JP2013153226A - Board transportation method in component mounting system - Google Patents

Board transportation method in component mounting system Download PDF

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JP2013153226A
JP2013153226A JP2013100940A JP2013100940A JP2013153226A JP 2013153226 A JP2013153226 A JP 2013153226A JP 2013100940 A JP2013100940 A JP 2013100940A JP 2013100940 A JP2013100940 A JP 2013100940A JP 2013153226 A JP2013153226 A JP 2013153226A
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board
component mounting
substrate
carry
conveyor
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Michiaki Motai
道明 馬渡
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a board transportation method in a component mounting system capable of increasing the productivity of boards by causing a board to wait at an appropriate position according to the length of the board.SOLUTION: A component mounting system includes two neighboring component mounting apparatuses 4 configured to have a component mounting apparatus 4 located at the downstream side having a feeder conveyor 13b and a component mounting apparatus 4 located at the upstream side having a take-out conveyor 13c. A feeding side board detector 17b provided to the component mounting apparatus 4 at the downstream side detects the front end of a board 2 to cause the board 2 to wait at a board waiting position. When a feeding-side board detector 17b provided to the component mounting apparatus 4 at the downstream side detects the front end of a board 2, the component mounting apparatus 4 at the upstream side stops the take-out conveyor 13c of its own from operating to cause the board 2 to wait at the board waiting position.

Description

本発明は、基板に対する部品実装関連の作業を行う複数台の部品実装用装置が連結されて成る部品実装システムにおける基板搬送方法に関するものである。   The present invention relates to a substrate carrying method in a component mounting system in which a plurality of component mounting apparatuses that perform component mounting related operations on a substrate are connected.

部品実装システムは、基板に半田を印刷する半田印刷機、半田印刷機により半田が印刷された基板に部品(電子部品)を装着する部品実装機、部品実装機により部品が実装された基板の検査を行う検査機、検査機により検査が行われた基板の半田リフロー処理を行うリフロー炉等の複数台の部品実装用装置が連結されて成る。   The component mounting system consists of a solder printer that prints solder on a substrate, a component mounter that mounts components (electronic components) on a substrate printed with solder by a solder printer, and an inspection of a substrate on which components are mounted by a component mounter. And a plurality of component mounting apparatuses such as a reflow furnace for performing a solder reflow process on the board inspected by the inspection machine.

部品実装システムを構成する各部品実装用装置は基板を作業位置に位置決めする位置決めコンベアのほか、上流側又は下流側に隣接する他の部品実装用装置との間で基板の受け渡し用に用いる基板受け渡し用コンベアを備えている。各部品実装用装置は、位置決めコンベアにより基板を位置決めし、基板に対する所要の作業を実行しながら、作業を施す前後の基板を基板受け渡し用コンベア上に待機させておくことができるので、部品実装システム全体における基板の搬送をスムーズに行うことができる。また、隣接する2台の部品実装用装置の間では、対向させた一対の基板受け渡し用コンベアに基板を跨らせた状態で待機させることもできる(例えば、特許文献1)。   Each component mounting device constituting the component mounting system is a substrate transfer used for transferring a substrate to and from another component mounting device adjacent to the upstream side or the downstream side, in addition to a positioning conveyor for positioning the substrate at a working position. It has a conveyor. Each component mounting device can position a substrate by a positioning conveyor, and while waiting for the substrate before and after the operation to be performed on the substrate delivery conveyor while performing a required operation on the substrate, the component mounting system The entire substrate can be transported smoothly. In addition, between two adjacent component mounting apparatuses, a pair of board transfer conveyors facing each other can be put on standby in a state where the board is straddled (for example, Patent Document 1).

特開2009−54619号公報JP 2009-54619 A

しかしながら、従来の部品実装システムでは、隣接する部品実装用装置同士で互いの基板受け渡し用コンベアの長さを把握しているわけではないので、搬送対象となっている基板の長さ(サイズ)に応じた適切な位置に基板を待機させるといったフレキシブルな基板搬送を行うことはできず、基板の生産性の向上の妨げとなっていた。   However, in the conventional component mounting system, adjacent component mounting apparatuses do not grasp the length of each other's board transfer conveyor, so the length (size) of the board to be transferred is determined. Flexible substrate transfer such as waiting the substrate at an appropriate position corresponding to the substrate cannot be performed, which hinders improvement in substrate productivity.

そこで本発明は、基板の長さに応じた適切な位置に基板を待機させて基板の生産性を向上させることができる部品実装システムにおける基板搬送方法を提供すること目的とする。   Accordingly, an object of the present invention is to provide a substrate carrying method in a component mounting system that can improve the productivity of a substrate by waiting the substrate at an appropriate position according to the length of the substrate.

請求項1に記載の部品実装システムにおける基板搬送方法は、基板に対する部品実装関連の作業を行う複数台の部品実装用装置が連結されて成り、各部品実装用装置が、上流側又は下流側に隣接する他の部品実装用装置との間で基板の受け渡し用に用いる基板受け渡し用コンベアとしての搬入コンベア及び搬出コンベアと、搬入コンベアに設けられて基板の先頭部を検出する搬入側基板検出器及び搬出コンベアに設けられて基板の先頭部を検出する搬出側基板検出器とを備えた部品実装システムにおける基板搬送方法であって、隣接する2台の部品実装用装置のうち下流側の部品実装用装置が備える搬入コンベアと上流側の部品実装用装置が備える搬出コンベアとの間を跨ぎ、下流側の部品実装用装置が備える前記搬入側基板検出器によって基板の先頭部が検出される基板待機位置に基板を待機させる場合、上流側の部品実装用装置は、下流側の部品実装用装置が備える前記搬入側基板検出器により基板の先頭部が検出されたとき、自機の搬出コンベアの作動を停止させることにより、基板を前記基板待機位置に待機させる。   The substrate transport method in the component mounting system according to claim 1 is formed by connecting a plurality of component mounting devices that perform component mounting related operations on the substrate, and each component mounting device is located upstream or downstream. A carry-in conveyor and a carry-out conveyor as board delivery conveyors used for board delivery between other adjacent component mounting apparatuses, a carry-in board detector that is provided on the carry-in conveyor and detects the leading portion of the board; A substrate carrying method in a component mounting system provided with a carry-out side board detector provided on a carry-out conveyor to detect a leading portion of a board, and for downstream component mounting among two adjacent component mounting devices By the carry-in board detector provided between the carry-in conveyor provided in the apparatus and the carry-out conveyor provided in the upstream component mounting apparatus and provided in the downstream component mounting apparatus When the board is made to stand by at the board standby position where the top part of the board is detected, the upstream part mounting apparatus detects the top part of the board by the carry-in board detector included in the downstream part mounting apparatus. Then, by stopping the operation of the carry-out conveyor of the own machine, the substrate is made to wait at the substrate standby position.

請求項2に記載の部品実装システムにおける基板搬送方法は、請求項1に記載の部品実装システムにおける基板搬送方法であって、下流側の部品実装用装置は、自機が備える前記搬入側基板検出器により基板の先頭部が検出されたとき、自機の搬入コンベアの作動を停止させるとともに、上流側の部品実装用装置に、上流側の部品実装用装置が備える搬出コンベアによる基板の搬送動作を停止させる指令を出力する。   The board transport method in the component mounting system according to claim 2 is the board transport method in the component mounting system according to claim 1, wherein the component mounting apparatus on the downstream side includes the carry-in board detection included in the own apparatus. When the top of the board is detected by the device, the operation of the carry-in conveyor of the own machine is stopped, and the upstream component mounting apparatus is operated to carry the board by the carry-out conveyor provided in the upstream component mounting apparatus. Outputs a command to stop.

