JP5990783B2 - Component mounting apparatus and board conveying method in component mounting apparatus - Google Patents

Component mounting apparatus and board conveying method in component mounting apparatus Download PDF

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JP5990783B2
JP5990783B2 JP2013144249A JP2013144249A JP5990783B2 JP 5990783 B2 JP5990783 B2 JP 5990783B2 JP 2013144249 A JP2013144249 A JP 2013144249A JP 2013144249 A JP2013144249 A JP 2013144249A JP 5990783 B2 JP5990783 B2 JP 5990783B2
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substrate
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transport
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detection sensor
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JP2015018895A (en
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久晃 江口
久晃 江口
八木 周蔵
周蔵 八木
道明 馬渡
道明 馬渡
利彦 永冶
利彦 永冶
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、上流側から送られてきた基板を搬入し、下流側に搬出する動作を実行する複数の基板搬送機構が直列に並べられて成る基板搬送部を備えた部品実装用装置及び部品実装用装置における基板搬送方法に関するものである。   The present invention relates to a component mounting apparatus and a component mounting including a substrate transport unit in which a plurality of substrate transport mechanisms that carry in an operation of carrying in a substrate sent from the upstream side and carrying it out downstream are arranged in series It is related with the board | substrate conveyance method in a manufacturing apparatus.

基板に部品を装着する部品実装用装置は基板搬送部を備えており、基板搬送部によって基板を作業位置に位置決めし、部品装着作業等の所要の作業を実行する(特許文献1)。ここで基板搬送部は、上流側から送られてきた基板を搬入して下流側に搬出する動作を行うコンベア等から成る複数の基板搬送機構が直列に並べられた構成を有している。各基板搬送機構は、基板の搬出側の端部に基板検出センサを備えている。各基板搬送機構は、上流側に隣接した基板搬送機構から送られてきた基板を所定の速度(第1の速度)で搬入し、その基板の前端が所定の減速開始位置に到達したところで基板の搬送速度を第1の速度よりも速度が小さい速度(第2の速度)に減速させ、基板の前端が基板検出センサによって検出されたところで基板の搬送を停止させる。その後、各基板搬送機構は、基板の搬送を再開して下流側に隣接した他の基板搬送機構に搬出する際、基板の後端が基板検出センサによって検出されるまで第1の速度で基板を搬送して送り出すといった一連の動作を行うようになっている。   A component mounting apparatus for mounting a component on a substrate includes a substrate transport unit, and the substrate transport unit positions the substrate at a work position to execute a required operation such as a component mounting operation (Patent Document 1). Here, the substrate transport unit has a configuration in which a plurality of substrate transport mechanisms including a conveyor or the like that performs an operation of carrying in a substrate sent from the upstream side and carrying it out to the downstream side are arranged in series. Each substrate transport mechanism includes a substrate detection sensor at an end portion on the substrate carry-out side. Each substrate transport mechanism carries in the substrate sent from the substrate transport mechanism adjacent to the upstream side at a predetermined speed (first speed), and when the front end of the substrate reaches a predetermined deceleration start position, The transport speed is reduced to a speed (second speed) smaller than the first speed, and the transport of the substrate is stopped when the front end of the substrate is detected by the substrate detection sensor. Thereafter, when each substrate transport mechanism resumes transporting the substrate and unloads it to another substrate transport mechanism adjacent to the downstream side, the substrate is transported at the first speed until the rear end of the substrate is detected by the substrate detection sensor. A series of operations such as conveying and sending out are performed.

特開2009−173433号公報JP 2009-173433 A

しかしながら、上記部品実装用装置において、基板の搬送方向の長さが比較的長く、送り出した基板の前端が下流側に隣接した他の基板搬送機構の減速開始位置に到達した(減速が開始された)時点で、基板の後端がまだ送り出す側の基板搬送機構の基板検出センサによって検出されていなかった場合には、送り出す側の基板搬送機構は、両基板搬送機構間で跨った状態の基板を、下流側に隣接した基板搬送機構の搬送速度(第2の速度)よりも大きな搬送速度(第1の速度)で搬送し続ける。その結果、基板は受け取り側の基板搬送機構のコンベアに押込まれるため、正規の停止位置に基板を停止しきれないでいわゆるオーバーランが発生してしまう。そうすると、下流側の基板搬送機構では、基板の停止位置を正規の位置に停止させなおす修正作業が必要となり、その分、部品実装用装置の作業効率が低下するおそれがあるという問題点があった。   However, in the component mounting apparatus described above, the length in the board conveyance direction is relatively long, and the front end of the sent-out board has reached the deceleration start position of another board conveyance mechanism adjacent to the downstream side (deceleration has started. ) At that time, if the rear end of the substrate has not yet been detected by the substrate detection sensor of the substrate transport mechanism on the sending side, the substrate transport mechanism on the sending side can detect the substrate straddled between both substrate transport mechanisms. Then, the substrate is continuously transported at a transport speed (first speed) larger than the transport speed (second speed) of the substrate transport mechanism adjacent to the downstream side. As a result, since the substrate is pushed into the conveyor of the receiving side substrate transport mechanism, the substrate cannot be stopped at the normal stop position, and so-called overrun occurs. As a result, the downstream board transport mechanism requires a correction work for stopping the board stop position at the regular position, and there is a problem that the work efficiency of the component mounting apparatus may be reduced accordingly. .

そこで本発明は、オーバーランの発生を防止して作業効率の低下を防ぐことができる部品実装用装置及び部品実装用装置における基板搬送方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a component mounting apparatus and a substrate carrying method in the component mounting apparatus that can prevent the occurrence of overrun and prevent a decrease in work efficiency.

請求項1に記載の部品実装用装置は、上流側から送られてきた基板を搬入して下流側に搬出する動作を行う複数の基板搬送機構が直列に並べられて成る基板搬送部を備えた部品実装用装置であって、各基板搬送機構は、基板の搬出側の端部に設けられて基板を検出する基板検出センサを備え、各基板搬送機構の作動制御を行う制御部は、各基板搬送機構が、上流側に隣接した他の基板搬送機構から送られてきた基板を第1の速度で搬入した後、基板の前端が所定の減速開始位置に到達したところで基板の搬送速度を前記第1の速度よりも速度が小さい第2の速度に減速させ、前記基板検出センサによって基板の前端が検出されたら基板を停止させる基板搬入動作及び停止させた基板の搬送を再開して基板の後端が前記基板検出センサによって検出されるまで前記第1の速度で基板を搬送して下流側に隣接した他の基板搬送機構に搬出する搬出動作を行うように制御し、各基板搬送機構が、基板の搬送を再開した後、前記基板検出センサによって基板の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構の前記減速開始位置に到達した場合には、前記基板検出センサによって基板の後端が検出されるまで、前記下流側に隣接した他の基板搬送機構と同調した基板の搬送を行うように作動させる。   The component mounting apparatus according to claim 1 is provided with a substrate transfer unit in which a plurality of substrate transfer mechanisms that perform an operation of loading a substrate sent from the upstream side and carrying it out to the downstream side are arranged in series. A component mounting apparatus, wherein each board transport mechanism includes a board detection sensor that is provided at an end portion on the carry-out side of the board and detects the board, and the control unit that controls the operation of each board transport mechanism After the transport mechanism carries in the substrate sent from another substrate transport mechanism adjacent to the upstream side at the first speed, the transport speed of the substrate is increased when the front end of the substrate reaches a predetermined deceleration start position. When the front end of the substrate is detected by the substrate detection sensor, the substrate carry-in operation for stopping the substrate and the conveyance of the stopped substrate are resumed to reduce the rear end of the substrate. By the substrate detection sensor After the substrate is transported at the first speed until it is taken out and controlled to perform a carry-out operation for carrying it out to another substrate carrying mechanism adjacent to the downstream side, each substrate carrying mechanism resumes carrying the substrate, If the front end of the sent-out substrate reaches the deceleration start position of another substrate transport mechanism adjacent to the downstream side before the rear end of the substrate is detected by the substrate detection sensor, the substrate detection sensor Until the rear end of the substrate is detected, the substrate is transported in synchronization with another substrate transport mechanism adjacent to the downstream side.

