CN103904083A - W形垂直沟道3dnand闪存及其形成方法 - Google Patents
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106409768A (zh) * | 2016-04-19 | 2017-02-15 | 清华大学 | Nand存储器结构、形成方法和三维存储器阵列 |
CN107706184A (zh) * | 2017-08-22 | 2018-02-16 | 长江存储科技有限责任公司 | 一种三维存储器的制备方法及其结构 |
CN108666320A (zh) * | 2018-05-03 | 2018-10-16 | 武汉新芯集成电路制造有限公司 | 一种三维存储结构 |
CN109300903A (zh) * | 2018-09-28 | 2019-02-01 | 长江存储科技有限责任公司 | 基于硅通孔堆叠的三堆存储器结构及制造方法 |
TWI717097B (zh) * | 2019-11-12 | 2021-01-21 | 旺宏電子股份有限公司 | 多層結構及其製作方法 |
US11177202B2 (en) | 2019-11-12 | 2021-11-16 | Macronix International Co., Ltd. | Multilayer structure and method for fabricating the same |
Citations (6)
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CN101794789A (zh) * | 2009-02-02 | 2010-08-04 | 三星电子株式会社 | 三维存储器器件 |
US20100213538A1 (en) * | 2009-02-25 | 2010-08-26 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
US20120276696A1 (en) * | 2011-04-29 | 2012-11-01 | Yang Jun-Kyu | Vertical structure non-volatile memory device and method of manufacturing the same |
KR20120124228A (ko) * | 2011-05-03 | 2012-11-13 | 삼성전자주식회사 | 수직 구조의 비휘발성 메모리 소자 및 그 제조 방법 |
CN103050149A (zh) * | 2011-10-13 | 2013-04-17 | 三星电子株式会社 | 非易失性存储器件及其编程方法和包括其的存储器系统 |
CN103066076A (zh) * | 2011-10-24 | 2013-04-24 | 爱思开海力士有限公司 | 三维非易失性存储器件及其制造方法以及存储系统 |
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- 2014-03-05 CN CN201410079424.1A patent/CN103904083A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101794789A (zh) * | 2009-02-02 | 2010-08-04 | 三星电子株式会社 | 三维存储器器件 |
US20100213538A1 (en) * | 2009-02-25 | 2010-08-26 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of manufacturing the same |
US20120276696A1 (en) * | 2011-04-29 | 2012-11-01 | Yang Jun-Kyu | Vertical structure non-volatile memory device and method of manufacturing the same |
KR20120124228A (ko) * | 2011-05-03 | 2012-11-13 | 삼성전자주식회사 | 수직 구조의 비휘발성 메모리 소자 및 그 제조 방법 |
CN103050149A (zh) * | 2011-10-13 | 2013-04-17 | 三星电子株式会社 | 非易失性存储器件及其编程方法和包括其的存储器系统 |
CN103066076A (zh) * | 2011-10-24 | 2013-04-24 | 爱思开海力士有限公司 | 三维非易失性存储器件及其制造方法以及存储系统 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106409768A (zh) * | 2016-04-19 | 2017-02-15 | 清华大学 | Nand存储器结构、形成方法和三维存储器阵列 |
CN106409768B (zh) * | 2016-04-19 | 2019-05-31 | 清华大学 | Nand存储器结构、形成方法和三维存储器阵列 |
CN107706184A (zh) * | 2017-08-22 | 2018-02-16 | 长江存储科技有限责任公司 | 一种三维存储器的制备方法及其结构 |
CN108666320A (zh) * | 2018-05-03 | 2018-10-16 | 武汉新芯集成电路制造有限公司 | 一种三维存储结构 |
CN109300903A (zh) * | 2018-09-28 | 2019-02-01 | 长江存储科技有限责任公司 | 基于硅通孔堆叠的三堆存储器结构及制造方法 |
TWI717097B (zh) * | 2019-11-12 | 2021-01-21 | 旺宏電子股份有限公司 | 多層結構及其製作方法 |
US11177202B2 (en) | 2019-11-12 | 2021-11-16 | Macronix International Co., Ltd. | Multilayer structure and method for fabricating the same |
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Inventor after: Wu Huaqiang Inventor after: Wang Bo Inventor after: Qian He Inventor after: Zhu Yiming Inventor after: He Wei Inventor before: Wu Huaqiang Inventor before: Wang Bo Inventor before: Qian He |
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Effective date of registration: 20160804 Address after: 100084 Haidian District 100084-82 mailbox Beijing Applicant after: Tsinghua University Applicant after: GigaDevice Semiconductor (Beijing) Inc. Address before: 100084 Haidian District 100084-82 mailbox Beijing Applicant before: Tsinghua University |
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