本発明では、隣接する2台の部品実装用装置のうち下流側の部品実装用装置が備える搬入コンベアと上流側の部品実装用装置が備える搬出コンベアとの間を跨ぎ、下流側の部品実装用装置が備える搬入側基板検出器によって基板の先頭部が検出される基板待機位置に待機させる場合、上流側の部品実装用装置は、下流側の部品実装用装置が備える搬入側基板検出器により基板の先頭部が検出されたとき、自機の搬出コンベアの作動を停止させることによって、基板を基板待機位置に待機させる。このため、基板の長さ(サイズ)に応じた適切な位置に基板を待機させるフレキシブルな基板の搬送を行うことができ、これにより基板の生産性を向上させることができる。   In the present invention, between the two adjacent component mounting apparatuses, the downstream component mounting apparatus includes a carry-in conveyor provided in the downstream component mounting apparatus and a carry-out conveyor provided in the upstream component mounting apparatus. In the case of waiting at the board standby position where the leading portion of the board is detected by the carry-in board detector provided in the apparatus, the upstream component mounting apparatus uses the carry-in board detector provided in the downstream component mounting apparatus. When the head of the substrate is detected, the operation of the carry-out conveyor of the own machine is stopped, and the substrate is made to wait at the substrate standby position. For this reason, the flexible board | substrate conveyance which makes a board | substrate stand by in the suitable position according to the length (size) of a board | substrate can be performed, and, thereby, productivity of a board | substrate can be improved.

本発明の一実施の形態における部品実装システムの斜視図The perspective view of the component mounting system in one embodiment of this invention 本発明の一実施の形態における部品実装システムを構成する部品実装機の平面図The top view of the component mounting machine which comprises the component mounting system in one embodiment of this invention 本発明の一実施の形態における部品実装機が備える基板搬送路及び装着ヘッドの斜視図The perspective view of the board | substrate conveyance path with which the component mounting machine in one embodiment of this invention and a mounting head are equipped. 本発明の一実施の形態における部品実装機の制御系統を示すブロック図The block diagram which shows the control system of the component mounting machine in one embodiment of this invention (a)(b)(c)本発明の一実施の形態における基板の待機位置の例を示す図(A) (b) (c) The figure which shows the example of the stand-by position of the board | substrate in one embodiment of this invention (a)(b)本発明の一実施の形態における基板の待機位置の例を示す図(A) (b) The figure which shows the example of the stand-by position of the board | substrate in one embodiment of this invention 本発明の一実施の形態における基板の待機位置の例を示す図The figure which shows the example of the stand-by position of the board | substrate in one embodiment of this invention

以下、図面を参照して本発明の実施の形態について説明する。図1に示す本発明の一実施の形態における部品実装システム1は、基板2の電極2a上に部品(電子部品)3の装着を施す部品実装用装置である部品実装機4が基板2の搬送方向(図1中に示す矢印A)に複数台連結された構成となっている。これら複数台の部品実装機4の上流側(基板2の流れの上流側)には通常、基板2の電極2a上に半田の印刷を施す部品実装用装置である半田印刷機が設置され、複数台の部品実装機4の下流側には部品3の実装がなされた基板2の検査を行う部品実装用装置である検査機及び検査機による検査を終えた基板2に半田リフロー処理工程を施す部品実装用装置であるリフロー炉等が設置されるが、本実施の形態では、部品実装機4以外の部品実装用装置の図示及び説明はここでは省略する。以下、説明の便宜上、部品実装システム1を構成する各部品実装機4における基板2の搬送方向に沿った水平面内方向をX軸方向とし、X軸方向と直交する水平面内方向をY軸方向とする。また、上下方向をZ軸方向とする。   Embodiments of the present invention will be described below with reference to the drawings. In a component mounting system 1 according to an embodiment of the present invention shown in FIG. 1, a component mounting machine 4, which is a component mounting device for mounting a component (electronic component) 3 on an electrode 2 a of a substrate 2, transports the substrate 2. A plurality of units are connected in the direction (arrow A shown in FIG. 1). On the upstream side of the plurality of component mounting machines 4 (upstream side of the flow of the substrate 2), a solder printer, which is a component mounting device for performing solder printing on the electrodes 2a of the substrate 2, is usually installed. An inspection machine which is a component mounting apparatus for inspecting the substrate 2 on which the component 3 is mounted on the downstream side of the component mounting machine 4 and a component which performs a solder reflow process on the substrate 2 which has been inspected by the inspection machine A reflow furnace or the like, which is a mounting apparatus, is installed, but in the present embodiment, illustration and description of a component mounting apparatus other than the component mounter 4 are omitted here. Hereinafter, for convenience of explanation, the horizontal plane direction along the conveyance direction of the substrate 2 in each component mounting machine 4 constituting the component mounting system 1 is defined as the X-axis direction, and the horizontal plane direction orthogonal to the X-axis direction is defined as the Y-axis direction. To do. Also, the vertical direction is the Z-axis direction.

図2において、各部品実装機4は、カバー部材11(図1も参照)により覆われた基台12と、基台12に設けられて基板2の搬送及び位置決めを行う基板搬送路13と、基台12に設置されて部品3を供給する部品供給手段としての複数のテープフィーダ14と、基台12に設けられたロボット機構15により水平面内方向に移動され、基板搬送路13により位置決めされた基板2にテープフィーダ14よりピックアップした部品3の装着を行う2つの装着ヘッド16を備えている。   2, each component mounting machine 4 includes a base 12 covered with a cover member 11 (see also FIG. 1), a board transport path 13 provided on the base 12 for transporting and positioning the board 2, and A plurality of tape feeders 14 that are installed on the base 12 and supply parts 3 are moved in the horizontal plane by a robot mechanism 15 provided on the base 12 and positioned by the substrate transport path 13. Two mounting heads 16 for mounting the component 3 picked up from the tape feeder 14 on the substrate 2 are provided.

基板搬送路13は、基台12の中央部に設けられて基板2を所定の作業位置(図2及び図3に示す位置)に位置決めする位置決めコンベア13aのほか、上流側又は下流側に隣接する他の部品実装機4との間で基板2の受け渡し用に用いる基板受け渡し用コンベアとしての搬入コンベア13bと搬出コンベア13cを備えている。すなわち基板搬送路13は、位置決めコンベア13aの上流側に、上流側の部品実装機4から送られてきた基板2を搬入して位置決めコンベア13aに受け渡す搬入コンベア13bを備えるとともに、位置決めコンベア13aの下流側に、位置決めコンベア13aから送られてきた基板2を受け取って下流側の部品実装機4に搬出する搬出コンベア13cを備えた構成となっている。   The substrate transport path 13 is provided at the center of the base 12 and is adjacent to the upstream or downstream side of the positioning conveyor 13a for positioning the substrate 2 at a predetermined work position (the position shown in FIGS. 2 and 3). A carry-in conveyor 13b and a carry-out conveyor 13c are provided as board delivery conveyors used for delivery of the board 2 to and from other component mounting machines 4. That is, the board conveyance path 13 includes a carry-in conveyor 13b that carries the board 2 sent from the upstream component mounter 4 and delivers it to the positioning conveyor 13a on the upstream side of the positioning conveyor 13a. On the downstream side, there is provided a carry-out conveyor 13c that receives the board 2 sent from the positioning conveyor 13a and carries it out to the component mounting machine 4 on the downstream side.

