CN104254572B - 导电性聚酰胺基材 - Google Patents

导电性聚酰胺基材 Download PDF

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Publication number
CN104254572B
CN104254572B CN201380021791.XA CN201380021791A CN104254572B CN 104254572 B CN104254572 B CN 104254572B CN 201380021791 A CN201380021791 A CN 201380021791A CN 104254572 B CN104254572 B CN 104254572B
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CN
China
Prior art keywords
substrate
conductive
weight
diamine
diamines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380021791.XA
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English (en)
Chinese (zh)
Other versions
CN104254572A (zh
Inventor
弗兰克·彼得·斯奥道勒斯·约翰内斯·伯格特·范·德
克里斯蒂安·施罗德
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DSM IP Assets BV
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DSM IP Assets BV
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Publication date
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Publication of CN104254572A publication Critical patent/CN104254572A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Conductive Materials (AREA)
CN201380021791.XA 2012-04-27 2013-04-26 导电性聚酰胺基材 Expired - Fee Related CN104254572B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12165949 2012-04-27
EP12165949.4 2012-04-27
PCT/EP2013/058749 WO2013160454A2 (en) 2012-04-27 2013-04-26 Electrically conductive polyamide substrate

Publications (2)

Publication Number Publication Date
CN104254572A CN104254572A (zh) 2014-12-31
CN104254572B true CN104254572B (zh) 2017-04-05

Family

ID=48227279

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380021791.XA Expired - Fee Related CN104254572B (zh) 2012-04-27 2013-04-26 导电性聚酰胺基材

Country Status (8)

Country Link
US (2) US20150107877A1 (enExample)
EP (1) EP2841503B1 (enExample)
JP (1) JP6146723B2 (enExample)
KR (1) KR102066304B1 (enExample)
CN (1) CN104254572B (enExample)
IN (1) IN2014DN08365A (enExample)
TW (1) TWI592079B (enExample)
WO (1) WO2013160454A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015059190A1 (en) * 2013-10-25 2015-04-30 Dsm Ip Assets B.V. Electrically conductive polyamide substrate
WO2017074397A1 (en) 2015-10-29 2017-05-04 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3d) printed electronics
DE102017129625B3 (de) * 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
CN115413285B (zh) 2020-03-13 2024-04-16 英威达纺织（英国）有限公司 用于网络应用的热塑性树脂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638605A (zh) * 2003-12-22 2005-07-13 佳能株式会社 电路形成方法、电路板、电路形成装置和油墨装置
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
WO2010109465A1 (en) * 2009-03-24 2010-09-30 Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. Process for sintering nanoparticles at low temperatures

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4355436B2 (ja) * 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP3998993B2 (ja) * 2002-02-14 2007-10-31 大日本印刷株式会社 ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体
KR100994399B1 (ko) * 2002-10-31 2010-11-16 도레이 카부시키가이샤 폴리아미드 및 폴리아미드 필름
US20060258136A1 (en) * 2005-05-11 2006-11-16 Guangjin Li Method of forming a metal trace
US20070076021A1 (en) * 2005-09-30 2007-04-05 Stancik Edward J Processes for inkjet printing
US9428612B2 (en) 2006-01-26 2016-08-30 Dsm Ip Assets B.V. Semi-crystalline semi-aromatic polyamide
EP2591912A1 (en) * 2006-02-20 2013-05-15 Daicel Chemical Industries, Ltd. Multilayer assembly and composite material comprising same
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
KR20090086564A (ko) * 2006-11-02 2009-08-13 도요 잉키 세이조 가부시끼가이샤 도전성 잉크, 도전 회로 및 비접촉형 미디어
US20080171181A1 (en) * 2007-01-11 2008-07-17 Molex Incorporated High-current traces on plated molded interconnect device
CN101772528B (zh) * 2007-07-23 2013-06-12 帝斯曼知识产权资产管理有限公司 电气/电子连接器及其使用的聚合物组合物
EP2170982A1 (en) * 2007-07-23 2010-04-07 DSM IP Assets B.V. Plastic component for a lighting systems
JP4706690B2 (ja) * 2007-11-05 2011-06-22 パナソニック電工株式会社 回路基板及びその製造方法
CN102318450B (zh) * 2008-02-05 2016-10-19 普林斯顿大学理事会 印刷电子设备
JP5129077B2 (ja) * 2008-09-30 2013-01-23 富士フイルム株式会社 配線形成方法
US20100113669A1 (en) * 2008-10-30 2010-05-06 E.I. Du Pont De Nemours And Company Thermoplastic composition including hyperbranched aromatic polyamide
JP5696332B2 (ja) * 2009-01-16 2015-04-08 ディーエスエム アイピー アセッツ ビー．ブイ． フレキシブルプリント回路基板用ポリアミドフィルム
US20110015328A1 (en) * 2009-07-17 2011-01-20 E.I.Du Pont De Nemours And Company Semi aromatic polyamide resin compositions, processes for their manufacture, and articles thereof
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
EP2410020B1 (de) * 2010-07-23 2013-01-30 Ems-Patent Ag Teilaromatische Polyamid-Formmassen und deren Verwendungen
CN103180133A (zh) * 2010-10-29 2013-06-26 纳幕尔杜邦公司 聚酰胺复合结构及其制备方法
US8906479B2 (en) * 2011-12-30 2014-12-09 E I Du Pont De Nemours And Company Compositions of polyamide and ionomer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638605A (zh) * 2003-12-22 2005-07-13 佳能株式会社 电路形成方法、电路板、电路形成装置和油墨装置
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
WO2010109465A1 (en) * 2009-03-24 2010-09-30 Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. Process for sintering nanoparticles at low temperatures

Also Published As

Publication number Publication date
EP2841503A2 (en) 2015-03-04
JP2015520800A (ja) 2015-07-23
TWI592079B (zh) 2017-07-11
TW201349968A (zh) 2013-12-01
KR102066304B1 (ko) 2020-01-14
WO2013160454A3 (en) 2013-12-19
KR20150004354A (ko) 2015-01-12
WO2013160454A2 (en) 2013-10-31
IN2014DN08365A (enExample) 2015-05-08
US20150107877A1 (en) 2015-04-23
EP2841503B1 (en) 2018-08-29
JP6146723B2 (ja) 2017-06-14
CN104254572A (zh) 2014-12-31
US20180371242A1 (en) 2018-12-27

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