CN104302096A - Pcb - Google Patents
Pcb Download PDFInfo
- Publication number
- CN104302096A CN104302096A CN201410432607.7A CN201410432607A CN104302096A CN 104302096 A CN104302096 A CN 104302096A CN 201410432607 A CN201410432607 A CN 201410432607A CN 104302096 A CN104302096 A CN 104302096A
- Authority
- CN
- China
- Prior art keywords
- heat
- sink shell
- layer
- pcb
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
Abstract
The invention discloses a PCB. The PCB comprises an electrical layer, a non-electrical layer, a heat absorbing layer and a bonding layer, all of which are fixed from top to bottom in sequence. The bonding layer made of a thermal conductance bonding agent is arranged on one face of the heat absorbing layer, and a thermal radiation film is arranged on the surface of the heat absorbing layer and has the infrared radiation effect. The PCB is good in heat dissipation performance and easy to manufacture.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), spy relates to a kind of pcb board.
Background technology
PCB Chinese is printed circuit board, and also known as printed circuit board (PCB), before printed circuit board occurs, the interconnection between electronic component is all rely on electric wire directly connect and form complete circuit.In the present age, circuit board just exists as effective experimental tool, and printed circuit board (PCB) has become to occupy important status in the electronics industry.In recent ten years, China's printed circuit board manufacturing development rapidly, develop that but to have also discovered a lot of problem to be solved thereupon, the material of existing pcb board heat dissipating layer mostly is aluminium sheet or pottery, this bi-material heat conductivility is poor, make the heat dissipating layer temperature of corresponding region immediately below element high, all the other regional temperatures are low, cause element local temperature too high and cisco unity malfunction.The poor plasticity of the heat dissipating layer that these materials are made, because the quality of aluminium and pottery is all very hard, general is all square or circular, the a lot of shape of pcb board is irregular, aluminium and pottery is made to be difficult to make the shape of needs, the rough surface of the heat dissipating layer that these materials are made and burr is many, and frivolous not, attach the problems such as difficulty.Prior art also useful carbon fills heat dissipating layer, but carbon easily occurs loose, not easily fixes, and the conductivity of carbon is not as aluminium, so the heat dissipation problem about pcb board in prior art still has problems.
Summary of the invention
Goal of the invention: the invention solves the problems referred to above, provide a kind of thermal diffusivity good and the pcb board easily made.
Technical scheme: a kind of pcb board of the present invention, comprises electrical layer, non-electrical gas-bearing formation, heat-sink shell and adhesive layer, and four layers are fixed from top to bottom successively, and described heat-sink shell one side is by the adhesive layer be made up of heat conductive adhesive; Described heat-sink shell surface has thermal radiation film, and this film has infrared radiation effect.
Described thermal radiation film merges the composition such as silicon oxide powder and alumina powder in the latex comprising silicones.
Described heat-sink shell is thin sheet metal.
Beneficial effect: compared with prior art, its advantage is to form the thermal radiation film with infrared radiation effect on heat-sink shell surface, and thermal diffusivity is good, and easily makes in the present invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board;
Fig. 2 is the structural representation of heat dissipating layer.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As shown in Figure 1-2, a kind of pcb board, comprise electrical layer 1, non-electrical gas-bearing formation 2, heat-sink shell 3 and bonding 4 layers, four layers are fixed from top to bottom successively, and heat-sink shell 3 and adhesive layer 4 constitute fin.
Heat-sink shell 3 adopts the metal thin plate with thermal conductivity such as stainless steel or copper alloy, this thin sheet surface forms thermal radiation film 5, it is the infrared radiation effect of infrared radiation by conducted thermal energy transformation, this thermal radiation film 5 merges the composition such as silicon oxide powder and alumina powder in the latex comprising silicones, directly blown by modes such as sprayings on the surface being attached to heat-sink shell 3, then dry coating, forms thermal radiation film.
The drying of said circumstances can be carried out with drying oven, can carry out drying with drying oven under about 115 °, improves manufacturing speed.
Adhesive layer 4 attaches on the back side of heat-sink shell 3 being mixed with heat conductive adhesive.