図2において、ロボット機構15は、X軸方向に対向する基台12の両端部の一端側において、基板搬送路13を跨ぐようにY軸方向に延びて設けられたビーム状のY軸テーブル15a、Y軸テーブル15aに一端が支持されてX軸方向に延び、Y軸テーブル15aに沿って移動自在に設けられた2つのビーム状のX軸テーブル15b及び各X軸テーブル15b上をX軸方向に移動自在に設けられた2つのプレート状の移動ステージ15cから成り、2つの移動ステージ15cのそれぞれには、下方に延びた複数の吸着ノズル16N(図3)が昇降及び上下軸(Z軸)回り回転自在に設けられた前述の装着ヘッド16がひとつずつ取り付けられている。   In FIG. 2, the robot mechanism 15 includes a beam-shaped Y-axis table 15 a provided to extend in the Y-axis direction so as to straddle the substrate transport path 13 at one end of both ends of the base 12 facing in the X-axis direction. One end is supported by the Y-axis table 15a, extends in the X-axis direction, and is movably provided along the Y-axis table 15a. The two beam-shaped X-axis tables 15b and each X-axis table 15b are moved in the X-axis direction. The two moving stages 15c are provided with a plurality of suction nozzles 16N (FIG. 3) extending downward and vertically and vertically (Z-axis). The mounting heads 16 provided so as to be rotatable are attached one by one.

図2において、ロボット機構15が備える2つの移動ステージ15cのそれぞれには、撮像視野を下方に向けた基板カメラ18(図3も参照)が設けられており、基板搬送路13を挟んでY軸方向に対向する基台12上の両領域のそれぞれには、撮像視野を上方に向けた部品カメラ19が設けられている。   In FIG. 2, each of the two moving stages 15 c included in the robot mechanism 15 is provided with a substrate camera 18 (see also FIG. 3) whose imaging field of view is directed downward. A component camera 19 with the imaging field of view facing upward is provided in each of the two regions on the base 12 facing in the direction.

図2において、複数のテープフィーダ14は基板搬送路13を挟んでY軸方向に対向する基台12の両端部のそれぞれにX軸方向に並んで設けられており、それぞれ基台12の中央部側(基板搬送路13側)の端部に設けられた部品供給口14aに部品3を連続的に供給する。   In FIG. 2, the plurality of tape feeders 14 are provided in the X-axis direction at both ends of the base 12 that face each other in the Y-axis direction across the substrate transport path 13. The component 3 is continuously supplied to the component supply port 14a provided at the end on the side (board conveyance path 13 side).

基板搬送路13(搬入コンベア13b、位置決めコンベア13a及び搬出コンベア13c)による基板2の搬送及び位置決め動作は、部品実装機4が備える制御装置30(図4)の作業実行制御部30a(図4)が図示しないアクチュエータ等から成る基板搬送路駆動部31(図4)の作動制御を行うことによってなされ、各テープフィーダ14による部品供給口14aへの部品3の供給動作は、制御装置30の作業実行制御部30aが図示しないアクチュエータ等から成るテープフィーダ駆動部32(図4)の作動制御を行うことによってなされる。   The board 2 is transported and positioned by the board transport path 13 (the carry-in conveyor 13b, the positioning conveyor 13a, and the carry-out conveyor 13c). The work execution control unit 30a (FIG. 4) of the control device 30 (FIG. 4) provided in the component mounter 4 is used. Is performed by controlling the operation of the substrate conveyance path drive unit 31 (FIG. 4) including an actuator (not shown). The operation of supplying the component 3 to the component supply port 14a by each tape feeder 14 is executed by the control device 30. This is done by controlling the operation of the tape feeder drive unit 32 (FIG. 4), which includes an actuator or the like (not shown) by the control unit 30a.

ロボット機構15による各装着ヘッド16の水平面内での移動動作は、制御装置30の作業実行制御部30aが図示しないアクチュエータ等から成るロボット機構駆動部33(図4)の作動制御(Y軸テーブル15aに対する各X軸テーブル15bのY軸方向への移動制御及び各X軸テーブル15bに対する各移動ステージ15cのX軸方向への移動制御)を行うことによってなされ、各吸着ノズル16Nの装着ヘッド16に対する昇降及び上下軸回りの回転動作は、制御装置30の作業実行制御部30aが図示しないアクチュエータ等から成るノズル駆動部34(図4)の作動制御を行うことによってなされる。また、各吸着ノズル16Nによる部品3の吸着及び離脱動作は、制御装置30の作業実行制御部30aが図示しないアクチュエータ等から成る真空圧供給部35(図4)の作動制御を行って吸着ノズル16N内に真空圧を供給し、或いは真空圧の供給を解除することによってなされる。   The movement operation of each mounting head 16 in the horizontal plane by the robot mechanism 15 is performed by the operation control (Y-axis table 15a) of the robot mechanism drive unit 33 (FIG. 4) including an actuator (not shown) by the work execution control unit 30a of the control device 30. The movement of each X-axis table 15b in the Y-axis direction and the movement control of each moving stage 15c in the X-axis direction with respect to each X-axis table 15b) are performed to move the suction nozzle 16N up and down with respect to the mounting head 16. The rotation operation about the vertical axis is performed by the operation execution control unit 30a of the control device 30 performing operation control of the nozzle drive unit 34 (FIG. 4) including an actuator (not shown). In addition, the suction and detachment operation of the component 3 by each suction nozzle 16N is performed by the work execution control unit 30a of the control device 30 controlling the operation of the vacuum pressure supply unit 35 (FIG. 4) including an actuator (not shown). This is done by supplying a vacuum pressure inside or releasing the supply of the vacuum pressure.

基板カメラ18及び部品カメラ19による撮像動作は、制御装置30の作業実行制御部30aによって制御される(図4)。基板カメラ18及び部品カメラ19の撮像動作によって得られた画像データは画像データ記憶部36(図4)に取り込まれて記憶され、制御装置30が備える画像認識部30b(図4)において画像認識される。   The imaging operation by the board camera 18 and the component camera 19 is controlled by the work execution control unit 30a of the control device 30 (FIG. 4). The image data obtained by the imaging operations of the board camera 18 and the component camera 19 is captured and stored in the image data storage unit 36 (FIG. 4), and the image is recognized by the image recognition unit 30b (FIG. 4) provided in the control device 30. The

図2及び図3において、位置決めコンベア13a、搬入コンベア13b及び搬出コンベア13cには、基板搬送路13によって搬送される基板2の進行方向の先頭部を検出するための基板検出器としての位置決め用基板検出器17a、搬入側基板検出器17b及び搬出側基板検出器17cが設けられている。   2 and 3, the positioning conveyor 13a, the carry-in conveyor 13b, and the carry-out conveyor 13c have a positioning substrate as a board detector for detecting the leading portion in the traveling direction of the board 2 transported by the board transport path 13. A detector 17a, a carry-in side substrate detector 17b, and a carry-out side substrate detector 17c are provided.

位置決め用基板検出器17aは、位置決めコンベア13aにおいて、基板2の長さ(基板2の搬送方向、すなわちX軸方向の長さ)に応じて基板2の位置決めを行う位置を変更できるように位置決めコンベア13aの中間部よりも基板2の出口側の位置に複数設けられている。また、搬入側基板検出器17bは搬入コンベア13bの基板2の出口側の端部に設けられており、搬出側基板検出器17cは搬出コンベア13cの基板2の出口側の端部に設けられている。各位置決め用基板検出器17a、搬入側基板検出器17b及び搬出側基板検出器17cはそれぞれY軸方向に対向して一対ずつ設けられており、一方が検査光Lを投光する投光器、他方がその検査光Lを受光する受光器から成り、搬送される基板2の先頭部が検査光Lに差し掛かると、受光器が検査光Lの受光状態から非受光状態に切り替わるようになっている。   The positioning substrate detector 17a is a positioning conveyor that can change the position at which the substrate 2 is positioned in the positioning conveyor 13a according to the length of the substrate 2 (the conveyance direction of the substrate 2, that is, the length in the X-axis direction). A plurality is provided at a position closer to the exit side of the substrate 2 than the intermediate portion 13a. The carry-in side substrate detector 17b is provided at the end of the carry-in conveyor 13b on the outlet side of the substrate 2, and the carry-out side substrate detector 17c is provided at the end of the carry-out conveyor 13c on the outlet side of the substrate 2. Yes. Each positioning substrate detector 17a, carry-in substrate detector 17b, and carry-out substrate detector 17c are provided in pairs in the Y-axis direction, one of which is a projector that projects the inspection light L, and the other is a projector. The optical receiver is configured to receive the inspection light L. When the leading portion of the substrate 2 being conveyed reaches the inspection light L, the light receiver is switched from the light receiving state of the inspection light L to the non-light receiving state.

