KR102071424B1 - 발광소자 패키지 - Google Patents

발광소자 패키지 Download PDF

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Publication number
KR102071424B1
KR102071424B1 KR1020130002145A KR20130002145A KR102071424B1 KR 102071424 B1 KR102071424 B1 KR 102071424B1 KR 1020130002145 A KR1020130002145 A KR 1020130002145A KR 20130002145 A KR20130002145 A KR 20130002145A KR 102071424 B1 KR102071424 B1 KR 102071424B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
light
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130002145A
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English (en)
Korean (ko)
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KR20140089984A (ko
Inventor
김병목
히로시 코다이라
김하나
유이치로 탄다
사토시 오제키
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130002145A priority Critical patent/KR102071424B1/ko
Priority to US14/149,547 priority patent/US9337403B2/en
Priority to JP2014001038A priority patent/JP6322416B2/ja
Priority to EP14150412.6A priority patent/EP2752896B1/en
Priority to CN201410008737.8A priority patent/CN103915543B/zh
Priority to CN201810311516.6A priority patent/CN108565328B/zh
Publication of KR20140089984A publication Critical patent/KR20140089984A/ko
Priority to JP2018074777A priority patent/JP6641407B2/ja
Application granted granted Critical
Publication of KR102071424B1 publication Critical patent/KR102071424B1/ko
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020130002145A 2013-01-08 2013-01-08 발광소자 패키지 Active KR102071424B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020130002145A KR102071424B1 (ko) 2013-01-08 2013-01-08 발광소자 패키지
JP2014001038A JP6322416B2 (ja) 2013-01-08 2014-01-07 発光素子パッケージ
US14/149,547 US9337403B2 (en) 2013-01-08 2014-01-07 Light emitting device package
CN201410008737.8A CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装
EP14150412.6A EP2752896B1 (en) 2013-01-08 2014-01-08 Light emitting device package
CN201810311516.6A CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装
JP2018074777A JP6641407B2 (ja) 2013-01-08 2018-04-09 発光素子パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130002145A KR102071424B1 (ko) 2013-01-08 2013-01-08 발광소자 패키지

Publications (2)

Publication Number Publication Date
KR20140089984A KR20140089984A (ko) 2014-07-16
KR102071424B1 true KR102071424B1 (ko) 2020-01-30

Family

ID=49886849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130002145A Active KR102071424B1 (ko) 2013-01-08 2013-01-08 발광소자 패키지

Country Status (5)

Country Link
US (1) US9337403B2 (enExample)
EP (1) EP2752896B1 (enExample)
JP (2) JP6322416B2 (enExample)
KR (1) KR102071424B1 (enExample)
CN (2) CN103915543B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902644B2 (en) 2014-06-19 2018-02-27 Corning Incorporated Aluminosilicate glasses
KR102427049B1 (ko) * 2016-05-19 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 플래시 모듈 및 이를 포함하는 단말기
CN109560461A (zh) * 2017-09-26 2019-04-02 青岛海信激光显示股份有限公司 一种激光器阵列
CN109491139A (zh) * 2018-10-31 2019-03-19 武汉华星光电技术有限公司 背光源的制作方法
US11468712B2 (en) * 2020-01-09 2022-10-11 AuthenX Inc. Liveness detection apparatus, system and method
US20210334505A1 (en) * 2020-01-09 2021-10-28 AuthenX Inc. Image capturing system and method for capturing image
CN114038973B (zh) * 2021-08-10 2023-06-16 重庆康佳光电技术研究院有限公司 发光器件及其制作方法和测试方法
FR3143721B1 (fr) * 2022-12-19 2024-12-13 Valeo Vision Dispositif lumineux pour véhicule automobile.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008305936A (ja) * 2007-06-07 2008-12-18 Nichia Corp 半導体発光装置
US20100006877A1 (en) * 2008-07-09 2010-01-14 Himax Display, Inc. Light-emitting diode package
WO2012120434A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. A light emitting module, a lamp, a luminaire and a display device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4430264B2 (ja) * 2001-03-19 2010-03-10 日亜化学工業株式会社 表面実装型発光装置
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP4228303B2 (ja) * 2004-04-12 2009-02-25 住友電気工業株式会社 半導体発光素子搭載部材と、それを用いた半導体発光装置
JP2005347564A (ja) * 2004-06-03 2005-12-15 Nec Compound Semiconductor Devices Ltd 気密封止パッケージ
KR100709890B1 (ko) * 2004-09-10 2007-04-20 서울반도체 주식회사 다중 몰딩수지를 갖는 발광다이오드 패키지
JP4661147B2 (ja) * 2004-09-24 2011-03-30 日亜化学工業株式会社 半導体装置
JP4890775B2 (ja) * 2005-03-23 2012-03-07 パナソニック株式会社 発光モジュール
JP2007080868A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
JP2007189031A (ja) * 2006-01-12 2007-07-26 Allied Material Corp 半導体素子搭載用部材とそれを用いた半導体装置および発光ダイオード
US7528422B2 (en) * 2006-01-20 2009-05-05 Hymite A/S Package for a light emitting element with integrated electrostatic discharge protection
DE102006015377B4 (de) * 2006-04-03 2018-06-14 Ivoclar Vivadent Ag Halbleiter-Strahlungsquelle sowie Lichthärtgerät
JP5136215B2 (ja) * 2008-05-29 2013-02-06 住友ベークライト株式会社 半導体装置
KR101266226B1 (ko) * 2008-07-09 2013-05-21 우시오덴키 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
JP2010177375A (ja) * 2009-01-28 2010-08-12 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
WO2010136920A1 (en) * 2009-05-28 2010-12-02 Koninklijke Philips Electronics N.V. Illumination device with an envelope enclosing a light source
JP2011014587A (ja) * 2009-06-30 2011-01-20 Nichia Corp 発光装置
JPWO2012053386A1 (ja) * 2010-10-21 2014-02-24 シーシーエス株式会社 発光装置の製造方法及び発光装置
TW201246615A (en) * 2011-05-11 2012-11-16 Siliconware Precision Industries Co Ltd Package structure and method of making same
JP5968674B2 (ja) * 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
US8860059B2 (en) * 2011-06-20 2014-10-14 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting devices, systems, and methods of manufacturing
JP2013016272A (ja) * 2011-06-30 2013-01-24 Canon Inc 表示装置
US9169017B2 (en) * 2012-02-15 2015-10-27 The Boeing Company Aircraft interior lighting system using structured micro lens arrays

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008305936A (ja) * 2007-06-07 2008-12-18 Nichia Corp 半導体発光装置
US20100006877A1 (en) * 2008-07-09 2010-01-14 Himax Display, Inc. Light-emitting diode package
WO2012120434A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. A light emitting module, a lamp, a luminaire and a display device

Also Published As

Publication number Publication date
CN108565328A (zh) 2018-09-21
EP2752896A2 (en) 2014-07-09
KR20140089984A (ko) 2014-07-16
JP2018139298A (ja) 2018-09-06
US9337403B2 (en) 2016-05-10
CN103915543B (zh) 2018-05-04
JP6322416B2 (ja) 2018-05-09
EP2752896A3 (en) 2016-07-20
CN103915543A (zh) 2014-07-09
CN108565328B (zh) 2021-05-18
JP6641407B2 (ja) 2020-02-05
US20140191276A1 (en) 2014-07-10
JP2014135488A (ja) 2014-07-24
EP2752896B1 (en) 2020-10-07

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