CN103997884A

CN103997884A - Electronic part installation system and substrate conveying method of electronic part installation system

Info

Publication number: CN103997884A
Application number: CN201410053873.9A
Authority: CN
Inventors: 安藤正; 小原诚子; 野尻信明; 麻生文彦
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2013-02-18
Filing date: 2014-02-18
Publication date: 2014-08-20
Anticipated expiration: 2034-02-18
Also published as: JP2014157973A; JP6164863B2; CN103997884B

Abstract

The invention provides an electronic part installation system and a substrate conveying method of an electronic part installation system. The substrate conveying method performs delivering between the devices. The electronic part installation system (1) temporarily stops controlling or controls again when conveying large size substrates (K1). When the electronic part installation system (1) temporarily stops controlling, the controlling part (90B) performs substrate detection through the downstream sensor (378B) of the downstream electronic part installation device (10B) to enable the conveyance to stop temporarily; and the control part (90A) enables the conveyance to stop conveying according to the temporary stop notification of the electronic component installation device from the downstream; in restart controlling, if the controlling part determines that the operation area of the downstream side electronic component installation device is empty, the conveyance begins. Furthermore, the controlling part of the upper stream side electronic component installation device receives the moving in permission notice of the downstream side electronic component part installation device which is moving into the operation area, the conveyance begins again.

Description

The substrate carrying method of electronic component mounting system and electronic component mounting system

Technical field

The present invention relates to a kind of electronic unit that carries out substrate conveying between 2 conveying mechanisms

Installation system with and substrate carrying method.

Background technology

In existing electronic component mounting apparatus, corresponding with the overall dimension of device and determine in the inner scope to carrying out the operating area of parts installation on substrate of device, determined corresponding thereto to carry out the upper limit of the substrate size of parts installation.Therefore, by position adjustments is carried out to conveyance direction downstream side in the position of determining the transducer of substrate position in operating area, thereby the substrate in operating area is further configured to conveyance direction downstream side, and carry out the installation of electronic unit, thus, the installation exercise of the substrate that reply is larger than given size (for example,, with reference to patent documentation 1).

On the other hand, in recent years, be built with electronic component mounting system, this electronic component mounting system is taken out of the substrate of the conveying mechanism of the electronic component mounting apparatus of upstream side mouthful and the substrate of the conveying mechanism of the electronic component mounting apparatus in downstream is moved into mouth and is connected, the substrate of installation exercise will be finished in the electronic component mounting apparatus of upstream side, the electronic component mounting apparatus transmission of side downstream, carries out a plurality of installation exercises continuously.

Known: for this substrate that carries out between a plurality of electronic component mounting apparatus, to carry, according to SMEMA(Surface Mount Equipment Manufacturers Association) interlock of standard implementation action control to each other.

In using the electronic component mounting system of this SMEMA standard, the control device of the electronic component mounting apparatus of upstream side (being called upstream control device) has takes out of possibility signal efferent, this is taken out of and may will be illustrated in " Ready OUT " signal (taking out of possibility signal) of the substrate that in device, existence can be taken out of by signal efferent, and the control device of the electronic component mounting apparatus of side sends downstream.In addition, in above-mentioned electronic component mounting system, the control device of the electronic component mounting apparatus in downstream (being called downstream control device) has the request signal of taking out of efferent, this takes out of request signal efferent by for asking to take out of " Board Available IN " signal (taking out of request signal) of circuit substrate, and upstream control device sends.

And between above-mentioned upstream control device and downstream control device, taking out of may signal and take out of in the situation of sending/receiving of request signal, conveying mechanism each other carries out the transmission of substrate mutually in linkage.

Patent documentation 1: TOHKEMY 2009-278014 communique

In addition, recently, particularly the upstream side of the operating area of the electronic component mounting apparatus in downstream in device has substrate standby region.By in this substrate standby region, before the electronic unit installation exercise of the substrate in operating area finishes, store next substrate, and make its standby, thereby reduce the different operations stagnations that cause of activity duration because of each electronic component mounting apparatus.

In comprising the electronic component mounting system of this electronic component mounting apparatus, the large substrate of contrast given size carries out in the situation of operation, allow in the operating area of electronic component mounting apparatus, accommodate large substrate by the electronic component mounting apparatus of application patent documentation 1, be also difficult to carry out substrate transmission between 2 electronic component mounting apparatus.

That is, if apply SMEMA standard in above-mentioned electronic component mounting system, downstream control device is being delivered to the moment in operating area by the substrate in substrate standby region, and upstream side control device sends and takes out of request signal.Now, in the situation that the substrate standby region of the electronic component mounting apparatus in downstream only has the storage volume for the substrate of given size, the large substrate of taking out of from the electronic component mounting apparatus of upstream side is difficult to enter the substrate standby region of the electronic component mounting apparatus in downstream.Therefore, the electronic component mounting apparatus of upstream side cannot completing substrate takes out of action, cannot realize the suitable interlock of carrying action, may stop because carrying bad grade to produce mistake.Its result, may make production line integral body stop, and running rate is reduced significantly.

Summary of the invention

The object of the invention is to, in the electronic component mounting system forming at the electronic component mounting apparatus by being connected, can realize the good communication of the substrate larger than regulation.

The invention that technical scheme 1 is recorded is a kind of electronic component mounting system 1, its substrate from upstream side electronic component mounting apparatus 10A take out of mouthfuls 313 downstream the substrate of side electronic component mounting apparatus 10B move into mouthfuls 312 and carry out the transmission of substrate,

It is characterized in that,

Described upstream side electronic component mounting apparatus 10A, has in the substrate transport path of portion within it: operating area 35A, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region 36A, it makes substrate take out of standby between mouth in this operating area and described substrate,

Described downstream electronic component mounting apparatus 10B, has in the substrate transport path of portion within it: operating area 33B, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region 32B, it makes substrate move into standby between mouth 312 and this operating area 33B at described substrate,

Described upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B have respectively: upstream side transducer 377A, 371B, and it,, in the throughput direction upstream-side-end in described substrate standby region, detects substrate; Downstream transducer 378A, 372B, it,, in the conveyance direction downstream side end in described substrate standby region, detects substrate; Conveying mechanism 320～360, its substrate carrying out in described substrate standby region is carried; And the control part 90 of this conveying mechanism,

The control part 90A of described upstream side electronic component mounting apparatus can communicate by letter with the control part 90B of described downstream electronic component mounting apparatus,

When throughput direction width and described upstream side transducer 371B from described downstream electronic component mounting apparatus 10B are transmitted from the large substrate Kl that compares large to the transducer spacing till described downstream transducer 372B,

This electronic component mounting system 1 temporarily stops controlling and again starts to be controlled, wherein,

In temporarily stopping control, the control part 90B of described downstream electronic component mounting apparatus, detection according to the described downstream transducer 372B by this downstream electronic component mounting apparatus to the leading section of large substrate, the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus is temporarily stopped, and, the control part 90A of described upstream side electronic component mounting apparatus, the notice (R signal is to the switching of off-state) that reception temporarily stops from the described conveying of the control part of described downstream electronic component mounting apparatus, the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus 10A is temporarily stopped,

In again starting control, the control part 90B of described downstream electronic component mounting apparatus, if being judged to be the operating area 33B of this downstream electronic component mounting apparatus is dummy status, make the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus again start, and, the control part 10A of described upstream side electronic component mounting apparatus, reception is from the control part 90B's of described downstream electronic component mounting apparatus, the notice that license is moved into the operating area of described downstream electronic component mounting apparatus (R signal is to the switching of off-state), the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is started again.