請求項2に記載の基板搬送方法は、上流側から送られてきた基板を搬入して下流側に搬出する動作を行う複数の基板搬送機構が直列に並べられて成る基板搬送部を備えた部品実装用装置における基板搬送方法であって、各基板搬送機構が、上流側に隣接した他の基板搬送機構から送られてきた基板を第1の速度で搬入する第1工程と、前記第1の工程を開始した後、基板の前端が所定の減速開始位置に到達したところで基板の搬送速度を前記第1の速度よりも速度が小さい第2の速度に減速させる第2工程と、前記基板の搬送速度を前記第2の速度に減速させた後、基板の搬出側の端部に設けられた基板検出センサによって基板の前端が検出されたら基板を停止させる第3工程と、前記第3工程の後、基板の搬送を再開させて基板の後端が前記基板検出センサによって検出されるまで前記第1の速度で基板を搬送して下流側に隣接した他の基板搬送機構に搬出する第4工程とを実行し、前記第4工程において、基板の搬送を再開させた後、前記基板検出センサによって基板の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構の前記減速開始位置に到達した場合には、前記基板検出センサによって基板の後端が検出されるまで、前記下流側に隣接した他の基板搬送機構と同調した基板の搬送を行う。   The substrate transport method according to claim 2 is a component including a substrate transport unit in which a plurality of substrate transport mechanisms that perform an operation of carrying in a substrate sent from the upstream side and carrying it out to the downstream side are arranged in series. A substrate transport method in a mounting apparatus, wherein each substrate transport mechanism carries a substrate sent from another substrate transport mechanism adjacent to the upstream side at a first speed, and the first step After starting the process, when the front end of the substrate reaches a predetermined deceleration start position, a second step of reducing the substrate transport speed to a second speed smaller than the first speed, and transporting the substrate After the speed is reduced to the second speed, a third step of stopping the substrate when the front end of the substrate is detected by a substrate detection sensor provided at an end portion on the carry-out side of the substrate, and after the third step , Restart the board transfer and the rear edge of the board will be And a fourth step of transporting the substrate at the first speed until it is detected by the substrate detection sensor and carrying it out to another substrate transport mechanism adjacent to the downstream side. In the fourth step, the transport of the substrate is performed. After restarting, before the rear end of the substrate is detected by the substrate detection sensor, when the front end of the sent-out substrate reaches the deceleration start position of another substrate transport mechanism adjacent to the downstream side, Until the rear end of the substrate is detected by the substrate detection sensor, the substrate is transferred in synchronization with the other substrate transfer mechanism adjacent to the downstream side.

本発明では、各基板搬送機構は、基板の搬送を再開した後、基板検出センサによって基板の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構の減速開始位置に到達した場合には、基板検出センサによって基板の後端が検出されるまで、下流側に隣接した他の基板搬送機構と同調した基板の搬送を行うことから、送り出した基板を、下流側に隣接した他の基板搬送機構の搬送速度よりも大きな搬送速度で搬送し続けるといった事態は生じない。このため、下流側に隣接した基板搬送機構では基板を正規の位置に確実に停止させることができ、オーバーランの発生を防止できるので、作業効率の低下を防ぐことができる。   In the present invention, each substrate transport mechanism restarts the transport of the substrate and before the rear end of the substrate is detected by the substrate detection sensor, the front end of the sent-out substrate is the other substrate transport mechanism adjacent to the downstream side. When the deceleration start position is reached, the substrate detection sensor detects the rear end of the substrate, and transports the substrate in synchronization with the other substrate transport mechanism adjacent to the downstream side. There will be no situation in which transport is continued at a transport speed larger than the transport speed of another substrate transport mechanism adjacent to the downstream side. For this reason, the substrate transport mechanism adjacent to the downstream side can surely stop the substrate at the regular position and can prevent the occurrence of overrun, thereby preventing the work efficiency from being lowered.

本発明の一実施の形態における部品実装機の斜視図The perspective view of the component mounting machine in one embodiment of this invention 本発明の一実施の形態における部品実装機の制御系統を示すブロック図The block diagram which shows the control system of the component mounting machine in one embodiment of this invention 本発明の一実施の形態における部品実装機が備える基板搬送部を構成する各基板搬送機構の動作手順を示すフローチャートThe flowchart which shows the operation | movement procedure of each board | substrate conveyance mechanism which comprises the board | substrate conveyance part with which the component mounting machine in one embodiment of this invention is provided. 本発明の一実施の形態における基板搬送部の平面図The top view of the board | substrate conveyance part in one embodiment of this invention (a)(b)(c)(d)本発明の一実施の形態における基板搬送部の動作説明図(A) (b) (c) (d) Operation explanatory drawing of the board | substrate conveyance part in one embodiment of this invention. (a)(b)(c)(d)本発明の一実施の形態における基板搬送部の動作説明図(A) (b) (c) (d) Operation explanatory drawing of the board | substrate conveyance part in one embodiment of this invention. (a)(b)(c)(d)本発明の一実施の形態における基板搬送部の動作説明図(A) (b) (c) (d) Operation explanatory drawing of the board | substrate conveyance part in one embodiment of this invention.

以下、図面を参照して本発明の実施の形態について説明する。図1に示す部品実装用装置の一例としての部品実装機1は、基板2を搬送して作業位置に位置決めし、その基板2に部品3を装着する動作を繰り返し実行する装置であり、基台11上に基板搬送部12、部品供給部13及び部品装着部14を有して成る。ここでは説明の便宜上、部品実装機1における基板2の搬送方向(図1中に示す矢印A)をX軸方向(オペレータOPから見た左右方向)とし、X軸方向と直交する水平面内方向(オペレータOPから見た前後方向)をY軸方向とする。また、上下方向をZ軸方向とする。   Embodiments of the present invention will be described below with reference to the drawings. A component mounter 1 as an example of a component mounting apparatus shown in FIG. 1 is a device that repeatedly executes an operation of conveying a substrate 2 and positioning it at a work position and mounting a component 3 on the substrate 2. 11 includes a substrate transfer unit 12, a component supply unit 13, and a component mounting unit. Here, for convenience of explanation, the conveyance direction (arrow A shown in FIG. 1) of the substrate 2 in the component mounting machine 1 is the X-axis direction (the left-right direction as viewed from the operator OP), and the horizontal plane direction orthogonal to the X-axis direction ( The front-back direction as viewed from the operator OP) is taken as the Y-axis direction. Also, the vertical direction is the Z-axis direction.

