CN104425436A - Semiconductor device and flexible circuit board - Google Patents
Semiconductor device and flexible circuit board Download PDFInfo
- Publication number
- CN104425436A CN104425436A CN201410446089.4A CN201410446089A CN104425436A CN 104425436 A CN104425436 A CN 104425436A CN 201410446089 A CN201410446089 A CN 201410446089A CN 104425436 A CN104425436 A CN 104425436A
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- main body
- semiconductor device
- flexible circuit
- circuit board
- installed surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides a semiconductor device and a flexible circuit board, which suppress solder from attaching to a frame portion. The semiconductor device (1) comprises the flexible circuit board (21) and a semiconductor device body (22) which comprises a frame portion (22a) and a pin terminal (23) extending out from the frame body (22a). A recess portion (22c) is arranged on the side surface of the installation surface (27a) of the frame body (22a), and the pin terminal (23) extends out of the bottom of the recess portion (22c). The main body (27) of the flexible circuit board has through holes (27c, 27d) penetrating the installation surface (27a) and a back side (27b) to form through holes (TH1, TH2). The pin terminal (23) is respectively inserted in the through holes (TH1, TH2), penetrates and inserts in a cover layer (25) which contacts with the periphery of the pin terminal (23).
Description
Technical field
The present invention relates to semiconductor device and flexible circuit board.
Background technology
At present, such as, as described in as open in Japanese Unexamined Patent Publication 9-191170 publication, there will be a known and surface is provided with tectal flexible circuit board.Below, also flexible circuit board is called the abbreviation " FPC " of Flexible Printed Circuit.FPC involved by above-mentioned publication is laminated by basement membrane, sheet metal and the cover layer as its surface protection film.Relative to this lit-par-lit structure, at the solder position of regulation by punch press process, to specify that shape forms perforation.The pin terminals of installing component is inserted in this perforation and carries out solder.
Suppose that the solder of molten condition flows to the adjacent position in outside from pin terminals.Its result, the solder that there is adjacent solder position confluxes each other and forms the problem of crane span structure shape short circuit (hereinafter referred to " short circuit of solder bridge joint ").3 layers of cover layers overlap, according to above-mentioned publication, are made gross thickness fully thickening, therefore prevent the solder between adjacent position from confluxing by this point.Its result, can prevent the generation of solder bridge joint short circuit.
Patent documentation 1: Japanese Unexamined Patent Publication 9-191170 publication
Patent documentation 2: Japanese Unexamined Patent Publication 7-170029 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2007-66946 publication
Patent documentation 4: Japanese Unexamined Patent Publication 2008-10798 publication
Patent documentation 5: Japanese Unexamined Patent Publication 2008-91557 publication
Patent documentation 6: Japanese Unexamined Patent Publication 2010-153534 publication
In the flexible circuit board involved by above-mentioned publication, the short circuit between the multiple solder positions suppressing the in-plane along flexible circuit board to adjoin.On the other hand, the inventor of the application is different from as above along the problem of the outflow of the solder of in-plane, and pays close attention to the problem along the outflow of the solder of the thickness direction of flexible circuit board.
The pin terminals that semiconductor device has frame and stretches out from this frame.Flexible circuit board forms perforation, from this perforation of surface lateral of flexible circuit board, inserts pin terminals.Frame is positioned at a face side of flexible circuit board, and from another face side of flexible circuit board, pin terminals solder is in perforation.
Now, if at the solder of the surface attachment of pin terminals along bore flow, then can flow through the gap flexible circuit board and pin terminals surface.Its result, there is solder and flow out and arrive frame, solder attachment is in the problem on the surface of frame.
Summary of the invention
The present invention proposes to solve above-mentioned problem, its object is to provide the semiconductor device and flexible circuit board that can suppress solder attachment on frame.
The semiconductor device involved by 1st invention of the application, is characterized in that having:
Semiconductor device main body, it has the frame of accommodating semiconductor element in inside and the terminal stretched out from described frame; And
Flexible circuit board, it is provided with described semiconductor device main body, has the base main body being provided with distribution and the cover layer be arranged in described base main body,
Described base main body can bend, and it has the base main body being provided with distribution and the cover layer be arranged in described base main body, and this flexible circuit board installs described semiconductor device main body,
In perforation described in described terminal insertion,
Described cover layer is arranged on described installed surface side as follows, that is, arrange the inner side at the edge to described perforation, thus by surrounding's covering of the described terminal through described perforation,
Described terminal from described rear side solder described perforation.