In addition, " leading section of substrate " represents the end of the conveyance direction downstream side of substrate, and " rearward end of substrate " represents the end of the throughput direction upstream side of substrate.Identical below.

The invention that technical scheme 2 is recorded is characterised in that to have the identical structure of invention of recording with technical scheme 1, and,

Transducer spacing till throughput direction width being less than or equal to from the described upstream side transducer 371B of described downstream electronic component mounting apparatus 10B to described downstream transducer 372B from the substrate K of given size while transmitting,

This electronic component mounting system 1 carries out pipage control, in this pipage control,

The control part 90A of described upstream side electronic component mounting apparatus, the downstream transducer 378A that utilizes this upstream side electronic component mounting apparatus to substrate rearward end pass through detect, the described conveying mechanism of described upstream side electronic component mounting apparatus is stopped, the control part 90B of described downstream electronic component mounting apparatus, utilize the downstream transducer 372B of this downstream electronic component mounting apparatus to detect the arrival of substrate leading section, the described conveying mechanism of described downstream electronic component mounting apparatus 10B is stopped.

The invention that technical scheme 3 is recorded is characterised in that to have the identical structure of invention of recording with technical scheme 1, and,

There is substrate size judgement unit, the throughput direction width of the substrate that its judgement is installed, whether than the described upstream side transducer 371B from described downstream electronic component mounting apparatus 10B to the transducer spacing till described downstream transducer 372B from greatly.

The invention that technical scheme 4 is recorded is a kind of substrate carrying method of electronic component mounting system 1, its substrate from upstream side electronic component mounting apparatus 10A take out of mouthfuls 313 downstream the substrate of side electronic component mounting apparatus 10B move into mouthfuls 312 and carry out the transmission of substrate,

It is characterized in that,

Described upstream side electronic component mounting apparatus 10A, has in the substrate transport path of portion within it: operating area 35A, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region 36A, it makes substrate take out of standby between mouth 313 in this operating area and described substrate,

Described downstream electronic component mounting apparatus 10B, has in the substrate transport path of portion within it: operating area 33B, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region 32B, it makes substrate move into standby between mouth 312 and this operating area at described substrate,

For throughput direction width and described upstream side transducer 371B from described downstream electronic component mounting apparatus 10B are transmitted from the large large substrate of comparing to the transducer spacing till described downstream transducer 372B,

The substrate carrying method of this electronic component mounting system 1 has following operation:

The control part 90B of described downstream electronic component mounting apparatus, detection according to the described downstream transducer 372B that utilizes this downstream electronic component mounting apparatus to the arrival of large substrate leading section, the operation that the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus is temporarily stopped;

The control part 90B of described downstream electronic component mounting apparatus carries out the operation of the notice that described conveying temporarily stops to the control part 90A of described upstream side electronic component mounting apparatus;

The control part 90A of described upstream side electronic component mounting apparatus receives the notice that described conveying temporarily stops, the operation that the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus 10A is temporarily stopped;

The control part 90B of described downstream electronic component mounting apparatus, if being judged to be the operating area 33B of this downstream electronic component mounting apparatus is dummy status, the operation that makes the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus again start;

The control part 90B of described downstream electronic component mounting apparatus is to the control part of described upstream side electronic component mounting apparatus, and notice is permitted the operation of moving into the operating area of described downstream electronic component mounting apparatus; And

The control part 90A of described upstream side electronic component mounting apparatus receives from the notice control part 90B of described downstream electronic component mounting apparatus, that license is moved into the operating area of described downstream electronic component mounting apparatus, the operation that the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is started again.

The effect of invention

Technical scheme 1,3 and 4 inventions of recording, in the transmission of the large substrate between upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus, the detection that the substrate of downstream electronic component mounting apparatus based on utilizing downstream transducer to carry out arrives, the conveying of substrate is temporarily stopped, and, receive and carry the notice stopping, the control part of upstream side electronic component mounting apparatus makes the control of carrying motor temporarily to stop.Therefore, upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus can stop the conveying of substrate in linkage, can not make the end of downstream side of large substrate protrude and standby in this substrate standby region the operating area of side electronic component mounting apparatus downstream.

And, owing to receiving the notice of moving into license of moving into from the operating area, downstream to standby region of the control device of downstream electronic component mounting apparatus, upstream side electronic component mounting apparatus starts the conveying of conveying mechanism again, so can large substrate be discharged from the substrate standby region of upstream side electronic component mounting apparatus, store large substrate in the operating area of downstream electronic component mounting apparatus.

As noted above, because upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus are suitably realized the conveying that large substrate is carried out in interlock, even so large substrate of the size that cannot store in the substrate standby region of downstream electronic component mounting apparatus, also can suitably and successfully transmit, can effectively avoid the reduction of running rate.

The invention that technical scheme 2 is recorded, at the transducer spacing with downstream electronic component mounting apparatus when comparing the transmission of substrate of the given size that throughput direction width is less, the control device of upstream side electronic component mounting apparatus carries out following pipage control, , at the downstream transducer that utilizes this upstream side electronic component mounting apparatus, detect after the passing through of rearward end of substrate, conveying mechanism is stopped, downstream electronic component mounting apparatus carries out following pipage control, , at the downstream transducer that utilizes this downstream electronic component mounting apparatus, detect after the arrival of leading section of substrate, conveying mechanism is stopped, therefore, can build electronic component mounting system, it is between upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus, can to the substrate of given size and large substrate, the two suitably transmits.

Accompanying drawing explanation

Fig. 1 is the vertical view of the related electronic component mounting system of present embodiment.

Fig. 2 is the vertical view of the electronic component mounting apparatus that comprises in electronic component mounting system.

Fig. 3 is the summary construction diagram of the base board delivery device of electronic component mounting apparatus.

Fig. 4 observes the figure of base board delivery device from throughput direction.

Fig. 5 means the block diagram of the control system of electronic component mounting apparatus.

The flow chart of the processing of each control device when Fig. 6 means the transmission control of carrying out common substrate.

Fig. 7 means the action specification figure of the transmission action of the transmission of common substrate in controlling.

Fig. 8 means the action specification figure after Fig. 7 of the transmission action of the transmission of common substrate in controlling.

Fig. 9 means the action specification figure after Fig. 8 of the transmission action of the transmission of common substrate in controlling.

The flow chart of the processing of each control device when Figure 10 means the transmission control of carrying out large substrate.

The flow chart after Figure 10 of the processing of each control device when Figure 11 means the transmission control of carrying out large substrate.

Figure 12 means the action specification figure of the transmission action of the transmission of large substrate in controlling.

Figure 13 means the action specification figure after Figure 12 of the transmission action of the transmission of large substrate in controlling.

Figure 14 means the action specification figure after Figure 13 of the transmission action of the transmission of large substrate in controlling.