図1において、基板搬送部12は基板2をX軸方向に搬送して所定の作業位置に位置決めする。部品供給部13は基台11に取付けられた複数のパーツフィーダ13a(例えばテープフィーダ)から成り、各パーツフィーダ13aは部品供給口13pに部品3を連続的に供給する。   In FIG. 1, a substrate transport unit 12 transports the substrate 2 in the X-axis direction and positions it at a predetermined work position. The parts supply unit 13 includes a plurality of parts feeders 13a (for example, tape feeders) attached to the base 11, and each parts feeder 13a continuously supplies the parts 3 to the parts supply port 13p.

部品装着部14は、基台11上に設けられたヘッド移動機構21と、ヘッド移動機構21によって移動される装着ヘッド22から成る。ヘッド移動機構21は、基台11に設けられた直交座標テーブルから成り、装着ヘッド22を水平面内方向で移動させる。装着ヘッド22には、複数の吸着ノズル22aが備えられている。装着ヘッド22は吸着ノズル22aの昇降とZ軸回りの回転動作及び吸着ノズル22aによる真空吸着動作を行って、各パーツフィーダ13aが部品供給口13pに供給する部品3の吸着(ピックアップ)を行う。   The component mounting unit 14 includes a head moving mechanism 21 provided on the base 11 and a mounting head 22 moved by the head moving mechanism 21. The head moving mechanism 21 includes an orthogonal coordinate table provided on the base 11, and moves the mounting head 22 in the horizontal plane direction. The mounting head 22 is provided with a plurality of suction nozzles 22a. The mounting head 22 lifts and lowers the suction nozzle 22a, rotates around the Z-axis, and performs vacuum suction operation by the suction nozzle 22a, and sucks (picks up) the component 3 that each part feeder 13a supplies to the component supply port 13p.

装着ヘッド22には撮像視野を下方に向けた基板カメラ23が設けられており、基台11上の基板搬送部12と部品供給部13の間の位置には撮像視野を上方に向けた部品カメラ24が設けられている。基板カメラ23は基板2に設けられた図示しない基板マークの撮像を行い、部品カメラ24は吸着ノズル22aが吸着した部品3の撮像を行う。   The mounting head 22 is provided with a substrate camera 23 with the imaging field of view facing downward, and a component camera with the imaging field of view facing upward at a position between the substrate transport unit 12 and the component supply unit 13 on the base 11. 24 is provided. The board camera 23 takes an image of a board mark (not shown) provided on the board 2, and the part camera 24 takes an image of the part 3 sucked by the suction nozzle 22a.

図1において、基板搬送部12は3つの基板搬送機構30がX軸方向に直列に並べられて成る。各基板搬送機構30は一対のコンベア30aを有した同一の構成を備えており(コンベア30aのX軸方向の長さは異なっていてもよい)、それぞれ上流側から送られてきた基板2を搬入して下流側に搬出する動作を行う。ここでは説明の便宜上、基板2の流れの上流側から順に上流側機構31、中央機構32及び下流側機構33と称する。   In FIG. 1, the substrate transport unit 12 includes three substrate transport mechanisms 30 arranged in series in the X-axis direction. Each substrate transport mechanism 30 has the same configuration with a pair of conveyors 30a (the lengths of the conveyors 30a in the X-axis direction may be different), and each substrate 2 sent from the upstream side is loaded. Then, the operation of carrying it out downstream is performed. Here, for convenience of explanation, the upstream mechanism 31, the central mechanism 32, and the downstream mechanism 33 are sequentially referred to from the upstream side of the flow of the substrate 2.

上流側機構31は部品実装機1の上流側に設置された図示しない他の部品実装用装置(例えば、印刷検査機や他の部品実装機1)から送られてきた基板2を受け取って(搬入して)中央機構32に送り出す(搬出する)。中央機構32は上流側機構31から基板2を受け取って下流側機構33に送り出し、下流側機構33は中央機構32から受け取った基板2を、部品実装機1の下流側に設置された他の部品実装用装置(例えば、他の部品実装機1や装着検査機)が備える基板搬送部に送り出す。各基板搬送機構30(上流側機構31、中央機構32及び下流側機構33)はそれぞれ、搬入した基板を一旦減速したうえで停止させ、その後搬送を再開して基板2を搬出する。   The upstream mechanism 31 receives the board 2 sent from another component mounting apparatus (not shown) (for example, a printing inspection machine or another component mounting machine 1) installed on the upstream side of the component mounting machine 1 (carry-in) And send it out to the central mechanism 32. The central mechanism 32 receives the substrate 2 from the upstream mechanism 31 and sends it out to the downstream mechanism 33, and the downstream mechanism 33 sends the substrate 2 received from the central mechanism 32 to other components installed on the downstream side of the component mounting machine 1. It sends out to the board | substrate conveyance part with which the apparatus for mounting (for example, other component mounting machines 1 and mounting inspection machines) is provided. Each substrate transport mechanism 30 (upstream side mechanism 31, central mechanism 32, and downstream side mechanism 33) decelerates and stops the loaded substrate, then resumes transport and unloads the substrate 2.

3つの基板搬送機構30(上流側機構31、中央機構32及び下流側機構33)はそれぞれ、基板2の搬入側(基板2の流れの上流側)の端部に第1のセンサS1を備えるとともに、基板2の搬出側(基板2の流れの下流側)の端部に第2のセンサS2(基板検出センサ)を備えている。ここで、第1のセンサS1は、上流側から送られてきてコンベア30aに接触する直前の基板2の前端を検出し得る位置に設けられており、第2のセンサS2は、下流側に送り出した基板2がコンベア30aから離間した直後の基板2の後端を検出し得る位置に設けられている。   Each of the three substrate transport mechanisms 30 (upstream mechanism 31, central mechanism 32, and downstream mechanism 33) includes a first sensor S1 at the end of the substrate 2 on the carry-in side (upstream side of the flow of the substrate 2). The second sensor S2 (substrate detection sensor) is provided at the end of the substrate 2 on the carry-out side (downstream side of the flow of the substrate 2). Here, the first sensor S1 is provided at a position where the front end of the substrate 2 just before coming in contact with the conveyor 30a from the upstream side can be detected, and the second sensor S2 is sent out downstream. The substrate 2 is provided at a position where the rear end of the substrate 2 immediately after being separated from the conveyor 30a can be detected.

各基板搬送機構30において、第1のセンサS1及び第2のセンサS2はそれぞれ、検査光MをY軸方向投光する投光器と、その検査光Mを受光する受光器との組合せから成る。搬送途中の基板2の前端が検査光Mに差し掛かると、それまで検査光Mの非受光状態であった受光器が検査光Mの受光状態に切り替わり、基板2の後端が検査光Mに差し掛かると、それまで検査光Mの受光状態であった受光器が検査光Mの非受光状態に切り替わることから、第1のセンサS1及び第2のセンサS2はそれぞれ基板の2の前端と後端を区別して検出することができる。   In each substrate transport mechanism 30, each of the first sensor S <b> 1 and the second sensor S <b> 2 includes a combination of a projector that projects the inspection light M in the Y-axis direction and a light receiver that receives the inspection light M. When the front end of the substrate 2 being transported reaches the inspection light M, the light receiver that has been in the non-light-receiving state of the inspection light M is switched to the light receiving state of the inspection light M, and the rear end of the substrate 2 becomes the inspection light M When this happens, the light receiving device that has been in the state of receiving the inspection light M is switched to the non-light receiving state of the inspection light M so that the first sensor S1 and the second sensor S2 are the front end and rear end of the substrate 2 respectively. Edges can be detected separately.

図2において、基板搬送部12を構成する3つの基板搬送機構30(上流側機構31、中央機構32及び下流側機構33)による基板2の搬送及び位置決め動作制御は、部品実装機1の制御部としての制御装置40によってなされる。制御装置40による3つの基板搬送機構30による基板2の搬送及び位置決め動作では、後述するように、各基板搬送機構30が備える第1のセンサS1及び第2のセンサS2によって検出される基板2の先端の検出情報及び基板2の後端の検出情報が用いられる(図2)。   In FIG. 2, the substrate 2 conveyance and positioning operation control by the three substrate conveyance mechanisms 30 (upstream side mechanism 31, central mechanism 32 and downstream side mechanism 33) constituting the substrate conveyance unit 12 are controlled by the control unit of the component mounting machine 1. This is done by the control device 40. In the transfer and positioning operation of the substrate 2 by the three substrate transfer mechanisms 30 by the control device 40, as will be described later, the substrate 2 detected by the first sensor S1 and the second sensor S2 included in each substrate transfer mechanism 30 is described. Detection information on the front end and detection information on the rear end of the substrate 2 are used (FIG. 2).

また、部品供給部13(パーツフィーダ13a)による部品3の供給動作制御、ヘッド移動機構21による装着ヘッド22の移動動作制御、装着ヘッド22に内蔵されたノズル駆動機構22Aによる各吸着ノズル22aの昇降及び回動動作制御、装着ヘッド22に内蔵された吸着機構22Bによる各吸着ノズル22aの部品3の吸着動作制御は制御装置40によってなされる(図2)。基板カメラ23による撮像動作制御と部品カメラ24による撮像動作制御は制御装置40によってなされ、基板カメラ23の撮像動作によって得られた画像データと部品カメラ24による撮像動作によって得られた画像データの画像認識は制御装置40の画像認識部40aによってなされる。   Further, the supply operation control of the component 3 by the component supply unit 13 (part feeder 13a), the movement operation control of the mounting head 22 by the head moving mechanism 21, and the lifting and lowering of each suction nozzle 22a by the nozzle drive mechanism 22A built in the mounting head 22 are performed. Further, the rotation control and the suction operation control of the component 3 of each suction nozzle 22a by the suction mechanism 22B built in the mounting head 22 are performed by the control device 40 (FIG. 2). The image capturing operation control by the substrate camera 23 and the image capturing operation control by the component camera 24 are performed by the control device 40, and the image data obtained by the image capturing operation by the substrate camera 23 and the image data obtained by the image capturing operation by the component camera 24 are recognized. Is performed by the image recognition unit 40a of the control device 40.

部品実装機1が行う基板2への部品3の装着作業では、制御装置40は先ず、部品実装機1の上流側に設置された他の部品実装用装置から送られてきた基板2を基板搬送部12によって搬送して所定の作業位置に位置決めする。この基板搬送部12による基板2の作業位置への位置決め動作についての詳細は後述する。   In the mounting operation of the component 3 on the board 2 performed by the component mounting machine 1, the control device 40 first transports the board 2 sent from another component mounting apparatus installed on the upstream side of the component mounting machine 1. It is conveyed by the section 12 and positioned at a predetermined work position. Details of the positioning operation of the substrate 2 to the work position by the substrate transport unit 12 will be described later.

制御装置40は、基板搬送部12によって基板2を作業位置に位置決めしたら、ヘッド移動機構21により装着ヘッド22を水平面内で移動させて、基板2の上方に基板カメラ23を位置させ、基板2に設けられた位置認識マーク(図示せず)の撮像を行う。そして、得られた位置認識マークの画像を画像認識部40aにおいて画像認識することによって、基板2の正規の作業位置からの位置ずれを検出する。   After positioning the substrate 2 at the working position by the substrate transport unit 12, the control device 40 moves the mounting head 22 in the horizontal plane by the head moving mechanism 21, positions the substrate camera 23 above the substrate 2, and moves the substrate 2 to the substrate 2. The position recognition mark (not shown) provided is imaged. Then, the image recognition unit 40a recognizes the image of the obtained position recognition mark, thereby detecting a displacement of the substrate 2 from the normal working position.

制御装置40は、基板2の位置ずれを検出したら、ヘッド移動機構21の作動制御を行って装着ヘッド22を部品供給部13の上方に移動させ、各パーツフィーダ13aに部品3の供給動作を行わせるとともに、ノズル駆動機構22Aと吸着機構22Bの作動制御を行い、吸着ノズル22aに部品3を吸着させてピックアップする。そして、吸着ノズル22aによりピックアップした部品3が部品カメラ24の上方を通過するように装着ヘッド22を移動させ、部品カメラ24による部品3の撮像とこれにより得られた画像データの画像認識を行って、吸着ノズル22aに対する部品3の位置ずれ(吸着ずれ)を求める。   When the control device 40 detects the displacement of the substrate 2, the control device 40 controls the operation of the head moving mechanism 21 to move the mounting head 22 above the component supply unit 13 and performs the operation of supplying the component 3 to each part feeder 13 a. At the same time, the operation of the nozzle drive mechanism 22A and the suction mechanism 22B is controlled, and the part 3 is sucked and picked up by the suction nozzle 22a. Then, the mounting head 22 is moved so that the part 3 picked up by the suction nozzle 22a passes above the part camera 24, and the part 3 is imaged by the part camera 24 and the image data obtained thereby is recognized. Then, the positional deviation (suction deviation) of the component 3 with respect to the suction nozzle 22a is obtained.

制御装置40は、吸着ノズル22aに対する部品3の位置ずれを求めたら、部品3が基板2の上方に位置するように装着ヘッド22を移動させる。そして、吸着ノズル22aを下降させて、部品3を基板2に装着する。この部品3の装着時には、制御装置40は、既に求めている基板2の位置ずれと部品3の吸着ずれが修正されるように、基板2に対する吸着ノズル22aの位置補正(回転補正を含む)を行う。制御装置40は、基板2に装着すべき全ての部品3の装着が終了したら、基板搬送部12を作動させて、基板2を部品実装機1の外部に搬出する。   When the controller 40 obtains the positional deviation of the component 3 with respect to the suction nozzle 22 a, the controller 40 moves the mounting head 22 so that the component 3 is positioned above the substrate 2. Then, the suction nozzle 22 a is lowered and the component 3 is mounted on the substrate 2. When the component 3 is mounted, the control device 40 corrects the position of the suction nozzle 22a with respect to the substrate 2 (including rotation correction) so that the already-determined positional shift of the substrate 2 and the suction shift of the component 3 are corrected. Do. When the mounting of all the components 3 to be mounted on the board 2 is completed, the control device 40 operates the board transport unit 12 to carry the board 2 out of the component mounting machine 1.