各位置決め用基板検出器17aから出力される基板2の先頭部の検出情報(受光器が検査光Lの受光状態から非受光状態に切り替わった情報)、搬入側基板検出器17bから出力される基板2の先頭部の検出情報及び搬出側基板検出器17cから出力される基板2の先頭部の検出情報はそれぞれ制御装置30に入力される(図4)。   Detection information of the head portion of the substrate 2 output from each positioning substrate detector 17a (information that the light receiver is switched from the light receiving state of the inspection light L to the non-light receiving state), the substrate output from the carry-in side substrate detector 17b The detection information of the top part of 2 and the detection information of the top part of the substrate 2 output from the carry-out side substrate detector 17c are respectively input to the control device 30 (FIG. 4).

各部品実装機4が実行する部品実装工程では、制御装置30は先ず、基板搬送路13を構成する搬入コンベア13b及び位置決めコンベア13aの作動制御を行って上流側に位置する他の部品実装機4から供給される基板2を搬入し、所定の作業位置に位置決めする。ここで、基板2の位置決めは、位置決めコンベア13aに備えられた複数の位置決め用基板検出器17aのうち、基板2の長さに応じて選択した一の位置決め用基板検出器17aにより基板2の先頭部が検出されたときに、作業実行制御部30aが位置決めコンベア13aの作動を停止させることによって行う。   In the component mounting process executed by each component mounting machine 4, the control device 30 first controls the operation of the carry-in conveyor 13 b and the positioning conveyor 13 a that constitute the substrate transport path 13, and the other component mounting machine 4 positioned on the upstream side. The substrate 2 supplied from is carried in and positioned at a predetermined work position. Here, the positioning of the substrate 2 is performed by using one positioning substrate detector 17a selected according to the length of the substrate 2 among the plurality of positioning substrate detectors 17a provided on the positioning conveyor 13a. When the part is detected, the work execution control unit 30a stops the operation of the positioning conveyor 13a.

制御装置30は、基板2の位置決めを行ったら、ロボット機構駆動部33の作動制御を行って基板2の上方に基板カメラ18を(装着ヘッド16を)移動させ、基板2に設けられた基板マーク(図示せず)の撮像を行う。そして、得られた基板マークの画像を画像認識部30bにおいて画像認識し、基板2の正規の作業位置からの位置ずれを求める。   After positioning the substrate 2, the control device 30 controls the operation of the robot mechanism drive unit 33 to move the substrate camera 18 (the mounting head 16) above the substrate 2, and the substrate mark provided on the substrate 2. Imaging (not shown) is performed. Then, the obtained image of the substrate mark is image-recognized by the image recognition unit 30b, and the positional deviation of the substrate 2 from the normal work position is obtained.

制御装置30は、基板2の位置ずれを求めたら、装着ヘッド16をテープフィーダ14の上方に移動させ、テープフィーダ14の部品供給口14aに供給された部品3を吸着ノズル16Nによって真空吸着によりピックアップする。そして、ピックアップした部品3が部品カメラ19の上方を通過するように装着ヘッド16を移動させ、部品カメラ19による部品3の撮像を行って画像認識し、部品3の異常(変形や欠損など)の有無の検査を行うとともに、部品3の吸着ノズル16Nに対する位置ずれ(吸着ずれ)を求める。   When the controller 30 determines the positional deviation of the substrate 2, the controller 30 moves the mounting head 16 above the tape feeder 14, and picks up the component 3 supplied to the component supply port 14a of the tape feeder 14 by vacuum suction by the suction nozzle 16N. To do. Then, the mounting head 16 is moved so that the picked-up component 3 passes above the component camera 19, the component 3 is imaged by the component camera 19, and image recognition is performed, and abnormality (deformation, defect, etc.) of the component 3 is detected. The presence / absence check is performed, and the positional deviation (suction deviation) of the component 3 relative to the suction nozzle 16N is obtained.

制御装置30は部品3の画像認識を行ったら、装着ヘッド16を基板2の上方に移動させ、吸着ノズル16Nによりピックアップした部品3が基板2上の目標装着位置である電極2a(この電極2a上には半田印刷機によって半田が印刷されている)に接触させるとともに、吸着ノズル16Nへの真空圧の供給を解除して部品3を基板2に装着する。このとき制御装置30は、基板2の位置決め時に求めた基板2の位置ずれと、部品3の画像認識時に求めた部品3の吸着ずれが修正されるように、基板2に対する吸着ノズル16Nの位置補正(回転補正を含む)を行う。   After recognizing the image of the component 3, the control device 30 moves the mounting head 16 above the substrate 2, and the component 3 picked up by the suction nozzle 16N is the electrode 2a (on the electrode 2a) on the substrate 2 as the target mounting position And the component 3 is mounted on the substrate 2 by releasing the supply of the vacuum pressure to the suction nozzle 16N. At this time, the control device 30 corrects the position of the suction nozzle 16N with respect to the board 2 so that the positional deviation of the board 2 obtained when positioning the board 2 and the suction deviation of the part 3 obtained when recognizing the image of the part 3 are corrected. (Including rotation correction).

制御装置30は、基板2に装着すべき部品3の装着が終了したら、位置決めコンベア13aと搬出コンベア13cを連動作動させ、下流側の部品実装機4に搬出する。   When the mounting of the component 3 to be mounted on the board 2 is completed, the control device 30 operates the positioning conveyor 13a and the unloading conveyor 13c in an interlocked manner, and unloads them to the component mounting machine 4 on the downstream side.

本実施の形態における部品実装システム1では、隣接する部品実装機4同士の間において、互いに対向させている一対の基板受け渡し用コンベア、すなわち、相対的に上流側に位置する部品実装機4(上流側の部品実装機4)が備える搬出コンベア13cと、相対的に下流側に位置する部品実装機4(下流側の部品実装機4)の間で基板2の受け渡しをする際、搬送対象となっている基板2をその長さに応じた適切な位置に待機させることができるようになっているので、以下にその説明を行う。   In the component mounting system 1 according to the present embodiment, between a pair of adjacent component mounting machines 4, a pair of board transfer conveyors facing each other, that is, a component mounting machine 4 (upstream) positioned relatively upstream. When the board 2 is transferred between the carry-out conveyor 13c provided in the component mounting machine 4) on the side and the component mounting machine 4 (downstream component mounting machine 4) positioned relatively downstream, the transfer target is to be conveyed. Since the board | substrate 2 which can be made to stand by in the suitable position according to the length can be demonstrated below.

図4において、部品実装システム1を構成する各部品実装機4が備える制御装置30には長さデータ記憶部37が繋がっており、この長さデータ記憶部37には、自機が備える搬入コンベア13bの長さのデータと、搬出コンベア13cの長さ(ともに基板2の搬送方向の長さ)のデータが記憶されている。   In FIG. 4, a length data storage unit 37 is connected to the control device 30 included in each component mounting machine 4 constituting the component mounting system 1. The length data storage unit 37 includes a carry-in conveyor included in the own device. Data on the length of 13b and data on the length of the carry-out conveyor 13c (both in the conveyance direction of the substrate 2) are stored.