The explanation of symbol

1 electronic component mounting system

10 electronic component mounting apparatus

10A upstream side electronic component mounting apparatus

10B downstream electronic component mounting apparatus

15,15A, 15B communication interface

16 telecommunication cables

30 base board delivery devices

32,32A, 32B move into buffer area (substrate standby region)

33,33A, 33B, 35,35A, the 35B band of position (operating area)

36,36A, 36B take out of buffer area (substrate standby region)

90,90A, 90B control device (control part)

312,312A, 312B substrate are moved into mouth

313,313A, 313B substrate are taken out of mouth

320～360 conveying mechanisms

322～362,322A～362A, 322B～362B carries motor

371,377,371A, 377A, 371B, 377B substrate sensor (upstream side transducer)

372,378,372A, 378A, 372B, 378B substrate sensor (downstream transducer)

373～376,373A～376A, 373B～376B substrate sensor

K substrate

Kl large substrate

Embodiment

［ overall structure of working of an invention mode ］

Based on Fig. 1 to Figure 14, embodiments of the present invention are described.

Fig. 1 is the vertical view of the related electronic component mounting system of present embodiment 1.This electronic component mounting system 1 is formed between 2 electronic component mounting apparatus 10,10 by 2 electronic component mounting apparatus 1010, and the substrate of base board delivery device 30 is taken out of mouthfuls 313 and moved into mouthfuls 312 with substrate and be configured to approach and relative.Its result can be carried out the transmission of substrate K between 2 electronic component mounting apparatus 10,10.

In addition, electronic component mounting system 1, has feature on the structure transmitting especially, control, transmission method at the substrate K for carrying out between 2 electronic component mounting apparatus of alignment arrangements.As an one example, exemplify the electronic component mounting system 1 of the electronic component mounting apparatus of 2 same forms 10,10 alignment arrangements, but be not particularly limited to this structure, for example, also can, by multi-form electronic component mounting apparatus alignment arrangements, also can configure side by side and be more than or equal to 3.

［ summary of electronic component mounting apparatus ］

Fig. 2 is the vertical view of electronic component mounting apparatus 10.

This electronic component mounting apparatus 10 mainly has following parts as shown in the figure and forms: as the feeder receptacle 20 of electronic unit supply unit, it will arrange maintenance for supplying with a plurality of electronic component feeders 21 of the electronic unit that will carry; Base board delivery device 30, it is carried substrate K in device inside along fixing throughput direction; And boarded head 40, it receives electronic unit from electronic component feeder 21, to substrate K is upper, installs.

In addition, electronic component mounting apparatus 10 mainly has following parts and forms: as the X-Y portal frame 50 of boarded head mobile unit, it drives boarded head 40 to carry to the optional position in prescribed limit; Camera 11 for parts, it is taken the electronic unit remaining on boarded head 40 from below; Camera 12 for substrate, it carries on boarded head 40, and the not shown base plate mark being arranged on substrate K is taken; Control device 90, its each structure to electronic component mounting apparatus 10 is controlled; And main frame 13, it supports overall structure.

In addition, in the following description, using the direction of the inner utilization base board delivery device 30 conveying substrate K at electronic component mounting apparatus 10 as X-direction, using vertical above-below direction as Z-direction, using with the direction of X-direction and Z-direction quadrature as Y direction, under the correct use state of electronic component mounting apparatus 10, device is configured such that X-direction and Y direction become level.

In addition, this electronic component mounting apparatus 10 is utilizing 2 positions by upstream side and downstream of the transport path of base board delivery device 30 conveying substrate K, have the band of position 33,35 as operating area, it is for carrying out the installation exercise of electronic unit to substrate K.Both sides across base board delivery device 30 in these 2 bands of position 33,35, are respectively arranged with 2, add up to 4 feeder receptacles 20,20.In addition, boarded head 40 and X-Y portal frame 50 are also corresponding with feeder receptacle 20 and respectively carry 4.

［ electronic component mounting apparatus: feeder receptacle ］

In each feeder receptacle 20, along X-direction, arranging mounting has a plurality of electronic component feeders 21.

In each electronic component feeder 21, electronic unit is arranged as to row and the parts that encapsulate rear formation are supplied with band, from spool (omitting diagram), to end thereafter, supply with.The parts of supplying with are supplied with the parts transmission position that band is transported to leading section (end of the transport path side) upside that is arranged on electronic component feeder 21.

Then, at these parts, transmit position, utilize the electronic unit in the 41 pairs of parts supply bands of absorption suction nozzle that carry on boarded head 40 to adsorb.

［ electronic component mounting apparatus: boarded head ］

Each boarded head 40 is provided with as shown in the figure: 6 absorption suction nozzles 41, at their leading section by attracting air to keep electronic unit; As the Z axis motor 42(of drive source with reference to Fig. 5), it makes this absorption suction nozzle 41 along Z-direction lifting; And as the θ axle motor 43(of rotary driving source with reference to Fig. 5), it is rotated driving by the electronic unit keeping via absorption suction nozzle 41 centered by Z-direction.

Each adsorbs suction nozzle 41 and is connected with negative pressure generating device, attracts, thereby adsorb, keep electronic unit by the bottom at this absorption suction nozzle 41.

In addition, the quantity of Z axis motor 42 and θ axle motor 43 is identical with absorption suction nozzle 41, carries on boarded head 40.

In addition, the radical of the absorption suction nozzle 41 carrying on boarded head 40 is not limited to 6, also can increase and decrease.

［ electronic component mounting apparatus: each camera ］

Parts are all CCD camera or CMOS camera with camera 11 and substrate with camera 12.

Parts are corresponding with each boarded head 40 and be fixedly mounted on respectively the assigned position (for example,, between feeder receptacle 20 and substrate transport path) of main frame 13 with camera 11.Each parts with camera 11 make sight line from main frame 13 towards vertical top, at boarded head 40 during by its field range, from below to taking at the electronic unit of its absorption suction nozzle 41 absorption.

Utilize not shown image processing apparatus, parts carried out to image processing with the captured image data of camera 11, to the electronic unit photographing towards and absorption suction nozzle 41 and electronic unit between the skew of center calculate.Then, utilize above-mentioned 43 pairs of electronic units of θ axle motor after revising and utilizing the skew of the center of 50 pairs of electronic units of X-Y portal frame described later to proofread and correct, carry out the installation of electronic unit.

In addition, substrate carries on boarded head 40 with sight line state downward with camera 12, from top to being positioned at the base plate mark of the substrate K of operating area, takes.Utilize not shown image processing apparatus, substrate is carried out to image processing with the captured image data of camera 12, according to the position of the base plate mark photographing, the skew of the position of substrate K and inclination are calculated.Then, when utilizing X-Y portal frame 50 to carry out the location of boarded head 40, be reflected in the position correction of boarded head 40.

［ electronic component mounting apparatus: X-Y portal frame ］

Each X-Y portal frame 50 has: X-axis guide rail 51, and it supports boarded head 40, can make boarded head 40 move along X-direction; Y-axis guide rail 52,52, it supports boarded head 40 via this X-axis guide rail 51, can make boarded head 40 move along Y direction; As the X-axis motor 53(of drive source with reference to Fig. 5), it makes boarded head 40 move along X-direction; And as the Y-axis motor 54(of drive source with reference to Fig. 5), it makes boarded head 40 move along Y direction via X-axis guide rail 51.

And, can pass through the driving of each motor 53,54, the integral body using boarded head 40 to the band of position 33 as object or 35 is carried.