次に、基板搬送部12による基板2の搬送動作(基板搬送方法)について図3のフローチャートを用いて説明する。各基板搬送機構30は、はじめコンベア30aは停止状態であり、この状態から上流側から送られてきた基板2の前端を第1のセンサS1が検出した場合には(ステップST1)、コンベア30aを起動して、上流側から送られてきた基板2を第1の速度で搬送(搬入)する(ステップST2)。そして、この第1の速度での基板2の搬送を実行しながら、第1のセンサS1による基板2の前端の検出後における、コンベア30aの駆動モータ(図示せず)の制御信号のパルス数を参照すること等により、基板2の前端が所定の減速開始位置(図4参照)に到達したか否かの判断を行う(ステップST3)。そして、基板2の前端が減速開始位置に到達したところで、基板2の搬送速度を第1の速度からそれよりも速度が小さい第2の速度に減速(第2の速度で基板2を搬送)する(ステップST4)。   Next, the transport operation (substrate transport method) of the substrate 2 by the substrate transport unit 12 will be described with reference to the flowchart of FIG. In each substrate transport mechanism 30, the conveyor 30 a is initially stopped, and when the first sensor S 1 detects the front end of the substrate 2 sent from the upstream side from this state (step ST 1), the conveyor 30 a It starts and the board | substrate 2 sent from the upstream side is conveyed (carrying in) at a 1st speed (step ST2). Then, while carrying the substrate 2 at this first speed, the number of pulses of the control signal of the drive motor (not shown) of the conveyor 30a after the detection of the front end of the substrate 2 by the first sensor S1 is obtained. By referencing or the like, it is determined whether or not the front end of the substrate 2 has reached a predetermined deceleration start position (see FIG. 4) (step ST3). When the front end of the substrate 2 reaches the deceleration start position, the transport speed of the substrate 2 is reduced from the first speed to a second speed that is smaller than the first speed (the substrate 2 is transported at the second speed). (Step ST4).

制御装置40は、基板2の搬送速度を第2の速度に減速した後、基板2の搬送を行いながら、第2のセンサS2が基板2の前端を検出したか(図4に示す停止位置に到達したか)否かの判断を行う(ステップST5)。そして、第2のセンサS2が基板2の前端を検出したとろで、基板2を(コンベア30aの搬送動作を)停止させる(ステップST6)。そして、搬送再開のタイミングになったか否かの判断を行い(ステップST7)、搬送再開のタイミングになったら、基板搬送機構30を起動し、基板2の搬送を再開して、基板2を第1の速度で搬送(搬出)する(ステップST8)。ここで、搬送再開のタイミングは、基板搬送機構30が中央機構32である場合には、装着ヘッド22による基板2に対する部品3の装着動作が終了するタイミングであり、上流側機構31では、中央機構32からの基板2の送り出しが完了したタイミングである。また、下流側機構33では、部品実装機1の下流側に設置された他の部品実装用装置における基板2の受け入れ準備が完了したタイミングである。   Whether the second sensor S2 detects the front end of the substrate 2 while transporting the substrate 2 after reducing the transport speed of the substrate 2 to the second speed (at the stop position shown in FIG. 4). It is determined whether or not (step ST5). Then, when the second sensor S2 detects the front end of the substrate 2, the substrate 2 is stopped (the conveying operation of the conveyor 30a) (step ST6). Then, it is determined whether or not the timing for resuming the conveyance is reached (step ST7). When the timing for resuming the conveyance is reached, the substrate conveyance mechanism 30 is activated, the conveyance of the substrate 2 is resumed, and the substrate 2 is moved to the first. (Carry out) at a speed of (step ST8). Here, when the substrate transport mechanism 30 is the central mechanism 32, the transport resumption timing is the timing when the mounting operation of the component 3 on the substrate 2 by the mounting head 22 is completed. This is the timing when the delivery of the substrate 2 from 32 is completed. Further, the downstream mechanism 33 is the timing when the preparation for receiving the substrate 2 in another component mounting apparatus installed on the downstream side of the component mounting machine 1 is completed.

制御装置40は、ステップST8で基板2の搬送を再開したら、基板2を第1の速度で搬送を実行しながら、第2のセンサS2が基板2の後端を検出したか否かの判断を行うとともに(ステップST9)、下流側に隣接した基板搬送機構30(上流側機構31にとっては中央機構32、中央機構32にとっては下流側機構33)が基板2の前端が所定の減速開始位置に到達したか否か、すなわち、下流側機構33が搬送速度を第1の速度から第2の速度に減速したか否かの判断を行う(ステップST10)。そして、その結果、下流側の基板搬送機構30の基板2の搬送速度が第2の速度に減速される前に第2のセンサS2が基板2の後端を検出した場合には基板2を(コンベア30aによる基板2の搬送動作を)停止させ(ステップST11)、第2のセンサS2が基板2の後端を検出する前に、下流側に隣接した基板搬送機構30の基板2の搬送速度が第2の速度に減速された場合には、基板2の搬送動作を、下流側に隣接した基板搬送機構30と同調して行わせる(ステップST12)。そして、このような下流側に隣接した基板搬送機構30と同調した基板2の搬送動作を行いながら、自己が備える第2のセンサS2が基板2の後端を検出するか否かの判断を行い(ステップST13)、その第2のセンサS2が基板2の後端を検出した場合には、基板2を(コンベア30aによる基板2の搬送動作を)停止させる(ステップST11)。   When the transfer of the substrate 2 is resumed in step ST8, the control device 40 determines whether or not the second sensor S2 has detected the rear end of the substrate 2 while executing the transfer of the substrate 2 at the first speed. In step ST9, the substrate transport mechanism 30 adjacent to the downstream side (the central mechanism 32 for the upstream mechanism 31 and the downstream mechanism 33 for the central mechanism 32) reaches the predetermined deceleration start position of the front end of the substrate 2. It is determined whether or not the downstream side mechanism 33 has reduced the conveyance speed from the first speed to the second speed (step ST10). As a result, when the second sensor S2 detects the rear end of the substrate 2 before the transport speed of the substrate 2 of the downstream substrate transport mechanism 30 is reduced to the second speed, the substrate 2 is Before the second sensor S2 detects the rear end of the substrate 2, the conveyance speed of the substrate 2 of the substrate conveyance mechanism 30 adjacent to the downstream side is stopped. When the speed is reduced to the second speed, the transfer operation of the substrate 2 is performed in synchronization with the substrate transfer mechanism 30 adjacent to the downstream side (step ST12). Then, while performing the transport operation of the substrate 2 in synchronization with the substrate transport mechanism 30 adjacent to the downstream side, it is determined whether or not the second sensor S2 provided therein detects the rear end of the substrate 2. (Step ST13) When the second sensor S2 detects the rear end of the substrate 2, the substrate 2 is stopped (the operation of transporting the substrate 2 by the conveyor 30a) (step ST11).

すなわち本実施の形態では、各基板搬送機構30の作動制御を行う制御装置40は、各基板搬送機構30が、上流側に隣接した他の基板搬送機構30から送られてきた基板2を第1の速度で搬入した後、基板2の前端が所定の減速開始位置に到達したところで基板2の搬送速度を第1の速度よりも速度が小さい第2の速度に減速させ、基板検出センサ(第2のセンサS2)によって基板2の前端が検出されたら基板2を停止させる動作(基板搬入動作)及び停止させた基板2の搬送を再開して基板2の後端が基板検出センサによって検出されるまで第1の速度で基板2を搬送して下流側に隣接した他の基板搬送機構30に搬出する動作(搬出動作)を行うように制御する。そして制御装置40は、各基板搬送機構30が、基板2の搬送を再開した後、基板検出センサによって基板2の後端が検出される前に、基板2の前端が下流側に隣接した他の基板搬送機構の減速開始位置に到達した場合には、基板検出センサによって基板2の後端が検出されるまで、下流側に隣接した基板搬送機構と同調した基板の搬送を行うように作動させる。   That is, in the present embodiment, the control device 40 that controls the operation of each substrate transport mechanism 30 is configured such that each substrate transport mechanism 30 receives the first substrate 2 sent from another substrate transport mechanism 30 adjacent to the upstream side. Then, when the front end of the substrate 2 reaches a predetermined deceleration start position, the conveyance speed of the substrate 2 is reduced to a second speed that is smaller than the first speed, and a substrate detection sensor (second When the front end of the substrate 2 is detected by the sensor S2), the operation of stopping the substrate 2 (substrate carrying-in operation) and the transportation of the stopped substrate 2 are resumed until the rear end of the substrate 2 is detected by the substrate detection sensor. Control is performed so that the substrate 2 is transported at the first speed and is transported to another substrate transport mechanism 30 adjacent to the downstream side (unloading operation). Then, after each substrate transport mechanism 30 resumes transport of the substrate 2 and before the rear end of the substrate 2 is detected by the substrate detection sensor, the control device 40 determines whether the front end of the substrate 2 is adjacent to the downstream side. When the deceleration start position of the substrate transport mechanism is reached, the substrate detection sensor is operated to transport the substrate in synchronization with the substrate transport mechanism adjacent to the downstream side until the rear end of the substrate 2 is detected by the substrate detection sensor.

基板搬送機構30において上記のような制御が行われた場合、図4に示すように、基板2の搬送方向(X軸方向)の長さをL、隣り合う基板搬送機構30の第2のセンサS2同士の間の距離をD、減速開始位置と第2のセンサS2との間の距離をdとした場合、基板2の搬送方向(X軸方向)の長さLの大きさによって、図5、図6、図7に示すように、基板搬送機構30の動作が異なる。図5はL<(D−d)の場合、図6は(D−d)<L<Dの場合、図7はL<Dの場合を示している。   When the above-described control is performed in the substrate transport mechanism 30, the length in the transport direction (X-axis direction) of the substrate 2 is L, and the second sensor of the adjacent substrate transport mechanism 30 is shown in FIG. When the distance between S2 is D and the distance between the deceleration start position and the second sensor S2 is d, depending on the length L of the substrate 2 in the transport direction (X-axis direction), FIG. 6 and 7, the operation of the substrate transport mechanism 30 is different. 5 shows a case where L <(D−d), FIG. 6 shows a case where (D−d) <L <D, and FIG. 7 shows a case where L <D.

図5に示すように、L<(D−d)の場合には、基板2の前端が上流側機構31の第2のセンサS2によって検出された位置(停止位置)にある状態から(図5(a))、上流側機構31によって第1の速度で搬送されると、基板2の前端が中央機構32の第1のセンサS1で検出されることによって(図5(b))、中央機構32も第1の速度での基板2の搬送を開始する。このため基板2は第1の速度で上流側機構31から中央機構32に移動する。そして、基板2の前端が中央機構32の減速開始位置に達したところで(図5(c))、中央機構32は基板2の搬送速度を第2の速度に減速するが、このとき基板2の後端は上流側機構31の第2のセンサS2により後端が検出された後であり、上流側機構31は動作が既に停止されている。その後、中央機構32は、第2のセンサS2によって基板2の前端を検出したところで(図5(d))基板2を停止させる。図5(d)の状態は図5(a)の状態から基板2が隣接する2つの基板搬送機構30の間で移送された状態であり、その後、図5(a)→図5(b)→図5(c)→図5(d)と同様の動作が繰り返されて基板2は進行を続ける。   As shown in FIG. 5, when L <(D-d), the front end of the substrate 2 is in a position (stop position) detected by the second sensor S2 of the upstream mechanism 31 (FIG. 5). (A)) When transported at the first speed by the upstream mechanism 31, the front end of the substrate 2 is detected by the first sensor S1 of the central mechanism 32 (FIG. 5B), thereby causing the central mechanism to 32 also starts transporting the substrate 2 at the first speed. Therefore, the substrate 2 moves from the upstream mechanism 31 to the central mechanism 32 at the first speed. When the front end of the substrate 2 reaches the deceleration start position of the central mechanism 32 (FIG. 5C), the central mechanism 32 decelerates the conveyance speed of the substrate 2 to the second speed. The rear end is after the rear end is detected by the second sensor S2 of the upstream mechanism 31, and the operation of the upstream mechanism 31 has already been stopped. Thereafter, the central mechanism 32 stops the substrate 2 when the front end of the substrate 2 is detected by the second sensor S2 (FIG. 5D). The state of FIG. 5D is a state in which the substrate 2 is transferred between two adjacent substrate transport mechanisms 30 from the state of FIG. 5A, and thereafter, FIG. 5A → FIG. 5B. → FIG. 5 (c) → The same operation as in FIG. 5 (d) is repeated, and the substrate 2 continues to advance.

図6に示すように、(D−d)<L<Dの場合には、基板2の前端が上流側機構31の第2のセンサS2によって検出された位置(停止位置)にある状態から(図6(a))、上流側機構31によって第1の速度で搬送されると、基板2の前端が中央機構32の第1のセンサS1で検出されることによって(図6(b))、中央機構32も第1の速度での基板2の搬送を開始する。このため基板2は第1の速度で上流側機構31から中央機構32に移動する。そして、基板2の前端が中央機構32の減速開始位置に達したところで(図6(c))、中央機構32は基板2の搬送速度を第2の速度に減速するが、このとき基板2の後端は上流側機構31の第2のセンサS2により後端がまだ検出されていないので、上流側機構31は中央機構32と同期して、基板2の搬送速度を第2の速度に減速する。そして、中央機構32は、第2のセンサS2によって基板2の前端を検出したところで(図6(d))基板2を停止させるが、このとき基板2の後端は上流側機構31の第2のセンサS2により後端が検出された後であり、上流側機構31は動作が既に停止されている。図6(d)の状態は図6(a)の状態から基板2が隣接する2つの基板搬送機構30の間で移送された状態であり、その後、図6(a)→図6(b)→図6(c)→図6(d)と同様の動作が繰り返されて基板2は進行を続ける。   As shown in FIG. 6, when (D−d) <L <D, the front end of the substrate 2 is in a position (stop position) detected by the second sensor S <b> 2 of the upstream mechanism 31 ( 6 (a)), when transported at the first speed by the upstream mechanism 31, the front end of the substrate 2 is detected by the first sensor S1 of the central mechanism 32 (FIG. 6 (b)). The central mechanism 32 also starts transporting the substrate 2 at the first speed. Therefore, the substrate 2 moves from the upstream mechanism 31 to the central mechanism 32 at the first speed. When the front end of the substrate 2 reaches the deceleration start position of the central mechanism 32 (FIG. 6C), the central mechanism 32 decelerates the conveyance speed of the substrate 2 to the second speed. Since the rear end of the upstream side mechanism 31 is not yet detected by the second sensor S2 of the upstream side mechanism 31, the upstream side mechanism 31 synchronizes with the central mechanism 32 and reduces the conveyance speed of the substrate 2 to the second speed. . The central mechanism 32 stops the substrate 2 when the front end of the substrate 2 is detected by the second sensor S2 (FIG. 6D). At this time, the rear end of the substrate 2 is the second end of the upstream mechanism 31. After the rear end is detected by the sensor S <b> 2, the operation of the upstream mechanism 31 has already been stopped. The state of FIG. 6D is a state in which the substrate 2 is transferred between two adjacent substrate transport mechanisms 30 from the state of FIG. 6A, and thereafter, FIG. 6A → FIG. 6B. → FIG. 6 (c) → The same operation as in FIG. 6 (d) is repeated, and the substrate 2 continues to advance.

