CN103997884B - The substrate carrying method of electronic component mounting system and electronic component mounting system - Google Patents

Abstract

The present invention provides a kind of substrate carrying method of electronic component mounting system and electronic component mounting system, it carries out the transmission between device for large substrate.Electronic component mounting system（1）Transmitting large substrate（Kl）Shi Jinhang temporarily ceases control and starts again at control, in control is temporarily ceased, control unit（90B）By using downstream electronic component mounting apparatus（10B）Downstream side senser（378B）The substrate detection of progress, temporarily ceases conveying, control unit（90A）Notice is temporarily ceased according to from downstream electronic component mounting apparatus, temporarily cease conveying, in control is started again at, if it is determined that the operating area of control unit downstream electronic component mounting apparatus is dummy status, then start again at conveying, also, the control unit of upstream side electronic component mounting apparatus, the notice for moving into license moved into operating area from downstream electronic component mounting apparatus is received, starts again at conveying.

Description

The substrate carrying method of electronic component mounting system and electronic component mounting system

Technical field

The present invention relates to a kind of electronic unit that substrate conveying is carried out between 2 conveying mechanisms

Installation system and its substrate carrying method.

Background technology

In existing electronic component mounting apparatus, portion in the device corresponding and definite with the appearance and size of device is to base The scope of the operating area of component installation is carried out on plate, determines the substrate size that can carry out component installation corresponding thereto The upper limit.Therefore, by the way that the position that the sensor of substrate position is determined in operating area is carried out to conveyance direction downstream side Position is adjusted, so that the substrate in operating area further be configured to conveyance direction downstream side, and carries out the peace of electronic unit Dress, thus, tackles the installation exercise of the substrate bigger than given size（For example, referring to patent document 1）.

On the other hand, in recent years, electronic component mounting system is built with, the electronic component mounting system is by the electronics of upstream side The substrate of the conveying mechanism of apparatus for mounting component takes out of the substrate of the conveying mechanism of mouth and the electronic component mounting apparatus in downstream Mouth connection is moved into, the ministry of electronics industry of the substrate, downstream side of installation exercise will be terminated in the electronic component mounting apparatus of upstream side Part erecting device transmission, continuously carries out multiple installation exercises.

It is known：Conveyed for this substrate carried out between multiple electronic component mounting apparatus, according to SMEMA （Surface Mount Equipment Manufacturers Association）The action control of standard implementation to each other Linkage.

In the electronic component mounting system using the SMEMA standards, the control of the electronic component mounting apparatus of upstream side Device（Referred to as upstream control device）With possible signal output portion is taken out of, this takes out of possible signal output portion and will represent in device " Ready OUT " the signals for the substrate that interior presence can take out of（Taking out of may signal）, downstream the electronic unit of side, which is installed, fills The control device put is sent.In addition, in above-mentioned electronic component mounting system, the control of the electronic component mounting apparatus in downstream Device（Referred to as downstream control device）With taking out of request signal output section, this, which takes out of request signal output section and will be used for request, removes Go out " the Board Available IN " signals of circuit substrate（Take out of request signal）, upstream control device transmission.

Also, between above-mentioned upstream control device and downstream control device, take out of possible signal and take out of asking In the case of the transmission/reception for seeking signal, mutual conveying mechanism mutually carries out the transmission of substrate in linkage.

Patent document 1：Japanese Unexamined Patent Publication 2009-278014 publications

In addition, recently, the upstream side of the particularly operating area of the electronic component mounting apparatus in downstream in the device has There is the standby region of substrate.By in the standby region of the substrate, the electronic unit installation exercise knot of the substrate in operating area Next substrate is stored before beam, and makes its standby, is led so as to reduce because the activity duration of each electronic component mounting apparatus is different The operation of cause is stagnated.

In the electronic component mounting system comprising this electronic component mounting apparatus, the big substrate of contrast given size into In the case of row operation, that is, allow to fill to install in electronic unit by the electronic component mounting apparatus of application patent document 1 Large substrate is housed in the operating area put, it is also difficult to substrate transmission is carried out between 2 electronic component mounting apparatus.

That is, if applying SMEMA standards in above-mentioned electronic component mounting system, downstream control device is by substrate At the time of substrate in standby region is delivered in operating area, control device sends and takes out of request signal to the upstream side.At this time, Only there is the storage volume of the substrate for given size in the standby region of the substrate of the electronic component mounting apparatus in downstream In the case of, the large substrate taken out of from the electronic component mounting apparatus of upstream side is difficult to the electronic unit installation dress into downstream The standby region of substrate put.Therefore, the electronic component mounting apparatus of upstream side can not completing substrate take out of action, can not realize The appropriate linkage of conveying action, may produce wrong stopping because conveying bad grade.As a result, production line may be made integrally to stop Only, running rate is greatly reduced.

The content of the invention

It is an object of the present invention to the electronic component mounting system formed in the electronic component mounting apparatus by being connected In, it can realize the good communication than providing big substrate.

The invention that technical solution 1 is recorded is a kind of electronic component mounting system 1, it is from upstream side electronic component mounting apparatus The substrate that the substrate of 10A takes out of the downstream side electronic component mounting apparatus 10B of mouth 313 moves into the transmission that mouth 312 carries out substrate,

It is characterized in that,

The upstream side electronic component mounting apparatus 10A, has in substrate transport path inside it：Operating area 35A, it is used for placement substrate, to carry out the installation of electronic unit；And the standby region 36A of substrate, it makes substrate in the operation Region and the substrate take out of it is standby between mouth,

The downstream electronic component mounting apparatus 10B, has in substrate transport path inside it：Operating area 33B, it is used for placement substrate, to carry out the installation of electronic unit；And the standby region 32B of substrate, it makes substrate in the base Plate move into it is standby between mouth 312 and operating area 33B,

The upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B have respectively：Upstream Side senser 377A, 371B, it is detected substrate in the conveying direction upstream-side-end in the standby region of the substrate；Under Side senser 378A, 372B are swum, it is detected substrate in the conveyance direction downstream side end in the standby region of the substrate； Conveying mechanism 320~360, it carries out the substrate conveying in the standby region of substrate；And the control unit 90 of the conveying mechanism,

The control of the control unit 90A of the upstream side electronic component mounting apparatus and the downstream electronic component mounting apparatus Portion 90B processed can communicate,

To conveying direction width and the upstream side senser from the downstream electronic component mounting apparatus 10B When distance is transmitted compared to bigger large substrate Kl between sensors of the 371B untill the downstream side senser 372B,

The electronic component mounting system 1 carries out temporarily ceasing control and starts again at control, wherein,

In control is temporarily ceased, the control unit 90B of the downstream electronic component mounting apparatus, according to passing through the downstream Detections of the downstream side senser 372B of side electronic component mounting apparatus to the front end of large substrate, makes the downstream The conveying of the conveying mechanism of electronic component mounting apparatus temporarily ceases, also, the upstream side electronic component mounting apparatus Control unit 90A, receive the conveying of the control unit from the downstream electronic component mounting apparatus temporarily cease it is logical Know（Switching of the R signal to off-state）, make the conveying of the conveying mechanism of the upstream side electronic component mounting apparatus 10A Temporarily cease,

In control is started again at, the control unit 90B of the downstream electronic component mounting apparatus, if it is decided that be under this The operating area 33B for swimming side electronic component mounting apparatus is dummy status, then makes the institute of the downstream electronic component mounting apparatus The conveying for stating conveying mechanism starts again at, also, the control unit 10A of the upstream side electronic component mounting apparatus, reception come from The downstream electronic component mounting apparatus it is control unit 90B, permit work to the downstream electronic component mounting apparatus The notice that industry region is moved into（Switching of the R signal to off-state）, make the described defeated of the upstream side electronic component mounting apparatus The conveying of mechanism is sent to start again at.

In addition, " front end of substrate " represents the end of the conveyance direction downstream side of substrate, " rearward end of substrate " represents The end of the conveying direction upstream side of substrate.It is same as below.

The invention that technical solution 2 is recorded is characterized in that thering is the structure identical with the invention that technical solution 1 is recorded, and And

It is less than or equal to conveying direction width from the upstream side of the downstream electronic component mounting apparatus 10B The substrate K of the given size of distance is transmitted between sensors of the sensor 371B untill the downstream side senser 372B When,

The electronic component mounting system 1 carries out conveying control, in conveying control,

The control unit 90A of the upstream side electronic component mounting apparatus, utilizes the upstream side electronic component mounting apparatus Downstream side senser 378A, by being detected, makes the described of the upstream side electronic component mounting apparatus to substrate rearward end Conveying mechanism stops, the control unit 90B of the downstream electronic component mounting apparatus, utilizes the downstream electronic unit installation dress Arrival of the downstream side senser 372B put to substrate front end is detected, and makes the downstream electronic component mounting apparatus The conveying mechanism of 10B stops.

The invention that technical solution 3 is recorded is characterized in that thering is the structure identical with the invention that technical solution 1 is recorded, and And

With substrate size judgement unit, it judges the conveying direction width for the substrate installed, if than from described Biographies of the upstream side senser 371B of downstream electronic component mounting apparatus 10B untill the downstream side senser 372B Distance is big between sensor.

The invention that technical solution 4 is recorded is a kind of substrate carrying method of electronic component mounting system 1, it is electric from upstream side The substrate of subassembly erecting device 10A take out of the downstream side electronic component mounting apparatus 10B of mouth 313 substrate move into mouth 312 into The transmission of row substrate,

It is characterized in that,

The upstream side electronic component mounting apparatus 10A, has in substrate transport path inside it：Operating area 35A, it is used for placement substrate, to carry out the installation of electronic unit；And the standby region 36A of substrate, it makes substrate in the operation Region and the substrate take out of it is standby between mouth 313,

The downstream electronic component mounting apparatus 10B, has in substrate transport path inside it：Operating area 33B, it is used for placement substrate, to carry out the installation of electronic unit；And the standby region 32B of substrate, it makes substrate in the base Plate move into it is standby between mouth 312 and the operating area,

The upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B have respectively：Upstream Side senser 377A, 371B, it is detected substrate in the conveying direction upstream-side-end in the standby region of the substrate；Under Side senser 378A, 372B are swum, it is detected substrate in the conveyance direction downstream side end in the standby region of the substrate； Conveying mechanism 320~360, it carries out the substrate conveying in the standby region of substrate；And the control unit 90 of the conveying mechanism,

The control of the control unit 90A of the upstream side electronic component mounting apparatus and the downstream electronic component mounting apparatus Portion 90B processed can communicate,

In order to conveying direction width and the upstream side senser from the downstream electronic component mounting apparatus 10B Distance is transmitted compared to bigger large substrate between sensors of the 371B untill the downstream side senser 372B,

The substrate carrying method of the electronic component mounting system 1 has following processes：

The control unit 90B of the downstream electronic component mounting apparatus, is filled according to using the downstream electronic unit installation The detection of arrival of the downstream side senser 372B put to large substrate front end, installs the downstream electronic unit The process that the conveying of the conveying mechanism of device temporarily ceases；

Controls of the control unit 90B of the downstream electronic component mounting apparatus to the upstream side electronic component mounting apparatus The process that portion 90A processed carries out the notice for conveying and temporarily ceasing；

The control unit 90A of the upstream side electronic component mounting apparatus receives the notice for conveying and temporarily ceasing, and makes institute State the process that the conveying of the conveying mechanism of upstream side electronic component mounting apparatus 10A temporarily ceases；

The control unit 90B of the downstream electronic component mounting apparatus, if it is decided that for the downstream electronic unit installation The operating area 33B of device is dummy status, then makes the conveying of the conveying mechanism of the downstream electronic component mounting apparatus The process started again at；

Controls of the control unit 90B of the downstream electronic component mounting apparatus to the upstream side electronic component mounting apparatus Portion processed, the process that notice license is moved into the operating area of the downstream electronic component mounting apparatus；And

The control unit 90A of the upstream side electronic component mounting apparatus is received from downstream electronic unit installation dress Notice control unit 90B, permitting the operating area to the downstream electronic component mounting apparatus to move into put, makes on described Swim the process that the conveying of the conveying mechanism of side electronic component mounting apparatus starts again at.

The effect of invention

The invention that technical solution 1,3 and 4 is recorded, electronic component mounting apparatus and the installation of downstream electronic unit in upstream side In the transmission of large substrate between device, downstream electronic component mounting apparatus is based on the base carried out using downstream side senser The detection that plate reaches, temporarily ceases the conveying of substrate, also, receives the notice that conveying stops, the installation of upstream side electronic unit The control that the control unit of device is temporarily ceased into enforcement conveying motor.Therefore, upstream side electronic component mounting apparatus and downstream Side electronic component mounting apparatus can stop the conveying of substrate in linkage, can not make the end of downstream side of large substrate downstream Side electronic component mounting apparatus operating area protrusion and it is standby in the standby region of the substrate.

Also, due to receiving the downstream to standby region of the control device from downstream electronic component mounting apparatus What operating area was moved into moves into the notice of license, and upstream side electronic component mounting apparatus starts again at the conveying of conveying mechanism, institute Can discharge large substrate from the standby region of substrate of upstream side electronic component mounting apparatus, in downstream, electronic unit is pacified Large substrate is stored in the operating area of assembling device.

It is as noted above, since upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus are suitably realized Link and carry out the conveying of large substrate, even so in the standby region of substrate of downstream electronic component mounting apparatus nothing The large substrate of the size of method storage, also can suitably and successfully be transmitted, can be effectively prevented from the reduction of running rate.

The invention that technical solution 2 is recorded, is conveying compared with distance between the sensor of downstream electronic component mounting apparatus During the transmission of the substrate of the less given size of direction width, the control device progress of upstream side electronic component mounting apparatus is following Conveying control, i.e. the rearward end of substrate is detected in the downstream side senser using the upstream side electronic component mounting apparatus By rear, stop conveying mechanism, downstream electronic component mounting apparatus carries out following conveying controls, i.e. is utilizing the downstream After the downstream side senser of side electronic component mounting apparatus detects the arrival of the front end of substrate, stop conveying mechanism, because This, can build electronic component mounting system, it is in upstream side electronic component mounting apparatus and downstream electronic unit installation dress Between putting, both substrates and large substrate of given size can suitably be transmitted.

Brief description of the drawings

Fig. 1 is the top view of the electronic component mounting system involved by present embodiment.

Fig. 2 is the top view of the electronic component mounting apparatus included in electronic component mounting system.

Fig. 3 is the summary construction diagram of the base board delivery device of electronic component mounting apparatus.

Fig. 4 is the figure of the base board delivery device from conveying direction.

Fig. 5 is the block diagram for the control system for representing electronic component mounting apparatus.

Fig. 6 is the flow chart of the processing of each control device when representing to perform the transmission control of usual substrate.

Fig. 7 is the action specification figure of the transmission action in the transmission control for represent usual substrate.

Fig. 8 is the action specification figure after Fig. 7 of the transmission action in the transmission control for represent usual substrate.

Fig. 9 is the action specification figure after Fig. 8 of the transmission action in the transmission control for represent usual substrate.

Figure 10 is the flow chart of the processing of each control device when representing to perform the transmission control of large substrate.

Figure 11 is the stream after Figure 10 of the processing of each control device when representing to perform the transmission control of large substrate Cheng Tu.

Figure 12 is the action specification figure of the transmission action in the transmission control for represent large substrate.

Figure 13 is the action specification figure after Figure 12 of the transmission action in the transmission control for represent large substrate.

Figure 14 is the action specification figure after Figure 13 of the transmission action in the transmission control for represent large substrate.

The explanation of symbol

1 electronic component mounting system

10 electronic component mounting apparatus

10A upstream sides electronic component mounting apparatus

10B downstreams electronic component mounting apparatus

15th, 15A, 15B communication interface

16 communication cables

30 base board delivery devices

32nd, 32A, 32B move into buffer area（The standby region of substrate）

33rd, 33A, 33B, 35,35A, 35B band of position（Operating area）

36th, 36A, 36B take out of buffer area（The standby region of substrate）

90th, 90A, 90B control device（Control unit）

312nd, 312A, 312B substrate move into mouth

313rd, 313A, 313B substrate take out of mouth

320~360 conveying mechanisms

322~362,322A~362A, 322B~362B convey motor

371st, 377,371A, 377A, 371B, 377B substrate sensor（Upstream side senser）

372nd, 378,372A, 378A, 372B, 378B substrate sensor（Downstream side senser）

373~376,373A~376A, 373B~376B substrate sensors

K substrates

Kl large substrates

Embodiment

［ overall structure of the embodiment of invention ］

Based on Fig. 1 to Figure 14, embodiments of the present invention are illustrated.

Fig. 1 is the top view of the electronic component mounting system 1 involved by present embodiment.The electronic component mounting system 1 Between 2 electronic component mounting apparatus 10,10 being formed in by 2 electronic component mounting apparatus 1010, base board delivery device 30 Substrate takes out of mouth 313 and substrate move into mouth 312 be configured to it is close and opposite.As a result, 2 electronic component mounting apparatus 10, The transmission of substrate K can be carried out between 10.

In addition, electronic component mounting system 1, especially in 2 electronic component mounting apparatus for being arranged Between substrate K transmit construction, control, there is feature on transmission method.As one example, exemplify same by 2 The electronic component mounting system 1 that the electronic component mounting apparatus 10,10 of form is arranged, but it is not particularly limited to the knot Structure, for example, it is also possible to which various forms of electronic component mounting apparatus are arranged, can also configure more than or equal to 3 side by side Platform.

［ summary of electronic component mounting apparatus ］

Fig. 2 is the top view of electronic component mounting apparatus 10.

The electronic component mounting apparatus 10 mainly has components described below and forms as shown in the figure：As electronic unit supply unit Feeder receptacle 20, its will for supply the electronic unit to be carried multiple electronic component feeders 21 arrange holding； Base board delivery device 30, portion conveys substrate K along fixed conveying direction in the device for it；And boarded head 40, it is from electronics Part feeder 21 receive electronic unit, to substrate K on install.

In addition, electronic component mounting apparatus 10 mainly has components described below and forms：X- as boarded head mobile unit Y portal frames 50, optional position of the boarded head 40 into prescribed limit is driven conveying by it；Component camera 11, it is from below The electronic unit being maintained on boarded head 40 is shot；Substrate camera 12, it is mounted on boarded head 40, to setting Base plate mark (not shown) on substrate K is shot；Control device 90, its each structure to electronic component mounting apparatus 10 It is controlled；And main frame 13, it is supported overall structure.

In addition, in the following description, will be defeated in the inner utilization base board delivery device 30 of electronic component mounting apparatus 10 The direction of substrate K is sent as X-direction, will be orthogonal with X-direction and Z-direction using vertical above-below direction as Z-direction Direction is as Y direction, and under the proper use of state of electronic component mounting apparatus 10, device is arranged to make X-direction and Y Direction of principal axis becomes level.

In addition, the electronic component mounting apparatus 10 leaning in the transport path using 30 conveying substrate K of base board delivery device Upstream side and 2 positions of downstream, have the band of position 33,35 as operating area, it is used to carry out electricity to substrate K The installation exercise of subassembly.Across base board delivery device 30 in the both sides of this 2 band of position 33,35, be respectively arranged with 2, Add up to 4 feeder receptacles 20,20.In addition, boarded head 40 and X-Y portal frames 50 are also opposite with feeder receptacle 20 Answer and respectively carry 4.

［ electronic component mounting apparatus：Feeder receptacle ］

In each feeder receptacle 20, multiple electronic component feeders 21 are placed with along X-direction arrangement.

In each electronic component feeder 21, electronic unit is arranged as a row and is formed after encapsulating supplementary part supply band, From spool（Illustration omitted）Supplied to end thereafter.The supplementary part supply band of supply, which is transported to, is arranged on electronic component feeder 21 Front end（The end of transport path side）The component of upside transmits position.

Then, position is transmitted in the component, using the absorption suction nozzle 41 carried on boarded head 40 in supplementary part supply band Electronic unit is adsorbed.

［ electronic component mounting apparatus：Boarded head ］

Each boarded head 40 is provided with as shown in the figure：6 absorption suction nozzles 41, their front end by attract air and Keep electronic unit；Z axis motor 42 as driving source（With reference to Fig. 5）, it makes the absorption suction nozzle 41 be lifted along Z-direction； And the θ axis motor 43 as rotary driving source（With reference to Fig. 5）, it is by the electronic unit kept via absorption suction nozzle 41 with Z Direction of principal axis pivots about driving.

Each absorption suction nozzle 41 is connected with negative pressure generating device, by being attracted in the bottom of the absorption suction nozzle 41, from And adsorb, keep electronic unit.

In addition, the quantity of Z axis motor 42 and θ axis motor 43 is identical with absorption suction nozzle 41, it is mounted on boarded head 40.

In addition, the radical of the absorption suction nozzle 41 carried on boarded head 40 is not limited to 6, can also be increased and decreased.

［ electronic component mounting apparatus：Each camera ］

Component camera 11 and substrate camera 12 are CCD camera or CMOS camera.

Component camera 11 and each 40 assigned position that is corresponding and being respectively and fixedly installed to main frame 13 of boarded head（Example Such as, between feeder receptacle 20 and substrate transport path）.Each component camera 11 makes sight from main frame 13 towards vertical Top, when boarded head 40 is by its field range, is clapped adsorbing the electronic unit adsorbed on suction nozzle 41 at it from below Take the photograph.

Using image processing apparatus (not shown), image procossing is carried out with the captured image data of camera 11 to component, Offset to the center between the direction of electronic unit and absorption suction nozzle 41 and electronic unit that photograph calculates. Then, X-Y portal frames described later are being modified and utilized to the direction of electronic unit using above-mentioned θ axis motor 43 After the offset of the center of 50 pairs of electronic units is corrected, the installation of electronic unit is carried out.

In addition, substrate is mounted on boarded head 40 with camera 12 with the state of sight downward, it is pointed to from top The base plate mark of the substrate K of operating area is shot.Using image processing apparatus (not shown), to substrate camera 12 Captured image data carries out image procossing, according to offset and inclination of the position of the base plate mark photographed to the position of substrate K Calculated.Then, when carrying out the positioning of boarded head 40 using X-Y portal frames 50, it is reflected into the position correction of boarded head 40 In.

［ electronic component mounting apparatus：X-Y portal frames ］

Each X-Y portal frames 50 have：X-axis guide rail 51, it supports boarded head 40, boarded head 40 can be made to be moved along X-direction It is dynamic；Y-axis guide rail 52,52, it supports boarded head 40 via the X-axis guide rail 51, boarded head 40 can be made to be moved along Y direction；Make For the X-axis motor 53 of driving source（With reference to Fig. 5）, it makes boarded head 40 be moved along X-direction；And the Y-axis as driving source Motor 54（With reference to Fig. 5）, it makes boarded head 40 be moved along Y direction via X-axis guide rail 51.

And it is possible to by the driving of each motor 53,54, using boarded head 40 to the band of position 33 or 35 as object Overall conveying.

In addition, convey 2 X-Y portal frames of boarded head 40 relative to the substrate K of the identical band of position 33 or 35 50th, 50, share 2 Y-axis guide rails 52,52.

In addition, on each motor 53,54, the encoder being detected to respective rotation amount is installed, this is rotated Angle is inputted to control device 90.Thus, control device 90 is controlled each motor 53,54, carries out each of boarded head 40 From absorption suction nozzle 41 and substrate camera 12 positioning.

［ electronic component mounting apparatus：Base board delivery device ］

Fig. 3 is the explanatory drawin of structure when briefly showing the vertical view of base board delivery device 30.Fig. 4 is from substrate conveying side To the side view of the conveying mechanism described later 330,350 of observation base board delivery device 30.

As shown in Fig. 2, base board delivery device 30 has the substrate pressing plate 311,311 of a pair of of strip, the substrate pressing plate 311st, 311 configured in parallel with each other, the substrate pressing plate across the total length in the X-direction of electronic component mounting apparatus 10 311st, substrate transport path is become between 311.In addition, the upstream side of the substrate conveying direction of a pair of of substrate pressing plate 311,311 Mouth 312 is moved into end as substrate, and end of downstream side takes out of mouth 313 as substrate.

In addition, as shown in figure 3, in substrate transport path between above-mentioned a pair of of substrate pressing plate 311,311, from substrate Move into mouth 312 and take out of mouth 313 towards substrate and sequentially form：The standby region of substrate as upstream side move into buffer area 32, The band of position 33 as the operating area of upstream side, connection buffer area 34, as downstream operating area position area Domain 35, the substrate standby region as downstream take out of buffer area 36.

As shown in figure 3, aforesaid substrate conveying device 30 is provided with conveyer in each region 32~36 on transport path Structure 320~360.

Each conveying mechanism 320~360 has：A pair of of substrate conveyer belt 321~361, its Y-axis in regional 32~36 Both ends on direction, are set with being tensioned with the roughly equal length of the X-direction length in each region 32~36；And conveying Motor 322~362, it applies the conveying to substrate conveying direction via belt pulley for feeding foil to aforesaid substrate conveyer belt 321~361 Action.

In addition, the conveying mechanism 330,350 of the band of position 33 and 35 as shown in figure 4, supporting substrate conveyer belt 331,351 and Its support structure 333,353, and them can be moved up and down, the substrate shown in Fig. 2 can be utilized to keep motor 334,354 Lift substrate conveyer belt 331,351.

Substrate pressing plate 311,311 is as noted above, the plate for the strip for being across the total length of substrate transport path and configuring Shape body.The substrate conveyer belt 321~361 of above-mentioned each conveying mechanism 320~360 the downside of substrate pressing plate 311 across Gap and close to configuration.In addition, substrate pressing plate 311 and substrate conveyer belt 321~361 are parallel with X-direction, substrate is pressed The lower surface of pressing plate 311 and the upper surface of substrate conveyer belt 321~361 become level.

Substrate K is positioned on a pair of of substrate conveyer belt 321~361, by conveying the driving of motor 322~362, with Conveyed in gap between substrate pressing plate 311 to defined conveying direction.

In addition, the conveying mechanism 330,350 of the band of position 33 and 35, keeps motor 334,354 to make by using substrate Substrate conveyer belt 331,351 rises, so as to keep base between the substrate conveyer belt 331,351 and substrate pressing plate 311 Plate K.

That is, in the above-mentioned band of position 33 and 35, the installation action of electronic unit is carried out to substrate K, therefore, passes through stabilization Ground keeps substrate K, the accurate positionin so as to fulfill electronic unit relative to substrate K.

In addition, base board delivery device 30 has：First substrate sensor 371 as upstream side senser（Hereinafter, by base The upstream of sheet conveying direction is referred to as " upstream "）, it is carried out in the substrate conveying direction upstream-side-end for moving into buffer area 32 The detection of substrate K；Second substrate sensor 372 as downstream side senser（Hereinafter, by the downstream of substrate conveying direction referred to as For " downstream "）, it is in the substrate conveyance direction downstream side end for moving into buffer area 32（The upstream-side-end of the band of position 33） Carry out the detection of substrate K；3rd substrate sensor 373, its end of downstream side in the band of position 33 carry out the detection of substrate K； Tetrabasal sensor 374, its upstream-side-end in connection buffer area 34 carry out the detection of substrate K；5th substrate senses Device 375, it is in the substrate conveyance direction downstream side end of connection buffer area 34（The upstream-side-end of the band of position 35）Carry out The detection of substrate K；6th substrate sensor 376, its end of downstream side in the band of position 35 carry out the detection of substrate K；As 7th substrate sensor 377 of upstream side senser, it carries out the inspection of substrate K in the upstream-side-end for taking out of buffer area 36 Survey；And the 8th substrate sensor 378 as downstream side senser, it is carried out in the end of downstream side for taking out of buffer area 36 The detection of substrate K.

Above-mentioned first and the 8th substrate sensor 371,378 be optical profile type to thing sensor, pass through in substrate K above it When the reflected light of carrying out self-reference substrate K is detected.

In addition, the second~the 7th substrate sensor 372~377 be optical profile type to thing sensor, by light source and light accepting part Form, substrate K by when, the irradiation light from light source is blocked by substrate K, and substrate K is detected using light accepting part.

［ control system of electronic component mounting apparatus ］

In the following, the block diagram based on Fig. 5, illustrates the control system of electronic component mounting apparatus 10.

The X-axis motor 53 and Y-axis motor 54 of above-mentioned X-Y portal frames 50 and carried on boarded head 40 Z axis motor 42 and θ axis motor 43, are connected through not shown drive circuit with control device 90 respectively.

In addition, component is controlled with camera 11 and substrate with the shooting action of camera 12 by control device 90 System.In addition, above-mentioned component with the captured image data of camera 11 and substrate camera 12 to image procossing (not shown) Device exports, and handling result is exported to control device 90.

In addition, above-mentioned each motor 42,43,53,54 and each camera 11,12 are on electronic component mounting apparatus 10 Carry multiple, but only illustrate one in Figure 5, remaining omission.

In addition, being connected with conveying motor 322~362 through not shown drive circuit on control device 90, this is defeated Power transmission motivation 322~362 carries out substrate conveying respectively in each region 32~36 of above-mentioned base board delivery device 30.In addition, Base board delivery device 30 transport path the install everywhere first~the 8th substrate sensor 371~378 via not shown Interface be connected with control device 90, by substrate detection signal inputted to control device 90.Thus, control device 90 is as progress The control unit of the action control of each conveying mechanism 320~360 works.

In addition, being connected with operation panel 14 on control device 90, which is installed dynamic by carry out electronic unit The input unit of various settings input operation in work and the display unit composition for carrying out various presentation of information.

In addition, electronic component mounting apparatus 10 is for the transmission control with other electronic component mounting apparatus 10 progress substrate K System, and there is communication interface 15, which is used between other electronic component mounting apparatus 10, carries out each other Control device 90 control signal transmission/reception.

The communication interface 15 meets so-called SMEMA（Surface Mount Equtpment Manufacturers Association）Standard, is provided with for connection communication cable 16（With reference to Fig. 7,12）Defined connector, the communication electricity Cable 16 is used to carry out the communication between 2 control devices 90,90.

In addition, the communication interface 15 has upstream-side connector and downstream-side connector, can be relative to the electronic unit Erecting device 10 connects other electronic component mounting apparatus 10 in substrate conveying direction upstream side with this both sides in downstream, carries out The transmission control of substrate K.That is, if it can also in series build and be linked with more using the electronic component mounting apparatus 10 Electronic component mounting apparatus 10 electronic component mounting system.

Control device 90 mainly has：EEPROM94, it stores the list of the electronic unit as mounting object and peace Planning data is filled, carrying order, carrying of each electronic unit on substrate K of electronic unit are determined in the erection schedule data Position, represent each electronic unit from reception position which electronic component feeder 21 is received etc.；ROM92, it is stored with peace Fill the executive program of operation control program and substrate transmission described later control；CPU91, it performs various programs；And RAM93, It becomes data storage areas in the execution of various programs.

Also, when installing electronic unit, the CPU91 for performing installation action control program is based on erection schedule data, to X Axis and Y-axis motor 53,54 are controlled, and thus, the absorption suction nozzle 41 of boarded head 40 are positioned at defined electronic unit and is supplied To the reception position of device 21, Z axis motor 42 is controlled, electronic unit is adsorbed using suction nozzle 41 is adsorbed.In addition, make carrying First 40 top by component with camera 11, and shot from below, to the substrate determined in erection schedule data Installation site conveys electronic unit.Then, the position correction of electronic unit is carried out using X-axis and Y-axis motor 53,54, and The amendment of direction is carried out using θ axis motor 43, while declines electronic unit using Z axis motor 42, performs installation action.

In addition, in the case of being had determined in erection schedule data, making, multiple absorption suction nozzles 41 of boarded head 40 are same When or successively carry out electronic unit absorption action after, to substrate K carry out installation action.

［ the transmission control of substrate ］

In the following, the substrate for the electronic component mounting system 1 that 2 above-mentioned electronic component mounting apparatus 10 are formed by connecting by explanation The transmission control of K.

In following record, the biography in 2 electronic component mounting apparatus 10 of the transmission control that will can carry out substrate K The electronic component mounting apparatus 10 of direction upstream side is passed, as " upstream side electronic component mounting apparatus 10A ", by under direction of transfer The electronic component mounting apparatus of side is swum, as " downstream electronic component mounting apparatus 10B ".Accompany with this, for upstream side electricity Each structure of subassembly erecting device 10A and downstream electronic component mounting apparatus 10B, each component, by the end of label Additional " A ", " B " and distinguish.

In the electronic component mounting system 1, the conveying direction width with substrate K（The length of substrate in X-direction. Hereinafter referred to as substrate size）Corresponding, the transmission control of substrate is different.

The transmission control of substrate size, buffering is moved into according to substrate size and downstream electronic component mounting apparatus 10B Relation between the length that region 32B can be housed, is divided into 2 kinds of methods.

The length that buffer area 32B can be housed is moved into, with the slave first substrate sensor 371B in X-direction to Distance is equal between sensor untill two substrate sensor 372B.

In the case where substrate size is less than or equal to and moves into the length that buffer area 32 can house, as regulation ruler Very little substrate K and the transmission control for carrying out usual substrate, the length moved into buffer area 32 and can housed is more than in substrate size In the case of degree, the transmission control of large substrate is carried out.The energy of buffer area 32 is moved into the following, substrate size is less than or equal to The substrate of the given size of the length enough housed is set to substrate K, will be greater than moving into the length that buffer area 32 can house Substrate is set to large substrate Kl.

［ the transmission control of substrate：The transmission control of usual substrate ］

First, the transmission control to usual substrate illustrates.If operating personnel install from upstream side electronic unit and fill The operation panel 14 of some put in 10A and downstream electronic component mounting apparatus 10B presets input substrate size, then base Board size information is by communication interface 15 and shared in each control device 90A, 90B.

Then, each control dress of upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B 90A, 90B are put, can be housed to whether the substrate size inputted is less than or equal to downstream electronic component mounting apparatus 10B Size judged, and determine be implement usual substrate transmission control, or implement large substrate transmission control.Due to Each control device 90A, 90B are previously stored with the size that downstream electronic component mounting apparatus 10B can be housed, more than The result for stating judgement is identical.

In addition it is also possible to only judged to implement which kind of substrate transmission controls, and is sentenced by some control device 90A or 90B Determine result to communicate to another control device 90B or 90A.

Fig. 6 be the upstream side electronic component mounting apparatus 10A for representing electronic component mounting system 1 control device 90A and The control device 90B of downstream electronic component mounting apparatus 10B performs the transmission control of usual substrate（Conveying control）Shi Jinhang Each processing flow chart, Fig. 7~Fig. 9 be represent usual substrate transmission control in transmission action action specification figure. In addition, the label 16 in Fig. 7~Fig. 9 be by communication interface 15A, 15B of control device 90A and control device 90B communicably The communication cable of connection.

The transmission control of the usual substrate is the control according to above-mentioned SMEMA standards progress.The transmission control of usual substrate System, as shown in fig. 7, by upstream side electronic component mounting apparatus 10A to take out of the standby substrate K of buffer area 36A downward When moving into buffer area 32B conveyings of trip side electronic component mounting apparatus 10B, is performed.

First, in the electronic component mounting apparatus 10B of downstream, if 32B standby substrate K in buffer area will moved into Conveyed to band of position 33B, making to move into buffer area 32B becomes dummy status, then control device 90B is by " Ready OUT " signals （It is known as " R signal " in the following description and attached drawing）As the notice for moving into license, sent out with on-state to control device 90A Send（Step T1）.

On the other hand, the control device 90A of upstream side electronic component mounting apparatus 10A periodically waits for R signal Input（Step S1）If receiving the on-state for the R signal for carrying out self-control device 90B, from control device 90A to control Device 90B processed sends " Board Available IN " signals with on-state（It is known as " B letters in the following description and attached drawing Number "）（Step S3）.

The control device 90B of downstream electronic component mounting apparatus 10B periodically waits for the input of B signal（Step Rapid T3）If receiving the on-state for the B signal for carrying out self-control device 90A, waited using first substrate sensor 371B Carry out the front end of substrate K（End of downstream side）Detection（Step T5）.

On the other hand, in the electronic component mounting apparatus 10A of upstream side, after B signal is sent, make to take out of buffer area The conveying motor 362A drivings of 36A, move into a mouthful 312B towards the substrate of downstream electronic component mounting apparatus 10B and start substrate The conveying of K（Step S5）.

Thus, if detecting substrate K using the first substrate sensor 371B of downstream electronic component mounting apparatus 10B Front end, then control device 90B make to move into the conveying motor 322B drivings of buffer area 32B, start the collecting of substrate K （Step T7）.

In the electronic component mounting apparatus 10A of upstream side, after waiting for substrate K using the 8th substrate sensor 378A End（Upstream-side-end）The detection passed through（Step S7）If after detecting substrate K using the 8th substrate sensor 378A End passes through（Sensor output disconnects）, then control device 90A make to take out of the conveying motor 362A of buffer area 36A and stop （Step S9：The state of Fig. 8）.

Then, control device 90A will be set to off-state for the B signal of control device 90B（Step S11）.

On the other hand, the control device 90B of the downstream electronic component mounting apparatus 10B periodically disconnections to B signal The switching of state is monitored（Step T9）If detecting that the B signal for carrying out self-control device 90A has been switched to off-state, Then control device 90B also will be switched to off-state for the R signal of control device 90A（Step T11）.

The control device 90A of the upstream side electronic component mounting apparatus 10A periodically switchings to the off-state of R signal Monitored（Step S13）If detect that the R signal for carrying out self-control device 90B has been switched to off-state, control device 90A terminates the transmission control of usual substrate.

On the other hand, in the electronic component mounting apparatus 10B of downstream, after R signal is switched to off-state, utilize Second substrate sensor 372B waits the arrival of the front end of substrate K（Step T13）If utilize second substrate sensor 372B Detect the front end of substrate K, then control device 90B stops the conveying motor 322B for moving into buffer area 32B（Step T15：The state of Fig. 9）.

Thus, from the usual substrate of upstream side electronic component mounting apparatus 10A downstream side electronic component mounting apparatus 10B Transmission control terminate.

In addition, when conveying common substrate, for upstream side electronic component mounting apparatus 10A and the downstream ministry of electronics industry Both part erecting device 10B, respective substrate sensor is measured as the elapsed time after substrate detection state, The elapsed time exceeds schedule time in the case of also not becoming non-detection status, is determined as timing error, by using behaviour The display unit for making panel 14A, 14B carries out wrong display, and is notified.

In addition, when conveying common substrate, for upstream side electronic component mounting apparatus 10A and the downstream ministry of electronics industry Both part erecting device 10B, the substrate detection state of the substrate sensor of upstream side and downstream to each region 32~36 Monitored, substrate size mistake is monitored.

That is, for the first substrate sensor 371 as the upstream side for moving into buffer area 32 and as downstream Two substrate sensors 372, as the band of position 33 upstream side second substrate sensor 372 and the 3rd base as downstream Plate sensor 373, the tetrabasal sensor 374 as the upstream side for connecting buffer area 34 and the 5th base as downstream Plate sensor 375, as the band of position 35 upstream side the 5th substrate sensor 375 and as downstream the 6th substrate pass Sensor 376, the 7th substrate sensor 377 as the upstream side for taking out of buffer area 36 and the 8th substrate as downstream pass Whether the respective paired sensor of sensor 378, monitor 2 sensors at the same time as substrate detection state.

In the case of being common substrate size in substrate, above-mentioned paired sensor will not become detection shape at the same time State, so in the case of just in case becoming detection state at the same time between above-mentioned respective paired sensor, is determined as substrate size Mistake, wrong display is carried out by using the display unit of operation panel 14A, 14B, and is notified.

［ the transmission control of substrate：The transmission control of large substrate ］

In the following, the transmission control to large substrate illustrates.

Figure 10 and Figure 11 is the control dress for the upstream side electronic component mounting apparatus 10A for representing electronic component mounting system 1 The control device 90B for putting 90A and downstream electronic component mounting apparatus 10B performs what is carried out during the transmission control of large substrate Kl The flow chart of each processing, Figure 12~Figure 14 are the action specifications of the transmission action in the transmission control for represent large substrate Kl Figure.

The transmission control of large substrate Kl, a part according to above-mentioned SMEMA standards, mutual control device 90A, " Ready OUT " signals are carried out between 90B（R signal）" Board Available IN " signals（B signal）Transmission/connect Receive, realize the linkage of action control.

The transmission control of the large substrate is as shown in figure 12, and in upstream side, electronic component mounting apparatus 10A's takes out of buffering In the 36A of region, do not make large substrate Kl standby, it is slow from band of position 35A to moving into for downstream electronic component mounting apparatus 10B Rush untill the 32B of region not stoppingly transportation large-scale substrate Kl.

First, in the electronic component mounting apparatus 10B of downstream, the standby large substrates of buffer area 32B will moved into Kl is conveyed to band of position 33B, if moving into buffer area 32B becomes dummy status, in control device 90B, as moving into The notice of license, R signal is sent with on-state to control device 90A（Step T21）.

On the other hand, the control device 90A of upstream side electronic component mounting apparatus 10A periodically waits for R signal Input（Step S21）If receiving the on-state for the R signal for carrying out self-control device 90B, from control device 90A to Control device 90B sends B signal with on-state（Step S23）.

In addition, control device 90A drives the conveying motor 352A of band of position 35A, initially towards taking out of buffering area Domain 36A carries out the conveying of large substrate Kl（Step S25）.

In addition, after the conveying of large substrate Kl starts, control device 90A is periodically with the 7th substrate sensor 377A waits the front end for detecting large substrate Kl（Step S27）, if it is detected control device 90A makes to take out of buffering The conveying motor 362A drivings of region 36A, take out of mouthful 313A towards substrate by large substrate Kl and convey（Step S29）.

Then, it is if sharp from band of position 35A to buffer area 36A transportation large-scales substrate Kl, control device 90A is taken out of The detection passed through of the rearward end of large substrate Kl is waited for the 6th substrate sensor 376A（Step S31）If utilize 6th substrate sensor 376A detects passing through for the rearward end of large substrate Kl（Sensor output disconnects）, then control device 90A stops the conveying motor 362A of band of position 35A（Step S33）.

On the other hand, the control device 90B of downstream electronic component mounting apparatus 10B periodically waits for B signal Input（Step T23）If the on-state for the B signal for carrying out self-control device 90A is received, etc. first substrate to be utilized Sensor 371B carries out the detection of the front end of large substrate Kl（Step T25）.

Then, using the conveying for taking out of buffer area 36A in upstream side electronic component mounting apparatus 10A, from its substrate The substrate for taking out of mouthful 313A downstream side electronic component mounting apparatus 10B moves into a mouthful 312B transportation large-scale substrate Kl, if utilized The first substrate sensor 371B of downstream electronic component mounting apparatus 10B detects the front end of large substrate Kl, then controls Device 90B makes the conveying motor 322B drivings for moving into buffer area 32B, starts the collecting of large substrate Kl（Step T27）.

In addition, in the electronic component mounting apparatus 10B of downstream, second substrate sensor 372B to be utilized is waited to carry out large-scale The detection of the front end of substrate Kl（Step T29）If before detecting large substrate Kl using second substrate sensor 372B End, then control device 90B make to move into the conveying motor 322B of buffer area 32B and stop（Step T31：Make downstream electronics The process that apparatus for mounting component temporarily ceases conveying, the state of Figure 13）.

Then, in control device 90B, the notice that is temporarily ceased as the conveying for control device 90A, by R signal It is switched to off-state（Step T33：The process of the notice temporarily ceased）.

The control device 90A of upstream side electronic component mounting apparatus 10A, substrate is detected in the 8th substrate sensor 378A In the state of, come self-control device 90B R signal become off-state in the case of, be judged as in large substrate Kl cross over State between device.Control device 90A is after the conveying motor 352A of band of position 35A stops, periodically to R signal The switching of off-state monitored（Step S35）If detect that the R signal for carrying out self-control device 90B is switched to disconnection The situation and substrate sensor 378A of state detect the situation of state for substrate, then in control device 90A, as temporarily stopping Only control, stop the conveying motor 362A for taking out of buffer area 36A（Step S37：Make upstream side electronic component mounting apparatus The process for temporarily ceasing conveying）.

In addition, maintain to send to downstream electronic component mounting apparatus 10B's from upstream side electronic component mounting apparatus 10A The on-state of B signal.

In addition, if when the R signal for carrying out self-control device 90B is switched to off-state, substrate sensor 378A is base Plate does not detect state, then control device 90A is judged as that large substrate Kl is taken out of completely.

After this, other large substrates Kl above is by from the position area in the electronic component mounting apparatus 10B of downstream Downstream side conveys domain 33B, until band of position 33B as untill dummy status, move into the large substrate Kl of buffer area 32B into For holding state.

That is, control device 90B by other large substrates Kl above, from band of position 33B, downstream send out by side, by right Whether substrate sensor 373B and substrate sensor 374B is that the state that substrate does not detect is judged, so as to position area Whether domain 33B is monitored as dummy status（Step T35）, in the case where being determined as dummy status, control device 90B starts to remove Enter the driving of the conveying motor 332B of the conveying motor 322B and band of position 33B of buffer area 32B.

In addition, at the same time, in control device 90B, as moving into the notice of license again by R signal with on-state Sent to control device 90A（Step T37：Downstream electronic component mounting apparatus is set to start again at the process and notice of conveying The downstream process for moving into license of the operating area of side electronic component mounting apparatus）.

In addition, in above-mentioned steps T35, by judge substrate sensor 373B and substrate sensor 374B whether be The state that substrate does not detect, so that the confirmation of the dummy status of band of position 33B is more scrupulously carried out, but if can be merely with base Plate sensor 373B with the discharge of other large substrates Kl before sufficient accuracy detection, then can also from band of position 33B The judgement of state is not detected merely with substrate sensor 373B progress substrates.

On the other hand, control device 90A is after the temporarily ceasing of the conveying motor 362A of buffer area 36A is taken out of, Periodically the switching to the on-state of R signal monitors（Step S39）If detect the R for carrying out self-control device 90B Signal is switched to the situation of on-state, then in control device 90A, as control is started again at, starts again at and take out of buffering The driving of the conveying motor 362A of region 36A（Step S41：Upstream side electronic component mounting apparatus is set to start again at conveying Process）.

In addition, the 8th substrate sensor 378A to be utilized such as upstream side electronic component mounting apparatus 10A carries out large substrate The detection of the rearward end of Kl（Step S43）If the rearward end of large substrate Kl is detected using the 8th substrate sensor 378A Pass through（Sensor output disconnects）, then control device 90A make to take out of the conveying motor 362A of buffer area 36A and stop（Step Rapid S45：The state of Figure 14）.

Then, control device 90A will be set to off-state for the B signal of control device 90B（Step S47）.

On the other hand, the control device 90B of the downstream electronic component mounting apparatus 10B periodically disconnections to B signal The switching of state is monitored（Step T39）If detect that the B signal for carrying out self-control device 90A is switched to off-state Situation, then control device 90B also will be switched to off-state for the R signal of control device 90A（Step T41）.

The control device 90A of the upstream side electronic component mounting apparatus 10A periodically switchings to the off-state of R signal Monitored（Step S49）If detect that the R signal for carrying out self-control device 90B has been switched to off-state, control device 90A terminates the transmission control of large substrate.

On the other hand, in the electronic component mounting apparatus 10B of downstream, after R signal is switched to off-state, profit is waited The detection of the front end of large substrate Kl is carried out with the 3rd substrate sensor 373B（Step T43）If passed using the 3rd substrate Sensor 373B detects the front end of large substrate Kl, then control device 90B makes the conveying motor for moving into buffer area 32B The conveying motor 332B of 322B and band of position 33B stops（Step T45）.

Thus, terminate from the large-scale of upstream side electronic component mounting apparatus 10A downstream side electronic component mounting apparatus 10B The transmission control of substrate.

In addition, in transportation large-scale substrate Kl, control is temporarily ceased by the conveying in step S37 and step T31, The long life using the 8th substrate sensor 378A and first substrate sensor 371B substrate detection states carried out is produced, because This, without the determination processing of timing error.

Further, since it is large substrate Kl, so in the first substrate sensing as the upstream side for moving into buffer area 32 Device 371 and the second substrate sensor 372 as downstream, the second substrate sensor of the upstream side as the band of position 33 372 and the 3rd substrate sensor 373 as downstream, as connection buffer area 34 upstream side tetrabasal sensor 374 and the 5th substrate sensor 375 as downstream, the 5th substrate sensor 375 of the upstream side as the band of position 35 With the 6th substrate sensor 376 as downstream, the 7th substrate sensor 377 as the upstream side for taking out of buffer area 36 In certain a pair of sensor in the 8th substrate sensor 378 as downstream, it can produce while be examined as substrate certainly The state of survey state, therefore, without the determination processing of substrate size mistake.

［ effect of the embodiment of invention ］

In above-mentioned electronic component mounting system 1, electronic component mounting apparatus 10A and downstream electronic unit in upstream side In the transmission of large substrate Kl between erecting device 10B, downstream electronic component mounting apparatus 10B is based on utilizing the 8th substrate The detection of the front end for the large substrate Kl that sensor 378A is carried out, temporarily ceases the conveying of large substrate Kl, also, receives The switching to off-state of R signal（Convey the notice stopped）, the control unit 90A of upstream side electronic component mounting apparatus 10A The control temporarily ceased into enforcement conveying motor 362A.Therefore, upstream side electronic component mounting apparatus 10A and downstream electronics Apparatus for mounting component 10B can stop the conveying of large substrate Kl in linkage, can not make the end of downstream side of large substrate Kl Downstream the band of position 33B sides of the upstream side of side electronic component mounting apparatus 10B are protruded and are moved at this in the 32B of buffer area It is standby.

Also, due to receive the control device 90B from downstream electronic component mounting apparatus 10B to the band of position The notice of license that what 33B was moved into move into, upstream side electronic component mounting apparatus 10A start again at using convey motor 362A into Capable conveying, it is possible to arrange large substrate Kl from the buffer area 36A that takes out of of upstream side electronic component mounting apparatus 10A Go out, large substrate Kl is stored in the band of position 33B of downstream electronic component mounting apparatus 10B.

It is as noted above, since upstream side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B are fitted The conveying of large substrate is carried out when realization linkage, even so slow in moving into for downstream electronic component mounting apparatus 10B The large substrate Kl for the size that can not be stored in the 32B of region is rushed, also can suitably and successfully be transmitted, can effectively kept away Exempt from the reduction of running rate.

Further, since in the transmission control of large substrate, without the determination processing and substrate and size of timing error The determination processing of mistake, can be to avoid carrying out wrong stopping so regardless of whether suitably transportation large-scale substrate Kl.

Usually in transferring substrates K, the control device 90A of upstream side electronic component mounting apparatus 10A carries out following conveyings Control, i.e. after substrate K is detected using the 8th substrate sensor 378A of upstream side electronic component mounting apparatus 10A End by rear, stop conveying motor 362A, downstream electronic component mounting apparatus 10B carries out following conveying controls, That is, the front end of substrate K is detected in the second substrate sensor 372B using downstream electronic component mounting apparatus 10B After arrival, stop conveying motor 322B, therefore, the high electronic component mounting system 1 of versatility can be built, it is in upstream Between side electronic component mounting apparatus 10A and downstream electronic component mounting apparatus 10B, can to the substrate K of given size and Both large substrate Kl are suitably transmitted.

［ other ］

In above-mentioned electronic component mounting system 1, using the knot for arranging 2 electronic component mounting apparatus along conveying direction Structure, but the structure that more electronic component mounting apparatus are arranged as to a row along conveying direction can also be used.

In the case, in order to the base that mouth 313 takes out of will be taken out of from the substrate of the electronic component mounting apparatus 10 of upstream side Plate is directly moved into the substrate of the electronic component mounting apparatus 10 in downstream and moves into mouth 312, it is desirable to each electronic unit installation dress Put 10 to be configured to, its substrate takes out of mouth 313 and the substrate of next electronic component mounting apparatus 10 moves into the closely phase of mouth 312 It is right.

2 electronic component mounting apparatus 10,10 included in electronic component mounting system 1 may not be identical dress Put.

For example, in order to carry out the transmission of large substrate Kl control, as long as at least upstream side electronic component mounting apparatus has The band of position and positioned at the band of position and substrate take out of mouth between take out of buffer area, at least downstream electronic unit is installed Device have the band of position and positioned at the band of position and substrate move into mouth 312 between move into buffer area.

For example, by with by moving into buffer area, the band of position, the electronics for taking out of the conveying mechanism that buffer area is formed Apparatus for mounting component, is configured at the upstream side of above-mentioned electronic component mounting apparatus 10 or the electronic unit installation system in downstream Unite and only by with by moving into buffer area, the band of position, the electronic unit peace for taking out of the conveying mechanism that buffer area is formed In the case of the electronic component mounting system that assembling device is formed, the transmission control of large substrate Kl can be also carried out.

In addition, form each electronic component mounting apparatus of electronic component mounting system, however it is not limited to only can be along X-axis side To a direction（For example, the right direction in Fig. 3）The electronic component mounting apparatus of upper conveying substrate.

For example, the base board delivery device 30 in each electronic component mounting apparatus 10A, 10B can be along the negative side in X-direction It is opposite with the example of Fig. 3 so as to edge by the way that each sensor or so is reversally configured in the case of substrate conveying is carried out Direction carry out the transmission control of large substrate Kl.

In addition, in the above-described embodiment, if operating personnel are from upstream side electronic component mounting apparatus 10A and downstream The operation panel 14 of some in electronic component mounting apparatus 10B presets the conveying direction for the substrate that input is installed Width（Substrate size）, then substrate size information is shared by communication interface 15 in each control device 90A, 90B.Above-mentioned behaviour Make panel 14, communication interface 15, each control device 90A, 90B composition substrate size judgement unit, to whether being more than from downstream Distance between sensors of the upstream side senser 371B of electronic component mounting apparatus 10B untill above-mentioned downstream sensor 372B Judged.

In addition, substitution aforesaid substrate size discrimination unit is readily apparent that, for example, carrying out each conveyer by control device 90 Structure 320,330 when action control when, the 1st substrate sensor 371 or the 2nd substrate sensor of 312 side of mouth are moved into substrate 372 on-off time measures, and substrate size is sentenced according to the responsiveness of the time of measuring and conveying mechanism Not.The substrate size judgement unit is by 371 or the 2nd substrate sensor 372 of substrate sensor and control device 90, conveying Mechanism 320,330 etc. is formed.

Claims (4)

1. a kind of electronic component mounting system, the substrate of its from upstream side electronic component mounting apparatus takes out of mouth downstream side electronics The substrate of apparatus for mounting component moves into the transmission that mouth carries out substrate,

It is characterized in that,

The upstream side electronic component mounting apparatus, has in substrate transport path inside it：Operating area, it is used to match somebody with somebody Substrate is put, to carry out the installation of electronic unit；And the standby region of substrate, it makes substrate be removed in the operating area and the substrate It is standby between outlet,

The downstream electronic component mounting apparatus, has in substrate transport path inside it：Operating area, it is used to match somebody with somebody Substrate is put, to carry out the installation of electronic unit；And the standby region of substrate, it makes substrate move into mouth and the operation in the substrate It is standby between region,

The upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus have respectively：Upstream side senser, It is detected substrate in the conveying direction upstream-side-end in the standby region of the substrate；Downstream side senser, it is described The conveyance direction downstream side end in the standby region of substrate, is detected substrate；Conveying mechanism, it carries out the standby area of substrate Substrate conveying in domain；And the control unit of the conveying mechanism,

The control unit energy of the control unit of the upstream side electronic component mounting apparatus and the downstream electronic component mounting apparatus Enough communication,

To conveying direction width with the upstream side senser from the downstream electronic component mounting apparatus under described When distance is transmitted compared to bigger large substrate between sensor untill trip side senser,

The electronic component mounting system carries out temporarily ceasing control and starts again at control, wherein,

In control is temporarily ceased, the control unit of the downstream electronic component mounting apparatus, permits to described while will move into Upstream side electronic component mounting apparatus notice, while conveyed to the large substrate, according to passing through the downstream ministry of electronics industry Detection of the downstream side senser of part erecting device to the front end of large substrate, leads to temporarily ceasing of moving into Know, and temporarily cease the conveying of the conveying mechanism of the downstream electronic component mounting apparatus, also, the upstream side The control unit of electronic component mounting apparatus, moves into the notice of license described in reception, while will respond to the downstream ministry of electronics industry Part erecting device notifies, while being conveyed to the large substrate, reception comes from the downstream electronic component mounting apparatus Control unit the notice that temporarily ceases of the conveying, in the state of the notice of the response is continued, make the upstream side electricity The conveying of the conveying mechanism of subassembly erecting device temporarily ceases,

In control is started again at, the control unit of the downstream electronic component mounting apparatus, if it is decided that for downstream electricity The operating area of subassembly erecting device is dummy status, then makes the conveying mechanism of the downstream electronic component mounting apparatus Conveying start again at, also, the control unit of the upstream side electronic component mounting apparatus, reception comes from the downstream electronics Notice control unit, permitting the operating area to the downstream electronic component mounting apparatus to move into of apparatus for mounting component, Start again at the conveying of the conveying mechanism of the upstream side electronic component mounting apparatus.

2. electronic component mounting system according to claim 1, it is characterised in that

It is being less than or equal to the upstream side senser from the downstream electronic component mounting apparatus to conveying direction width When the substrate of the given size of distance is transmitted between sensor untill the downstream side senser,

The electronic component mounting system carries out conveying control, in conveying control,

The control unit of the upstream side electronic component mounting apparatus, utilizes the downstream of the upstream side electronic component mounting apparatus Side senser, by being detected, makes the conveying mechanism of the upstream side electronic component mounting apparatus to substrate rearward end Stop, the control unit of the downstream electronic component mounting apparatus, using the downstream electronic component mounting apparatus it is described under Swim arrival of the side senser to substrate front end to be detected, make the conveyer of the downstream electronic component mounting apparatus Structure stops.

3. electronic component mounting system according to claim 1, it is characterised in that

With substrate size judgement unit, it judges the conveying direction width for the substrate installed, if than from the downstream Distance is big between sensor of the upstream side senser of side electronic component mounting apparatus untill the downstream side senser.

4. a kind of substrate carrying method of electronic component mounting system, the substrate of its from upstream side electronic component mounting apparatus take out of The substrate of mouth downstream side electronic component mounting apparatus moves into the transmission that mouth carries out substrate,

It is characterized in that,

The upstream side electronic component mounting apparatus, has in substrate transport path inside it：Operating area, it is used to match somebody with somebody Substrate is put, to carry out the installation of electronic unit；And the standby region of substrate, it makes substrate be removed in the operating area and the substrate It is standby between outlet,

The downstream electronic component mounting apparatus, has in substrate transport path inside it：Operating area, it is used to match somebody with somebody Substrate is put, to carry out the installation of electronic unit；And the standby region of substrate, it makes substrate move into mouth and the operation in the substrate It is standby between region,

The upstream side electronic component mounting apparatus and downstream electronic component mounting apparatus have respectively：Upstream side senser, It is detected substrate in the conveying direction upstream-side-end in the standby region of the substrate；Downstream side senser, it is described The conveyance direction downstream side end in the standby region of substrate, is detected substrate；Conveying mechanism, it carries out the standby area of substrate Substrate conveying in domain；And the control unit of the conveying mechanism,

The control unit energy of the control unit of the upstream side electronic component mounting apparatus and the downstream electronic component mounting apparatus Enough communication,

In order to conveying direction width and the upstream side senser from the downstream electronic component mounting apparatus to described Distance is transmitted compared to bigger large substrate between sensor untill the side senser of downstream,

The substrate carrying method of the electronic component mounting system has following processes：

The control unit of the downstream electronic component mounting apparatus, is installed while license will be moved into the upstream side electronic unit Device notifies, while conveyed to the large substrate, according under described using the downstream electronic component mounting apparatus Detection of the side senser to large substrate front end is swum, temporarily ceasing of moving into is notified, and make the downstream electronics The process that the conveying of the conveying mechanism of apparatus for mounting component temporarily ceases；

Control unit from the control unit of the downstream electronic component mounting apparatus to the upstream side electronic component mounting apparatus into The row process for conveying the notice temporarily ceased；

The control unit of the upstream side electronic component mounting apparatus, moves into the notice of license described in reception, while will respond to institute Downstream electronic component mounting apparatus notice is stated, while being conveyed to the large substrate, the conveying is received and temporarily ceases Notice, in the state of the notice of the response is continued, make the conveyer of the upstream side electronic component mounting apparatus The process that the conveying of structure temporarily ceases；

The control unit of the downstream electronic component mounting apparatus, if it is decided that be the work of the downstream electronic component mounting apparatus Industry region is dummy status, then the work for starting again at the conveying of the conveying mechanism of the downstream electronic component mounting apparatus Sequence；

The control unit of the downstream electronic component mounting apparatus leads to the control unit of the upstream side electronic component mounting apparatus Know the process that license is moved into the operating area of the downstream electronic component mounting apparatus；And

The control unit of the upstream side electronic component mounting apparatus receives the control from the downstream electronic component mounting apparatus Portion processed, the notice of permitting the operating area to the downstream electronic component mounting apparatus to move into, make the upstream side electronics The process that the conveying of the conveying mechanism of apparatus for mounting component starts again at.