The semiconductor device involved by 2nd invention of the application, is characterized in that having:
Semiconductor device main body, it has the frame of accommodating semiconductor element in inside and the terminal stretched out from described frame; And
Flexible circuit board, it has the base main body being provided with distribution, and this flexible circuit board is installed described semiconductor device main body,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
In perforation described in described terminal insertion,
Described terminal is connected to described perforation from described rear side by solder,
Also laying is provided with in described installed surface side,
Described laying can not arrive the mode on the surface of described frame with the solder fillet of described solder, be present between described flexible circuit board and described frame.
The flexible circuit board involved by 3rd invention of the application, it has:
Be provided with the base main body of distribution; And
Be arranged on the cover layer in described base main body,
Described base main body is installed semiconductor device main body,
The feature of this flexible circuit board is,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
Described cover layer is arranged on described installed surface side, covers described perforation.
The flexible circuit board involved by 4th invention of the application, it has:
Be provided with the base main body of distribution; And
Be arranged on the cover layer in described base main body,
Described base main body is installed semiconductor device main body,
The feature of this flexible circuit board is,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
Described cover layer is arranged on described installed surface side, has opening, and this opening has the diameter less than described penetration hole diameter, and described cover layer is by described perforation local complexity.
The effect of invention
According to the present invention, can suppress solder attachment on the frame of semiconductor device main body that should be installed on flexible circuit board.
Accompanying drawing explanation
Fig. 1 is the figure representing semiconductor device involved by embodiments of the present invention 1 and flexible circuit board.
Fig. 2 is the figure representing semiconductor device involved by embodiments of the present invention 2 and flexible circuit board.
Fig. 3 is the figure representing semiconductor device involved by embodiments of the present invention 3 and flexible circuit board.
Fig. 4 is the figure representing the effect that embodiments of the present invention are described and the semiconductor device involved by comparative example illustrated and flexible circuit board.
The explanation of label
10 semiconductor devices, 21 flexible circuit boards, 22 semiconductor device main bodys, 22a frame, 22b low-melting glass, 22c recess, 23 pin terminals, 24 solders, 25 cover layers, 27 flexible substrate main bodys, 27a installed surface, the 27b back side, 27c through hole, 28a conductor layer, 28b conductor layer, TH1, TH2 bore a hole
Embodiment
Execution mode 1
Fig. 1 is the figure representing semiconductor device 10 involved by embodiments of the present invention 1 and flexible circuit board 21.Fig. 1 indicates the profile of semiconductor device 10 and flexible circuit board 21.Semiconductor device 10 has flexible circuit board 21 and semiconductor device main body 22.Semiconductor device main body 22 is such as high speed optical communication device.
The pin terminals 23 that semiconductor device main body 22 has frame 22a and stretches out from frame 22a.Such as, in the situations such as CAN assembly, this frame 22a is base.Semiconductor element etc. is contained in the inside of frame 22a.Pin terminals 23 is electrically connected with the circuit element of the inside being present in frame 22a via wire etc.
Frame 22a and pin terminals 23 are formed by conductive materials such as metals respectively, between frame 22a and pin terminals 23, suitably have insulating barrier.In addition, frame 22a also can be formed by nonisulated property materials such as moulding resins.Frame 22a has recess 22c on the surface of installed surface 27a side, and pin terminals 23 is stretched out from the bottom surface of recess 22c.
Flexible circuit board 21 has the flexible circuit board main body 27 being provided with distribution and the cover layer 25 be arranged in flexible circuit board main body 27.Flexible circuit board 21 is installed semiconductor device main body 22.
Flexible circuit board main body 27 is the basement membranes that can bend.Flexible circuit board main body 27 has the back side 27b towards the opposition side of the installed surface 27a of semiconductor device main body 22 side, installed surface 27a.Flexible circuit board main body 27 has conductor layer 28a on installed surface 27a, 27b has conductor layer 28b overleaf.
Flexible circuit board main body 27 has through hole 27c, 27d.This through hole 27c, 27d run through installed surface 27a and back side 27b, are formed with perforation TH1, TH2.In perforation TH1, the wall of through hole 27c is also provided with conductor layer, conductor layer 28a and conductor layer 28b is electrically connected.On the other hand, in perforation TH2, conductor layer 28a and conductor layer 28b is formed as electric notconnect state.