また、図4において、制御装置30は通信部38と繋がっている。この通信部38は、上流側に隣接する他の部品実装機4が備える通信部38及び下流側に隣接する他の部品実装機4が備える通信部38と繋がっているため、各部品実装機4が備える制御装置30は、上流側及び下流側に隣接する他の部品実装機4が備える制御装置30との間で通信(データのやり取り)をすることが可能である。   In FIG. 4, the control device 30 is connected to the communication unit 38. The communication unit 38 is connected to the communication unit 38 included in the other component mounting machine 4 adjacent to the upstream side and the communication unit 38 included in the other component mounting machine 4 adjacent to the downstream side. Is capable of communicating (data exchange) with the control device 30 provided in another component mounting machine 4 adjacent to the upstream side and the downstream side.

各部品実装機4の制御装置30は、上流側又は下流側に隣接する他の部品実装機4との間で基板2の搬送を行うときは、先ず、通信部38を介して、上流側又は下流側に隣接する部品実装機4との間で、互いに対向させている一対の基板受け渡し用コンベア(上流側の部品実装機4が備える搬出コンベア13c及び下流側の部品実装機4が備える搬入コンベア13b)それぞれの長さのデータ及び搬送対象となっている基板2の長さのデータの送受信を行う(データ送受信工程)。   When the control device 30 of each component mounter 4 transports the board 2 to or from another component mounter 4 adjacent to the upstream side or the downstream side, first, via the communication unit 38, the upstream side or A pair of board transfer conveyors (the carry-out conveyor 13c provided in the upstream component mounter 4 and the carry-in conveyor provided in the downstream component mounter 4) that face each other between the component mounter 4 adjacent to the downstream side. 13b) The data of each length and the data of the length of the board | substrate 2 used as conveyance object are transmitted / received (data transmission / reception process).

すなわち、各部品実装機4の制御装置30は、上流側の部品実装機4に対しては、自機が備える搬入コンベア13bの長さのデータを送信する一方、上流側の部品実装機4からは、その上流側の部品実装機4が備える搬出コンベア13cの長さのデータを受信して長さデータ記憶部37に記憶させる。また、下流側の部品実装機4に対しては、自機が備える搬出コンベア13cの長さのデータを送信する一方、下流側の部品実装機4からは、その下流側の部品実装機4が備える搬入コンベア13bの長さのデータを受信して長さデータ記憶部37に記憶させる。   That is, the control device 30 of each component mounter 4 transmits data on the length of the carry-in conveyor 13b included in the own device to the upstream component mounter 4, while the upstream component mounter 4 Receives the data of the length of the carry-out conveyor 13c provided in the upstream component mounting machine 4, and stores it in the length data storage unit 37. In addition, data on the length of the carry-out conveyor 13c included in the own machine is transmitted to the downstream component mounter 4, while the downstream component mounter 4 receives the downstream component mounter 4 from the downstream component mounter 4. Data on the length of the carry-in conveyor 13 b provided is received and stored in the length data storage unit 37.

これにより長さデータ記憶部37には、自機及び隣接する部品実装機4の基板受け渡し用コンベア(搬入コンベア13b及び搬出コンベア13c)それぞれの長さのデータ及び搬送対象となっている基板2の長さのデータ(以下、これらのデータを「長さデータ」と総称する)が長さデータ記憶部37に記憶された状態となる(データ記憶工程)。   As a result, the length data storage unit 37 stores the length data of the own machine and the board delivery conveyors (the carry-in conveyor 13b and the carry-out conveyor 13c) of the adjacent component mounting machine 4 and the board 2 to be transferred. Length data (hereinafter, these data are collectively referred to as “length data”) is stored in the length data storage unit 37 (data storage step).

なお、搬送対象となっている基板2の長さのデータは必ずしも通信部38を介した通信によらなくてもよく、オペレータによって直接長さデータ記憶部37に入力されるのであってもよい。   Note that the length data of the substrate 2 to be transported does not necessarily have to be transmitted via the communication unit 38, and may be directly input to the length data storage unit 37 by the operator.

上記長さデータが長さデータ記憶部37に記憶された状態となったら、制御装置30の待機位置選択部30c(図4)が、長さデータ記憶部37に記憶された長さデータに基づいて、上流側及び下流側に隣接する他の部品実装機4との間で互いに対向させている一対の基板受け渡し用コンベア(搬入コンベア13b及び搬出コンベア13c)により形成される基板搬送領域(図5、図6及び図7において一点鎖線で囲んで示す領域)R内における基板2の待機位置を、予め定めた複数の候補の中から選択する(待機位置選択工程)。   When the length data is stored in the length data storage unit 37, the standby position selection unit 30c (FIG. 4) of the control device 30 is based on the length data stored in the length data storage unit 37. In addition, a board transfer region (FIG. 5) formed by a pair of board transfer conveyors (load-in conveyor 13b and carry-out conveyor 13c) facing each other between the upstream and downstream component mounting machines 4 adjacent to each other. 6 and 7, the standby position of the substrate 2 in R) is selected from a plurality of predetermined candidates (standby position selection step).

ここで、基板2の待機位置の候補は、搬入コンベア13bに設けた搬入側基板検出器17b及び搬出コンベア13cに設けた搬出側基板検出器17cのいずれか一方によって基板2の先頭部が検出される位置となる。本実施の形態では、隣接する2台の部品実装機4の間において、上流側の部品実装機4が備える搬出側基板検出器17cによって基板2の先頭部が検出される第1の基板待機位置と、下流側の部品実装機4が備える搬入側基板検出器17bによって基板2の先頭部が検出される第2の基板待機位置とのいずれか一方を基板2の待機位置の候補とすることができる。なお、基板2をこれら2つの基板待機位置(第1の基板待機位置及び第2の基板待機位置)の双方を待機位置の候補とすることができるかどうかは、隣接する2台の部品実装機4のうち、上流側の部品実装機4が備える搬出コンベア13cの長さと、下流側の部品実装機4が備える搬入コンベア13bの長さと、搬送対象となっている基板2の長さの大小関係によって定まる。   Here, the candidate for the standby position of the substrate 2 is detected at the head of the substrate 2 by either the carry-in substrate detector 17b provided on the carry-in conveyor 13b or the carry-out substrate detector 17c provided on the carry-out conveyor 13c. Position. In the present embodiment, the first board standby position where the leading portion of the board 2 is detected by the carry-out board detector 17c included in the upstream component mounting machine 4 between the two adjacent component mounting machines 4. And the second board standby position where the leading portion of the board 2 is detected by the carry-in board detector 17b included in the component mounting machine 4 on the downstream side is set as a candidate for the standby position of the board 2. it can. Whether two of the two board standby positions (the first board standby position and the second board standby position) can be used as candidates for the standby position is determined by whether two adjacent component mounters are used. 4, the length of the carry-out conveyor 13 c included in the upstream component mounter 4, the length of the carry-in conveyor 13 b included in the downstream component mounter 4, and the length of the substrate 2 to be transported. It depends on.