In addition, with respect to the substrate K of the identical band of position 33 or 35, carry 2 X-Y portal frames 50,50 of boarded head 40, share 2 Y-axis guide rails 52,52.

In addition, on each motor 53,54, the encoder that rotation amount is separately detected is installed, by this anglec of rotation to control device 90 inputs.Thus, 90 pairs of each motor 53,54 of control device are controlled, and carry out the absorption suction nozzle 41 separately of boarded head 40 and the location that substrate is used camera 12.

［ electronic component mounting apparatus: base board delivery device ］

Fig. 3 is the key diagram of structure when the overlooking of base board delivery device 30 is shown briefly.Fig. 4 observes the end view of the conveying mechanism described later 330,350 of base board delivery device 30 from substrate throughput direction.

As shown in Figure 2, base board delivery device 30 has a pair of rectangular substrate pressing plate 311,311, this substrate pressing plate 311,311 is crossed over the total length in the X-direction of electronic component mounting apparatus 10 and configuration in parallel with each other becomes substrate transport path between this substrate pressing plate 311,311.In addition, the upstream-side-end of the substrate throughput direction of a pair of substrate pressing plate 311,311 becomes substrate and moves into mouth 312, and end of downstream side becomes substrate and takes out of mouth 313.

In addition, as shown in Figure 3, in the substrate transport path between above-mentioned a pair of substrate pressing plate 311,311, from substrate, move into mouthfuls 312 and towards substrate, take out of mouthfuls 313 and form successively: as the substrate standby region of upstream side move into buffer area 32, as the band of position 33 of the operating area of upstream side, connect buffer area 34, as the band of position 35 of the operating area in downstream, take out of buffer area 36 as the substrate standby region in downstream.

As shown in Figure 3, in aforesaid substrate conveying device 30 each region 32～36 on transport path, be provided with conveying mechanism 320～360.

Each conveying mechanism 320～360 has: a pair of substrate conveyer belt 321～361, and its both ends in the Y direction of regional 32～36, arrange with the length tensioning about equally of the X-direction length with this each region 32～36; And carry motor 322～362, it applies the conveying action to substrate throughput direction via belt pulley for feeding foil to aforesaid substrate conveyer belt 321～361.

In addition, the band of position 33 and 35 conveying mechanism 330,350 are as shown in Figure 4, supporting substrate conveyer belt 331,351 and support structure 333,353 thereof, and can make them move up and down, can utilize the substrate shown in Fig. 2 to keep motor 334,354 to make 331,351 liftings of substrate conveyer belt.

Substrate pressing plate 311,311 is as noted above, is to cross over the total length of substrate transport path and the rectangular plate body that configures.The substrate conveyer belt 321～361 of each above-mentioned conveying mechanism 320～360 all approaches configuration at the downside of substrate pressing plate 311 across gap.In addition, substrate pressing plate 311 and substrate conveyer belt 321～361 are all parallel with X-direction, and the upper surface of the lower surface of substrate pressing plate 311 and substrate conveyer belt 321～361 all becomes level.

Substrate K is positioned on a pair of substrate conveyer belt 321～361, by carrying the driving of motor 322～362, and substrate pressing plate 311 between gap in to the throughput direction of regulation, carried.

In addition, the band of position 33 and 35 conveying mechanism 330,350 by utilizing substrate to keep motor 334,354 to make substrate conveyer belt 331,351 increase, thereby can keep substrate K between this substrate conveyer belt 331,351 and substrate pressing plate 311.

That is, in the above-mentioned band of position 33 and 35, substrate K is carried out to the installation action of electronic unit, therefore, by stably keeping substrate K, thereby realize electronic unit with respect to the accurate location of substrate K.

In addition, base board delivery device 30 has: below the first substrate transducer 371(as upstream side transducer, by the upstream of substrate throughput direction referred to as " upstream "), it carries out the detection of substrate K in the substrate throughput direction upstream-side-end of moving into buffer area 32; Below second substrate transducer 372(as downstream transducer, by the downstream of substrate throughput direction referred to as " downstream "), it carries out the detection of substrate K in the substrate conveyance direction downstream side end (upstream-side-end of the band of position 33) of moving into buffer area 32; The 3rd substrate sensor 373, its in the band of position 33 end of downstream side carry out the detection of substrate K; Tetrabasal transducer 374, it carries out the detection of substrate K in the upstream-side-end that connects buffer area 34; The 5th substrate sensor 375, it carries out the detection of substrate K in the substrate conveyance direction downstream side end (upstream-side-end of the band of position 35) that connects buffer area 34; The 6th substrate sensor 376, its in the band of position 35 end of downstream side carry out the detection of substrate K; As the 7th substrate sensor 377 of upstream side transducer, it carries out the detection of substrate K in the upstream-side-end of taking out of buffer area 36; And as the 8th substrate sensor 378 of downstream transducer, it carries out the detection of substrate K in the end of downstream side of taking out of buffer area 36.

The above-mentioned first and the 8th substrate sensor the 371, the 378th, optical profile type to thing transducer, at substrate K, by time above it, reverberation from substrate K is detected.

In addition, the second～seven substrate sensor 372～377th, optical profile type to thing transducer, by light source and light accepting part, formed, substrate K by time, from the irradiation light of light source, by substrate K, blocked, utilize light accepting part to detect substrate K.

［ control system of electronic component mounting apparatus ］

Below, the block diagram based on Fig. 5, describes the control system of electronic component mounting apparatus 10.

The X-axis motor 53 of above-mentioned X-Y portal frame 50 and Y-axis motor 54 and the Z axis motor 42 and the θ axle motor 43 that on boarded head 40, carry, be connected with control device 90 via not shown drive circuit respectively.

In addition, parts are controlled by control device 90 with the shooting action of camera 12 with camera 11 and substrate.In addition, above-mentioned parts are exported to not shown image processing apparatus with the captured image data of camera 12 with camera 11 and substrate, and result is exported to control device 90.

In addition, above-mentioned each motor 42,43,53,54 and each camera 11,12 all carry a plurality of on electronic component mounting apparatus 10, but in Fig. 5, only illustrate one, remaining omission.

In addition, on control device 90, via not shown drive circuit, be connected with and carry motor 322～362, this conveying motor 322～362 carries out respectively substrate conveying in each region 32～36 of above-mentioned base board delivery device 30.In addition, in the first～eight substrate sensor 371～378 of installing everywhere of the transport path of base board delivery device 30, via not shown interface, be connected with control device 90, substrate detection signal is inputted to control device 90.Thus, control device 90 works as the control part that carries out the action control of each conveying mechanism 320～360.

In addition, be connected with guidance panel 14 on control device 90, this guidance panel 14 consists of the display part that carries out the input part of the various setting input operations in electronic unit installation action and carry out various information demonstrations.

In addition, electronic component mounting apparatus 10 is in order to carry out the transmission control of substrate K with other electronic component mounting apparatus 10, and there is communication interface 15, this communication interface 15 for and these other electronic component mounting apparatus 10 between, carry out the sending/receiving of the control signal of control device 90 each other.

This communication interface 15 meets so-called SMEMA(Surface Mount Equtpment Manufacturers Association) standard, be provided with for connecting telecommunication cable 16(with reference to Fig. 7,12) the connector of regulation, this telecommunication cable 16 is for carrying out the communication between 2 control device 90,90.