Perforation TH1, TH2 have diameter phi 2.Pin terminals 23 has diameter phi 1.Their pass is φ 1 < φ 2.
Pin terminals 23 is inserted in perforation TH1, TH2 respectively.Pin terminals 23 runs through and penetrates cover layer 25, is formed with through hole 25h in cover layer 25.
Pin terminals 23 penetrates in the cover layer 25 of atresia state, and therefore cover layer 25 contacts with the surrounding of pin terminals 23.The known various material that cover layer 25 can be used as cover layer and use, but the material preferably easily run through by the front end of pin terminals 23 is formed.
In addition, insert the perforation pin terminals 23 of TH2 to be connected with the low-melting glass 22b in frame 22a.
Make according to said structure, cover layer 25, in the mode surrounding of the pin terminals 23 through perforation TH1, TH2 covered, is arranged on installed surface 27a side.Usually, the attachment of cover layer 25 in order to avoid solder 24 to the unnecessary position on flexible circuit board 21 surface is arranged.In the present embodiment, be arranged on around perforation TH1, TH2, and in the mode of the part covering perforation TH1, TH2 further, or so that the mode of perforation TH1, TH2 shutoff is arranged.
Pin terminals 23 is being bored a hole TH1, TH2 from back side 27b side solder.
The semiconductor device 10 involved by execution mode 1 according to the above description and flexible circuit board 21, cover layer 25 can suppress the outflow of solder 24, therefore, it is possible to suppress solder 24 to be attached on frame 22a.
Fig. 4 is the figure representing the effect that embodiments of the present invention are described and the semiconductor device 310 involved by comparative example illustrated and flexible circuit board 321.Semiconductor device 310, except being replaced into except flexible circuit board 321 this point by flexible circuit board 21, has the structure identical with the semiconductor device 10 involved by execution mode 1.Flexible circuit board 321, except being replaced into except cover layer 125 this point by cover layer 25, has the structure identical with flexible circuit board 21.
In the flexible circuit board 321 involved by this comparative example, the cover layer 125 of installed surface 27a side, has the opening 125a larger than the diameter of perforation TH1, TH2 immediately below perforation TH1, TH2.
Utilize cover layer 125, the effect preventing solder from flowing out of cover layer 25 as shown in Embodiment 1 cannot be obtained.Thus, as shown in the label SH of Fig. 4, the surface contact of solder 124 and frame 22a.Particularly, in semiconductor device main body 22, frame 22a is electric conductor, therefore, there is the problem of the short circuit (electric short circuit) producing circuit between conductor layer 28a.
This point, according to execution mode 1, cover layer 25 can block the solder 24 in stifled perforation TH1, TH2, therefore, it is possible to suppress the outflow of solder 24, solder 24 can be suppressed to be attached on frame 22a.
Execution mode 2
Fig. 2 is the figure representing semiconductor device 110 involved by embodiments of the present invention 2 and flexible circuit board 31.Fig. 2 (a) indicates the profile of semiconductor device 110 and flexible circuit board 31.Semiconductor device 110, except being replaced into except flexible circuit board 31 this point by flexible circuit board 21, has the structure identical with the semiconductor device 10 involved by execution mode 1.
Flexible circuit board 31, except being replaced into except cover layer 35 this point by cover layer 25, has the structure identical with the flexible circuit board 21 involved by execution mode 1.Therefore, in the following description, identical label is marked for the structure identical or suitable with execution mode 1 and is described, and, the difference with execution mode 1 is described as center, simplifies or omit the explanation of common item.
Cover layer 35 has with the cover layer 35a mode that conductor layer 28a covers arranged in installed surface 27a side and the cover layer 35b mode that conductor layer 28b covers arranged with 27b side overleaf.Cover layer 35a is arranged on installed surface 27a side, immediately below perforation TH1, TH2, have through hole 35h.
Through hole 35h has the diameter less than perforation TH1, TH2, and cover layer 35a covers perforation TH1, TH2 partly.Gap is provided with between the surface and the surface of pin terminals 23 of the through hole 35h of cover layer 35.This gap is less than or equal to 25 μm.
Fig. 2 (b) is in the semiconductor device 110 involved by embodiments of the present invention 2 and flexible circuit board 31, by the figure after amplification near through hole 35h.The diameter of through hole 35h
than the diameter of pin terminals 23
slightly large, between the surface and the surface of pin terminals 23 of the through hole 35h of cover layer 35, be provided with very small gap g.Gap g is diameter
with diameter
the half of difference.For execution mode 2, this gap g is less than or equal to 25 μm.