例えば、図5、図6及び図7に示すように、隣接する2台の部品実装機4のうち、上流側の部品実装機4(図5、図6及び図7において紙面左側に位置する部品実装機4)が備える搬出コンベア13cの長さScが、下流側の部品実装機4(図5、図6及び図7において紙面右側に位置する部品実装機4)が備える搬入コンベア13bの長さSbよりも大きい場合には、基板2の長さWがSbよりも小さい第1のケース(W<Sb<Scのとき)と、基板2の長さWがSbよりも大きく、かつScよりも小さい第2のケース(Sb<W<Scのとき)には、第1の基板待機位置(図5(a)及び図6(a))と第2の基板待機位置(図5(b)及び図6(b))のいずれもが基板2の待機位置の候補となるが、基板2の長さWがScよりも大きい第3のケース(Sb<Sc<Wのとき)では、第2の基板待機位置(図7)のみが基板2の待機位置の候補となる。   For example, as shown in FIGS. 5, 6, and 7, out of two adjacent component mounters 4, the upstream component mounter 4 (the component located on the left side of the page in FIGS. 5, 6, and 7). The length Sc of the carry-out conveyor 13c provided in the mounting machine 4) is the length of the carry-in conveyor 13b provided in the component mounting machine 4 on the downstream side (the component mounting machine 4 located on the right side in FIG. 5, FIG. 6 and FIG. 7). When the length is larger than Sb, the first case where the length W of the substrate 2 is smaller than Sb (when W <Sb <Sc), the length W of the substrate 2 is larger than Sb, and is larger than Sc. In a small second case (when Sb <W <Sc), the first substrate standby position (FIGS. 5A and 6A) and the second substrate standby position (FIGS. 5B and 5B) 6B is a candidate for the standby position of the substrate 2, but the length W of the substrate 2 is larger than Sc. In There third case (when Sb <Sc <W), a second substrate standby position only (FIG. 7) are candidates of the standby position of the substrate 2.

ここで、第1のケースにおいて基板2を第2の基板待機位置に停止させた状態では、基板2は下流側の部品実装機4が備える搬入コンベア13b内に収まり、上流側の部品実装機4が備える搬出コンベア13cとの間を跨がないことから、上流側に位置する部品実装機4が備える搬出コンベア13cにも(すなわち第1の基板待機位置にも)基板2を待機させることが可能である(図5(c))。   Here, in a state where the board 2 is stopped at the second board standby position in the first case, the board 2 is accommodated in the carry-in conveyor 13b included in the downstream component mounting machine 4 and the upstream component mounting machine 4 is placed. Since it does not straddle the carry-out conveyor 13c included in the board, the board 2 can be put on standby also in the carry-out conveyor 13c provided in the component mounting machine 4 located on the upstream side (that is, also in the first board standby position). (FIG. 5C).

一方、第2のケースにおいて基板2を第2の基板待機位置に停止させた状態及び第3のケースにおいて基板2を第2の基板待機位置に停止させた状態では、基板2は下流側の部品実装機4が備える搬入コンベア13b内には収まらず、上流側の部品実装機4が備える搬出コンベア13cとの間を跨ぐことから、第1のケースとは異なり、上流側に位置する部品実装機4が備える搬出コンベア13cに基板2を待機させることはできない。   On the other hand, in the state where the substrate 2 is stopped at the second substrate standby position in the second case and in the state where the substrate 2 is stopped at the second substrate standby position in the third case, the substrate 2 is a downstream component. Unlike the first case, the component mounter located upstream is not included in the carry-in conveyor 13b included in the mounter 4 and straddles the carry-out conveyor 13c included in the upstream component mounter 4. The board | substrate 2 cannot be made to wait on the carrying-out conveyor 13c with which 4 is equipped.

このように、本実施の形態における部品実装システム1では、各部品実装機4が、隣接する他の部品実装機4との間で互いに対向させている一対の基板受け渡し用コンベア(搬入コンベア13b及び搬出コンベア13c)の長さのデータ及び搬送対象となっている基板の長さのデータを通信によって提供しあって共有し、その共有したデータに基づいて、隣接する他の部品実装機4との間で互いに対向させている一対の基板受け渡し用コンベア(搬入コンベア13b及び搬出コンベア13c)により形成される基板搬送領域R内における基板2の待機位置を予め定めた複数の候補の中から選択することができるようになっている。   As described above, in the component mounting system 1 according to the present embodiment, each component mounter 4 is paired with a pair of board transfer conveyors (the carry-in conveyor 13b and the carry-in conveyor 13b) that face each other with the other adjacent component mounters 4. The length data of the carry-out conveyor 13c) and the length data of the board to be transported are provided by communication and shared, and based on the shared data, the other adjacent component mounting machines 4 Selecting a standby position of the substrate 2 from a plurality of predetermined candidates in the substrate transport region R formed by a pair of substrate transfer conveyors (the carry-in conveyor 13b and the carry-out conveyor 13c) opposed to each other. Can be done.

各部品実装機4の制御装置30は、上述の待機位置選択工程が終了したら、待機位置選択工程で選択した待機位置で基板2が停止するように、自機が備える基板受け渡し用コンベア(上流側の部品実装機4であれば搬出コンベア13c、下流側の部品実装機4であれば搬入コンベア13b)を作動させて基板2を搬送する(基板搬送工程)。   When the above-described standby position selection process is completed, the control device 30 of each component mounter 4 has a board transfer conveyor (upstream side) provided in its own apparatus so that the board 2 stops at the standby position selected in the standby position selection process. In the case of the component mounting machine 4, the carry-out conveyor 13 c is operated, and in the case of the component mounting machine 4 on the downstream side, the carry-in conveyor 13 b) is operated to transfer the board 2 (board transfer process).

ここで、上記第1のケースにおいて、各部品実装機4の制御装置30の待機位置選択部30cが、基板2の待機位置として第1の基板待機位置を選択した場合には、上流側の部品実装機4が備える制御装置30の基板停止判断部30dは、搬出側基板検出器17cにより基板2の先頭部が検出されたとき、搬出コンベア13cによる基板2の搬送作動を停止させる指令を自機の作業実行制御部30aに出力し、その指令を受けた上流側の部品実装機4の制御装置30の作業実行制御部30aは、自機(上流側の部品実装機4)が備える搬出コンベア13cの作動を停止させる。これにより基板2は第1の基板待機位置に停止する(図5(a))。   Here, in the first case, when the standby position selection unit 30c of the control device 30 of each component mounter 4 selects the first board standby position as the standby position of the board 2, the upstream component The board stop determination unit 30d of the control device 30 provided in the mounting machine 4 issues a command to stop the transport operation of the board 2 by the carry-out conveyor 13c when the leading-edge part of the board 2 is detected by the carry-out board detector 17c. The work execution control unit 30a of the control device 30 of the upstream component mounting machine 4 that has received the command is the unloading conveyor 13c provided in the own machine (upstream component mounting machine 4). The operation of is stopped. As a result, the substrate 2 stops at the first substrate standby position (FIG. 5A).

一方、第1のケースにおいて、各部品実装機4の制御装置30の待機位置選択部30cが、基板2の待機位置として第2の基板待機位置を選択した場合には、上流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬出側基板検出器17cにより基板2の先頭部が検出されたときであっても、その基板2の検出信号を無視するが、下流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬入側基板検出器17bにより基板2の先頭部が検出されたとき、搬入コンベア13bによる基板2の搬送作動を停止させる指令を自機の制御装置30の作業実行制御部30aに出力し、その指令を受けた下流側の部品実装機4の制御装置30の作業実行制御部30aは、自機(下流側の部品実装機4)が備える搬入コンベア13bの作動を停止させる。これにより基板2は第2の基板待機位置に停止する(図5(b))。   On the other hand, in the first case, when the standby position selection unit 30c of the control device 30 of each component mounting machine 4 selects the second board standby position as the standby position of the board 2, the upstream component mounting machine The substrate stop determination unit 30d of the control device 30 of FIG. 4 ignores the detection signal of the substrate 2 even when the leading portion of the substrate 2 is detected by the carry-out side substrate detector 17c included in the own device. The board stop determining unit 30d of the control device 30 of the component mounting machine 4 on the downstream side performs the transport operation of the board 2 by the carry-in conveyor 13b when the leading part of the board 2 is detected by the carry-in board detector 17b included in the own apparatus. Is output to the work execution control unit 30a of the control device 30 of the own machine, and the work execution control unit 30a of the control device 30 of the component mounting machine 4 on the downstream side receiving the command receives the command (downstream side). Equipped with 4 parts mounting machine It stops the operation of that input conveyor 13b. As a result, the substrate 2 stops at the second substrate standby position (FIG. 5B).

