CN104051382B - 叠层封装结构及其形成方法 - Google Patents

叠层封装结构及其形成方法 Download PDF

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Publication number
CN104051382B
CN104051382B CN201310294054.9A CN201310294054A CN104051382B CN 104051382 B CN104051382 B CN 104051382B CN 201310294054 A CN201310294054 A CN 201310294054A CN 104051382 B CN104051382 B CN 104051382B
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soldered ball
top surface
molding material
package
forming method
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CN104051382A (zh
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李建勋
郑荣伟
侯皓程
王宗鼎
吴俊毅
宋明忠
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本发明提供了层叠封装结构及其形成方法，该方法包括压印底部封装件的焊球，其中在压印步骤之后，焊球的顶面变平。焊球模制在模制材料中。焊球的顶面通过模制材料中的沟槽露出。

Description

叠层封装结构及其形成方法
本申请要求于2013年3月11日提交的标题为“Package-on-Package Structureand Methods for Forming the Same”的美国临时专利申请序列号61/776,747的优先权，其内容结合于此作为参考。
技术领域
本发明总的来说涉及集成电路，更具体地，涉及叠层封装结构及其形成方法。
背景技术
在现有叠层封装（PoP）封装工艺中，首先形成底部封装件，其包括接合至封装衬底的器件管芯。然后，模塑料模制在封装衬底上，其中将器件管芯模制在模塑料中。封装衬底还包括与器件管芯位于封装衬底同一侧的焊球。焊球用于将底部封装件连接至顶部封装件。然后，在模塑料中形成通孔模制开口（through-molding openings），因此通过通孔模制开口来露出焊球。在形成通孔模制开口的过程中，激光钻孔用于去除模塑料中覆盖连接件的部分。激光钻孔是低生产量工艺。虽然焊球可以被制得足够大，使得模塑料不能完全覆盖焊球，但是由于焊球的大尺寸，焊球的间距也很大。此外，顶部封装件和底部封装件之间的焊点高度（stand-off height）也很高。
发明内容
根据本发明的一个方面，提供了一种方法，包括：压印底部封装件的焊球，在压印步骤之后，焊球的顶面变平；将焊球模制在模制材料中；以及通过模制材料中的沟槽来露出焊球的顶面。
优选地，压印步骤包括：将间隔件置于底部封装件的封装衬底上方；将刚性板置于焊球上方，刚性板包括与焊球重叠的第一部分以及与间隔件重叠的第二部分；以及对刚性板施加压力来压印焊球，刚性板受到间隔件的阻挡，并且在焊球被压印之后来执行模制步骤。
优选地，该方法还包括：移除间隔件和刚性板；以及对模制材料执行激光修整从而露出焊球。
优选地，该方法还包括：在对刚性板施加压力的步骤中，将焊球加热至低于焊球的熔化温度的温度。
优选地，通过将模具压向焊球来执行压印焊球的步骤，并且模制步骤包括将模制材料分布至底部封装件和模具之间的空间中。
优选地，模具包括多个分散的插针，并且在压印步骤中，多个分散的插针中的每一个都压向焊球中的一个。
优选地，模具包括多个彼此独立的插针环，并且在压印步骤中，底部封装件中的所有焊球都受到多个插针环中的一个的按压。
优选地，模具包括插针网格，并且在压印步骤中，多个底部封装件中的所有焊球都受到插针网格的按压。
