor device main body 22 is installed on flexible circuit board 21.
Flexible circuit board main body 27 is the basement membrane that can be bent.Flexible circuit board main body 27 has towards semiconductor dress
Put mounting surface 27a, the back side 27b of the opposition side of mounting surface 27a of the side of main body 22.Flexible circuit board main body 27 is in mounting surface
There is conductor layer 28a on 27a, overleaf there is conductor layer 28b on 27b.
Flexible circuit board main body 27 has through hole 27c, 27d.The through hole 27c, 27d run through mounting surface 27a and the back side
27b, is formed with perforation TH1, TH2.In the TH1 that perforates, conductor layer is also equipped with the wall of through hole 27c, by conductor layer 28a
Electrically connected with conductor layer 28b.On the other hand, in the TH2 that perforates, conductor layer 28a and conductor layer 28b is formed as electric disconnected shape
State.
Perforation TH1, TH2 have diameter phi 2.Pin terminals 23 have diameter phi 1.Their relation is the ＜ φ 2 of φ 1.
Pin terminals 23 are inserted in perforation TH1, TH2 respectively.Pin terminals 23 run through and penetrate coating 25, in coating
Through hole 25h is formed with 25.
Pin terminals 23 are penetrated in the coating 25 of non-porous state, therefore are connect around coating 25 and pin terminals 23
Touch.Coating 25 can use used as coating known to various materials, however, it is preferred to before by pin terminals 23
The material that end is easily run through is formed.
Additionally, the pin terminals 23 of insertion perforation TH2 are connected with the low-melting glass 22b in frame 22a.
Made according to said structure, side of the coating 25 will be covered around the pin terminals 23 for passing through perforation TH1, TH2
Formula, is arranged on mounting surface 27a sides.Generally, coating 25 be in order to avoid solder 24 on the surface of flexible circuit board 21 not
The attachment at necessary position and set.In the present embodiment, it is arranged on around perforation TH1, TH2, and further to cover
The mode of a part of lid perforation TH1, TH2, or be configured in the way of perforation TH1, TH2 are blocked.
Pin terminals 23 are from back side 27b sides solder in perforate TH1, TH2.
Semiconductor device 10 and flexible circuit board 21 involved by implementation method 1 according to the above description, coating
25 outflows that can suppress solder 24, are attached on frame 22a therefore, it is possible to suppress solder 24.
The semiconductor dress involved by comparative example that Fig. 4 has been expressed as illustrating the effect of embodiments of the present invention and has shown
Put the figure of 310 and flexible circuit board 321.Semiconductor device 310 by flexible circuit board 21 except being replaced into flexible circuit
Beyond this point of substrate 321, with involved by implementation method 1 the identical of semiconductor device 10 construct.Flexible circuit board
321 by coating 25 in addition to being replaced into this point of coating 125, with the identical of flexible circuit board 21 construct.
In the flexible circuit board 321 involved by the comparative example, the coating 125 of mounting surface 27a sides, perforation TH1,
The underface of TH2 has the opening 125a bigger than the diameter of perforate TH1, TH2.
Using coating 125, it is impossible to obtain the effect for preventing solder from flowing out of coating 25 as shown in Embodiment 1.
Thus, as shown in the label SH of Fig. 4, solder 124 is contacted with the surface of frame 22a.Particularly, in semiconductor device main body 22
In, frame 22a is electric conductor, accordingly, there exist asking for short circuit (the electric short circuit) that circuit is produced between conductor layer 28a
Topic.
This point, according to implementation method 1, coating 25 can block the solder 24 in stifled perforation TH1, TH2, therefore, it is possible to
Suppress the outflow of solder 24, solder 24 can be suppressed and be attached on frame 22a.
Implementation method 2
Fig. 2 is to represent the semiconductor device 110 and flexible circuit board 31 involved by embodiments of the present invention 2
Figure.Fig. 2 (a) represents the profile of semiconductor device 110 and flexible circuit board 31.Semiconductor device 110 is except will be soft
Property circuit substrate 21 is replaced into beyond this point of flexible circuit board 31, with the semiconductor device involved by implementation method 1
10 identicals are constructed.