第2のケースにおいて、各部品実装機4の制御装置30の待機位置選択部30cが、基板2の待機位置として第1の基板待機位置を選択した場合には、上流側の部品実装機4が備える制御装置30の基板停止判断部30dは、搬出側基板検出器17cにより基板2の先頭部が検出されたとき、搬出コンベア13cによる基板2の搬送作動を停止させる指令を自機の作業実行制御部30aに出力し、その指令を受けた上流側の部品実装機4の制御装置30の作業実行制御部30aは、自機(上流側の部品実装機4)が備える搬出コンベア13cの作動を停止させる。これにより基板2は第1の基板待機位置に停止する(図6(a))。   In the second case, when the standby position selection unit 30c of the control device 30 of each component mounting machine 4 selects the first board standby position as the standby position of the board 2, the upstream component mounting machine 4 The substrate stop determining unit 30d of the control device 30 includes a command to stop the transport operation of the substrate 2 by the unloading conveyor 13c when the leading end of the substrate 2 is detected by the unloading side substrate detector 17c. The work execution control unit 30a of the control device 30 of the upstream component mounter 4 that has received the command to the unit 30a stops the operation of the carry-out conveyor 13c included in the own device (upstream component mounter 4). Let As a result, the substrate 2 stops at the first substrate standby position (FIG. 6A).

一方、第2のケースにおいて、各部品実装機4の制御装置30の待機位置選択部30cが、基板2の待機位置として第2の基板待機位置を選択した場合には、上流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬出側基板検出器17cにより基板2の先頭部が検出されたときであっても、その基板2の検出信号を無視するが、下流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬入側基板検出器17bにより基板2の先頭部が検出されたとき、搬入コンベア13bによる基板2の搬送作動を停止させる指令を自機の制御装置30の作業実行制御部30aに出力するとともに、上流側の部品実装機4が備える搬出コンベア13cによる基板2の搬送動作を停止させる指令を上流側の制御装置30の作業実行制御部30aに出力する。そして、その指令を受けた下流側の部品実装機4が備える制御装置30の作業実行制御部30aは、自機(下流側の部品実装機4)の搬入コンベア13bの作動を停止させ、上流側の部品実装機4が備える制御装置30の作業実行制御部30aは、自機(上流側の部品実装機4)の搬出コンベア13cの作動を停止させる。これにより基板2は第2の基板待機位置に停止する(図6(b))。   On the other hand, in the second case, when the standby position selection unit 30c of the control device 30 of each component mounting machine 4 selects the second board standby position as the standby position of the board 2, the upstream component mounting machine The substrate stop determination unit 30d of the control device 30 of FIG. 4 ignores the detection signal of the substrate 2 even when the leading portion of the substrate 2 is detected by the carry-out side substrate detector 17c included in the own device. The board stop determining unit 30d of the control device 30 of the component mounting machine 4 on the downstream side performs the transport operation of the board 2 by the carry-in conveyor 13b when the leading part of the board 2 is detected by the carry-in board detector 17b included in the own apparatus. Is output to the work execution control unit 30a of the control device 30 of the own machine, and the instruction to stop the conveying operation of the board 2 by the carry-out conveyor 13c provided in the upstream component mounting machine 4 is controlled on the upstream side. And it outputs the work execution control unit 30a of the location 30. Then, the work execution control unit 30a of the control device 30 included in the downstream component mounter 4 that has received the command stops the operation of the carry-in conveyor 13b of the own device (downstream component mounter 4), and the upstream side The work execution control unit 30a of the control device 30 provided in the component mounter 4 stops the operation of the carry-out conveyor 13c of the own device (upstream component mounter 4). As a result, the substrate 2 stops at the second substrate standby position (FIG. 6B).

第3のケースにおいて、各部品実装機4の制御装置30の待機位置選択部30cが、基板2の待機位置として第2の基板待機位置を選択した場合には、上流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬出側基板検出器17cにより基板2の先頭部が検出されたときであっても、その基板2の検出信号を無視するが、下流側の部品実装機4の制御装置30の基板停止判断部30dは、自機が備える搬入側基板検出器17bにより基板2の先頭部が検出されたとき、搬入コンベア13bによる基板2の搬送作動を停止させる指令を自機の制御装置30の作業実行制御部30aに出力するとともに、上流側の部品実装機4が備える搬出コンベア13cによる基板2の搬送動作を停止させる指令を上流側の制御装置30の作業実行制御部30aに出力する。そして、その指令を受けた下流側の部品実装機4が備える制御装置30の作業実行制御部30aは、自機(下流側の部品実装機4)の搬入コンベア13bの作動を停止させ、上流側の部品実装機4が備える制御装置30の作業実行制御部30aは、自機(上流側の部品実装機4)の搬出コンベア13cの作動を停止させる。これにより基板2は第2の基板待機位置に停止する(図7)。   In the third case, when the standby position selection unit 30c of the control device 30 of each component mounting machine 4 selects the second board standby position as the standby position of the board 2, the upstream side of the component mounting machine 4 The substrate stop determination unit 30d of the control device 30 ignores the detection signal of the substrate 2 even when the leading portion of the substrate 2 is detected by the carry-out side substrate detector 17c included in the own device, but the downstream side The board stop judging unit 30d of the control device 30 of the component mounting machine 4 stops the transport operation of the board 2 by the carry-in conveyor 13b when the leading-side board detector 17b provided in the machine itself detects the leading part of the board 2. A command to stop the conveyance operation of the board 2 by the carry-out conveyor 13c provided in the upstream component mounter 4 is output to the work execution control unit 30a of the control device 30 of the own device. And outputs of the work execution controller 30a. Then, the work execution control unit 30a of the control device 30 included in the downstream component mounter 4 that has received the command stops the operation of the carry-in conveyor 13b of the own device (downstream component mounter 4), and the upstream side The work execution control unit 30a of the control device 30 provided in the component mounter 4 stops the operation of the carry-out conveyor 13c of the own device (upstream component mounter 4). As a result, the substrate 2 stops at the second substrate standby position (FIG. 7).

以上説明したように、本実施の形態における基板搬送方法は、複数台の部品実装機4が連結されて成り、各部品実装機4が、上流側又は下流側に隣接する他の部品実装機4との間で基板2の受け渡し用に用いる基板受け渡し用コンベアとしての搬入コンベア13b及び搬出コンベア13cと、搬入コンベア13bに設けられて基板2の先頭部を検出する搬入側基板検出器17b及び搬出コンベア13cに設けられて基板2の先頭部を検出する搬出側基板検出器17cとを備えた部品実装システム1における基板搬送方法であり、隣接する2台の部品実装機4のうち下流側の部品実装機4が備える搬入コンベア13bと上流側の部品実装機4が備える搬出コンベア13cとの間を跨ぎ、下流側の部品実装機4が備える搬入側基板検出器17bによって基板2の先頭部が検出される基板待機位置に基板2を待機させる場合、上流側の部品実装機4は、下流側の部品実装機4が備える搬入側基板検出器17bにより基板2の先頭部が検出されたとき、自機の搬出コンベア13cの作動を停止させることにより、基板2を基板待機位置に待機させるようになっている。   As described above, the substrate carrying method according to the present embodiment is formed by connecting a plurality of component mounters 4, and each component mounter 4 is another component mounter 4 adjacent to the upstream side or the downstream side. A carry-in conveyer 13b and a carry-out conveyer 13c as substrate transfer conveyers used for delivering the substrate 2 to and from the carry-in conveyer 13b, and a carry-in substrate detector 17b and a carry-out conveyer that are provided on the carry-in conveyer 13b and detect the leading portion of the substrate 2. 13c is a substrate carrying method in the component mounting system 1 provided with a carry-out side substrate detector 17c that detects a leading portion of the substrate 2, and the component mounting on the downstream side of the two adjacent component mounting machines 4 Crossing between the carry-in conveyor 13b provided in the machine 4 and the carry-out conveyor 13c provided in the upstream component mounting machine 4 and the carry-in board detector 17b provided in the downstream component mounting machine 4 Thus, when the board 2 is made to stand by at the board standby position where the head portion of the board 2 is detected, the upstream component mounting machine 4 is connected to the board 2 by the carry-in board detector 17b included in the downstream component mounting machine 4. When the leading portion is detected, the operation of the carry-out conveyor 13c of the own machine is stopped, so that the substrate 2 is put on standby at the substrate standby position.