根据本发明的又一方面，提供了一种方法，包括：将间隔件置于底部封装件的封装衬底上；使用与多个焊球接触的共面表面来压印封装衬底的多个焊球，其中，通过共面表面来使多个焊球的顶面变平，并且在共面表面受到间隔件的阻挡之后，停止压印步骤；移除间隔件；将多个焊球模制在模制材料中；以及移除位于多个焊球上方的模制材料的顶部从而露出多个焊球。
优选地，移除模制材料的顶部的步骤包括激光修整。
优选地，在移除模制材料的顶部的步骤之后，形成连续沟槽，通过连续沟槽来露出多个焊球。
优选地，沟槽形成环，底部封装件的管芯被环包围。
优选地，在移除模制材料的顶部的步骤之后，形成多个分散沟槽，多个焊球中的每一个都通过多个分散沟槽中的一个来露出。
优选地，该方法还包括：将顶部封装件接合至底部封装件，其中，顶部封装件接合至多个焊球。
根据本发明的又一方面，提供了一种封装件，包括：底部封装件，包括封装衬底和位于封装衬底上方并与封装衬底接合的管芯；多个焊料区，位于封装衬底的顶面上方且与封装衬底的顶面接合；以及模制材料，位于封装衬底上方并且模制焊料区。模制材料包括：第一顶面，覆盖管芯；和沟槽，从第一顶面延伸至模制材料中，其中，多个焊料区暴露在沟槽中。
优选地，模制材料还包括沟槽中的第二顶面，并且第二顶面在多个焊料区之间延伸且基本上是平面的。
优选地，模制材料还包括与第一顶面共面的第三顶面，并且第一顶面和第三顶面位于沟槽的相对侧。
优选地，沟槽延伸至底部封装件的边缘。
优选地，沟槽形成包围管芯的沟槽环。
优选地，多个焊料区具有平坦顶面。
附图说明
为了更完整地理解本实施例及其优点，现在结合附图来参考以下描述，其中：
图1至图8是根据一些示例性实施例的制造叠层封装（PoP）结构的中间阶段的截面图；
图9至图13是根据一些可选实施例的制造PoP结构的中间阶段的截面图，其中插针（pin）型模具用于压印焊球；
图14至图18是根据又一些可选实施例的制造PoP结构的中间阶段的截面图，其中沟槽型模具用于压印焊球；以及
图19至图23是根据又一些可选实施例的制造PoP结构的中间阶段的截面图，其中梯台（terrace）型模具用于压印焊球。
具体实施方式
以下详细讨论本发明实施例的制造和使用。然而，应该理解，实施例提供了许多可在各种具体环境中实施的可应用发明概念。所讨论的具体实施例是示例性的，但不限制本发明的范围。
根据各个实施例提供了一种封装件及其形成方法。根据一些实施例示出了形成封装件的中间阶段。讨论了实施例的变型。在各个视图和示例性实施例中，类似标号用于表示类似元件。
参照图1，提供封装部件10。封装部件10可包括在封装部件100中，其包括多个封装部件10。在一些实施例中，封装部件10是封装衬底。因此，在整篇说明书中，封装部件10称作封装衬底，尽管它们可以是另一种类型的封装部件。因此，封装部件100可以是封装衬底条。在可选的实施例中，封装部件10是中介片。
在一些实施例中，封装衬底10包括由诸如硅的半导体材料形成的衬底11。可选地，衬底11由介电材料形成。衬底11还可以是包括层压介电膜的层压衬底。封装衬底10被配置为将第一表面10A上的连接件12电连接至第二表面10B上的导电部件16，其中表面10A和10B是封装衬底10的相对表面。例如，导电部件16可以是金属焊盘。封装衬底10可包括位于其中的金属线/通孔14。可选地，部件14包括穿透衬底11的通孔。
封装部件20通过电连接件12接合至封装衬底10。封装部件20可以是管芯，因此在下文中可选地将其称为管芯20，尽管它们还可以是诸如封装件的另一种类型的封装部件。管芯20可以是包括诸如晶体管、电容器、电感器、电阻器等的集成电路器件（未示出）的器件管芯。管芯20与连接件12的接合可以是焊料接合或直接金属-金属接合（诸如铜-铜接合）。在一些实施例中，底部填充物18可分布在管芯20和封装衬底10之间的间隙内。在可选实施例中，在管芯20和封装衬底10之间的间隙内没有分布底部填充物。在整篇说明书中，封装衬底10、管芯20和焊球24一起称为底部封装件102。
