CN104015461A - 一种无卤Tg130覆铜板制作方法 - Google Patents
一种无卤Tg130覆铜板制作方法 Download PDFInfo
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- CN104015461A CN104015461A CN201410226899.9A CN201410226899A CN104015461A CN 104015461 A CN104015461 A CN 104015461A CN 201410226899 A CN201410226899 A CN 201410226899A CN 104015461 A CN104015461 A CN 104015461A
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CN201410226899.9A CN104015461B (zh) | 2014-05-27 | 2014-05-27 | 一种无卤Tg130覆铜板制作方法 |
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CN201410226899.9A CN104015461B (zh) | 2014-05-27 | 2014-05-27 | 一种无卤Tg130覆铜板制作方法 |
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CN104015461A true CN104015461A (zh) | 2014-09-03 |
CN104015461B CN104015461B (zh) | 2016-06-15 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105109186A (zh) * | 2014-12-19 | 2015-12-02 | 李立群 | 一种新型tg150覆铜板制作方式 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3383440B2 (ja) * | 1994-10-04 | 2003-03-04 | 京セラケミカル株式会社 | 銅張積層板 |
CN1868735A (zh) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | 一种无卤环氧玻璃布基覆铜箔板及其制备方法 |
CN1966573A (zh) * | 2005-11-16 | 2007-05-23 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及其在粘结片和覆铜板中的应用 |
CN101914265A (zh) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用 |
CN102051025A (zh) * | 2010-12-11 | 2011-05-11 | 宏昌电子材料股份有限公司 | 一种无卤阻燃环氧树脂组合物及其应用 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3383440B2 (ja) * | 1994-10-04 | 2003-03-04 | 京セラケミカル株式会社 | 銅張積層板 |
CN1966573A (zh) * | 2005-11-16 | 2007-05-23 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及其在粘结片和覆铜板中的应用 |
CN1868735A (zh) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | 一种无卤环氧玻璃布基覆铜箔板及其制备方法 |
CN101914265A (zh) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用 |
CN102051025A (zh) * | 2010-12-11 | 2011-05-11 | 宏昌电子材料股份有限公司 | 一种无卤阻燃环氧树脂组合物及其应用 |
Non-Patent Citations (1)
Title |
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田民波 等: "《高密度封装基板》", 30 September 2003, article "《封装用一般有机基板材料》", pages: 423-428 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105109186A (zh) * | 2014-12-19 | 2015-12-02 | 李立群 | 一种新型tg150覆铜板制作方式 |
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CN104015461B (zh) | 2016-06-15 |
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Effective date of registration: 20171201 Address after: The economic development zone of Anhui province Tongling city four road 244000 No. 3708 Patentee after: Tongling Huake Electronic Materials Co., Ltd. Address before: The four economic and Technological Development Zone in Anhui province Tongling City Road 244000 No. 3708 West Patentee before: Tongling composite base plate Co., Ltd of great high honour section |
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Address after: 244000 No. 3708, Cuihu 4th Road, Tongling Economic Development Zone, Anhui Province Patentee after: Jinbao Electronics (Tongling) Co.,Ltd. Address before: 244000 No. 3708, Cuihu 4th Road, Tongling Economic Development Zone, Anhui Province Patentee before: TONGLING HUAKE ELECTRONIC MATERIAL Co.,Ltd. |