Cover layer 35 can suppress the outflow of solder 24, therefore, it is possible to suppress solder 24 to be attached on frame 22a.Gap is formed as being less than or equal to 25 μm, and therefore, solder 24 is rested between pin terminals 23 and cover layer 35 by surface tension.Therefore, it is possible to the through hole 35h be used for by pin terminals 23 is set in cover layer 35a, and also suppress the outflow of solder.In addition, owing to being provided with through hole 35h in advance, so favourable in productivity ratio etc.
Execution mode 3
Fig. 3 is the figure representing semiconductor device 210 involved by embodiments of the present invention 3 and flexible circuit board 41.Semiconductor device 210, except being replaced into except flexible circuit board 41 this point by flexible circuit board 21, has the structure identical with the semiconductor device 10 involved by execution mode 1.
Flexible circuit board 41, except cover layer 25 being replaced into cover layer 45 this point and conductor layer 28a, 28b being replaced into except conductor layer 48a, 48b this point and laying 46, has the structure identical with the flexible circuit board 21 involved by execution mode 1.Therefore, in the following description, identical label marked for the structure identical or suitable with execution mode 1 and is described, and the difference with execution mode 1 is described as center, simplifying or omit the explanation of common item.
Cover layer 45 is different from the cover layer 25 involved by execution mode 1 and the cover layer 35 involved by execution mode 2, immediately below perforation TH1, TH2, has the opening 45a larger than perforation TH1, TH2 diameter.
The cover layer 45 of installed surface 27a side is also provided with laying 46.Recess 22c has height d3, and laying 46 has thickness d 2.This thickness d 2 is larger than the height of solder fillet 44f with the aggregate value of height d3.In addition, on laying 46, immediately below perforation TH1, TH2, be respectively arranged with through hole 46a.
The diameter of through hole 46a
larger than the diameter of perforation TH1, TH2 respectively.In addition, in the present embodiment, the diameter of through hole 46a
consistent with the width of recess 22c.In addition, the thickness d 2 of laying 46 is roughly identical with the thickness d 1 of flexible circuit board 41, but, also can d2 be designed larger than d1.
Identically with execution mode 1, pin terminals 23 is inserted in perforation TH1, TH2, and pin terminals 23 is being bored a hole TH1, TH2 from back side 27b side solder.
According to execution mode 3, by being provided with laying 46, can not arriving the mode of the bottom surface of the recess 22c of frame 22a with solder fillet 44, being separated between flexible circuit board 41 with frame 22a.Thereby, it is possible to suppress solder 44 to be attached on frame 22a.
Claims (11)
1. a semiconductor device, is characterized in that, has:
Semiconductor device main body, it has the frame of accommodating semiconductor element in inside and the terminal stretched out from described frame; And
Flexible circuit board, it has the base main body being provided with distribution and the cover layer be arranged in described base main body, and this flexible circuit board installs described semiconductor device main body,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
In perforation described in described terminal insertion,
Described cover layer is arranged on described installed surface side as follows, that is, arrange the inner side at the edge to described perforation, thus by surrounding's covering of the described terminal through described perforation,
Described terminal from described rear side solder described perforation.
2. semiconductor device according to claim 1, is characterized in that,
Described cover layer contacts with the surrounding of described terminal.
3. semiconductor device according to claim 1 and 2, is characterized in that,
Described cover layer has gap between the surface of described terminal,
Described gap is less than or equal to 25 μm.
4. semiconductor device according to claim 1 and 2, is characterized in that,
Described cover layer is also provided with laying.
5. semiconductor device according to claim 4, is characterized in that,
The thickness of described laying is more than or equal to the thickness of described flexible circuit board.
6. a semiconductor device, is characterized in that, has:
Semiconductor device main body, it has the frame of accommodating semiconductor element in inside and the terminal stretched out from described frame; And
Flexible circuit board, it has the base main body being provided with distribution, and this flexible circuit board is installed described semiconductor device main body,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
In perforation described in described terminal insertion,
Described terminal is connected to described perforation from described rear side by solder,
Also laying is provided with in described installed surface side,
Described laying can not arrive the mode on the surface of described frame with the solder fillet of described solder, be present between described flexible circuit board and described frame.
7. the semiconductor device according to claim 1 or 6, is characterized in that,
Described frame is made up of conductive material, between described frame and described terminal, there is insulating barrier.