Flexible circuit board 31 in addition to coating 25 is replaced into this point of coating 35, with implementation method 1
The involved identical of flexible circuit board 21 construction.Therefore, in the following description, identical for implementation method 1 or phase
When structure mark identical label and illustrate, also, illustrated the difference from implementation method 1 as center,
Simplify or omit the explanation of common item.
Coating 35 have the coating 35a that sets in the way of conductor layer 28a to be covered in mounting surface 27a sides and with
The coating 35b that overleaf 27b sides set the mode that conductor layer 28b is covered.Coating 35a is arranged on mounting surface 27a sides,
The underface of perforation TH1, TH2 has through hole 35h.
Through hole 35h has the diameter smaller than perforation TH1, TH2, and coating 35a partly covers perforation TH1, TH2.Covering
Gap is provided between the surface of the through hole 35h of cap rock 35 and the surface of pin terminals 23.The gap is less than or equal to 25 μm.
Fig. 2 (b) be in the semiconductor device 110 and flexible circuit board 31 involved by embodiments of the present invention 2,
By the figure after the neighbouring amplification of through hole 35h.The diameter of through hole 35hThan the diameter of pin terminals 23It is slightly larger, in coating
Very small gap g is provided between the surface of 35 through hole 35h and the surface of pin terminals 23.Gap g is diameterWith
DiameterDifference half.For implementation method 2, gap g is less than or equal to 25 μm.
Coating 35 can suppress the outflow of solder 24, be attached on frame 22a therefore, it is possible to suppress solder 24.Between
Gap is formed as less than or equal to 25 μm, therefore, solder 24 is rested between pin terminals 23 and coating 35 by surface tension.
Therefore, it is possible to be provided in coating 35a by the through hole 35h of pin terminals 23, and also suppress the outflow of solder.Separately
Outward, due to being provided with through hole 35h in advance, so favourable at aspects such as productivity ratio.
Implementation method 3
Fig. 3 is to represent the semiconductor device 210 and flexible circuit board 41 involved by embodiments of the present invention 3
Figure.Semiconductor device 210 in addition to flexible circuit board 21 is replaced into this point of flexible circuit board 41, with implementation
The identical of semiconductor device 10 construction involved by mode 1.
Flexible circuit board 41 by coating 25 except being replaced into this point of coating 45 and putting conductor layer 28a, 28b
Be changed to beyond conductor layer 48a, 48b this point and laying 46, with the flexible circuit board involved by implementation method 1
21 identicals are constructed.Therefore, in the following description, identical mark is marked for the structure with implementation method 1 identically or comparably
Number and illustrate, and illustrated the difference from implementation method 1 as center, simplify or omit saying for common item
It is bright.
Coating 45 is different from the coating 35 involved by coating 25 and implementation method 2 involved by implementation method 1,
In the underface of perforation TH1, TH2, with the opening 45a bigger than perforation TH1, TH2 diameter.
Laying 46 is additionally provided with the coating 45 of mounting surface 27a sides.Recess 22c has height d3, laying 46
With thickness d 2.The thickness d 2 is big with the height of the aggregate value than solder fillet 44f of height d3.In addition, on laying 46,
Through hole 46a is respectively arranged with immediately below perforation TH1, TH2.
The diameter of through hole 46aDiameter respectively than perforate TH1, TH2 is big.Additionally, in the present embodiment, through hole 46a
DiameterWidth with recess 22c is consistent.In addition, the thickness d 2 of laying 46 substantially with the thickness of flexible circuit board 41
D1 is identical, but it is also possible to d2 is designed to bigger than d1.
Identically with implementation method 1, in the insertion of pin terminals 23 perforation TH1, TH2, pin terminals 23 are soft from back side 27b sides
Soldering is in perforate TH1, TH2.
According to implementation method 3, by being provided with laying 46, can will not reach frame 22a's with solder fillet 44
The mode of the bottom surface of recess 22c, will separate between flexible circuit board 41 and frame 22a.It is attached thereby, it is possible to suppress solder 44
On frame 22a.