図7に示すように、D<Lの場合には、基板2の前端が上流側機構31の第2のセンサS2によって検出された位置(停止位置)にある状態から(図7(a))、上流側機構31によって第1の速度で搬送されると、基板2の前端が中央機構32の第1のセンサS1で検出されることによって(図7(b))、中央機構32も第1の速度での基板2の搬送を開始する。このため基板2は第1の速度で上流側機構31から中央機構32に移動する。そして、基板2の前端が中央機構32の減速開始位置に達したところで(図7(c))、中央機構32は基板2の搬送速度を第2の速度に減速するが、このとき基板2の後端はまだ上流側機構31の第2のセンサS2によって検出されていないので、上流側機構31は中央機構32と同期して、基板2の搬送速度を第2の速度に減速する。そして、中央機構32は、第2のセンサS2によって基板2の前端を検出したところで(図7(d))、基板2を停止させるが、このとき基板2の後端はまだ上流側機構31の第2のセンサS2によって後端が検出されていないので、上流側機構31は中央機構32と同期して基板2を停止させる。なお、この後、中央機構32は基板2の搬送を再開するが、この時点で基板2の後端は上流側機構31の第2のセンサS2によって検出されておらず、中央機構32と同期した動作を行うので、中央機構32による基板2の搬送動作の再開とともに上流側機構31も基板2の搬送動作を再開する。そして、基板2の後端が上流側機構31の第2のセンサS2によって検出されたところで、上流側機構31は搬送動作を停止させる。図7(d)の状態は図7(a)の状態から基板2が隣接する2つの基板搬送機構30の間で移送された状態であり、その後、図7(a)→図7(b)→図7(c)→図7(d)と同様の動作が繰り返されて基板2は進行を続ける。   As shown in FIG. 7, when D <L, the front end of the substrate 2 is in a position (stop position) detected by the second sensor S2 of the upstream mechanism 31 (FIG. 7 (a)). When the upstream mechanism 31 is transported at the first speed, the front end of the substrate 2 is detected by the first sensor S1 of the central mechanism 32 (FIG. 7B), and the central mechanism 32 is also first. The conveyance of the substrate 2 at a speed of is started. Therefore, the substrate 2 moves from the upstream mechanism 31 to the central mechanism 32 at the first speed. When the front end of the substrate 2 reaches the deceleration start position of the central mechanism 32 (FIG. 7C), the central mechanism 32 decelerates the conveyance speed of the substrate 2 to the second speed. Since the rear end has not yet been detected by the second sensor S2 of the upstream mechanism 31, the upstream mechanism 31 synchronizes with the central mechanism 32 to reduce the transport speed of the substrate 2 to the second speed. The central mechanism 32 stops the substrate 2 when the front end of the substrate 2 is detected by the second sensor S2 (FIG. 7D). At this time, the rear end of the substrate 2 is still at the upstream side of the upstream mechanism 31. Since the rear end is not detected by the second sensor S <b> 2, the upstream mechanism 31 stops the substrate 2 in synchronization with the central mechanism 32. After that, the central mechanism 32 resumes the conveyance of the substrate 2, but at this time, the rear end of the substrate 2 is not detected by the second sensor S <b> 2 of the upstream mechanism 31 and is synchronized with the central mechanism 32. Since the operation is performed, the upstream mechanism 31 also restarts the transport operation of the substrate 2 as the central mechanism 32 restarts the transport operation of the substrate 2. When the rear end of the substrate 2 is detected by the second sensor S2 of the upstream mechanism 31, the upstream mechanism 31 stops the transport operation. The state of FIG. 7D is a state in which the substrate 2 is transferred between two adjacent substrate transfer mechanisms 30 from the state of FIG. 7A, and thereafter, FIG. 7A → FIG. 7B. → FIG. 7 (c) → The same operation as in FIG. 7 (d) is repeated, and the substrate 2 continues to advance.

上記のように、(D−d)<Lの場合において、基板2の前端が中央機構32の減速開始位置に達したところで(図6(c)又は図7(c))、中央機構32は基板2の搬送速度を第2の速度に減速するが、このとき上流側機構31が中央機構32と同期して基板2を第2の速度で搬送するようになっており、基板2を送り出した側の上流側機構31が第1の速度のまま基板2を中央機構32側に搬送し続ける事態は生じない。このため中央機構32では、上流側機構31から基板2が押込まれることがなく、基板2を正規の停止位置(第2のセンサS2によって基板2の前端が検出される位置)で確実に停止できる。なお、ここでは上流側機構31と中央機構32との間の基板2の搬送を例にとって説明したが、これは中央機構32と下流側機構33との間、更には部品実装機1の上流側に設置された他の部品実装用装置の基板搬送部と上流側機構31との間及び下流側機構33と部品実装機1の下流側に設置された他の部品実装用装置の基板搬送部との間の基板2の搬送についても同様の効果が得られる。   As described above, when (D−d) <L, when the front end of the substrate 2 reaches the deceleration start position of the central mechanism 32 (FIG. 6C or FIG. 7C), the central mechanism 32 The transport speed of the substrate 2 is reduced to the second speed. At this time, the upstream side mechanism 31 transports the substrate 2 at the second speed in synchronization with the central mechanism 32, and the substrate 2 is sent out. A situation in which the upstream upstream mechanism 31 continues to transport the substrate 2 to the central mechanism 32 side at the first speed does not occur. For this reason, in the central mechanism 32, the board | substrate 2 is not pushed from the upstream mechanism 31, and the board | substrate 2 is stopped reliably in the regular stop position (position where the front end of the board | substrate 2 is detected by 2nd sensor S2). it can. Here, the conveyance of the substrate 2 between the upstream mechanism 31 and the central mechanism 32 has been described as an example, but this is performed between the central mechanism 32 and the downstream mechanism 33 and further on the upstream side of the component mounting machine 1. Between the substrate transport section of the other component mounting apparatus installed in the upstream side mechanism 31 and the downstream side mechanism 33 and the board transport section of the other component mounting apparatus installed downstream of the component mounter 1. The same effect can be obtained for the transfer of the substrate 2 between the two.