8. the semiconductor device according to claim 1 or 6, is characterized in that,
Described frame has recess at described installed surface side surface, and described terminal stretches out from the bottom surface of described recess.
9. a flexible circuit board, it has:
Be provided with the base main body of distribution; And
Be arranged on the cover layer in described base main body,
Described base main body is installed semiconductor device main body,
The feature of this flexible circuit board is,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
Described cover layer is arranged on described installed surface side, covers described perforation.
10. a flexible circuit board, it has:
Be provided with the base main body of distribution; And
Be arranged on the cover layer in described base main body,
Described base main body is installed semiconductor device main body,
The feature of this flexible circuit board is,
Described base main body can bend, and it has towards the back side of the opposition side of the installed surface of described semiconductor device main body side, described installed surface and the perforation running through described installed surface and the described back side,
Described cover layer is arranged on described installed surface side, has opening, and this opening has the diameter less than described perforation, and described cover layer is by described perforation local complexity.
11. flexible circuit boards according to claim 9 or 10, is characterized in that,
The described cover layer of described installed surface side is also provided with laying.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-183141 | 2013-09-04 | ||
| JP2013183141A JP6361102B2 (en) | 2013-09-04 | 2013-09-04 | Semiconductor device and flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104425436A true CN104425436A (en) | 2015-03-18 |
| CN104425436B CN104425436B (en) | 2017-06-16 |
Family
ID=52700157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410446089.4A Active CN104425436B (en) | 2013-09-04 | 2014-09-03 | Semiconductor device and flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6361102B2 (en) |
| CN (1) | CN104425436B (en) |
| TW (1) | TWI544585B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109792843A (en) * | 2016-09-30 | 2019-05-21 | 赛峰电子与防务公司 | Electronic unit including being connected to the electronic equipment of the module of pcb and including this equipment |
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|---|---|---|---|---|
| JP2004023082A (en) * | 2002-06-20 | 2004-01-22 | Heiwa Corp | Printed circuit board |
| US20040253474A1 (en) * | 2003-06-13 | 2004-12-16 | Hiroshi Akamatsu | Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| CN102986310A (en) * | 2010-07-14 | 2013-03-20 | 京瓷化成株式会社 | Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
| CN103091938A (en) * | 2011-10-28 | 2013-05-08 | Lg伊诺特有限公司 | Camera module |
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| JPS58138370U (en) * | 1982-03-12 | 1983-09-17 | 株式会社日立製作所 | LSI package spacer |
| JPH0322490A (en) * | 1989-06-19 | 1991-01-30 | Canon Inc | Flexible substrate |
| JP3656304B2 (en) * | 1996-01-11 | 2005-06-08 | 住友電装株式会社 | Method for manufacturing flexible circuit board |
| JP2006108387A (en) * | 2004-10-05 | 2006-04-20 | Sony Corp | Flexible printed-wiring board reinforcing structure |
| JP2006156682A (en) * | 2004-11-29 | 2006-06-15 | Sumitomo Electric Ind Ltd | Module |
-
2013
- 2013-09-04 JP JP2013183141A patent/JP6361102B2/en active Active
-
2014
- 2014-04-28 TW TW103115134A patent/TWI544585B/en active
- 2014-09-03 CN CN201410446089.4A patent/CN104425436B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004023082A (en) * | 2002-06-20 | 2004-01-22 | Heiwa Corp | Printed circuit board |
| US20040253474A1 (en) * | 2003-06-13 | 2004-12-16 | Hiroshi Akamatsu | Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| CN102986310A (en) * | 2010-07-14 | 2013-03-20 | 京瓷化成株式会社 | Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
| CN103091938A (en) * | 2011-10-28 | 2013-05-08 | Lg伊诺特有限公司 | Camera module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109792843A (en) * | 2016-09-30 | 2019-05-21 | 赛峰电子与防务公司 | Electronic unit including being connected to the electronic equipment of the module of pcb and including this equipment |
| CN109792843B (en) * | 2016-09-30 | 2021-08-24 | 赛峰电子与防务公司 | Electronic device comprising a module connected to a pcb and electronic unit comprising such a device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015050423A (en) | 2015-03-16 |
| TW201519374A (en) | 2015-05-16 |
| JP6361102B2 (en) | 2018-07-25 |
| TWI544585B (en) | 2016-08-01 |
| CN104425436B (en) | 2017-06-16 |
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