CN104022151A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN104022151A CN104022151A CN201410281040.8A CN201410281040A CN104022151A CN 104022151 A CN104022151 A CN 104022151A CN 201410281040 A CN201410281040 A CN 201410281040A CN 104022151 A CN104022151 A CN 104022151A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000002161 passivation Methods 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 27
- 238000004381 surface treatment Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
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- 229910004205 SiNX Inorganic materials 0.000 claims description 6
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- 238000000151 deposition Methods 0.000 abstract description 9
- 238000003672 processing method Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 97
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 28
- 229910002601 GaN Inorganic materials 0.000 description 26
- 230000000694 effects Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
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- 229910002704 AlGaN Inorganic materials 0.000 description 6
- 230000005533 two-dimensional electron gas Effects 0.000 description 6
- 238000010893 electron trap Methods 0.000 description 5
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- 238000005516 engineering process Methods 0.000 description 4
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- 150000002259 gallium compounds Chemical class 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 238000003379 elimination reaction Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
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- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
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- 229910052594 sapphire Inorganic materials 0.000 description 2
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- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66431—Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Abstract
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CN201410281040.8A CN104022151B (zh) | 2014-06-20 | 2014-06-20 | 半导体器件及其制造方法 |
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CN104022151A true CN104022151A (zh) | 2014-09-03 |
CN104022151B CN104022151B (zh) | 2018-03-02 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104347701A (zh) * | 2014-09-10 | 2015-02-11 | 电子科技大学 | 一种具有复合钝化层结构的场效应晶体管 |
CN106373886A (zh) * | 2015-07-24 | 2017-02-01 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制作方法、电子装置 |
CN108063171A (zh) * | 2017-12-20 | 2018-05-22 | 东南大学 | 一种ZnO纳米棒阵列发光二极管及其制备方法 |
CN109659358A (zh) * | 2018-11-20 | 2019-04-19 | 西安电子科技大学芜湖研究院 | 一种氮化镓hemt低欧姆接触电阻结构及其制作方法 |
CN110581170A (zh) * | 2019-08-13 | 2019-12-17 | 中山市华南理工大学现代产业技术研究院 | 具有Г型栅的GaN基MIS-HEMT器件及制备方法 |
CN114586175A (zh) * | 2020-09-30 | 2022-06-03 | 英诺赛科(苏州)科技有限公司 | 半导体器件以及制造半导体器件的方法 |
US20220376104A1 (en) * | 2021-05-20 | 2022-11-24 | Cree, Inc. | Transistors including semiconductor surface modification and related fabrication methods |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009010107A (ja) * | 2007-06-27 | 2009-01-15 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
CN102881722A (zh) * | 2012-10-26 | 2013-01-16 | 西安电子科技大学 | 源场板异质结场效应晶体管及其制作方法 |
CN102938413B (zh) * | 2012-11-21 | 2015-05-27 | 西安电子科技大学 | AlGaN/GaN异质结增强型器件及其制作方法 |
-
2014
- 2014-06-20 CN CN201410281040.8A patent/CN104022151B/zh active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104347701A (zh) * | 2014-09-10 | 2015-02-11 | 电子科技大学 | 一种具有复合钝化层结构的场效应晶体管 |
CN104347701B (zh) * | 2014-09-10 | 2017-10-17 | 电子科技大学 | 一种具有复合钝化层结构的场效应晶体管 |
CN106373886A (zh) * | 2015-07-24 | 2017-02-01 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制作方法、电子装置 |
CN108063171A (zh) * | 2017-12-20 | 2018-05-22 | 东南大学 | 一种ZnO纳米棒阵列发光二极管及其制备方法 |
CN109659358A (zh) * | 2018-11-20 | 2019-04-19 | 西安电子科技大学芜湖研究院 | 一种氮化镓hemt低欧姆接触电阻结构及其制作方法 |
CN110581170A (zh) * | 2019-08-13 | 2019-12-17 | 中山市华南理工大学现代产业技术研究院 | 具有Г型栅的GaN基MIS-HEMT器件及制备方法 |
CN114586175A (zh) * | 2020-09-30 | 2022-06-03 | 英诺赛科(苏州)科技有限公司 | 半导体器件以及制造半导体器件的方法 |
CN114586175B (zh) * | 2020-09-30 | 2023-04-18 | 英诺赛科(苏州)科技有限公司 | 半导体器件以及制造半导体器件的方法 |
US11862721B2 (en) | 2020-09-30 | 2024-01-02 | Innoscience (Suzhou) Technology Co., Ltd. | HEMT semiconductor device with a stepped sidewall |
US20220376104A1 (en) * | 2021-05-20 | 2022-11-24 | Cree, Inc. | Transistors including semiconductor surface modification and related fabrication methods |
WO2022245885A1 (en) * | 2021-05-20 | 2022-11-24 | Wolfspeed, Inc. | Transistors including semiconductor surface modification and related fabrication methods |
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Publication number | Publication date |
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CN104022151B (zh) | 2018-03-02 |
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Owner name: SUZHOU JIEXINWEI SEMICONDUCTOR CO., LTD. Free format text: FORMER OWNER: SUZHOU DYNAX SEMICONDUCTOR INC. Effective date: 20150313 |
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Effective date of registration: 20150313 Address after: No. 99 Jiangsu province 215123 area in the northwest of Suzhou City Industrial Park Jinji Lake Avenue, room 20 517-B Applicant after: Suzhou Jiexinwei Semiconductor Technology Co., Ltd. Address before: 215300 Kunshan City, Jiangsu province high tech Zone, Feng Feng Road, No. 18, No. Applicant before: Suzhou Dynax High-Energy Semiconductor Co., Ltd. |
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