在封装衬底10的顶面上形成焊球24。焊球24可电连接至连接件12和导电部件16。根据一些实施例，焊球24置于封装衬底10上，然后通过回流步骤将焊球24与封装衬底10连接。因此，焊球24具有圆形表面。在一些实施例中，焊球24的顶端24A高于管芯20的顶面20A。在可选的实施例中，焊球24的顶端24A与管芯20的顶面20A基本平齐或低于管芯20的顶面20A。
参照图2，间隔件26置于封装衬底条100上。虽然所示间隔件26包括分散的部分，但是所示分散部分可以是集成间隔件的一部分。在一些实施例中，间隔件26具有网格的俯视图形状，其中管芯20与网格的网格开口对齐。此外，焊球24也与网格的网格开口对齐。间隔件26的顶端低于焊球24的顶端。
还如图2所示，刚性板28置于焊球24上方并且与其对齐。在一些实施例中，刚性板28包括诸如金属、陶瓷等的刚性材料。此外，刚性板28可由热导电材料形成。例如，刚性板28可由不锈钢形成。与间隔件26类似，虽然所示刚性板28包括分散部分，但是所示分散部分可以是集成板的一部分。在一些实施例中，刚性板28具有网格的俯视图形状，其中管芯20与网格中的网格开口对齐。此外，刚性板28包括与间隔件26重叠的部分。刚性板28的底面是平坦的（共面的）。
压印头（Coin head）30置于刚性板28的上方。在一些实施例中，压印头30的俯视图的大小与刚性板28的俯视图的大小类似，并且具有平坦底面。压印头30连接至被配置为驱动压印头30向下按压刚性板28的机械装置（未示出）。在一些实施例中，压印头30被配置为热刚性板28。例如，压印头30可包括位于其中的电线圈（未示出）。
参照图3，操作压印头30来向下按压刚性板28，使得刚性板28按压焊球24的顶面并且使其变平。按压焊球24的顶面并且使其变平的动作称为“压印”焊球24。在一些实施例中，在刚性板28受到按压期间，压印头30加热刚性板28，刚性板28又加热焊球24。焊球24的最终温度高于室温（例如，约21℃至约25℃），并且低于焊球24的熔化温度。在一些示例性实施例中，在压印工艺过程中，焊球24的温度在约50℃至约150℃之间。在可选实施例中，通过从底部加热封装衬底10来执行对焊球24的加热。
由于加热焊球24，所以减小了压印焊球24所需的压力。由于向下按压压印头30，所以降低了焊球24的高度，并且使刚性板28下降，直至刚性板28落在间隔件26上，此时，可以停止压印。因此，间隔件26用作压印的阻挡器（stopper）。此外，间隔件26的厚度限定了焊球24的最终高度。然后，可去除间隔件26、刚性板28和压印头30。图4示出了得到的底部封装件102。
在压印之后，如图4所示，焊球24具有桶状截面图，并且具有基本平坦的顶面和基本平坦的底面。此外，焊球24中间截面的直径大于顶面和底面的直径。
参照图5，模制材料32被模制在管芯20和封装衬底10上，然后将其固化。在一些示例性实施例中，模制材料32包括聚合物，其可以是模塑料、底部填充物、模制底部填充物（MUF）等。焊球24隐埋在模制材料32中。
图6A示出了激光修整步骤来去除模制材料32中覆盖焊球24的部分。调整激光修整工艺中所用激光的能量，使得模制材料32在暴露于激光时得到修整，而焊球24即使暴露于激光也没有被去除。如图6A所示，作为激光修整的结果，形成沟槽34，其中焊球24暴露在沟槽34中。所得到的模制材料32包括沟槽34外部的表面32A和沟槽34内部的表面32B。表面32B低于表面32A。此外，焊球24的顶面24A可与模制材料32的顶面32B基本平齐或者高于模制材料32的顶面32B。
焊球24具有最大直径D1，其大于顶面24A的直径D2。由于焊球24具有桶形形状，所以在每个焊球24的上半部分，焊球的直径随着高度的减小而增大。在一些实施例中，控制激光修整工艺，使得焊球24在表面32B上方的部分的直径小于最大直径D1。换言之，可以控制激光修整，使得模制材料32的顶面32B不低至焊球24具有最大直径D1处的平面。
激光修整可具有各种类型。图6B和图6C示出了两种可能的修整类型。图6B和图6C是一个底部封装件102的俯视图。参照图6B，在一些实施例中，互连同一底部封装件102中的沟槽34从而形成大沟槽。此外，如图6B所示，可以互连同一底部封装件102中的所有沟槽34从而形成沟槽环。沟槽环可以包围管芯20。底部封装件102的截面图与图6A所示的截面图类似。
