CN104061816B - 包括各向异性热引导涂层的热能引导系统及其制造方法 - Google Patents

包括各向异性热引导涂层的热能引导系统及其制造方法 Download PDF

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Publication number
CN104061816B
CN104061816B CN201410106383.0A CN201410106383A CN104061816B CN 104061816 B CN104061816 B CN 104061816B CN 201410106383 A CN201410106383 A CN 201410106383A CN 104061816 B CN104061816 B CN 104061816B
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CN
China
Prior art keywords
layer
thermal
thermal energy
coating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410106383.0A
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English (en)
Chinese (zh)
Other versions
CN104061816A (zh
Inventor
E·M·戴德
野村壮史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN104061816A publication Critical patent/CN104061816A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
CN201410106383.0A 2013-03-22 2014-03-21 包括各向异性热引导涂层的热能引导系统及其制造方法 Expired - Fee Related CN104061816B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/848,827 2013-03-22
US13/848,827 US10209016B2 (en) 2013-03-22 2013-03-22 Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same

Publications (2)

Publication Number Publication Date
CN104061816A CN104061816A (zh) 2014-09-24
CN104061816B true CN104061816B (zh) 2018-05-11

Family

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Family Applications (1)

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CN201410106383.0A Expired - Fee Related CN104061816B (zh) 2013-03-22 2014-03-21 包括各向异性热引导涂层的热能引导系统及其制造方法

Country Status (3)

Country Link
US (1) US10209016B2 (enExample)
JP (1) JP6374168B2 (enExample)
CN (1) CN104061816B (enExample)

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EP2886448B1 (en) * 2013-12-20 2017-03-08 Airbus Operations GmbH A load bearing element and a method for manufacturing a load bearing element
US9511549B2 (en) * 2014-06-02 2016-12-06 Toyota Motor Engineering & Manufacturing North America, Inc. Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells
US9990457B2 (en) 2016-01-12 2018-06-05 Toyota Motor Engineering & Manufacturing North America, Inc. Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations
US10206310B2 (en) 2017-04-07 2019-02-12 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies incorporating three-dimensional heat flow structures
US10627653B2 (en) 2017-08-28 2020-04-21 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal guiding for photonic components
CN111205763B (zh) * 2018-11-22 2022-02-15 兴勤电子工业股份有限公司 涂料组合物、涂层及包含该涂层的压敏电阻器

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EP0654819A2 (de) * 1993-11-18 1995-05-24 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Anordnung zur Wärmeableitung und Verfahren zu deren Herstellung
CN101083895A (zh) * 2006-04-28 2007-12-05 丛林网络公司 可再使用的散热器附着组件
CN101271948A (zh) * 2008-04-29 2008-09-24 深圳市量子光电子有限公司 Led封装结构及其成型方法
CN101713905A (zh) * 2008-10-06 2010-05-26 鸿富锦精密工业（深圳）有限公司 光路引擎以及使用该光路引擎的投影机

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EP0654819A2 (de) * 1993-11-18 1995-05-24 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Anordnung zur Wärmeableitung und Verfahren zu deren Herstellung
CN101083895A (zh) * 2006-04-28 2007-12-05 丛林网络公司 可再使用的散热器附着组件
CN101271948A (zh) * 2008-04-29 2008-09-24 深圳市量子光电子有限公司 Led封装结构及其成型方法
CN101713905A (zh) * 2008-10-06 2010-05-26 鸿富锦精密工业（深圳）有限公司 光路引擎以及使用该光路引擎的投影机

Also Published As

Publication number Publication date
JP2014187355A (ja) 2014-10-02
CN104061816A (zh) 2014-09-24
US10209016B2 (en) 2019-02-19
JP6374168B2 (ja) 2018-08-15
US20140284039A1 (en) 2014-09-25

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Effective date of registration: 20181015

Address after: Aichi Prefecture, Japan

Patentee after: Toyota Motor Corp.

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Patentee before: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, Inc.

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Granted publication date: 20180511

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