以上説明したように、本実施の形態における部品実装機1(部品実装機1における基板搬送方法)では、各基板搬送機構30は、基板2の搬送を再開した後、第2のセンサS2(基板検出センサ)によって基板2の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構30の減速開始位置に到達した場合には、第2のセンサS2によって基板2の後端が検出されるまで、下流側に隣接した他の基板搬送機構30と同調した基板2の搬送を行うことから、送り出した基板2を、下流側に隣接した他の基板搬送機構30の搬送速度よりも大きな搬送速度で搬送し続けるといった事態は生じない。このため、下流側に隣接した基板搬送機構30では基板2を正規の位置(停止位置)に確実に停止させることができ、オーバーランの発生を防止できるので、作業効率の低下を防ぐことができる。   As described above, in the component mounter 1 (the substrate transport method in the component mounter 1) in the present embodiment, each substrate transport mechanism 30 restarts the transport of the substrate 2 and then the second sensor S2 (the substrate If the front end of the sent-out substrate reaches the deceleration start position of another substrate transport mechanism 30 adjacent to the downstream side before the rear end of the substrate 2 is detected by the detection sensor), the second sensor S2 Until the rear end of the substrate 2 is detected, the substrate 2 is transported in synchronization with the other substrate transport mechanism 30 adjacent to the downstream side, so that the sent-out substrate 2 is transported to another substrate transport mechanism adjacent to the downstream side. There is no situation in which conveyance continues at a conveyance speed larger than the conveyance speed of 30. For this reason, the substrate transport mechanism 30 adjacent to the downstream side can surely stop the substrate 2 at the regular position (stop position) and can prevent the occurrence of overrun, thereby preventing a reduction in work efficiency. .

オーバーランの発生を防止して作業効率の低下を防ぐことができる部品実装置及び部品実装用装置における基板搬送方法を提供することを目的とする。   It is an object of the present invention to provide a component actual apparatus and a substrate carrying method in a component mounting apparatus that can prevent the occurrence of overrun and prevent a reduction in work efficiency.

1 部品実装機(部品実装用装置)
2 基板
12 基板搬送部
30 基板搬送機構
40 制御装置(制御部)
S2 第2のセンサ(基板検出センサ)
1 Component mounter (component mounting equipment)
2 Substrate 12 Substrate transport unit 30 Substrate transport mechanism 40 Control device (control unit)
S2 Second sensor (substrate detection sensor)

Claims (2)

上流側から送られてきた基板を搬入して下流側に搬出する動作を行う複数の基板搬送機構が直列に並べられて成る基板搬送部を備えた部品実装用装置であって、
各基板搬送機構は、基板の搬出側の端部に設けられて基板を検出する基板検出センサを備え、
各基板搬送機構の作動制御を行う制御部は、
各基板搬送機構が、上流側に隣接した他の基板搬送機構から送られてきた基板を第1の速度で搬入した後、基板の前端が所定の減速開始位置に到達したところで基板の搬送速度を前記第1の速度よりも速度が小さい第2の速度に減速させ、前記基板検出センサによって基板の前端が検出されたら基板を停止させる基板搬入動作及び停止させた基板の搬送を再開して基板の後端が前記基板検出センサによって検出されるまで前記第1の速度で基板を搬送して下流側に隣接した他の基板搬送機構に搬出する搬出動作を行うように制御し、
各基板搬送機構が、基板の搬送を再開した後、前記基板検出センサによって基板の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構の前記減速開始位置に到達した場合には、前記基板検出センサによって基板の後端が検出されるまで、前記下流側に隣接した他の基板搬送機構と同調した基板の搬送を行うように作動させることを特徴とする部品実装用装置。
A component mounting apparatus including a substrate transport unit in which a plurality of substrate transport mechanisms that perform operations of carrying in a substrate sent from the upstream side and carrying it out to the downstream side are arranged in series,
Each substrate transport mechanism includes a substrate detection sensor that is provided at an end portion on the carry-out side of the substrate and detects the substrate,
The controller that controls the operation of each substrate transport mechanism
After each substrate transport mechanism carries in a substrate sent from another substrate transport mechanism adjacent to the upstream side at a first speed, the substrate transport speed is increased when the front end of the substrate reaches a predetermined deceleration start position. The substrate is decelerated to a second speed that is lower than the first speed, and when the front end of the substrate is detected by the substrate detection sensor, the substrate carrying-in operation for stopping the substrate and the transport of the stopped substrate are resumed. Control to perform a carry-out operation of carrying the substrate at the first speed until the rear end is detected by the substrate detection sensor and carrying it out to another substrate carrying mechanism adjacent to the downstream side;
After each substrate transport mechanism resumes transport of the substrate, before the rear end of the substrate is detected by the substrate detection sensor, the deceleration start of the other substrate transport mechanism in which the front end of the sent-out substrate is adjacent to the downstream side When the position reaches the position, the substrate detection sensor is operated to transport the substrate in synchronization with another substrate transport mechanism adjacent to the downstream side until the rear end of the substrate is detected by the substrate detection sensor. Component mounting equipment.
上流側から送られてきた基板を搬入して下流側に搬出する動作を行う複数の基板搬送機構が直列に並べられて成る基板搬送部を備えた部品実装用装置における基板搬送方法であって、
各基板搬送機構が、
上流側に隣接した他の基板搬送機構から送られてきた基板を第1の速度で搬入する第1工程と、
前記第1の工程を開始した後、基板の前端が所定の減速開始位置に到達したところで基板の搬送速度を前記第1の速度よりも速度が小さい第2の速度に減速させる第2工程と、
前記基板の搬送速度を前記第2の速度に減速させた後、基板の搬出側の端部に設けられた基板検出センサによって基板の前端が検出されたら基板を停止させる第3工程と、
前記第3工程の後、基板の搬送を再開させて基板の後端が前記基板検出センサによって検出されるまで前記第1の速度で基板を搬送して下流側に隣接した他の基板搬送機構に搬出する第4工程とを実行し、
前記第4工程において、基板の搬送を再開させた後、前記基板検出センサによって基板の後端が検出される前に、送り出した基板の前端が下流側に隣接した他の基板搬送機構の前記減速開始位置に到達した場合には、前記基板検出センサによって基板の後端が検出されるまで、前記下流側に隣接した他の基板搬送機構と同調した基板の搬送を行うことを特徴とする部品実装用装置における基板搬送方法。
A substrate transport method in a component mounting apparatus including a substrate transport unit in which a plurality of substrate transport mechanisms that perform operations of carrying in a substrate sent from the upstream side and carrying it out to the downstream side are arranged in series,
Each board transfer mechanism
A first step of loading a substrate sent from another substrate transfer mechanism adjacent to the upstream side at a first speed;
A second step of decelerating the substrate transport speed to a second speed smaller than the first speed when the front end of the substrate reaches a predetermined deceleration start position after starting the first step;
A third step of stopping the substrate when the front end of the substrate is detected by the substrate detection sensor provided at the end portion on the carry-out side of the substrate after the substrate transport speed is reduced to the second speed;
After the third step, the transfer of the substrate is resumed, and the substrate is transferred at the first speed until the rear end of the substrate is detected by the substrate detection sensor, and is transferred to another substrate transfer mechanism adjacent to the downstream side. Execute the fourth step of carrying out,
In the fourth step, after the substrate transport is resumed, before the rear end of the substrate is detected by the substrate detection sensor, the deceleration of the other substrate transport mechanism in which the front end of the fed-out substrate is adjacent to the downstream side. When the start position is reached, component mounting is performed in which the substrate is transported in synchronization with another substrate transport mechanism adjacent to the downstream side until the rear end of the substrate is detected by the substrate detection sensor. Substrate transport method in an industrial apparatus.
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