Claims (9)
1. a kind of semiconductor device, it is characterised in that have：
Semiconductor device main body, it has internally house the frame of semiconductor element and stretch out from the frame
Terminal；And
Flexible circuit board, it has the coating for being provided with the base main body of distribution and being arranged in the base main body,
The semiconductor device main body is installed on the flexible circuit board,
The base main body can bend, and it has mounting surface towards the semiconductor device main body side, the mounting surface
The back side of opposition side and the perforation through the mounting surface and the back side,
The terminal is inserted in the perforation,
The coating is arranged on the installation surface side as follows, i.e. set to the inner side at the edge of the perforation, so that
To be covered around the terminal for passing through the perforation,
The terminal from the rear side solder in the perforation,
The coating has gap between the surface of the terminal,
The gap is less than or equal to 25 μm.
2. a kind of semiconductor device, it is characterised in that have：
Semiconductor device main body, it has internally house the frame of semiconductor element and stretch out from the frame
Terminal；And
Flexible circuit board, it has the coating for being provided with the base main body of distribution and being arranged in the base main body,
The semiconductor device main body is installed on the flexible circuit board,
The base main body can bend, and it has mounting surface towards the semiconductor device main body side, the mounting surface
The back side of opposition side and the perforation through the mounting surface and the back side,
The terminal is inserted in the perforation,
The coating is arranged on the installation surface side as follows, i.e. set to the inner side at the edge of the perforation, so that
To be covered around the terminal for passing through the perforation,
The terminal from the rear side solder in the perforation,
Laying is additionally provided with the coating.
3. semiconductor device according to claim 2, it is characterised in that
Thickness of the thickness of the laying more than or equal to the flexible circuit board.
4. a kind of semiconductor device, it is characterised in that have：
Semiconductor device main body, it has internally house the frame of semiconductor element and stretch out from the frame
Terminal；And
Flexible circuit board, it has the base main body for being provided with distribution, and the semiconductor is installed on the flexible circuit board
Apparatus main body,
The base main body can bend, and it has mounting surface towards the semiconductor device main body side, the mounting surface
The back side of opposition side and the perforation through the mounting surface and the back side,
The terminal is inserted in the perforation,
The terminal from the rear side by solder connection in the perforation,
Laying is additionally provided with the installation surface side,
The laying is present in described soft in the way of the surface that the solder fillet of the solder will not reach the frame
Property is between circuit substrate and the frame.
5. the semiconductor device according to claim 1 or 4, it is characterised in that
The frame is made up of conductive material, there is insulating barrier between the frame and the terminal.
6. the semiconductor device according to claim 1 or 4, it is characterised in that
The frame has recess on the surface of the installation surface side, and the terminal stretches out from the bottom surface of the recess.
7. a kind of flexible circuit board, it has：
It is provided with the base main body of distribution；And
The coating in the base main body is arranged on,
Semiconductor device main body is installed in the base main body,
The flexible circuit board is characterised by,
The base main body can bend, and it has mounting surface towards the semiconductor device main body side, the mounting surface
The back side of opposition side and the perforation through the mounting surface and the back side,
The coating is arranged on the installation surface side, covers the end of the installation surface side of the perforation and does not cover institute
State the inside of perforation.
8. flexible circuit board according to claim 7, it is characterised in that
Laying is additionally provided with the coating of the installation surface side.