In addition, this communication interface 15 has upstream side connector and downstream connector, can in these both sides in substrate throughput direction upstream side and downstream, be connected other electronic component mounting apparatus 10 with respect to this electronic component mounting apparatus 10, carry out the transmission of substrate K and control.That is,, if use this electronic component mounting apparatus 10, also can in series build and link the electronic component mounting system that has more electronic component mounting apparatus 10.

Control device 90 mainly has: EEPROM94, its storage becomes list and the erection schedule data of the electronic unit of mounting object, the loading position of the lift-launch order, each electronic unit that defines electronic unit on substrate K, represents that each electronic unit is from which electronic component feeder 21 received receiving positions etc. in these erection schedule data; ROM92, it stores the executive program of installation action control program and substrate transmission described later control; CPU91, it carries out various programs; And RAM93, it becomes data storage areas in the execution of various programs.

And, when mounting electronic parts, carry out the CPU91 of installation action control program based on erection schedule data, X-axis and Y-axis motor 53,54 are controlled, thus, the absorption suction nozzle 41 of boarded head 40 is positioned to the receiving position of the electronic component feeder 21 of regulation, Z axis motor 42 is controlled, utilize absorption suction nozzle 41 attract electrons parts.In addition, make boarded head 40 by parts, use the top of camera 11, and take from below, to substrate mounting position conveying electronic parts definite in erection schedule data.Then, utilize X-axis and Y-axis motor 53,54 to carry out the position correction of electronic unit, and utilize θ axle motor 43 carry out towards correction, utilize Z axis motor 42 that electronic unit is declined simultaneously, carry out installation action.

In addition, the in the situation that of definite in erection schedule data, at a plurality of absorption suction nozzles 41 that make boarded head 40 simultaneously or carry out successively, after the absorption action of electronic unit, carrying out installation action to substrate K.

［ transmission of substrate is controlled ］

Below, illustrate that the transmission of the substrate K of the electronic component mounting system 1 that 2 above-mentioned electronic component mounting apparatus 10 are formed by connecting is controlled.

In following record, can carry out the electronic component mounting apparatus 10 of the direction of transfer upstream side in 2 electronic component mounting apparatus 10 that the transmission of substrate K controls, as " upstream side electronic component mounting apparatus 10A ", by the electronic component mounting apparatus in direction of transfer downstream, as " downstream electronic component mounting apparatus 10B ".Accompany therewith, for each structure, each parts of upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B, by the end at label additional " A ", " B ", distinguish.

In this electronic component mounting system 1, with the throughput direction width (length of the substrate in X-direction of substrate K.Hereinafter referred to as substrate size) corresponding, the transmission of substrate is controlled different.

The transmission of substrate size is controlled, and the relation between the length that buffer area 32B can accommodate of moving into according to substrate size and downstream electronic component mounting apparatus 10B, is divided into 2 kinds of methods.

Move into the length that buffer area 32B can accommodate, with in X-direction from first substrate transducer 371B to second substrate transducer 372B till transducer spacing from equating.

In the situation that being less than or equal to, substrate size moves into the length that buffer area 32 can be accommodated; as the substrate K of given size, carrying out the transmission of common substrate controls; in the situation that substrate size is greater than, move into the length that buffer area 32 can be accommodated, carry out the transmission of large substrate and control.Below, the substrate that substrate size is less than or equal to the given size of moving into the length that can accommodate buffer area 32 is made as substrate K, by being greater than the substrate of moving into the length that can accommodate buffer area 32, is made as large substrate Kl.

［ transmission of substrate is controlled: the transmission of substrate is controlled conventionally ］

First, the transmission of common substrate is controlled and described.If the guidance panel 14 of certain from upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B of operating personnel presets input substrate size, substrate size information exchange is crossed communication interface 15 and is shared in each control device 90A, 90B.

Then; each control device 90A, the 90B of upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B; whether inputted substrate size is less than or equal to the size that downstream electronic component mounting apparatus 10B can accommodate is judged; and determine it is that the transmission of implementing common substrate is controlled, still implement the transmission of large substrate and control.Due to the equal pre-stored size that has downstream electronic component mounting apparatus 10B to accommodate of each control device 90A, 90B, so the coming to the same thing of above-mentioned judgement.

In addition, also can only by some control device 90A or 90B, judge that implementing which kind of substrate transmission controls, and communicates its result of determination to another control device 90B or 90A.

Fig. 6 means the flow chart of each processing of carrying out when (pipage control) controlled in the control device 90A of upstream side electronic component mounting apparatus 10A of electronic component mounting system 1 and transmission that the control device 90B of downstream electronic component mounting apparatus 10B carries out common substrate, and Fig. 7～Fig. 9 means the action specification figure of the transmission action of the transmission of common substrate in controlling.In addition, the label in Fig. 7～Fig. 9 16 is telecommunication cables that communication interface 15A, the 15B of control device 90A and control device 90B can be connected communicatedly.

It is the control of carrying out according to above-mentioned SMEMA standard that the transmission of this common substrate is controlled.Conventionally the transmission of substrate is controlled, and as shown in Figure 7, the substrate K that takes out of buffer area 36A standby at upstream side electronic component mounting apparatus 10A downstream during the moving into buffer area 32B and carry of side electronic component mounting apparatus 10B, is being performed.

First, in the electronic component mounting apparatus 10B of downstream, if the substrate K moving into buffer area 32B standby is carried to band of position 33B, make to move into buffer area 32B and become dummy status, control device 90B, by " Ready OUT " signal (being called " R signal " in the following description and accompanying drawing) as the notice of moving into license, sends (step T1) with on-state to control device 90A.

On the other hand, the control device 90A of upstream side electronic component mounting apparatus 10A the input (step S1) of pending R signal such as periodically, if receive the on-state of the R signal of self-control device 90B, from control device 90A to control device 90B with on-state, send " Board Available IN " signal (being called " B signal " the following description and accompanying drawing) (step S3).

The control device 90B of downstream electronic component mounting apparatus 10B the input (step T3) of pending B signal such as periodically, if receive the on-state of the B signal of self-control device 90A, utilize the detection (step T5) of the leading section (end of downstream side) of the pending substrate K such as first substrate transducer 371B.

On the other hand, in upstream side electronic component mounting apparatus 10A, after sending B signal, the conveying motor 362A that takes out of buffer area 36A is driven, towards the substrate of downstream electronic component mounting apparatus 10B, move into the conveying (step S5) that mouthful 312B starts substrate K.

Thus, if utilize the first substrate transducer 371B of downstream electronic component mounting apparatus 10B the leading section of substrate K to be detected, control device 90B drives the conveying motor 322B that moves into buffer area 32B, starts accommodate (the step T7) of substrate K.

In upstream side electronic component mounting apparatus 10A, the detection (step S7) that utilizes the rearward end (upstream-side-end) of the pending substrate K such as the 8th substrate sensor 378A to pass through, if utilize the 8th substrate sensor 378A the passing through of rearward end (transducer output disconnects) of substrate K to be detected, control device 90A makes the conveying motor 362A that takes out of buffer area 36A stop (state of step S9: Fig. 8).

Then, control device 90A is made as off-state (step S11) by the B signal for control device 90B.

On the other hand, the control device 90B of downstream electronic component mounting apparatus 10B periodically monitors (step T9) to the switching of the off-state of B signal, if detect the B signal of self-control device 90A to switch to off-state, control device 90B also switches to off-state (step T11) by the R signal for control device 90A.

