CN103915543B - 发光器件封装 - Google Patents

发光器件封装 Download PDF

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Publication number
CN103915543B
CN103915543B CN201410008737.8A CN201410008737A CN103915543B CN 103915543 B CN103915543 B CN 103915543B CN 201410008737 A CN201410008737 A CN 201410008737A CN 103915543 B CN103915543 B CN 103915543B
Authority
CN
China
Prior art keywords
light emitting
emitting device
light
substrate
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410008737.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN103915543A (zh
Inventor
金炳穆
小平洋
金夏罗
反田祐郎
反田祐一郎
大关聪司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Priority to CN201810311516.6A priority Critical patent/CN108565328B/zh
Publication of CN103915543A publication Critical patent/CN103915543A/zh
Application granted granted Critical
Publication of CN103915543B publication Critical patent/CN103915543B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201410008737.8A 2013-01-08 2014-01-08 发光器件封装 Active CN103915543B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810311516.6A CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130002145A KR102071424B1 (ko) 2013-01-08 2013-01-08 발광소자 패키지
KR10-2013-0002145 2013-01-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810311516.6A Division CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装

Publications (2)

Publication Number Publication Date
CN103915543A CN103915543A (zh) 2014-07-09
CN103915543B true CN103915543B (zh) 2018-05-04

Family

ID=49886849

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410008737.8A Active CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装
CN201810311516.6A Active CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810311516.6A Active CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装

Country Status (5)

Country Link
US (1) US9337403B2 (enExample)
EP (1) EP2752896B1 (enExample)
JP (2) JP6322416B2 (enExample)
KR (1) KR102071424B1 (enExample)
CN (2) CN103915543B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902644B2 (en) 2014-06-19 2018-02-27 Corning Incorporated Aluminosilicate glasses
KR102427049B1 (ko) * 2016-05-19 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 플래시 모듈 및 이를 포함하는 단말기
CN109560461A (zh) * 2017-09-26 2019-04-02 青岛海信激光显示股份有限公司 一种激光器阵列
CN109491139A (zh) * 2018-10-31 2019-03-19 武汉华星光电技术有限公司 背光源的制作方法
US20210334505A1 (en) * 2020-01-09 2021-10-28 AuthenX Inc. Image capturing system and method for capturing image
US11468712B2 (en) * 2020-01-09 2022-10-11 AuthenX Inc. Liveness detection apparatus, system and method
CN114038973B (zh) * 2021-08-10 2023-06-16 重庆康佳光电技术研究院有限公司 发光器件及其制作方法和测试方法
FR3143721B1 (fr) * 2022-12-19 2024-12-13 Valeo Vision Dispositif lumineux pour véhicule automobile.

Citations (4)

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CN1577874A (zh) * 2003-07-17 2005-02-09 松下电器产业株式会社 光器件及其制造方法
JP2005347564A (ja) * 2004-06-03 2005-12-15 Nec Compound Semiconductor Devices Ltd 気密封止パッケージ
CN101015071A (zh) * 2004-09-10 2007-08-08 首尔半导体株式会社 具多模造树脂的发光二极管封装
CN101371358A (zh) * 2006-01-20 2009-02-18 许密特有限公司 具有集成静电放电保护的用于发光二极管的封装

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JP4430264B2 (ja) * 2001-03-19 2010-03-10 日亜化学工業株式会社 表面実装型発光装置
JP4228303B2 (ja) * 2004-04-12 2009-02-25 住友電気工業株式会社 半導体発光素子搭載部材と、それを用いた半導体発光装置
JP4661147B2 (ja) * 2004-09-24 2011-03-30 日亜化学工業株式会社 半導体装置
JP4890775B2 (ja) * 2005-03-23 2012-03-07 パナソニック株式会社 発光モジュール
JP2007080868A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
JP2007189031A (ja) * 2006-01-12 2007-07-26 Allied Material Corp 半導体素子搭載用部材とそれを用いた半導体装置および発光ダイオード
DE102006015377B4 (de) * 2006-04-03 2018-06-14 Ivoclar Vivadent Ag Halbleiter-Strahlungsquelle sowie Lichthärtgerät
JP5233172B2 (ja) * 2007-06-07 2013-07-10 日亜化学工業株式会社 半導体発光装置
JP5136215B2 (ja) * 2008-05-29 2013-02-06 住友ベークライト株式会社 半導体装置
KR101266226B1 (ko) * 2008-07-09 2013-05-21 우시오덴키 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
US7800125B2 (en) * 2008-07-09 2010-09-21 Himax Display, Inc. Light-emitting diode package
JP2010177375A (ja) * 2009-01-28 2010-08-12 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
KR20120024860A (ko) * 2009-05-28 2012-03-14 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 광원을 둘러싸는 봉입체를 갖는 조명 장치
JP2011014587A (ja) * 2009-06-30 2011-01-20 Nichia Corp 発光装置
JPWO2012053386A1 (ja) * 2010-10-21 2014-02-24 シーシーエス株式会社 発光装置の製造方法及び発光装置
TWI529348B (zh) * 2011-03-07 2016-04-11 皇家飛利浦電子股份有限公司 發光模組、燈、燈具及顯示裝置
TW201246615A (en) * 2011-05-11 2012-11-16 Siliconware Precision Industries Co Ltd Package structure and method of making same
JP5968674B2 (ja) * 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
US8860059B2 (en) * 2011-06-20 2014-10-14 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting devices, systems, and methods of manufacturing
JP2013016272A (ja) * 2011-06-30 2013-01-24 Canon Inc 表示装置
US9169017B2 (en) * 2012-02-15 2015-10-27 The Boeing Company Aircraft interior lighting system using structured micro lens arrays

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1577874A (zh) * 2003-07-17 2005-02-09 松下电器产业株式会社 光器件及其制造方法
JP2005347564A (ja) * 2004-06-03 2005-12-15 Nec Compound Semiconductor Devices Ltd 気密封止パッケージ
CN101015071A (zh) * 2004-09-10 2007-08-08 首尔半导体株式会社 具多模造树脂的发光二极管封装
CN101371358A (zh) * 2006-01-20 2009-02-18 许密特有限公司 具有集成静电放电保护的用于发光二极管的封装

Also Published As

Publication number Publication date
JP6322416B2 (ja) 2018-05-09
KR102071424B1 (ko) 2020-01-30
EP2752896A2 (en) 2014-07-09
KR20140089984A (ko) 2014-07-16
JP6641407B2 (ja) 2020-02-05
CN108565328B (zh) 2021-05-18
JP2014135488A (ja) 2014-07-24
EP2752896A3 (en) 2016-07-20
US9337403B2 (en) 2016-05-10
EP2752896B1 (en) 2020-10-07
CN103915543A (zh) 2014-07-09
CN108565328A (zh) 2018-09-21
US20140191276A1 (en) 2014-07-10
JP2018139298A (ja) 2018-09-06

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210818

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address