9. a kind of flexible circuit board, it has：
It is provided with the base main body of distribution；And
The coating in the base main body is arranged on,
Semiconductor device main body is installed in the base main body,
The flexible circuit board is characterised by,
The base main body can bend, and it has mounting surface towards the semiconductor device main body side, the mounting surface
The back side of opposition side and the perforation through the mounting surface and the back side,
The coating is arranged on the installation surface side, and with opening, the opening has the diameter smaller than the perforation, described to cover
Cap rock by the perforation local complexity,
Laying is additionally provided with the coating of the installation surface side.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-183141 | 2013-09-04 | ||
| JP2013183141A JP6361102B2 (en) | 2013-09-04 | 2013-09-04 | Semiconductor device and flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104425436A CN104425436A (en) | 2015-03-18 |
| CN104425436B true CN104425436B (en) | 2017-06-16 |
Family
ID=52700157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410446089.4A Active CN104425436B (en) | 2013-09-04 | 2014-09-03 | Semiconductor device and flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6361102B2 (en) |
| CN (1) | CN104425436B (en) |
| TW (1) | TWI544585B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3057103B1 (en) * | 2016-09-30 | 2022-11-11 | Safran Electronics & Defense | ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTRONIC UNIT COMPRISING SUCH A DEVICE |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102986310A (en) * | 2010-07-14 | 2013-03-20 | 京瓷化成株式会社 | Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
| CN103091938A (en) * | 2011-10-28 | 2013-05-08 | Lg伊诺特有限公司 | Camera module |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138370U (en) * | 1982-03-12 | 1983-09-17 | 株式会社日立製作所 | LSI package spacer |
| JPH0322490A (en) * | 1989-06-19 | 1991-01-30 | Canon Inc | Flexible substrate |
| JP3656304B2 (en) * | 1996-01-11 | 2005-06-08 | 住友電装株式会社 | Method for manufacturing flexible circuit board |
| JP2004023082A (en) * | 2002-06-20 | 2004-01-22 | Heiwa Corp | Printed circuit board |
| JP3918779B2 (en) * | 2003-06-13 | 2007-05-23 | 松下電器産業株式会社 | Soldering method for non-heat resistant parts |
| JP2006108387A (en) * | 2004-10-05 | 2006-04-20 | Sony Corp | Flexible printed-wiring board reinforcing structure |
| JP2006156682A (en) * | 2004-11-29 | 2006-06-15 | Sumitomo Electric Ind Ltd | Module |
-
2013
- 2013-09-04 JP JP2013183141A patent/JP6361102B2/en active Active
-
2014
- 2014-04-28 TW TW103115134A patent/TWI544585B/en active
- 2014-09-03 CN CN201410446089.4A patent/CN104425436B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102986310A (en) * | 2010-07-14 | 2013-03-20 | 京瓷化成株式会社 | Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
| CN103091938A (en) * | 2011-10-28 | 2013-05-08 | Lg伊诺特有限公司 | Camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015050423A (en) | 2015-03-16 |
| CN104425436A (en) | 2015-03-18 |
| JP6361102B2 (en) | 2018-07-25 |
| TWI544585B (en) | 2016-08-01 |
| TW201519374A (en) | 2015-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7586754B2 (en) | Printed wiring board and process for manufacturing the same | |
| CN104105350B (en) | The method and pcb board of selectivity electricity nickel gold | |
| CN103237416B (en) | Same surface realizes the pattern-producing method of the hard gold of plating and electroplating mild alloy | |
| CN104681531B (en) | Package substrate and method for fabricating the same | |
| SG170744A1 (en) | Circuit board and connection substrate | |
| CN109769344A (en) | The manufacturing method of circuit board and the circuit board | |
| CN104425436B (en) | Semiconductor device and flexible circuit board | |
| CN109788663A (en) | The production method of circuit board and circuit board obtained by this method | |
| CN109561602A (en) | Circuit board and preparation method thereof | |
| TWI526131B (en) | Printed circuit board and method of manufacturing the same | |
| JP4696924B2 (en) | Flexible circuit board | |
| KR101847163B1 (en) | Printed circuit board and method of manufacturing the same | |
| JP2016012702A (en) | Print circuit board balancing wettability and anticorrosion of solder coat and manufacturing method of the same | |
| CN105451469B (en) | A kind of preparation method of circuit edge connector | |
| CN103124009A (en) | Connector structure and production method thereof | |
| CN107404804A (en) | Circuit board and preparation method thereof | |
| CN101841977A (en) | Broken-line etching design method of soft printed circuit board electroplating lead | |
| CN107087341B (en) | Circuit board and preparation method thereof | |
| CN103957657B (en) | FPC and the optical module with the FPC | |
| CN204836822U (en) | Printed circuit board of encapsulation in casing | |
| CN110278659A (en) | Composite circuit board and its manufacturing method | |
| CN202663645U (en) | Lead-free solder coating surface finish printed circuit board with heat radiating groove | |
| JP2005332906A (en) | Flexible printed wiring board and its manufacturing method | |
| JP2013069844A (en) | Printed wiring board and method of manufacturing the same | |
| JP4899804B2 (en) | Flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |