JP6164863B2 - Electronic component mounting system and board conveying method of electronic component mounting system - Google Patents

Description

  The present invention relates to an electronic component mounting system related to transport between two transport mechanisms and a substrate transport method thereof.

  In the conventional electronic component mounting apparatus, the range of the work area for mounting the component on the board inside the apparatus is determined according to the external dimensions of the apparatus, and the upper limit of the size of the board capable of mounting the component accordingly Has been determined. Therefore, by adjusting the position of the sensor that determines the position of the board in the work area to the downstream side in the transport direction, the board in the work area is arranged more downstream in the transport direction, and electronic components are mounted. This corresponds to a mounting operation of a substrate larger than a prescribed size (see, for example, Patent Document 1).

On the other hand, in recent years, the board carry-out port of the transport mechanism of the electronic component mounting apparatus on the upstream side and the board carry-in port of the transport mechanism of the electronic component mounting apparatus on the downstream side are connected, and the mounting work is performed with the electronic component mounting apparatus on the upstream side. An electronic component mounting system is constructed in which a finished board is transferred to an electronic component mounting apparatus on the downstream side, and a plurality of mounting operations are continuously performed.
It is known that with respect to the conveyance of a substrate between a plurality of electronic component mounting apparatuses as described above, it is known to coordinate operation control between each other based on the SMEMA (Surface Mount Equipment Manufacturers Association) standard.
In an electronic component mounting system to which this SMEMA standard is applied, a “Ready OUT” signal indicating that there is a board that can be dispensed by the control device (upstream control device) of the upstream electronic component mounting device. The control unit of the downstream electronic component mounting apparatus (referred to as the downstream control apparatus) includes a payout of the circuit board. A payout request signal output unit for transmitting a “Board Available IN” signal (payout request signal) to the upstream control device.
When the payout enable signal and the payout request signal are sent and received between the upstream control device and the downstream control device, the mutual transfer mechanisms cooperate to transfer the substrate.

JP 2009-278014 A

Recently, in particular, an electronic component mounting apparatus on the downstream side has a board standby area on the upstream side of the work area in the apparatus, and before the electronic component mounting work for the board in the work area is finished, It is possible to reduce the stagnation of work due to the difference in the work time of each electronic component mounting apparatus by storing and waiting the board.
When working on a board larger than a prescribed size in an electronic component mounting system including such an electronic component mounting apparatus, the electronic component mounting apparatus disclosed in Patent Document 1 is applied to a large area within the work area of the electronic component mounting apparatus. Even if the board can be accommodated, it is difficult to transfer the board between the two electronic component mounting apparatuses.
That is, when the SMEMA standard is applied to the electronic component mounting system, the downstream control device transmits a payout request signal to the upstream control device when the substrate in the substrate standby region is transferred into the work area. . At this time, if the board standby area of the downstream electronic component mounting apparatus has only a storage capacity up to a board of a specified size, the large board delivered from the upstream electronic component mounting apparatus is mounted on the downstream electronic component mounting apparatus. Because it cannot fully enter the board standby area of the equipment, the electronic component mounting device on the upstream side cannot complete the board dispensing operation and cannot properly coordinate the transportation operation, resulting in an error due to transportation failure, etc. There was a possibility that a stop would occur, and as a result, the entire production line stopped, and there was a possibility that the operating rate would be significantly reduced.

  An object of the present invention is to enable good delivery of a board larger than a standard in an electronic component mounting system including connected electronic component mounting apparatuses.

The invention described in claim 1
In an electronic component mounting system that delivers a substrate from a substrate carry-out port of the upstream electronic component mounting device to a substrate carry-in port of the downstream electronic component mounting device,
The upstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board conveyance path inside the work area and the board carry-out port. A board standby area,
The downstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board transfer path inside the substrate, and between the board carry-in port and the work area. A substrate standby area to be
Each of the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus includes an upstream sensor that detects the substrate at an upstream end portion in the transport direction of the substrate standby region, and a downstream end portion of the substrate standby region. A downstream sensor that detects the substrate, a transport mechanism that transports the substrate in the substrate standby area, and a controller of the transport mechanism;
The control unit of the upstream electronic component mounting apparatus and the control unit of the downstream electronic component mounting apparatus can communicate with each other,
Upon delivery of a large substrate having a width in the transport direction larger than the distance between the sensors from the upstream sensor to the downstream sensor of the downstream electronic component mounting apparatus,
The control unit of the downstream electronic component mounting apparatus is
Conveying the large board while notifying the upstream electronic component mounting apparatus of the permission to carry in, and notifying the temporary stop of loading by detecting the leading end of the large board by the downstream sensor of the downstream electronic component mounting apparatus; While temporarily stopping the conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus,
The control unit of the upstream electronic component mounting apparatus is
The large board is transported while receiving a notification of the carry-in permission and notifying a response to the downstream electronic component mounting apparatus, and receives a notification of temporary stop of the transport from the control unit of the downstream electronic component mounting apparatus. A pause control for temporarily stopping the conveyance by the conveyance mechanism of the upstream electronic component mounting apparatus while continuing the notification of the response ,
When the control unit of the downstream electronic component mounting apparatus determines that the work area of the downstream electronic component mounting apparatus is empty, the control unit of the downstream electronic component mounting apparatus restarts the conveyance by the conveyance mechanism and the upstream electronic component mounting apparatus The control unit of the component mounting apparatus receives the notification of permission to carry in the work area of the downstream electronic component mounting apparatus from the control unit of the downstream electronic component mounting apparatus, and the transport mechanism of the upstream electronic component mounting apparatus And a resumption control for resuming the conveyance.

  The “front end portion of the substrate” indicates an end portion on the downstream side in the substrate transport direction, and the “rear end portion of the substrate” indicates an end portion on the upstream side in the transport direction of the substrate. The same applies hereinafter.

The invention according to claim 2 has the same configuration as the invention according to claim 1,
Upon delivery of a substrate of a specified size whose transport direction width is not more than the distance between sensors from the upstream sensor to the downstream sensor of the downstream electronic component mounting apparatus,
The control unit of the upstream electronic component mounting apparatus detects the passage of the rear end portion of the substrate by the downstream sensor of the upstream electronic component mounting apparatus and stops the transport mechanism of the upstream electronic component mounting apparatus. The control unit of the downstream electronic component mounting apparatus detects the arrival of the front end portion of the substrate by the downstream sensor of the downstream electronic component mounting apparatus and stops the conveyance mechanism of the downstream electronic component mounting apparatus. It is characterized by performing.

The invention according to claim 3 is a substrate transport method of an electronic component mounting system for delivering a substrate from a substrate carry-out port of the upstream electronic component mounting device to a substrate carry-in port of the downstream electronic component mounting device.
The upstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board conveyance path inside the work area and the board carry-out port. A board standby area,
The downstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board transfer path inside the substrate, and between the board carry-in port and the work area. A substrate standby area to be
Each of the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus includes an upstream sensor that detects the substrate at an upstream end portion in the transport direction of the substrate standby region, and a downstream end portion of the substrate standby region. A downstream sensor that detects the substrate, a transport mechanism that transports the substrate in the substrate standby area, and a controller of the transport mechanism;
The control unit of the upstream electronic component mounting apparatus and the control unit of the downstream electronic component mounting apparatus can communicate with each other,
In order to deliver a large substrate having a width in the transport direction larger than the distance between the sensors of the downstream electronic component mounting apparatus,
The control unit of the downstream electronic component mounting apparatus conveys the large substrate while notifying the upstream electronic component mounting apparatus of the loading permission, and the leading edge of the large substrate by the downstream sensor of the downstream electronic component mounting apparatus A step of temporarily stopping the conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus by detecting the arrival of a part;
A step in which the control unit of the downstream electronic component mounting apparatus notifies the control unit of the upstream electronic component mounting apparatus of the temporary stop of the conveyance;
The control unit of the upstream electronic component mounting apparatus receives the notification of the carry-in permission, transfers the large board while notifying the downstream electronic component mounting apparatus of a response, and receives a notification of the temporary stop of the transfer. And temporarily stopping the conveyance by the conveyance mechanism of the upstream electronic component mounting apparatus while continuing to notify the response ;
When the control unit of the downstream electronic component mounting apparatus determines that the work area of the downstream electronic component mounting apparatus is empty, the process of resuming conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus;
A step in which the control unit of the downstream electronic component mounting apparatus notifies the control unit of the upstream electronic component mounting apparatus of permission to carry into the work area of the downstream electronic component mounting apparatus;
The control unit of the upstream electronic component mounting apparatus receives the notification of permission to carry into the work area of the downstream electronic component mounting apparatus from the control unit of the downstream electronic component mounting apparatus, and the upstream electronic component mounting apparatus And resuming the conveyance of the conveyance mechanism.

According to the first and third aspects of the present invention, in the delivery of the large board between the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus, the downstream electronic component mounting apparatus detects the arrival of the board by the downstream sensor. Based on this, the conveyance of the substrate is temporarily stopped, and upon receiving the conveyance stop notification, the control unit of the upstream electronic component mounting apparatus performs control to temporarily stop the conveyance mechanism. For this reason, the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus can stop the substrate conveyance in cooperation with each other, and the downstream end of the large-sized substrate protrudes into the work area of the downstream electronic component mounting apparatus. Without waiting in the substrate standby area.
Then, the upstream electronic component mounting apparatus restarts the transport of the transport mechanism in response to the notification of permission to carry in to the work area downstream of the standby area from the control unit of the downstream electronic component mounting apparatus. A large board can be discharged from the board standby area of the mounting apparatus, and the large board can be stored in the work area of the downstream electronic component mounting apparatus.
In this way, the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus cooperate with each other as appropriate to transport the large board, so that the large size cannot be stored in the board standby area of the downstream electronic component mounting apparatus. Even if it is a board | substrate, it can deliver smoothly suitably, and it becomes possible to avoid the fall of an operation rate effectively.

  According to the second aspect of the present invention, when a substrate having a specified size whose transport direction width is smaller than the distance between sensors of the downstream electronic component mounting apparatus is transferred, the control unit of the upstream electronic component mounting apparatus performs the upstream electronic component mounting. The downstream electronic component mounting apparatus performs the conveyance control for detecting the passage of the rear end portion of the substrate by the downstream sensor of the apparatus and stops the conveyance mechanism, and the downstream electronic component mounting apparatus is the leading edge of the substrate by the downstream sensor of the downstream electronic component mounting apparatus. Since the transport control is performed to stop the transport mechanism by detecting the arrival of the sensor, it is possible to appropriately transfer both the specified size board and the large board between the upstream electronic component mounting device and the downstream electronic component mounting device. It is possible to construct an electronic component mounting system.

It is a top view of the electronic component mounting system which concerns on this embodiment. It is a top view of the electronic component mounting apparatus contained in an electronic component mounting system. It is a schematic block diagram of the board | substrate conveyance apparatus of an electronic component mounting apparatus. It is the figure which looked at the board | substrate conveyance apparatus from the conveyance direction. It is a block diagram which shows the control system of an electronic component mounting apparatus. It is the flowchart which showed the process of each control apparatus at the time of performing normal board | substrate delivery control. It is operation | movement explanatory drawing which showed the delivery operation | movement in the delivery control of a normal board | substrate. FIG. 8 is an operation explanatory diagram subsequent to FIG. 7 illustrating a transfer operation in normal substrate transfer control. FIG. 9 is an operation explanatory diagram subsequent to FIG. 8 illustrating a transfer operation in normal substrate transfer control. It is the flowchart which showed the process of each control apparatus at the time of performing delivery control of a large sized board | substrate. It is a flowchart following FIG. 10 which showed the process of each control apparatus at the time of performing delivery control of a large sized board | substrate. It is operation | movement explanatory drawing which showed the delivery operation | movement in the delivery control of a large sized board | substrate. FIG. 13 is an operation explanatory diagram following FIG. 12 illustrating a transfer operation in the transfer control of a large substrate. It is operation | movement explanatory drawing following FIG. 13 which showed the delivery operation | movement in the delivery control of a large sized board | substrate.

[Overall Configuration of Embodiment of Invention]
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows an embodiment in which a substrate K can be transferred by arranging a substrate carry-in port 313 and a substrate carry-in port 312 of the substrate carrying device 30 included in the electronic component mounting apparatus 10 side by side in close proximity to each other. 1 shows an electronic component mounting system 1 composed of a plurality of electronic component mounting apparatuses 10 and 10.
The electronic component mounting system 1 is particularly characterized in a structure, a control, and a transfer method for transferring the substrate K between two electronic component mounting apparatuses arranged side by side. As an example, the electronic component mounting system 1 in which two electronic component mounting apparatuses 10 and 10 of the same format are arranged side by side is illustrated, but the configuration is not limited to that particular configuration. They may be arranged side by side, or three or more units may be arranged.

[Outline of electronic component mounting equipment]
FIG. 2 is a plan view of the electronic component mounting apparatus 10. As shown in the figure, the electronic component mounting apparatus 10 includes a feeder bank 20 as an electronic component supply unit that holds a plurality of electronic component feeders 21 that supply electronic components to be mounted side by side, and a fixed substrate K inside the apparatus. Board transport device 30 for transporting along the transport direction, head 40 for receiving electronic components from electronic component feeder 21 and mounting them on substrate K, and head moving means for driving and transporting head 40 to an arbitrary position within a predetermined range X-Y gantry 50, a component camera 11 that images electronic components held by the head 40 from below, and a substrate camera that is mounted on the head 40 and images a substrate mark (not shown) attached to the substrate K 12, a control device 90 that controls each component of the electronic component mounting device 10, and a main frame 13 that supports the overall configuration. It is provided.

  In the following description, the direction in which the substrate K is transported by the substrate transport device 30 inside the electronic component mounting apparatus 10 is the X-axis direction, the vertical vertical direction is the Z-axis direction, and the X-axis direction and the Z-axis direction are orthogonal to each other. Assume that the direction is the Y-axis direction, and the apparatus is installed so that the X-axis direction and the Y-axis direction are horizontal in the normal use state of the electronic component mounting apparatus 10.

  In addition, the electronic component mounting apparatus 10 is a station as a work area for mounting electronic components on the substrate K at two locations near the upstream side and the downstream side of the substrate K transport path by the substrate transport device 30. A total of four feeder banks 20, 20 are provided on both sides of the two station areas 33, 35 across the substrate transfer device 30. Further, four heads 40 and four XY gantry 50 are mounted in correspondence with the feeder bank 20.

[Electronic component mounting equipment: Feeder bank]
In each feeder bank 20, a plurality of electronic component feeders 21 are placed side by side along the X-axis direction.
Each electronic component feeder 21 is provided with a component tape, in which electronic components are arranged in a row, supplied from a reel (not shown) to the rear end thereof, and is provided above the front end portion (end on the transport path side). To the parts delivery position. Then, the electronic component in the component tape is sucked by the suction nozzle 41 mounted on the head 40 at the component delivery position.

[Electronic component mounting device: head]
As shown in the figure, each head 40 has six suction nozzles 41 that hold electronic components by air suction at the tip thereof, and a Z-axis that is a drive source for raising and lowering the suction nozzles 41 along the Z-axis direction. A motor 42 (see FIG. 5) and a θ-axis motor 43 (see FIG. 5), which is a rotational drive source for rotating the electronic component held via the suction nozzle 41 around the Z-axis direction, are provided. .
Each suction nozzle 41 is connected to a negative pressure generator, and sucks and holds electronic components by suction at the lower end of the suction nozzle 41.
Note that the same number of Z-axis motors 42 and θ-axis motors 43 as the suction nozzles 41 are mounted on the head 40.
Further, the number of suction nozzles 41 mounted on the head 40 is not limited to six, and may be increased or decreased.

[Electronic component mounting device: each camera]
Both the component camera 11 and the board camera 12 are CCD cameras or CMOS cameras.
The component camera 11 is individually fixedly mounted at a predetermined position of the main frame 13 (for example, between the feeder bank 20 and the board conveyance path) corresponding to each head 40. Each component camera 11 has its line of sight directed vertically upward from the main frame 13, and images the electronic component sucked by the suction nozzle 41 from below when the head 40 passes through the visual field range. Image processing by an image processing device (not shown) is performed on the captured image data of the component camera 11, and the orientation of the captured electronic component and the deviation of the center position between the suction nozzle 41 and the electronic component are calculated. Then, the electronic component is mounted after the above-described correction of the orientation of the electronic component by the θ-axis motor 43 and correction of the shift of the center position of the electronic component by the XY gantry 50 described later.
The substrate camera 12 is mounted on the head 40 with the line of sight directed downward, and images the substrate mark of the substrate K in the work area from above. Image processing by an image processing device (not shown) is performed on the captured image data of the substrate camera 12, and a shift or inclination of the position of the substrate K is calculated from the position of the captured substrate mark. Then, when the head 40 is positioned by the XY gantry 50, it is reflected in the position correction.

[Electronic component mounting device: XY gantry]
Each XY gantry 50 has an X-axis guide rail 51 that supports the head 40 so as to be movable in the X-axis direction, and a Y-axis that supports the head 40 so as to be movable in the Y-axis direction via the X-axis guide rail 51. A guide rail 52, an X-axis motor 53 (see FIG. 5) that is a drive source that moves the head 40 along the X-axis direction, and a drive source that moves the head 40 in the Y-axis direction via the X-axis guide rail 51 Y-axis motor 54 (see FIG. 5).
The head 40 can be transported to the entire target station area 33 or 35 by driving the motors 53 and 54.
Note that the two XY gantry 50 and 50 that transport the head 40 to the substrate K in the same station area 33 or 35 share two Y-axis guide rails 52 and 52.
Each of the motors 53 and 54 is equipped with an encoder that detects the amount of rotation of each motor, and the rotation angle is input to the control device 90. Accordingly, the control device 90 controls the motors 53 and 54 to position the respective suction nozzles 41 of the head 40 and the substrate camera 12.

[Electronic component mounting device: substrate transfer device]
FIG. 3 is an explanatory diagram simply showing the configuration of the substrate transfer apparatus 30 in plan view. FIG. 4 is a side view of the later-described transport mechanisms 330 and 350 of the substrate transport apparatus 30 as viewed from the substrate transport direction.
As shown in FIG. 2, the board transport device 30 includes a pair of long board pressing plates 311 and 311 disposed in parallel with each other over the entire length of the electronic component mounting apparatus 10 in the X-axis direction. A space between the substrate pressing plates 311 and 311 is a substrate transport path. The upstream end of the pair of substrate pressing plates 311 and 311 in the substrate transport direction is a substrate carry-in port 312 and the downstream end is a substrate carry-out port 313.
Further, as shown in FIG. 3, the substrate transport path between the pair of substrate pressing plates 311 and 311, in order from the substrate carry-in port 312 to the substrate carry-out port 313, serves as a substrate standby region on the upstream side. An in-buffer area 32, a station area 33 as an upstream work area, a joint buffer area 34, a station area 35 as a downstream work area, and an out-buffer area 36 as a downstream substrate standby area are formed.

As shown in FIG. 3, the substrate transport apparatus 30 includes transport mechanisms 320 to 360 in the regions 32 to 36 on the transport path.
Each of the transport mechanisms 320 to 360 has a pair of substrate transport belts 321 stretched at both ends in the Y-axis direction of the respective regions 32 to 36 so as to have a length substantially equal to the length in the X-axis direction of each of the regions 32 to 36. And 361 and transport motors 322 to 362 for applying a transport operation in the substrate transport direction to the substrate transport belts 321 to 361 via transport rollers.
Further, as shown in FIG. 4, the transport mechanisms 330 and 350 in the station regions 33 and 35 support the substrate transport belts 331 and 351 and their support structures 333 and 353 so as to be movable up and down. The substrate conveying belts 331 and 351 can be moved up and down by holding motors 334 and 354.

As described above, the substrate pressing plates 311 and 311 are long plate-like bodies disposed over the entire length of the substrate transfer path, and the substrate transfer belts 321 to 361 of the transfer mechanisms 320 to 360 described above are used. , Both are arranged close to each other through a gap below the substrate pressing plate 311. The substrate pressing plate 311 and the substrate transport belts 321 to 361 are both parallel to the X-axis direction, and the lower surface of the substrate pressing plate 311 and the upper surfaces of the substrate transport belts 321 to 361 are both horizontal.
The substrate K is placed on a pair of substrate transport belts 321 to 361 and is transported in a predetermined transport direction through a gap with the substrate pressing plate 311 by driving transport motors 322 to 362.
Further, the transport mechanisms 330 and 350 in the station regions 33 and 35 raise the substrate transport belts 331 and 351 by the substrate holding motors 334 and 354, so that the substrate transport belts 331 and 351 and the substrate pressing plate 311 are moved. The substrate K can be held.
That is, in these station areas 33 and 35, the mounting operation of the electronic component on the substrate K is performed. Therefore, the electronic component can be accurately positioned with respect to the substrate K by stably holding the substrate K.

Further, the substrate transport apparatus 30 is connected to a first substrate sensor 371 as an upstream sensor that detects the substrate K at the upstream end portion of the in-buffer region 32 in the substrate transport direction (hereinafter simply referred to as “upstream in the substrate transport direction” A second substrate sensor 372 as a downstream sensor that detects the substrate K at the downstream end of the in-buffer region 32 in the substrate transport direction (upstream end of the station region 33) (hereinafter referred to as “upstream”). The downstream in the transport direction is simply referred to as “downstream”), and the third substrate sensor 373 that detects the substrate K at the downstream end of the station region 33 and the detection of the substrate K at the upstream end of the joint buffer region 34 are detected. The substrate K at the downstream end of the fourth substrate sensor 374 to be performed and the substrate transfer direction of the joint buffer region 34 (upstream end of the station region 35). The fifth substrate sensor 375 that performs detection, the sixth substrate sensor 376 that detects the substrate K at the downstream end of the station region 35, and the substrate K at the upstream end of the out buffer region 36. A seventh substrate sensor 377 as an upstream sensor and an eighth substrate sensor 378 as a downstream sensor that detects the substrate K at the downstream end of the out buffer region 36 are provided.
The first and eighth substrate sensors 371 and 378 are optical objective sensors that detect reflected light from the substrate K when the substrate K passes therethrough.
The second to seventh substrate sensors 372 to 377 are composed of a light source and a light receiving unit, and when the substrate K passes, the irradiation light from the light source is blocked by the substrate K and the light receiving unit detects the substrate K. It is an optical objective sensor.

[Control system for electronic component mounting equipment]
Next, a control system of the electronic component mounting apparatus 10 will be described based on the block diagram of FIG.
The X-axis motor 53 and the Y-axis motor 54 of the XY gantry 50 described above, and the Z-axis motor 42 and the θ-axis motor 43 mounted on the head 40 are connected to the control device 90 via a drive circuit (not shown). ing.
Further, the imaging operation of the component camera 11 and the board camera 12 is controlled by the control device 90. Further, the captured image data of the component camera 11 and the board camera 12 is output to an image processing device (not shown), and the processing result is output to the control device 90.
The motors 42, 43, 53, 54 and the cameras 11, 12 are all mounted on the electronic component mounting apparatus 10, but only one is shown in FIG. 5, and the rest are omitted. .

Furthermore, transport motors 322 to 362 for individually transporting substrates in the respective regions 32 to 36 of the substrate transport apparatus 30 are connected to the control device 90 via a drive circuit (not shown). In addition, first to eighth substrate sensors 371 to 378 installed at various locations on the transport path of the substrate transport device 30 are connected to the control device 90 via an interface (not shown), and a substrate detection signal is input to the control device 90. It has become so. Thereby, the control apparatus 90 functions as a control part which performs operation control of each conveyance mechanism 320-360.
The control device 90 is connected to an operation panel 14 including an input unit for performing various setting input operations in an electronic component mounting operation and a display unit for displaying various information.

In addition, the electronic component mounting apparatus 10 performs control of the control signal between the control devices 90 with the other electronic component mounting apparatus 10 in order to perform delivery control of the substrate K with the other electronic component mounting apparatus 10. A communication interface 15 for performing transmission and reception is provided.
The communication interface 15 conforms to a so-called SMEMA (Surface Mount Equipment Manufacturers Association) standard, and connects a communication cable 16 (see FIGS. 7 and 12) for communication between the two control devices 90 and 90. Equipped with a predetermined connector.
The communication interface 15 includes an upstream connector and a downstream connector, and the other electronic component mounting apparatus 10 is connected to the electronic component mounting apparatus 10 both upstream and downstream in the board transport direction. It is possible to perform delivery control of the substrate K. That is, if this electronic component mounting apparatus 10 is used, it is possible to construct an electronic component mounting system in which many electronic component mounting apparatuses 10 are connected in series.

The control device 90 determines a list of electronic components to be mounted and their mounting order, a mounting position of each electronic component on the substrate K, a receiving position indicating which electronic component feeder 21 each electronic component receives from. EEPROM 94 for storing the mounted mounting schedule data, ROM 92 for storing a mounting operation control program and a board transfer control execution program to be described later, a CPU 91 for executing various programs, and a data storage area for executing various programs The RAM 93 is mainly provided.
When the electronic component is mounted, the CPU 91 that executes the mounting operation control program controls the X-axis and Y-axis motors 53 and 54 based on the mounting schedule data, so that the head 40 is positioned at a predetermined receiving position of the electronic component feeder 21. The suction nozzle 41 is positioned, the Z-axis motor 42 is controlled, and the suction nozzle 41 sucks the electronic component. Further, the head 40 is passed over the component camera 11 and the lower part is imaged, and the electronic component is transported to the board mounting position determined in the mounting schedule data. Then, the position of the electronic component is corrected by the X-axis and Y-axis motors 53 and 54 and the orientation is corrected by the θ-axis motor 43, while the electronic component is lowered by the Z-axis motor 42 to execute the mounting operation.
If the mounting schedule data defines the electronic component suction operation for the plurality of suction nozzles 41 of the head 40, the mounting operation for the substrate K is performed.

[Substrate delivery control]
Next, the delivery control of the board K of the electronic component mounting system 1 formed by connecting two electronic component mounting apparatuses 10 will be described.
In the following description, the electronic component mounting apparatus 10 on the upstream side in the transfer direction of the two electronic component mounting apparatuses 10 that can perform the transfer control of the board K is referred to as “upstream electronic component mounting apparatus 10A”, and the downstream side in the transfer direction. This electronic component mounting apparatus is referred to as a “downstream electronic component mounting apparatus 10B”. In connection with this, about each structure and each member of 10 A of upstream electronic component mounting apparatuses and the downstream electronic component mounting apparatus 10B, it shall distinguish by attaching | subjecting "A" and "B" to the end of a code | symbol.

In this electronic component mounting system 1, board delivery control differs according to the width in the conveyance direction of the board K (the length of the board in the X-axis direction; hereinafter referred to as the board size).
The board size delivery control is divided into two methods depending on the relation between the board size and the acceptable length of the in-buffer area 32B of the downstream electronic component mounting apparatus 10B.
The acceptable length of the in-buffer region 32B is equal to the inter-sensor distance from the first substrate sensor 371B to the second substrate sensor 372B in the X-axis direction.
When the substrate size is less than or equal to the acceptable length of the in-buffer area 32, normal substrate transfer control is performed as the specified-size substrate K. When the substrate size is larger than the acceptable length of the in-buffer area 32, , Large-sized substrate delivery control. Hereinafter, a substrate having a specified size whose substrate size is equal to or smaller than the acceptable length of the in-buffer region 32 is simply referred to as a substrate K, and a substrate larger than the acceptable length of the in-buffer region 32 is referred to as a large substrate Kl.

[Substrate delivery control: Normal substrate delivery control]
First, normal substrate transfer control will be described. The board size information is shared by the control devices 90A and 90B through the communication interface 15 when the operator sets and inputs the board size in advance from either the operation panel 14 of the upstream electronic component mounting apparatus 10A or the downstream electronic component mounting apparatus 10B. Is done.
Then, each of the control devices 90A and 90B of the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B determines whether or not the input board size is equal to or smaller than an acceptable size of the downstream electronic component mounting apparatus 10B. To determine whether to perform normal substrate transfer control or large substrate transfer control. Since each of the control devices 90A and 90B stores in advance the acceptable size of the downstream electronic component mounting device 10B, the result of the determination is the same.
Note that which substrate transfer control is performed may be determined by only one of the control devices 90A or 90B, and the determination result may be communicated to the other control device 90B or 90A.

  FIG. 6 is performed when the control device 90A of the upstream electronic component mounting apparatus 10A and the control device 90B of the downstream electronic component mounting apparatus 10B of the electronic component mounting system 1 execute normal board transfer control (transport control). FIGS. 7 to 9 are flowcharts showing individual processes, and FIGS. 7 to 9 are operation explanatory views showing a transfer operation in a normal substrate transfer control. In addition, the code | symbol 16 in FIGS. 7-9 is the communication cable which connects communication interface 15A, 15B of control apparatus 90A and control apparatus 90B so that communication is possible.

  This normal substrate transfer control is a control performed in accordance with the above-mentioned SMEMA standard. As shown in FIG. 7, in the normal board delivery control, the board K waiting in the out buffer area 36A of the upstream electronic component mounting apparatus 10A is transferred to the in buffer area 32B of the downstream electronic component mounting apparatus 10B. It is executed when

First, the board K that has been waiting in the in-buffer area 32B in the downstream electronic component mounting apparatus 10B is transferred to the station area 33B, and when the in-buffer area 32B becomes empty, the control apparatus 90B carries into the control apparatus 90A. As a notification of permission, a “Ready OUT” signal (referred to as “R signal” in the following description and drawings) is transmitted in the ON state (step T1).
In contrast, the control device 90A of the upstream electronic component mounting apparatus 10A periodically waits for input of the R signal (step S1), and receives the ON state of the R signal from the control device 90B. 90A transmits a “Board Available IN” signal (referred to as “B signal” in the following description and drawings) to the control device 90B in an ON state (step S3).

The control device 90B of the downstream electronic component mounting apparatus 10B periodically waits for input of the B signal (step T3), and when the ON state of the B signal from the control device 90A is received, the first substrate sensor 371B Detection of the front end (downstream end) of the substrate K is awaited (step T5).
On the other hand, in the upstream electronic component mounting apparatus 10A, after transmitting the B signal, the conveyance motor 362A in the out buffer area 36A is driven to start conveying the substrate K toward the substrate carry-in port 312B of the downstream electronic component mounting apparatus 10B. (Step S5).
Thereby, when the front-end | tip part of the board | substrate K is detected by the 1st board | substrate sensor 371B of the downstream electronic component mounting apparatus 10B, the control apparatus 90B drives the conveyance motor 322B of the in-buffer area | region 32B, and receives board | substrate K. Is started (step T7).

In the upstream electronic component mounting apparatus 10A, the eighth substrate sensor 378A waits for detection of the passage of the rear end portion (upstream end portion) of the substrate K (step S7), and the eighth substrate sensor 378A detects the substrate K. When the passage of the rear end (sensor output OFF) is detected, the control device 90A stops the transport motor 362A in the out buffer area 36A (step S9: state of FIG. 8).
Then, the control device 90A turns off the B signal for the control device 90B (step S11).
In contrast, the control device 90B of the downstream electronic component mounting apparatus 10B periodically monitors the switching of the B signal in the OFF state (step T9), and the B signal from the control device 90A has switched to the OFF state. When this is detected, the control device 90B also switches the R signal for the control device 90A to the OFF state (step T11).
The control device 90A of the upstream electronic component mounting apparatus 10A periodically monitors switching of the OFF state of the R signal (step S13), and detects that the R signal from the control device 90B has switched to the OFF state. Then, the control device 90A ends the normal substrate transfer control.

On the other hand, in the downstream electronic component mounting apparatus 10B, after the R signal is switched to the OFF state, the second substrate sensor 372B waits for the tip of the substrate K to reach (step T13), and the second substrate sensor 372B When the leading end of K is detected, the control device 90B stops the transport motor 322B in the in-buffer area 32B (step T15: state of FIG. 9).
Thereby, the normal board delivery control from the upstream electronic component mounting apparatus 10A to the downstream electronic component mounting apparatus 10B is completed.

  When a normal board is transported, the elapsed time after each board sensor enters the board detection state is measured for both the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B. If the non-detection state does not occur even if this exceeds the specified time, it is determined that there is a time error, and an error display is notified by the display unit of the operation panels 14A and 14B.

Further, when a normal board is transported, the board detection states of the board sensors on the upstream side and the downstream side of each of the areas 32 to 36 in both the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B. Monitored for substrate size errors.
That is, the first substrate sensor 371 on the upstream side of the in-buffer region 32 and the second substrate sensor 372 on the downstream side, the second substrate sensor 372 on the upstream side of the station region 33 and the third substrate on the downstream side. Substrate sensor 373, fourth substrate sensor 374 upstream of joint buffer region 34 and fifth substrate sensor 375 downstream and fifth substrate sensor 375 upstream of station region 35 and downstream Of the sixth substrate sensor 376, the seventh substrate sensor 377 on the upstream side of the out buffer region 36, and the eighth substrate sensor 378 on the downstream side. Monitor whether or not When the substrate is a normal substrate size, these paired sensors do not become in the detection state at the same time, so in the unlikely event that they are in the detection state at the same time between the respective paired sensors, It is determined that there is a size error, and notification by error display is performed on the display units of the operation panels 14A and 14B.

[Substrate delivery control: Large substrate delivery control]
Next, the delivery control of a large substrate will be described.
10 and FIG. 11 show individual control performed when the control device 90A of the upstream electronic component mounting apparatus 10A and the control device 90B of the downstream electronic component mounting apparatus 10B of the electronic component mounting system 1 execute the delivery control of the large board Kl. FIG. 12 to FIG. 14 are flowcharts showing the processing of FIG. 12, and are operation explanatory views showing the delivery operation in the delivery control of the large substrate Kl.

The delivery control of the large board Kl is partially compliant with the above-mentioned SMEMA standard, and a “Ready OUT” signal (R signal) and a “Board Available IN” signal (B signal) between the control devices 90A and 90B. The operation control is coordinated by transmitting and receiving data.
As shown in FIG. 12, in the large-sized board delivery control, the large board K1 does not stand by in the out buffer area 36A of the upstream electronic component mounting apparatus 10A, and the in-buffer of the downstream electronic component mounting apparatus 10B from the station area 35A. The large substrate Kl is transferred without stopping to the region 32B.

First, when the large board Kl waiting in the in-buffer area 32B in the downstream electronic component mounting apparatus 10B is transferred to the station area 33B and the in-buffer area 32B becomes empty, the control device 90B An R signal is transmitted in an ON state as a notification of permission for loading (step T21).
In contrast, the control device 90A of the upstream electronic component mounting apparatus 10A periodically waits for input of the R signal (step S21), and receives the ON state of the R signal from the control device 90B. The B signal is transmitted in the ON state from 90A to the control device 90B (step S23).
Further, the controller 90A drives the transport motor 352A in the station area 35A to start transporting the large substrate Kl toward the out buffer area 36A (step S25).
Further, after the transfer of the large substrate Kl is started, the control device 90A periodically waits for the seventh substrate sensor 377A to detect the leading end of the large substrate Kl (step S27). Then, the transport motor 362A in the out buffer area 36A is driven to transport the large substrate Kl toward the substrate carry-out port 313A (step S29).
When the large substrate Kl is transferred from the station area 35A to the out buffer area 36A, the control device 90A waits for detection of the passage of the rear end portion of the large substrate Kl by the sixth substrate sensor 376A (step S31). When the passage of the rear end of the large substrate Kl by the sixth substrate sensor 376A (sensor output OFF) is detected, the control device 90A stops the transport motor 362A in the station area 35A (step S33).

On the other hand, the control device 90B of the downstream electronic component mounting apparatus 10B periodically waits for input of the B signal (step T23), and receives the ON state of the B signal from the control device 90A. Waiting for detection of the tip of the large substrate Kl by 371B (step T25).
Then, the large substrate Kl is conveyed from the substrate carry-out port 313A to the substrate carry-in port 312B of the downstream electronic component mounter 10B by the conveyance in the out buffer region 36A of the upstream electronic component mounting apparatus 10A, and the leading end of the large substrate Kl When the part is detected by the first board sensor 371B of the downstream electronic component mounting apparatus 10B, the control apparatus 90B drives the transport motor 322B in the in-buffer area 32B to start accepting the large board Kl (step T27). ).
Further, in the downstream electronic component mounting apparatus 10B, the second substrate sensor 372B waits for detection of the leading end portion of the large substrate Kl (step T29), and the leading end portion of the large substrate Kl is detected by the second substrate sensor 372B. Then, the control device 90B stops the transport motor 322B in the in-buffer area 32B (step T31: a process in which the downstream electronic component mounting apparatus temporarily stops transport, the state of FIG. 13).
Then, the control device 90B switches the R signal to an OFF state as a notification of temporary stop of conveyance to the control device 90A (step T33: step of performing notification of temporary stop).

The control device 90A of the upstream electronic component mounting apparatus 10A allows the large board Kl to be placed between the apparatuses when the R signal from the control apparatus 90B is turned off while the eighth board sensor 378A detects the board. It is determined that the vehicle is straddling. The control device 90A periodically monitors switching of the OFF state of the R signal after the transport motor 352A in the station area 35A is stopped (step S35), and the R signal from the control device 90B is switched to the OFF state. When the control unit 90A detects that the board sensor 378A is in the board detection state, the controller 90A stops the transport motor 362A in the out-buffer area 36A as a temporary stop control (Step S37: the upstream electronic component mounting apparatus temporarily stops the transport). To stop automatically).
Note that the ON state of the B signal transmitted from the upstream electronic component mounting apparatus 10A to the downstream electronic component mounting apparatus 10B is maintained.
Further, if the substrate sensor 378A is in a substrate non-detection state when the R signal from the control device 90B is switched to the OFF state, the control device 90A determines that the large substrate Kl has been completely carried out.

Thereafter, the other large substrate Kl that precedes is transferred from the station region 33B to the downstream side in the downstream electronic component mounting apparatus 10B, and the large substrate Kl in the in-buffer region 32B until the station region 33B becomes empty. Is in a standby state.
That is, the control device 90B sends another preceding large substrate Kl from the station region 33B to the downstream side, and determines whether both the substrate sensor 373B and the substrate sensor 374B are in the undetected state of the station region 33B. Is determined to be empty (step T35), and if it is determined to be empty, the control device 90B starts driving the transfer motor 322B in the in-buffer area 32B and the transfer motor 332B in the station area 33B. To do. At the same time, the control device 90B transmits the R signal to the control device 90A in the ON state again as a carry-in permission notification (step T37: a step in which the downstream electronic component mounting apparatus resumes conveyance and the downstream side) A step of notifying permission to carry into the work area of the electronic component mounting apparatus).
In step T35, the vacant state of the station area 33B is more strictly confirmed by determining whether both the substrate sensor 373B and the substrate sensor 374B are in the undetected state, but the substrate sensor 373B If the discharge of the other large substrate Kl preceding from the station area 33B can be detected with sufficient accuracy by only the substrate sensor 373B, the substrate undetected state may be determined only by the substrate sensor 373B.

On the other hand, the control device 90A periodically monitors switching of the ON state of the R signal after the transport motor 362A in the out buffer area 36A is temporarily stopped (step S39). When detecting that the R signal has been switched to the ON state, the control device 90A resumes driving of the transport motor 362A in the out buffer area 36A as resumption control (step S41: the upstream electronic component mounting apparatus resumes transport). Process).
Furthermore, the upstream electronic component mounting apparatus 10A waits for detection of the rear end portion of the large board Kl by the eighth board sensor 378A (step S43), and the rear end part of the large board Kl by the eighth board sensor 378A. When the passage (sensor output OFF) is detected, the control device 90A stops the transport motor 362A in the out buffer area 36A (step S45: state of FIG. 14).
Then, the control device 90A turns off the B signal for the control device 90B (step S47).

In contrast, the control device 90B of the downstream electronic component mounting apparatus 10B periodically monitors switching of the B signal in the OFF state (step T39), and the B signal from the control device 90A is switched to the OFF state. When detecting this, the control device 90B also switches the R signal for the control device 90A to the OFF state (step T41).
The control device 90A of the upstream electronic component mounting apparatus 10A periodically monitors the switching of the OFF state of the R signal (step S49), and detects that the R signal from the control device 90B has switched to the OFF state. Then, the control device 90A ends the transfer control of the large substrate.

On the other hand, in the downstream electronic component mounting apparatus 10B, after the R signal is switched to the OFF state, the third substrate sensor 373B waits for detection of the leading end portion of the large substrate Kl (step T43), and the third substrate sensor 373B When the leading end of the large substrate Kl is detected, the control device 90B stops the transport motor 322B in the in-buffer area 32B and the transport motor 332B in the station area 33B (step T45).
Thereby, the delivery control of the large board from the upstream electronic component mounting apparatus 10A to the downstream electronic component mounting apparatus 10B is completed.

When transporting the large substrate Kl, the substrate detection state by the eighth substrate sensor 378A and the first substrate sensor 371B is prolonged due to the suspension control of the transport in step S37 and step T31. Time error determination processing is not performed.
Further, since the substrate is a large substrate Kl, the first substrate sensor 371 on the upstream side of the in-buffer region 32, the second substrate sensor 372 on the downstream side, and the second substrate sensor 372 on the upstream side of the station region 33. A third substrate sensor 373 on the downstream side, a fourth substrate sensor 374 on the upstream side of the joint buffer region 34, a fifth substrate sensor 375 on the downstream side, and a fifth substrate sensor 375 on the upstream side of the station region 35. In the paired sensor of the substrate sensor 375 and the sixth substrate sensor 376 on the downstream side, the seventh substrate sensor 377 on the upstream side of the out buffer region 36 and the eighth substrate sensor 378 on the downstream side. At the same time, naturally, a state in which the substrate detection state occurs is naturally generated, so that the substrate size error determination process is not performed.

[Effect of the embodiment of the invention]
In the electronic component mounting system 1, in the delivery of the large board Kl between the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B, the downstream electronic component mounting apparatus 10B is based on the eighth board sensor 378A. Based on the detection of the leading end of the large substrate Kl, the conveyance of the large substrate Kl is temporarily stopped, and the R-signal is switched to the OFF state (notification of conveyance stop), and the upstream electronic component mounting apparatus 10A The control layer and 90A perform control to temporarily stop the transport motor 362A. For this reason, the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B can stop the conveyance of the large board Kl in cooperation with each other, and the downstream end of the large board Kl is connected to the downstream electronic component mounting apparatus. It is possible to wait in the in-buffer area 32B without protruding to the station area 33B on the upstream side of 10B.
Then, the upstream electronic component mounting apparatus 10A resumes the conveyance by the conveyance motor 362A in response to the notification of the permission to carry in the station area 33B from the control device 90B of the downstream electronic component mounting apparatus 10B. The large board Kl can be discharged from the out buffer area 36A of the apparatus 10A, and the large board Kl can be stored in the station area 33B of the downstream electronic component mounting apparatus 10B.
As described above, the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B cooperate with each other appropriately to carry a large substrate, and therefore can be stored in the in-buffer area 32B of the downstream electronic component mounting apparatus 10B. Even a large-sized substrate Kl with no size can be delivered smoothly and appropriately, and a reduction in operating rate can be effectively avoided.

  In addition, since the time error determination process and the substrate and size error determination process are not performed during the delivery control of the large substrate, the error stops even though the large substrate Kl is appropriately transported. It is possible to avoid this.

  When the normal board K is delivered, the control device 90A of the upstream electronic component mounting apparatus 10A detects the passage of the rear end portion of the board K by the eighth board sensor 378A of the upstream electronic component mounting apparatus 10A, and carries the transport motor. The downstream electronic component mounting apparatus 10B detects the arrival of the front end of the substrate K by the second substrate sensor 372B of the downstream electronic component mounting apparatus 10B and stops the conveyance motor 322B. Since the conveyance control is performed, a highly versatile electronic that can appropriately transfer both the substrate K of the specified size and the large substrate Kl between the upstream electronic component mounting apparatus 10A and the downstream electronic component mounting apparatus 10B. The component mounting system 1 can be constructed.

[Others]
In the electronic component mounting system 1, two electronic component mounting apparatuses are arranged along the transport direction. However, it is also possible to adopt a configuration in which more electronic component mounting apparatuses are aligned in the transport direction. .
In that case, in order to allow the board carried out from the board carry-out port 313 of the upstream electronic component mounting apparatus 10 to be carried into the board carry-in port 312 of the downstream electronic component mounting apparatus 10 as it is, The mounting apparatus 10 is required to be disposed so that the board carry-out port 313 is in close proximity to the board carry-in port 312 of the next electronic component mounting apparatus 10.

The two electronic component mounting apparatuses 10 and 10 included in the electronic component mounting system 1 may not be the same.
For example, in order to perform delivery control of the large board Kl, at least the upstream electronic component mounting apparatus includes a station area and an out buffer area between the station area and the board carry-out port, and at least the downstream electronic component mounting apparatus. May have any in-buffer area between the station area and the station area and the substrate carry-in port 312.
For example, an electronic component mounting system in which an electronic component mounting apparatus having a transport mechanism composed of an in-buffer area, a station area, and an out-buffer area is arranged upstream or downstream of the electronic component mounting apparatus 10 described above, Even in the case of an electronic component mounting system including only an electronic component mounting apparatus having a transport mechanism including a station area and an out buffer area, it is possible to perform delivery control of the large board Kl.

In addition, each electronic component mounting apparatus constituting the electronic component mounting system is not limited to one that can transport a substrate only in one direction along the X-axis direction (for example, the right direction in FIG. 3).
For example, when the board conveyance device 30 of each of the electronic component mounting apparatuses 10A and 10B can carry the board in the reverse direction in the X-axis direction, each sensor is arranged so as to be reversed left and right. It is also possible to perform delivery control of the large substrate Kl in the reverse direction.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 10 Electronic component mounting apparatus 10A Upstream electronic component mounting apparatus 10B Downstream electronic component mounting apparatus 15, 15A, 15B Communication interface 16 Communication cable 30 Substrate conveyance apparatus 32, 32A, 32B In-buffer area (board standby area) )
33, 33A, 33B, 35, 35A, 35B Station area (work area)
36, 36A, 36B Out buffer area (board standby area)
90, 90A, 90B Control device (control unit)
312, 312 A, 312 B Substrate carry-in port 313, 313 A, 313 B Substrate carry-out port 320-360 Transport mechanism 322-362, 322 A-362 A, 322 B-362 B Transport motor 371, 377, 371 A, 377 A, 371 B, 377 B Substrate sensor (upstream side) Sensor)
372, 378, 372A, 378A, 372B, 378B Substrate sensor (downstream sensor)
373-376, 373A-376A, 373B-376B Substrate sensor K Substrate Kl Large substrate

Claims (3)

In an electronic component mounting system that delivers a substrate from a substrate carry-out port of the upstream electronic component mounting device to a substrate carry-in port of the downstream electronic component mounting device,
The upstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board conveyance path inside the work area and the board carry-out port. A board standby area,
The downstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board transfer path inside the substrate, and between the board carry-in port and the work area. A substrate standby area to be
Each of the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus includes an upstream sensor that detects the substrate at an upstream end portion in the transport direction of the substrate standby region, and a downstream end portion of the substrate standby region. A downstream sensor that detects the substrate, a transport mechanism that transports the substrate in the substrate standby area, and a controller of the transport mechanism;
The control unit of the upstream electronic component mounting apparatus and the control unit of the downstream electronic component mounting apparatus can communicate with each other,
Upon delivery of a large substrate having a width in the transport direction larger than the distance between the sensors from the upstream sensor to the downstream sensor of the downstream electronic component mounting apparatus,
The control unit of the downstream electronic component mounting apparatus is
Conveying the large board while notifying the upstream electronic component mounting apparatus of the permission to carry in, and notifying the temporary stop of loading by detecting the leading end of the large board by the downstream sensor of the downstream electronic component mounting apparatus; While temporarily stopping the conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus,
The control unit of the upstream electronic component mounting apparatus is
The large board is transported while receiving a notification of the carry-in permission and notifying a response to the downstream electronic component mounting apparatus, and receives a notification of temporary stop of the transport from the control unit of the downstream electronic component mounting apparatus. A pause control for temporarily stopping the conveyance by the conveyance mechanism of the upstream electronic component mounting apparatus while continuing the notification of the response ,
When the control unit of the downstream electronic component mounting apparatus determines that the work area of the downstream electronic component mounting apparatus is empty, the control unit of the downstream electronic component mounting apparatus restarts the conveyance by the conveyance mechanism and the upstream electronic component mounting apparatus The control unit of the component mounting apparatus receives the notification of permission to carry in the work area of the downstream electronic component mounting apparatus from the control unit of the downstream electronic component mounting apparatus, and the transport mechanism of the upstream electronic component mounting apparatus The electronic component mounting system is characterized by performing resumption control for resuming conveyance of the electronic component. Upon delivery of a substrate of a specified size whose transport direction width is not more than the distance between sensors from the upstream sensor to the downstream sensor of the downstream electronic component mounting apparatus,
The control unit of the upstream electronic component mounting apparatus detects the passage of the rear end portion of the substrate by the downstream sensor of the upstream electronic component mounting apparatus and stops the transport mechanism of the upstream electronic component mounting apparatus. The control unit of the downstream electronic component mounting apparatus detects the arrival of the front end portion of the substrate by the downstream sensor of the downstream electronic component mounting apparatus and stops the conveyance mechanism of the downstream electronic component mounting apparatus. The electronic component mounting system according to claim 1, wherein: In the board transport method of the electronic component mounting system for delivering the board from the board carry-out port of the upstream electronic component mounting apparatus to the board carry-in port of the downstream electronic component mounting apparatus,
The upstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board conveyance path inside the work area and the board carry-out port. A board standby area,
The downstream electronic component mounting apparatus waits for a substrate between a work area in which a substrate is placed for mounting an electronic component on the board transfer path inside the substrate, and between the board carry-in port and the work area. A substrate standby area to be
Each of the upstream electronic component mounting apparatus and the downstream electronic component mounting apparatus includes an upstream sensor that detects the substrate at an upstream end portion in the transport direction of the substrate standby region, and a downstream end portion of the substrate standby region. A downstream sensor that detects the substrate, a transport mechanism that transports the substrate in the substrate standby area, and a controller of the transport mechanism;
The control unit of the upstream electronic component mounting apparatus and the control unit of the downstream electronic component mounting apparatus can communicate with each other,
In order to deliver a large substrate having a width in the transport direction larger than the distance between the sensors of the downstream electronic component mounting apparatus,
The control unit of the downstream electronic component mounting apparatus conveys the large substrate while notifying the upstream electronic component mounting apparatus of the loading permission, and the leading edge of the large substrate by the downstream sensor of the downstream electronic component mounting apparatus A step of temporarily stopping the conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus by detecting the arrival of a part;
A step in which the control unit of the downstream electronic component mounting apparatus notifies the control unit of the upstream electronic component mounting apparatus of the temporary stop of the conveyance;
The control unit of the upstream electronic component mounting apparatus receives the notification of the carry-in permission, transfers the large board while notifying the downstream electronic component mounting apparatus of a response, and receives a notification of the temporary stop of the transfer. And temporarily stopping the conveyance by the conveyance mechanism of the upstream electronic component mounting apparatus while continuing to notify the response ;
When the control unit of the downstream electronic component mounting apparatus determines that the work area of the downstream electronic component mounting apparatus is empty, the process of resuming conveyance by the conveyance mechanism of the downstream electronic component mounting apparatus;
A step in which the control unit of the downstream electronic component mounting apparatus notifies the control unit of the upstream electronic component mounting apparatus of permission to carry into the work area of the downstream electronic component mounting apparatus;
The control unit of the upstream electronic component mounting apparatus receives the notification of permission to carry into the work area of the downstream electronic component mounting apparatus from the control unit of the downstream electronic component mounting apparatus, and the upstream electronic component mounting apparatus And a step of resuming the conveyance of the conveyance mechanism of the electronic component mounting system.

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