CN104094395A - 晶片保持件 - Google Patents

晶片保持件 Download PDF

Info

Publication number
CN104094395A
CN104094395A CN201380004382.9A CN201380004382A CN104094395A CN 104094395 A CN104094395 A CN 104094395A CN 201380004382 A CN201380004382 A CN 201380004382A CN 104094395 A CN104094395 A CN 104094395A
Authority
CN
China
Prior art keywords
wafer
sheet metal
fish plate
punched areas
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380004382.9A
Other languages
English (en)
Chinese (zh)
Inventor
田中知行
池田穗高
横田满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TEK HOLUN KK
Original Assignee
TEK HOLUN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TEK HOLUN KK filed Critical TEK HOLUN KK
Publication of CN104094395A publication Critical patent/CN104094395A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201380004382.9A 2012-02-14 2013-02-13 晶片保持件 Pending CN104094395A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-029048 2012-02-14
JP2012029048A JP4967078B1 (ja) 2012-02-14 2012-02-14 ウェーハ保持具
PCT/JP2013/053369 WO2013122089A1 (fr) 2012-02-14 2013-02-13 Porte-plaquette

Publications (1)

Publication Number Publication Date
CN104094395A true CN104094395A (zh) 2014-10-08

Family

ID=46650122

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380004382.9A Pending CN104094395A (zh) 2012-02-14 2013-02-13 晶片保持件

Country Status (4)

Country Link
JP (1) JP4967078B1 (fr)
CN (1) CN104094395A (fr)
TW (1) TW201349383A (fr)
WO (1) WO2013122089A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653664A (zh) * 2016-12-07 2017-05-10 南方科技大学 砷化镓晶圆用除氧托盘
CN115020304A (zh) * 2022-06-10 2022-09-06 华羿微电子股份有限公司 一种晶圆载具

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103590114B (zh) * 2012-08-17 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 一种托盘紧固装置及等离子体加工设备
JP2016221941A (ja) * 2015-06-03 2016-12-28 順治 曽根 複合材料構造の熱歪みの低減構造
CN108872260B (zh) * 2017-05-11 2021-12-24 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置
GB201713202D0 (en) * 2017-08-17 2017-10-04 Semblant Ltd Substrate mount
CN111007080B (zh) * 2019-12-25 2022-07-12 成都先进功率半导体股份有限公司 一种晶圆裂纹检查装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245933A (ja) * 1987-03-31 1988-10-13 Shimadzu Corp 半導体ウエハの搬送方法
JP2001185528A (ja) * 1999-12-27 2001-07-06 Minolta Co Ltd エッチング用治具及びエッチング装置並びにエッチング方法
JP4096636B2 (ja) * 2002-06-12 2008-06-04 トヨタ自動車株式会社 ウエハ支持治具およびそれを用いた半導体素子製造方法
JP2006120827A (ja) * 2004-10-21 2006-05-11 Renesas Technology Corp 半導体装置の製造方法
JP4886909B1 (ja) * 2011-06-29 2012-02-29 株式会社テクノホロン ウェーハ保持具

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653664A (zh) * 2016-12-07 2017-05-10 南方科技大学 砷化镓晶圆用除氧托盘
CN106653664B (zh) * 2016-12-07 2019-11-15 南方科技大学 砷化镓晶圆用除氧托盘
CN115020304A (zh) * 2022-06-10 2022-09-06 华羿微电子股份有限公司 一种晶圆载具

Also Published As

Publication number Publication date
JP2013168394A (ja) 2013-08-29
JP4967078B1 (ja) 2012-07-04
TW201349383A (zh) 2013-12-01
WO2013122089A1 (fr) 2013-08-22

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141008