The control device 90A of upstream side electronic component mounting apparatus 10A periodically monitors (step S13) to the switching of the off-state of R signal; if detect the R signal of self-control device 90B to switch to off-state, control device 90A finishes the transmission control of common substrate.

On the other hand, in the electronic component mounting apparatus 10B of downstream, R signal is being switched to after off-state, utilize second substrate transducer 372B to wait for the arrival (step T13) of the leading section of substrate K, if utilize second substrate transducer 372B the leading section of substrate K to be detected, control device 90B makes the conveying motor 322B that moves into buffer area 32B stop (state of step T15: Fig. 9).

Thus, from the upstream side electronic component mounting apparatus 10A transmission of the common substrate of side electronic component mounting apparatus 10B downstream, control and finish.

In addition, when carrying common substrate, for upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B the two, the elapsed time that substrate sensor is separately become after substrate detected state measures, in this elapsed time, exceed schedule time also do not become non-detection status in the situation that, be judged to be timing error, by utilizing the display part of guidance panel 14A, 14B to carry out mistake, show, and notify.

In addition, when carrying common substrate, for upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B the two, the substrate detected state of the substrate sensor in the upstream side in each region 32～36 and downstream is monitored, substrate size mistake is monitored.

, for the first substrate transducer 371 and the second substrate transducer 372 that becomes downstream that become the upstream side of moving into buffer area 32, become the second substrate transducer 372 and the 3rd substrate sensor 373 that becomes downstream of the upstream side of the band of position 33, become the tetrabasal transducer 374 and the 5th substrate sensor 375 that becomes downstream of the upstream side that connects buffer area 34, become the 5th substrate sensor 375 and the 6th substrate sensor 376 that becomes downstream of the upstream side of the band of position 35, become the 7th substrate sensor 377 of the upstream side of taking out of buffer area 36 and become the paired transducer separately of the 8th substrate sensor 378 in downstream, monitor whether 2 transducers become substrate detected state simultaneously.

Due in the situation that substrate is common substrate size, above-mentioned paired transducer can not become detected state simultaneously, so in the situation that just in case become detected state between above-mentioned paired transducer separately simultaneously, be judged to be substrate size mistake, by utilizing the display part of guidance panel 14A, 14B to carry out mistake, show, and notify.

［ transmission of substrate is controlled: the transmission of large substrate is controlled ］

Below, the transmission of large substrate is controlled and described.

Figure 10 and Figure 11 mean the flow chart of each processing of carrying out when transmission that the control device 90A of upstream side electronic component mounting apparatus 10A of electronic component mounting system 1 and the control device 90B of downstream electronic component mounting apparatus 10B carry out large substrate Kl is controlled, and Figure 12～Figure 14 means the action specification figure of the transmission action of the transmission of large substrate Kl in controlling.

The transmission of large substrate Kl is controlled, a part is according to above-mentioned SMEMA standard, the sending/receiving of carrying out " Ready OUT " signal (R signal) and " Board Available IN " signal (B signal) between control device 90A, 90B each other, realizes the interlock of action control.

The transmission of this large substrate is controlled as shown in figure 12, taking out of in the 36A of buffer area of upstream side electronic component mounting apparatus 10A, do not make large substrate Kl standby, from moving into of 35AZhi downstream, band of position electronic component mounting apparatus 10B, do not stop ground transportation large-scale substrate Kl till the 32B of buffer area.

First, in the electronic component mounting apparatus 10B of downstream, large substrate Kl moving into buffer area 32B standby is carried to band of position 33B, if move into buffer area 32B, become dummy status, in control device 90B, as the notice of moving into license, R signal is sent to (step T21) with on-state to control device 90A.

On the other hand, the control device 90A of upstream side electronic component mounting apparatus 10A the input (step S21) of pending R signal such as periodically, if receive the on-state of the R signal of self-control device 90B, from control device 90A to control device 90B with on-state, send B signal (step S23).

In addition, control device 90A drives the conveying motor 352A of band of position 35A, starts to carry out the conveying (step S25) of large substrate Kl towards taking out of buffer area 36A.

In addition, after the conveying of large substrate Kl starts, control device 90A periodically utilizes the 7th substrate sensor 377A to wait for the leading section (step S27) that large substrate Kl detected, if detected, control device 90A drives the conveying motor 362A that takes out of buffer area 36A, large substrate Kl is taken out of to mouthful 313A towards substrate and carry (step S29).

Then, if from band of position 35A to taking out of buffer area 36A transportation large-scale substrate Kl, control device 90A utilizes the detection of passing through (step S31) of the rearward end of the pending large substrate Kl such as the 6th substrate sensor 376A, if utilize the 6th substrate sensor 376A the passing through of rearward end (transducer output disconnects) of large substrate Kl to be detected, control device 90A makes the conveying motor 362A of band of position 35A stop (step S33).

On the other hand, the control device 90B of downstream electronic component mounting apparatus 10B the input (step T23) of pending B signal such as periodically, if receive the on-state of the B signal of self-control device 90A, wait for and utilize first substrate transducer 371B to carry out the detection (step T25) of the leading section of large substrate Kl.

Then, utilization is in the conveying of taking out of buffer area 36A of upstream side electronic component mounting apparatus 10A, from its substrate take out of mouthful 313A downstream the substrate of side electronic component mounting apparatus 10B move into a mouthful 312B transportation large-scale substrate Kl, if utilize the first substrate transducer 371B of downstream electronic component mounting apparatus 10B the leading section of large substrate Kl to be detected, control device 90B drives the conveying motor 322B that moves into buffer area 32B, starts accommodate (the step T27) of large substrate Kl.

In addition, in the electronic component mounting apparatus 10B of downstream, wait utilizes second substrate transducer 372B to carry out the detection (step T29) of the leading section of large substrate Kl, if utilize second substrate transducer 372B the leading section of large substrate Kl to be detected, control device 90B makes the conveying motor 322B that moves into buffer area 32B stop (step T31: make downstream electronic component mounting apparatus temporarily stop the operation of carrying, the state of Figure 13).

Then, in control device 90B, the notice temporarily stopping as the conveying for control device 90A, switches to off-state (step T33: the operation of the notice temporarily stopping) by R signal.

The control device 90A of upstream side electronic component mounting apparatus 10A, detects under the state of substrate at the 8th substrate sensor 378A, comes the R signal of self-control device 90B to become in the situation of off-state, is judged as the state between large substrate Kl crossover device.Control device 90A is after the conveying motor 352A of band of position 35A stops, periodically the switching of the off-state of R signal is monitored to (step S35), if the situation and the substrate sensor 378A that detect the R signal of self-control device 90B to switch to off-state are the situation of substrate detected state, in control device 90A, as temporarily stopping, controlling, make the conveying motor 362A that takes out of buffer area 36A stop (step S37: make upstream side electronic component mounting apparatus temporarily stop the operation of carrying).

In addition, maintain the on-state that is sent to the B signal of downstream electronic component mounting apparatus 10B from upstream side electronic component mounting apparatus 10A.

In addition, if when the R signal that carrys out self-control device 90B switches to off-state, substrate sensor 378A is not detected state of substrate, and control device 90A is judged as large substrate Kl and is taken out of completely.