The shape that the shape of fin can need according to pcb board changes arbitrarily, both after above-mentioned drying, can form adhesive layer 4 by heat conductive adhesive, and also can be cut into arbitrary shape by shearing device.
Fin is attached on non-electrical gas-bearing formation 2 by adhesive layer 4 by thermal radiation film 5.Even if if non-electrical gas-bearing formation 2 surface irregularity, the adhesives such as resin glue are softer, also easily attach.
When heating position starts adstante febre, the adhesive layer 4 focusing on the high heat conductive adhesive composition of thermal conductivity transmits, and is delivered to heat-sink shell 3.The heat of heat-sink shell is transformed to infrared ray or far infrared by thermal radiation film 5, and heat is externally dispelled the heat from thermal radiation film 5.This good heat dissipation effect and simple for production.
Claims (3)
1. a pcb board, is characterized in that: comprise electrical layer (1), non-electrical gas-bearing formation (2), heat-sink shell (3) and adhesive layer (4), four layers are fixed from top to bottom successively, and described heat-sink shell (3) one side is by the adhesive layer be made up of heat conductive adhesive (4); Described heat-sink shell (3) surface has thermal radiation film (5), and this film has infrared radiation effect.
2. a kind of pcb board according to claim 1, is characterized in that: described thermal radiation film (5) merges the composition such as silicon oxide powder and alumina powder in the latex comprising silicones.
3. a kind of pcb board according to claim 1, is characterized in that: described heat-sink shell (3) is thin sheet metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410432607.7A CN104302096A (en) | 2014-08-27 | 2014-08-27 | Pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410432607.7A CN104302096A (en) | 2014-08-27 | 2014-08-27 | Pcb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104302096A true CN104302096A (en) | 2015-01-21 |
Family
ID=52321593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410432607.7A Pending CN104302096A (en) | 2014-08-27 | 2014-08-27 | Pcb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104302096A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199823A (en) * | 1996-01-19 | 1997-07-31 | Nissan Motor Co Ltd | Chip-on-board printed wiring board |
| CN1530865A (en) * | 2003-03-10 | 2004-09-22 | 华邦电子股份有限公司 | System and method for automatic processing multiple information platform state |
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
-
2014
- 2014-08-27 CN CN201410432607.7A patent/CN104302096A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199823A (en) * | 1996-01-19 | 1997-07-31 | Nissan Motor Co Ltd | Chip-on-board printed wiring board |
| CN1530865A (en) * | 2003-03-10 | 2004-09-22 | 华邦电子股份有限公司 | System and method for automatic processing multiple information platform state |
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3173569U (en) | Thin metal substrate with high thermal conductivity | |
| CN204981729U (en) | High -efficient thermal film who contains thermal conductive adhesive | |
| CN204340308U (en) | A kind of miniature graphite copper radiating rib | |
| TW201242501A (en) | Ceramic heat sink module and manufacturing method thereof | |
| WO2013139058A1 (en) | Thermal dissipation substrate and manufacturing method therefor | |
| TW201103381A (en) | High heat dissipation circuit board and fabrication method thereof | |
| CN204999844U (en) | Heat dissipation sticky tape | |
| CN106783753A (en) | Semiconductor devices | |
| CN102250589A (en) | High performance silica-free heat conductive paste, and preparation method thereof | |
| CN203590662U (en) | Electronic component cooling device | |
| CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
| CN203884121U (en) | Radiating fin | |
| CN203968557U (en) | High conductive graphite film | |
| CN104708869A (en) | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof | |
| CN104302096A (en) | Pcb | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN202753512U (en) | Copper-clad plate with aluminum base ceramic composite structure | |
| CN205364691U (en) | Good copper -clad plate of heat dissipation function | |
| CN203968554U (en) | Biadhesive heat-conducting silica gel sheet | |
| CN203633041U (en) | Electronic element heat dissipation apparatus | |
| CN203554870U (en) | Electronic component thermally conductive and insulating construction | |
| CN207869491U (en) | Insulate tension aluminum substrate radiator structure | |
| CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
| CN206432253U (en) | Semiconductor devices | |
| CN204462998U (en) | Panel computer and mobile phone thermal diffusion sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150121 |