本実施の形態における基板搬送方法では、隣接する2台の部品実装機4のうち下流側の部品実装機4が備える搬入コンベア13bと上流側の部品実装機4が備える搬出コンベア13cとの間を跨ぎ、下流側の部品実装機4が備える搬入側基板検出器17bによって基板2の先頭部が検出される基板待機位置に待機させる場合、上流側の部品実装機4は、下流側の部品実装機4が備える搬入側基板検出器17bにより基板2の先頭部が検出されたとき、自機の搬出コンベア13cの作動を停止させることによって、基板2を基板待機位置に待機させる。このため、基板2の長さ(サイズ)に応じた適切な位置に基板2を待機させるフレキシブルな基板2の搬送を行うことができ、これにより基板2の生産性を向上させることができる。   In the substrate carrying method in the present embodiment, between the two adjacent component mounters 4, between the carry-in conveyor 13 b provided in the downstream component mounter 4 and the carry-out conveyor 13 c provided in the upstream component mounter 4. In the case where the downstream side component mounting machine 4 is put on standby at a board standby position where the leading portion of the board 2 is detected by the carry-in side board detector 17b included in the downstream side component mounting machine 4, the upstream side component mounting machine 4 When the leading portion of the substrate 2 is detected by the carry-in side substrate detector 17b included in 4, the operation of the carry-out conveyor 13 c of the own machine is stopped, thereby causing the substrate 2 to stand by at the substrate standby position. For this reason, the flexible board | substrate 2 which makes the board | substrate 2 stand by in the suitable position according to the length (size) of the board | substrate 2 can be conveyed, and, thereby, the productivity of the board | substrate 2 can be improved.

これまで本発明の実施の形態について説明してきたが、本発明は上述したものに限定されない。例えば、上述の実施の形態では、部品実装機4の間での基板2の搬送についてのみ説明したが、部品実装機4以外の部品実装用装置(例えば前述の半田印刷機や検査機、リフロー炉等)についても、その部品実装用装置が、基板2に対する部品実装関連の作業を行う部品実装用装置であって、上流側又は下流側に隣接する他の部品実装用装置との間で基板2の受け渡し用に用いる基板受け渡し用コンベアを備えたものであれば、その部品実装用装置を含む隣接する2台の部品実装用装置の間で同様の基板2の搬送を行うことができる。   Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, only the conveyance of the substrate 2 between the component mounting machines 4 has been described. However, a component mounting apparatus other than the component mounting machine 4 (for example, the above-described solder printer, inspection machine, reflow furnace) And the like, the component mounting apparatus is a component mounting apparatus that performs a component mounting related operation on the substrate 2, and the substrate 2 is connected to another component mounting apparatus adjacent to the upstream side or the downstream side. If a board delivery conveyor used for delivery is provided, the same substrate 2 can be transported between two adjacent component mounting apparatuses including the component mounting apparatus.

基板の長さに応じた適切な位置に基板を待機させて基板の生産性を向上させることができる部品実装システムにおける基板搬送方法を提供する。   Provided is a board transfer method in a component mounting system that can improve the productivity of a board by waiting the board at an appropriate position according to the length of the board.

1 部品実装システム
2 基板
4 部品実装機(部品実装用装置)
13b 搬入コンベア
13c 搬出コンベア
17b 搬入側基板検出器
17c 搬出側基板検出器
1 Component mounting system 2 Board 4 Component mounting machine (component mounting device)
13b Carry-in conveyor 13c Carry-out conveyor 17b Carry-in side board detector 17c Carry-out side board detector

Claims (2)

基板に対する部品実装関連の作業を行う複数台の部品実装用装置が連結されて成り、各部品実装用装置が、上流側又は下流側に隣接する他の部品実装用装置との間で基板の受け渡し用に用いる基板受け渡し用コンベアとしての搬入コンベア及び搬出コンベアと、搬入コンベアに設けられて基板の先頭部を検出する搬入側基板検出器及び搬出コンベアに設けられて基板の先頭部を検出する搬出側基板検出器とを備えた部品実装システムにおける基板搬送方法であって、
隣接する2台の部品実装用装置のうち下流側の部品実装用装置が備える搬入コンベアと上流側の部品実装用装置が備える搬出コンベアとの間を跨ぎ、下流側の部品実装用装置が備える前記搬入側基板検出器によって基板の先頭部が検出される基板待機位置に基板を待機させる場合、上流側の部品実装用装置は、下流側の部品実装用装置が備える前記搬入側基板検出器により基板の先頭部が検出されたとき、自機の搬出コンベアの作動を停止させることにより、基板を前記基板待機位置に待機させることを特徴とする部品実装システムにおける基板搬送方法。
A plurality of component mounting devices that perform component mounting-related work on a board are connected to each other, and each component mounting device delivers a substrate to another component mounting device adjacent to the upstream side or the downstream side. Loading and unloading conveyors as substrate transfer conveyors used for the purpose, loading side board detectors that are provided on the loading conveyors to detect the leading edge of the substrates, and unloading sides that are provided on the unloading conveyor to detect the leading edge of the substrates A board conveying method in a component mounting system comprising a board detector,
Among the two adjacent component mounting apparatuses, the downstream component mounting apparatus includes the carry-in conveyor provided in the downstream component mounting apparatus and the carry-out conveyor provided in the upstream component mounting apparatus. When the board is made to stand by at the board standby position where the leading part of the board is detected by the carry-in board detector, the upstream component mounting apparatus is controlled by the carry-in board detector included in the downstream component mounting apparatus. When the leading portion of the board is detected, the operation of the carry-out conveyor of the own machine is stopped to place the board on standby at the board standby position.
下流側の部品実装用装置は、自機が備える前記搬入側基板検出器により基板の先頭部が検出されたとき、自機の搬入コンベアの作動を停止させるとともに、上流側の部品実装用装置に、上流側の部品実装用装置が備える搬出コンベアによる基板の搬送動作を停止させる指令を出力すること特徴とする請求項1に記載の部品実装システムにおける基板搬送方法。   The component mounting apparatus on the downstream side stops the operation of the carry-in conveyor of the own machine when the leading portion of the board is detected by the carry-in board detector included in the own machine, and the upstream component mounting apparatus. The board conveying method in the component mounting system according to claim 1, wherein a command to stop the board carrying operation by the carry-out conveyor provided in the upstream component mounting apparatus is output.
JP2013100940A 2013-05-13 2013-05-13 Board transportation method in component mounting system Pending JP2013153226A (en)

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KR20210121405A (en) * 2020-03-30 2021-10-08 김종렬 PCB location tracking system in SMT Line

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JP2010087136A (en) * 2008-09-30 2010-04-15 Panasonic Corp Component mounting line and method for substrate conveyance between working machines

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JP2010087136A (en) * 2008-09-30 2010-04-15 Panasonic Corp Component mounting line and method for substrate conveyance between working machines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210121405A (en) * 2020-03-30 2021-10-08 김종렬 PCB location tracking system in SMT Line
KR102375629B1 (en) * 2020-03-30 2022-03-16 김종렬 PCB location tracking system in SMT Line

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