After this, other large substrates Kl above by the band of position 33B from the electronic component mounting apparatus 10B of downstream downstream side carry, until band of position 33B becomes dummy status, the large substrate Kl that moves into buffer area 32B becomes holding state.

; control device 90B by other large substrates Kl above from band of position 33B downstream side send; by whether substrate sensor 373B and substrate sensor 374B being to the state that substrate do not detect, judge; thereby whether band of position 33B is become to dummy status and monitor (step T35); in the situation that being judged to be dummy status, control device 90B starts to move into the driving of the conveying motor 322B of buffer area 32B and the conveying motor 332B of band of position 33B.

In addition, meanwhile, in control device 90B, as the notice of moving into license, again R signal is sent to (step T37: make downstream electronic component mounting apparatus again start the operation of carrying and notify the operation of moving into license of the operating area of side electronic component mounting apparatus downstream) with on-state to control device 90A.

In addition, in above-mentioned steps T35, by judging whether substrate sensor 373B and substrate sensor 374B are the state that substrate does not detect, thereby carry out more scrupulously the confirmation of the dummy status of band of position 33B, if but could only utilize substrate sensor 373B discharge with other large substrates Kl before sufficient accuracy detection from band of position 33B, also could only utilize substrate sensor 373B to carry out the not judgement of detected state of substrate.

On the other hand, control device 90A is after taking out of temporarily the stopping of conveying motor 362A of buffer area 36A, periodically the switching of the on-state of R signal is monitored to (step S39), if detect the R signal of self-control device 90B to switch to the situation of on-state, in control device 90A, as again starting, control, again start to take out of the driving (step S41: make upstream side electronic component mounting apparatus again start the operation of carrying) of the conveying motor 362A of buffer area 36A.

In addition, upstream side electronic component mounting apparatus 10A waits for and utilizes the 8th substrate sensor 378A to carry out the detection (step S43) of the rearward end of large substrate Kl, if utilize the 8th substrate sensor 378A the passing through of rearward end (transducer output disconnects) of large substrate Kl to be detected, control device 90A makes the conveying motor 362A that takes out of buffer area 36A stop (state of step S45: Figure 14).

Then, control device 90A is made as off-state (step S47) by the B signal for control device 90B.

On the other hand, the control device 90B of downstream electronic component mounting apparatus 10B periodically monitors (step T39) to the switching of the off-state of B signal, if detect the B signal of self-control device 90A to switch to the situation of off-state, control device 90B also switches to off-state (step T41) by the R signal for control device 90A.

The control device 90A of upstream side electronic component mounting apparatus 10A periodically monitors (step S49) to the switching of the off-state of R signal, if detect the R signal of self-control device 90B to switch to off-state, control device 90A finishes the transmission control of large substrate.

On the other hand, in the electronic component mounting apparatus 10B of downstream, R signal is switched to after off-state, wait utilizes the 3rd substrate sensor 373B to carry out the detection (step T43) of the leading section of large substrate Kl, if utilize the 3rd substrate sensor 373B the leading section of large substrate Kl to be detected, control device 90B makes to move into the conveying motor 322B of buffer area 32B and the conveying motor 332B of band of position 33B stops (step T45).

Thus, finish to control from the upstream side electronic component mounting apparatus 10A transmission of the large substrate of side electronic component mounting apparatus 10B downstream.

In addition, when transportation large-scale substrate Kl, by the conveying in step S37 and step T31, temporarily stop controlling, produce and utilize the long-term of substrate detected state that the 8th substrate sensor 378A and first substrate transducer 371B carry out, therefore, do not carry out the determination processing of timing error.

In addition, owing to being large substrate Kl, so becoming the first substrate transducer 371 and the second substrate transducer 372 that becomes downstream of the upstream side of moving into buffer area 32, become the second substrate transducer 372 and the 3rd substrate sensor 373 that becomes downstream of the upstream side of the band of position 33, become the tetrabasal transducer 374 and the 5th substrate sensor 375 that becomes downstream of the upstream side that connects buffer area 34, become the 5th substrate sensor 375 and the 6th substrate sensor 376 that becomes downstream of the upstream side of the band of position 35, become the 7th substrate sensor 377 of the upstream side of taking out of buffer area 36 and become in certain a pair of transducer in the 8th substrate sensor 378 in downstream, certainly can produce the state that simultaneously becomes substrate detected state, therefore, do not carry out the determination processing of substrate size mistake.

［ effect of working of an invention mode ］

In above-mentioned electronic component mounting system 1, in the transmission of large substrate Kl between upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B, the detection of the leading section of the large substrate Kl of downstream electronic component mounting apparatus 10B based on utilizing the 8th substrate sensor 378A to carry out, the conveying of large substrate Kl is temporarily stopped, and, receive the switching to off-state (notice that conveying stops) of R signal, the control part 90A of upstream side electronic component mounting apparatus 10A makes the control of carrying motor 362A temporarily to stop.Therefore, upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B can stop the conveying of large substrate Kl in linkage, and the end of downstream side that can the not make large substrate Kl downstream band of position 33B side of the upstream side of side electronic component mounting apparatus 10B is protruded and standby in this moves into buffer area 32B.

And, due to the notice of moving into license of moving into band of position 33B receiving from the control device 90B of downstream electronic component mounting apparatus 10B, upstream side electronic component mounting apparatus 10A starts to utilize the conveying of carrying motor 362A to carry out again, so can large substrate Kl be discharged from the buffer area 36A that takes out of of upstream side electronic component mounting apparatus 10A, store large substrate Kl in the band of position 33B of downstream electronic component mounting apparatus 10B.

As noted above, because upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B suitably realize the conveying that large substrate is carried out in interlock, even so at the large substrate Kl that moves into the size that cannot store in the 32B of buffer area of downstream electronic component mounting apparatus 10B, also can suitably and successfully transmit, can effectively avoid the reduction of running rate.

In addition, while controlling due to transmission at large substrate, do not carry out the determination processing of timing error and the determination processing of substrate and dimensional error, so no matter whether suitably transportation large-scale substrate Kl all can avoid carrying out mistake and stop.

Conventionally when transferring substrates K, the control device 90A of upstream side electronic component mounting apparatus 10A carries out following pipage control, , at the 8th substrate sensor 378A that utilizes this upstream side electronic component mounting apparatus 10A, detect after the passing through of rearward end of substrate K, make to carry motor 362A to stop, downstream electronic component mounting apparatus 10B carries out following pipage control, , at the second substrate transducer 372B that utilizes this downstream electronic component mounting apparatus 10B, detect after the arrival of leading section of substrate K, make to carry motor 322B to stop, therefore, can build the electronic component mounting system 1 that versatility is high, it is between upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B, can to the substrate K of given size and large substrate Kl, the two suitably transmits.

［ other ］

In above-mentioned electronic component mounting system 1, adopt the structure that 2 electronic component mounting apparatus are arranged along throughput direction, but also can adopt, more electronic component mounting apparatus is arranged as to the structure of row along throughput direction.

In the case, for the substrate of the electronic component mounting apparatus from upstream side 10 being taken out of to mouthful 313 substrates of taking out of, directly move into the substrate of the electronic component mounting apparatus 10 in downstream and move into mouthfuls 312, require each electronic component mounting apparatus 10 to be configured to, its substrate takes out of mouthfuls 313, and to move into mouth 312 closely relative with the substrate of next electronic component mounting apparatus 10.

