CN103911639A - 用于印刷电路板的电镀装置 - Google Patents

用于印刷电路板的电镀装置 Download PDF

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Publication number
CN103911639A
CN103911639A CN201310752115.1A CN201310752115A CN103911639A CN 103911639 A CN103911639 A CN 103911639A CN 201310752115 A CN201310752115 A CN 201310752115A CN 103911639 A CN103911639 A CN 103911639A
Authority
CN
China
Prior art keywords
guide
pcb
circuit card
cover
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310752115.1A
Other languages
English (en)
Chinese (zh)
Inventor
金哲奎
卢侑廷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN103911639A publication Critical patent/CN103911639A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201310752115.1A 2012-12-31 2013-12-31 用于印刷电路板的电镀装置 Pending CN103911639A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0158175 2012-12-31
KR1020120158175A KR20140087649A (ko) 2012-12-31 2012-12-31 인쇄회로기판용 도금장치

Publications (1)

Publication Number Publication Date
CN103911639A true CN103911639A (zh) 2014-07-09

Family

ID=51037633

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310752115.1A Pending CN103911639A (zh) 2012-12-31 2013-12-31 用于印刷电路板的电镀装置

Country Status (3)

Country Link
JP (1) JP2014129603A (ja)
KR (1) KR20140087649A (ja)
CN (1) CN103911639A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104762652A (zh) * 2015-04-27 2015-07-08 栾善东 一种复合酸体系pcb垂直连续电镀装置和方法
CN107012489A (zh) * 2016-01-06 2017-08-04 应用材料公司 用于在电化学沉积期间遮蔽工件特征的系统和方法
CN107208303A (zh) * 2015-01-21 2017-09-26 应用材料公司 具有膜管屏蔽件的电镀装置
CN111378996A (zh) * 2018-12-31 2020-07-07 乐金显示有限公司 电镀设备和使用该电镀设备的电镀方法
CN111379007A (zh) * 2018-12-31 2020-07-07 乐金显示有限公司 用于电铸的设备以及用于水平电铸的设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6538541B2 (ja) * 2015-12-21 2019-07-03 株式会社荏原製作所 レギュレーションプレート、これを備えためっき装置及びめっき方法

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JPS5645887Y2 (ja) * 1977-12-31 1981-10-27
JPS59125973U (ja) * 1983-02-15 1984-08-24 株式会社山田メッキ工業所 メツキ装置
JPH0192399A (ja) * 1987-10-01 1989-04-11 Furukawa Saakitsuto Fuoiru Kk 不溶性電極装置
JPH03294497A (ja) * 1990-04-12 1991-12-25 C Uyemura & Co Ltd 小孔内の表面処理方法
JPH08158098A (ja) * 1994-09-29 1996-06-18 Nok Corp メッキ方法
JPH1096097A (ja) * 1996-09-24 1998-04-14 Hitachi Cable Ltd 電気めっき装置
US5744013A (en) * 1996-12-12 1998-04-28 Mitsubishi Semiconductor America, Inc. Anode basket for controlling plating thickness distribution
JPH10330997A (ja) * 1997-05-29 1998-12-15 Toyota Motor Corp 隔膜電極
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating
JP3637214B2 (ja) * 1998-09-24 2005-04-13 株式会社荏原製作所 ウエハのメッキ方法
US6746578B2 (en) * 2001-05-31 2004-06-08 International Business Machines Corporation Selective shield/material flow mechanism
JP2006249450A (ja) * 2005-03-08 2006-09-21 Nisshin Kasei Kk メッキ方法およびメッキ装置
JP4711805B2 (ja) * 2005-11-08 2011-06-29 上村工業株式会社 めっき槽
KR20150062008A (ko) * 2013-11-28 2015-06-05 삼성전기주식회사 도금 장치

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107208303A (zh) * 2015-01-21 2017-09-26 应用材料公司 具有膜管屏蔽件的电镀装置
CN107208303B (zh) * 2015-01-21 2019-05-10 应用材料公司 具有膜管屏蔽件的电镀装置
CN104762652A (zh) * 2015-04-27 2015-07-08 栾善东 一种复合酸体系pcb垂直连续电镀装置和方法
CN104762652B (zh) * 2015-04-27 2017-06-20 栾善东 一种复合酸体系pcb垂直连续电镀装置和方法
CN107012489A (zh) * 2016-01-06 2017-08-04 应用材料公司 用于在电化学沉积期间遮蔽工件特征的系统和方法
CN107012489B (zh) * 2016-01-06 2021-05-07 应用材料公司 用于在电化学沉积期间遮蔽工件特征的系统和方法
US11987897B2 (en) 2016-01-06 2024-05-21 Applied Materials, Inc. Systems and methods for shielding features of a workpiece during electrochemical deposition
CN111378996A (zh) * 2018-12-31 2020-07-07 乐金显示有限公司 电镀设备和使用该电镀设备的电镀方法
CN111379007A (zh) * 2018-12-31 2020-07-07 乐金显示有限公司 用于电铸的设备以及用于水平电铸的设备
US11466378B2 (en) 2018-12-31 2022-10-11 Lg Display Co., Ltd. Electroplating apparatus and electroplating method using the same
US11530489B2 (en) 2018-12-31 2022-12-20 Lg Display Co., Ltd. Apparatus for electro-forming and apparatus for horizontal electro-forming

Also Published As

Publication number Publication date
KR20140087649A (ko) 2014-07-09
JP2014129603A (ja) 2014-07-10

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PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140709