图6C示出了另一种修整类型，其中每个焊球24均通过分散的沟槽34露出，并且分散的沟槽34是彼此分离的。在所示实例中，沟槽34具有正方形的俯视图形状。在可选实施例中，沟槽34可具有其他类型的俯视图形状，包括但不限于圆形、六边形、八边形等。
参照图7，顶部封装件40置于底部封装件102上。顶部封装件40的焊球42与焊球24对齐并且置于其上。每一个顶部封装件40都可包括器件管芯44和器件管芯44接合在其上的封装衬底46。此外，可在器件管芯44上模制模制材料48。
接下来，如图8所示，执行回流，使得顶部封装件40接合至封装衬底10。在回流之后，焊球24和42（图7）熔化且连接在一起，并且得到的焊料区在图8中称为焊料区50。在一些实施例中，焊料区50具有下半部分宽于对应的上半部分的轮廓。例如，最大直径D1位于每个焊料区50的下半部分中。在一些实施例中，焊料区50的最大直径D1出现在高度H1处，其接近于焊料区50的整个高度H2的四分之一。在回流之后，底部填充物（未示出）可设置在顶部封装件40和底部封装件102之间。可沿划线51执行切割步骤。因此，图8中的结构被切割成多个封装件200。
图9至图13示出了根据可选实施例的形成PoP结构的中间阶段的截面图。除非另有说明，否则这些实施例中的部件的材料和形成方法与图1至图8所示实施例中由类似参考标号表示的类似部件基本上相同。因此，可在图1至图8所示实施例的讨论中找到关于图9至图13（以及图14至图23所示的实施例）所示部件的形成工艺和材料的细节。
参照图9，提供最初的封装件102。底部封装件102与图1所示的封装件基本上相同，因此这里没有讨论细节。接下来，参照图10，模具52置于底部封装件102上，并且压向焊球24。模具52可由不锈钢、陶瓷、铜、铝或其他类型的刚性材料形成。在一些实施例中，模具52包括向下延伸从而接触并按压焊球24的插针（pin）52A。插针52A可以彼此相同。设计插针52A使其与焊球24对齐，从而每一个焊球24都对应于一个位于上方的插针52A并且可与其对齐。在一些实施例中，插针52A具有垂直侧壁，其中顶部和底部具有相同形状和相同宽度。在可选实施例中，插针52A具有锥形轮廓，其中插针52A的下部的水平尺寸（宽度）小于插针52A的上部的水平尺寸。插针52A的个数可以等于焊球24的总数。插针52A的底面是平坦的。模具52还包括主体52B，插针52A附接至主体52B。
还如图10所示，施加压力54来向下按压模具52。因此，焊球24受到压印，并且其顶面变得平坦。得到的焊球24的轮廓可与图4所示实施例呈现的轮廓基本相同。在压印焊球24的过程中，可加热焊球24，例如，加热至约50℃至约150℃之间的温度。
接下来，参照图11，由于模具52保留在底部封装件102上，所以聚合物32被注入至模具52和底部封装件102之间的空间内。当注入聚合物32时，其呈液体形态，并且能够流动。模塑料32可以与管芯20的顶面和边缘接触，并且可与插针52A、焊球24以及封装衬底10的顶面接触。模塑料32的顶面32A可以高于管芯20的顶面20A，并且管芯20可完全封装在模塑料32中。然后，例如以热固化工艺固化模塑料32，虽然可以使用其他固化方法。然后，可移走模具52，并且完成模制工艺。
图12示出了在移走模具52之后的底部封装件102。在插针52A（图11）所在处形成沟槽34，并且露出焊球24的顶面。沟槽34可具有彼此基本相同的大小和形状。可以发现沟槽34的俯视图与图6C所示的俯视图类似。在后续步骤中，如图13所示，顶部封装件40通过焊料区50接合至底部封装件102，通过对焊球24（图12）和顶部封装件40中的焊球进行回流来形成焊料区50。焊料区50的轮廓可以与图8中的轮廓基本上相同，因此这里没有重复细节。然后，可沿划线51执行切割步骤，使得图13所示的结构被切割成多个封装件200。可选地，可在后续填充模制材料之后执行切割。
图14至图18示出了根据又一些可选实施例的形成PoP结构的中间阶段的截面图。除了代替插针52A与焊球24具有一一对应关系，而是每一个封装衬底10中的所有焊球24都由形成环的相同插针来压印以外，这些实施例与图9至图13中的实施例类似。参照图14，提供底部封装件102。底部封装件102与图1所示的底部封装件基本上相同，因此这里没有重复细节。
如图15所示，将模具52按压在焊球24上。模具52包括主体52B和物理上彼此分离的多个插针环52A。每一个插针环52A都覆盖一个底部封装件102中的所有焊球24。所有插针环52A的底面是共面的。向下按压模具52，使得焊球24被压印为桶形形状。
接下来，参照图16，模制材料32被注入至模具52和底部封装件102之间的空间中，然后对其进行固化。然后移走模具52，如图17所示，得到的沟槽34形成多个沟槽环，每一个沟槽环都位于一个底部封装件102中。此外，每一个沟槽34都包围位于同一底部封装件102中的对应管芯20。这些实施例的俯视图可与图6B的俯视图基本上相同。图18示出了将顶部封装件40接合至底部封装件102。
图19至图23示出了根据又一些可选实施例的形成PoP结构的中间阶段的截面图。除了覆盖每个底部封装件102的插针环52A都相互连接从而形成插针网格以外，这些实施例与图14至图18中的实施例类似。
参照图19，提供最初的封装件。最初的封装件与图1所示的封装件基本上相同，因此这里没有讨论细节。接下来，如图20所示，放置模具52来压印焊球24。模具52包括主体52B和位于主体52B下方且与其附接的模制网格52A。模制网格52A可被视为图15中的插针环52A彼此合并在一起。模制网格52A的网格线覆盖所有底部封装件102中的所有焊球24。模制网格52A的网格开口与管芯20对齐。模制网格52A的网格线可包括与第一个底部封装件102的第一半重叠的第一半部分以及与第二个底部封装件102的第二半重叠的第二半部分。还如图20所示，向下按压模具52，使得焊球24受到压印。接下来，参照图21，模制材料32被注入至模具52和底部封装件102之间的空间中，然后对其进行固化。如图22所示，然后移走模具52。
图23示出了将顶部封装件40接合至底部封装件102。然后，可沿划线51执行切割步骤从而将图23中的结构切割成多个封装件200。可选地，可在后续填充模制材料之后执行切割步骤。图23中的封装件200与图18中的封装件类似，除了在图23中，每个封装件200都包括覆盖管芯20的部分模制材料32，这部分模制材料32具有顶面32A，并且模制材料32的所有剩余顶面32B均低于顶面32A。此外，顶面32B（即，沟槽34中的模制材料32的顶面）一直延伸至封装件200的边缘。然而，在图18中，每个封装件200的顶面32B都形成一个环，但没有延伸至对应封装件200的边缘。换言之，在图18中，沟槽34（以及顶面32B）在直接位于管芯20上方的第一顶面32A（表示为32A1）和延伸至封装件200边缘的第二顶面32A（表示为32A2）之间。
在本发明的实施例中，通过压印焊球，焊球顶面的面积增大。因此，扩大了用于将顶部封装件的焊球对准至底部封装件的工艺窗口。由于焊球受到压印，所以最终PoP封装件中的焊球高度降低。
根据一些实施例，一种方法包括压印底部封装件的焊球，其中在压印步骤之后，焊球的顶面变平。将焊球模制在模制材料中。焊球的顶面通过模制材料中的沟槽露出。
根据其他实施例，一种方法包括将间隔件置于底部封装件的封装衬底上，并且使用与多个焊球接触的共面表面来压印封装衬底的多个焊球。通过共面表面，多个焊球的顶面变平。在共面表面受到间隔件阻挡之后，停止压印步骤。该方法还包括：去除间隔件；将多个焊球模制在模制材料中；以及去除在多个焊球上方的模制材料的顶部以露出多个焊球。
根据又一些其他实施例，一种封装件包括底部封装件，其包括封装衬底和位于封装衬底上方并与其接合的管芯。多个焊料区设置在封装衬底的顶面上方并且与其接合。模制材料位于封装衬底上方，并且模制焊料区。模制材料具有覆盖管芯的第一顶面以及从第一顶面延伸至模制材料中的沟槽，其中多个焊料区暴露在沟槽中。
虽然已详细描述了实施例及其优点，但是应该理解，可以进行各种改变、替换和变更而不背离所附权利要求限定的实施例的精神和范围。而且，本申请的范围不旨在限于本说明书所描述的工艺、机械装置、制造、物质组成、工具、方法和步骤的特定实施例。本领域的技术人员从本发明应容易理解，根据本发明，可以使用与文中所述的对应实施例执行基本相同的功能或实现基本相同效果的目前现有或即将开发的工艺、机械装置、制造、物质组成、工具、方法或步骤。因此，所附权利要求旨在将这种工艺、机械装置、制造、物质组成、工具、方法或步骤包括在其范围内。此外，每个权利要求都构成独立的实施例，并且各个权利要求和实施例的组合均在本发明的范围内。

Claims (16)

1.一种叠层封装结构的形成方法，包括：
使用压印头压印底部封装件的焊球，其中在压印过程中，所述压印头加热所述焊球，并且在压印步骤之后，所述焊球的顶面变平；
将所述焊球模制在模制材料中；以及
通过所述模制材料中的沟槽来露出所述焊球的顶面，所述沟槽形成包围所述底部封装件的管芯的沟槽环。
2.根据权利要求1所述的叠层封装结构的形成方法，其中，所述压印步骤包括：
将间隔件置于所述底部封装件的封装衬底上方；
将刚性板置于所述焊球上方，所述刚性板包括与所述焊球重叠的第一部分以及与所述间隔件重叠的第二部分；以及
对所述刚性板施加压力来压印所述焊球，所述刚性板受到所述间隔件的阻挡，并且在所述焊球被压印之后来执行模制步骤。
3.根据权利要求2所述的叠层封装结构的形成方法，还包括：
移除所述间隔件和所述刚性板；以及
对所述模制材料执行激光修整从而露出所述焊球。
4.根据权利要求2所述的叠层封装结构的形成方法，还包括：在对所述刚性板施加压力的步骤中，将所述焊球加热至低于所述焊球的熔化温度的温度。
5.根据权利要求1所述的叠层封装结构的形成方法，其中，通过将模具压向所述焊球来执行压印所述焊球的步骤，并且模制步骤包括将所述模制材料分布至所述底部封装件和所述模具之间的空间中。
6.根据权利要求5所述的叠层封装结构的形成方法，其中，所述模具包括多个分散的插针，并且在所述压印步骤中，所述多个分散的插针中的每一个都压向所述焊球中的一个。
7.根据权利要求5所述的叠层封装结构的形成方法，其中，所述模具包括彼此独立的多个插针环，并且在所述压印步骤中，所述底部封装件中的所有焊球都受到所述多个插针环中的一个的按压。
8.根据权利要求5所述的叠层封装结构的形成方法，其中，所述模具包括插针网格，并且在所述压印步骤中，多个底部封装件中的所有焊球都受到所述插针网格的按压。
9.一种叠层封装结构的形成方法，包括：
将间隔件置于底部封装件的封装衬底上；
使用与多个焊球接触的共面表面来压印所述封装衬底的多个焊球，其中，通过所述共面表面来使所述多个焊球的顶面变平，并且在所述共面表面受到所述间隔件的阻挡之后，停止压印步骤；
移除所述间隔件；
将所述多个焊球模制在模制材料中；以及
移除位于所述多个焊球上方的所述模制材料的顶部从而露出所述多个焊球；
在移除所述模制材料的顶部的步骤之后，形成连续沟槽，通过所述连续沟槽来露出所述多个焊球，其中，所述沟槽形成环，所述底部封装件的管芯被所述环包围。
10.根据权利要求9所述的叠层封装结构的形成方法，其中，移除所述模制材料的顶部的步骤包括激光修整。
11.根据权利要求9所述的叠层封装结构的形成方法，还包括：将顶部封装件接合至所述底部封装件，其中，所述顶部封装件接合至所述多个焊球。
12.一种封装件，包括：
底部封装件，包括：
封装衬底；和
管芯，位于所述封装衬底上方并与所述封装衬底接合；
多个焊料区，位于所述封装衬底的顶面上方且与所述封装衬底的顶面接合；以及
模制材料，位于所述封装衬底上方并且模制所述焊料区，其中，所述模制材料包括：
第一顶面，覆盖所述管芯；和
沟槽，从所述第一顶面延伸至所述模制材料中，其中，所述多个焊料区暴露在所述沟槽中，所述沟槽形成包围所述管芯的沟槽环。
13.根据权利要求12所述的封装件，其中，所述模制材料还包括所述沟槽中的第二顶面，并且所述第二顶面在所述多个焊料区之间延伸且是平面的。
14.根据权利要求12所述的封装件，其中，所述模制材料还包括与所述第一顶面共面的第三顶面，并且所述第一顶面和所述第三顶面位于所述沟槽的相对侧。
15.根据权利要求12所述的封装件，其中，所述沟槽延伸至所述底部封装件的边缘。
16.根据权利要求12所述的封装件，其中，所述多个焊料区具有平坦顶面。
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