2 electronic component mounting apparatus 10,10 that comprise in electronic component mounting system 1 can not be also identical devices.

For example, in order to carry out the transmission of large substrate Kl, control, as long as at least upstream side electronic component mounting apparatus has the He Gai band of position, the band of position and substrate is taken out of the buffer area of taking out of between mouth, at least downstream electronic component mounting apparatus has the He Gai band of position, the band of position and substrate and moves into the buffer area of moving between mouthfuls 312.

For example, by having by moving into buffer area, the band of position, take out of the electronic component mounting apparatus of the conveying mechanism that buffer area forms, be disposed at the upstream side of above-mentioned electronic component mounting apparatus 10 or the electronic component mounting system in downstream and only by having by moving into buffer area, the band of position, take out of in the situation of the electronic component mounting system that the electronic component mounting apparatus of the conveying mechanism that buffer area forms forms, also can carry out the transmission of large substrate Kl and control.

In addition, form each electronic component mounting apparatus of electronic component mounting system, being not limited to only can for example, at the electronic component mounting apparatus of the upper conveying substrate of a direction along X-direction (, the right in Fig. 3).

For example, in the situation that the base board delivery device 30 of each electronic component mounting apparatus 10A, 10B can carry out substrate conveying along the opposite direction in X-direction, by each transducer left and right is reversally configured, thereby direction that can be contrary along the example with Fig. 3 is carried out the transmission control of large substrate Kl.

In addition, in the above-described embodiment, if the some guidance panel 14 of operating personnel from upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B presets the throughput direction width (substrate size) of inputting the substrate of installing, substrate size information exchange is crossed to communication interface 15 and shared in each control device 90A, 90B.Aforesaid operations panel 14, communication interface 15, each control device 90A, 90B form substrate size judgement unit, to the transducer spacing till whether being greater than from the upstream side transducer 371B of downstream electronic component mounting apparatus 10B to above-mentioned downstream transducer 372B from judging.

In addition, easily expect replacing aforesaid substrate size discrimination unit, for example, by control device 90 when carrying out the action control of each conveying mechanism 320,330 etc., substrate is moved into the 1st substrate sensor 371 of mouthful 312 sides or measured connection, the opening time of the 2nd substrate sensor 372, according to the responsiveness of this Measuring Time and conveying mechanism, substrate size is differentiated.This substrate size judgement unit consists of substrate sensor 371 or the 2nd substrate sensor 372 and control device 90, conveying mechanism 320,330 etc.

Claims

1. an electronic component mounting system, its substrate from upstream side electronic component mounting apparatus take out of mouth downstream the substrate of side electronic component mounting apparatus move into mouth and carry out the transmission of substrate,

It is characterized in that,

Described upstream side electronic component mounting apparatus, has in the substrate transport path of portion within it: operating area, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region, it makes substrate take out of standby between mouth in this operating area and described substrate,

Described downstream electronic component mounting apparatus, has in the substrate transport path of portion within it: operating area, and it is for placement substrate, to carry out the installation of electronic unit; And substrate standby region, it makes substrate move into standby between mouth and this operating area at described substrate,

Described upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus have respectively: upstream side transducer, and it,, in the throughput direction upstream-side-end in described substrate standby region, detects substrate; Downstream transducer, it,, in the conveyance direction downstream side end in described substrate standby region, detects substrate; Conveying mechanism, its substrate carrying out in described substrate standby region is carried; And the control part of this conveying mechanism,

The control part of described upstream side electronic component mounting apparatus can be communicated by letter with the control part of described downstream electronic component mounting apparatus,

When throughput direction width and described upstream side transducer from described downstream electronic component mounting apparatus to the transducer spacing till the transducer of described downstream is transmitted from the large large substrate of comparing,

This electronic component mounting system temporarily stops controlling and again starts to be controlled, wherein,

In temporarily stopping control, the control part of described downstream electronic component mounting apparatus, detection according to the described downstream transducer by this downstream electronic component mounting apparatus to the leading section of large substrate, the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus is temporarily stopped, and, the control part of described upstream side electronic component mounting apparatus, the notice that reception temporarily stops from the described conveying of the control part of described downstream electronic component mounting apparatus, the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is temporarily stopped,

In again starting control, the control part of described downstream electronic component mounting apparatus, if being judged to be the operating area of this downstream electronic component mounting apparatus is dummy status, make the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus again start, and, the control part of described upstream side electronic component mounting apparatus, reception is from the control part of described downstream electronic component mounting apparatus, the notice that license is moved into the operating area of described downstream electronic component mounting apparatus, the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is started again.

2. electronic component mounting system according to claim 1, is characterized in that,

Transducer spacing till throughput direction width being less than or equal to from the described upstream side transducer of described downstream electronic component mounting apparatus to described downstream transducer from the substrate of given size while transmitting,

This electronic component mounting system carries out pipage control, in this pipage control,

The control part of described upstream side electronic component mounting apparatus, the described downstream transducer that utilizes this upstream side electronic component mounting apparatus to substrate rearward end pass through detect, the described conveying mechanism of described upstream side electronic component mounting apparatus is stopped, the control part of described downstream electronic component mounting apparatus, utilize the described downstream transducer of this downstream electronic component mounting apparatus to detect the arrival of substrate leading section, the described conveying mechanism of described downstream electronic component mounting apparatus is stopped.

3. electronic component mounting system according to claim 1, is characterized in that,

There is substrate size judgement unit, the throughput direction width of the substrate that its judgement is installed, whether than the described upstream side transducer from described downstream electronic component mounting apparatus to the transducer spacing till the transducer of described downstream from greatly.

4. a substrate carrying method for electronic component mounting system, its substrate from upstream side electronic component mounting apparatus take out of mouth downstream the substrate of side electronic component mounting apparatus move into mouth and carry out the transmission of substrate,

It is characterized in that,

For throughput direction width and described upstream side transducer from described downstream electronic component mounting apparatus to the transducer spacing till the transducer of described downstream is transmitted from the large large substrate of comparing,

The substrate carrying method of this electronic component mounting system has following operation:

The control part of described downstream electronic component mounting apparatus, detection according to the described downstream transducer that utilizes this downstream electronic component mounting apparatus to large substrate leading section, the operation that the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus is temporarily stopped;

The control part of described downstream electronic component mounting apparatus carries out the operation of the notice that described conveying temporarily stops to the control part of described upstream side electronic component mounting apparatus;

The control part of described upstream side electronic component mounting apparatus receives the notice that described conveying temporarily stops, the operation that the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is temporarily stopped;

The control part of described downstream electronic component mounting apparatus, is dummy status if be judged to be the operating area of this downstream electronic component mounting apparatus, the operation that makes the conveying of the described conveying mechanism of described downstream electronic component mounting apparatus again start;

The control part of described downstream electronic component mounting apparatus is to the control part of described upstream side electronic component mounting apparatus, and notice is permitted the operation of moving into the operating area of described downstream electronic component mounting apparatus; And

The control part of described upstream side electronic component mounting apparatus receives from the notice control part of described downstream electronic component mounting apparatus, that license is moved into the operating area of described downstream electronic component mounting apparatus, the operation that the conveying of the described conveying mechanism of described upstream side electronic component mounting apparatus is started again.