CN103847096B - 真空加热加压密封成形装置及真空加热加压密封成形方法 - Google Patents

真空加热加压密封成形装置及真空加热加压密封成形方法 Download PDF

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CN103847096B
CN103847096B CN201310428990.4A CN201310428990A CN103847096B CN 103847096 B CN103847096 B CN 103847096B CN 201310428990 A CN201310428990 A CN 201310428990A CN 103847096 B CN103847096 B CN 103847096B
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heating
vacuum
substrate
vacuum chamber
seal stock
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CN103847096A (zh
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伊藤英敏
佐藤丰树
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Mikado Technos Co Ltd
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Mikado Technos Co Ltd
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)
  • Press Drives And Press Lines (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
CN201310428990.4A 2012-11-29 2013-09-18 真空加热加压密封成形装置及真空加热加压密封成形方法 Active CN103847096B (zh)

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JP2012261395A JP6050103B2 (ja) 2012-11-29 2012-11-29 真空加熱加圧封止成形装置及び真空加熱加圧封止成形方法
JP2012-261395 2012-11-29

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CN103847096A CN103847096A (zh) 2014-06-11
CN103847096B true CN103847096B (zh) 2018-06-29

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KR (1) KR20140070347A (ja)
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Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
CN104553030A (zh) * 2014-12-29 2015-04-29 中国第一重型机械股份公司 一种用于碳素电极挤压机的真空罩
JP6181807B1 (ja) 2016-04-27 2017-08-16 日機装株式会社 加圧装置および加圧方法
KR101947654B1 (ko) 2017-11-02 2019-02-13 안재익 쿠션기능을 가지는 진공성형기의 금형 구동장치
CN108177376B (zh) * 2017-11-16 2020-03-31 安徽信盟装备股份有限公司 一种真空成型密封舱开合门机构
JP6994445B2 (ja) * 2018-08-31 2022-01-14 Ｔｏｗａ株式会社 樹脂成形装置、離型フィルムの剥離方法、樹脂成形品の製造方法
CN110509571A (zh) * 2019-08-30 2019-11-29 安徽唯宏新材料科技有限公司 一种用于环氧板的制备压合装置
CN111048472B (zh) * 2020-01-07 2021-12-03 深圳南信国际电子有限公司 一种带镀层的红外探测器真空封装结构
KR102333717B1 (ko) * 2020-12-01 2021-12-02 주식회사 펀시스 몰드 성형장치
CN112820667B (zh) * 2021-01-04 2022-05-17 深圳市铨天科技有限公司 一种用于储存芯片的压固机加工设备
CN117096042B (zh) * 2023-08-22 2024-03-01 无锡沃德倍斯科技有限公司 一种芯片真空压合机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1526534A (zh) * 2003-03-04 2004-09-08 三荣技研股份有限公司 层压装置以及层压方法
CN1655924A (zh) * 2002-05-30 2005-08-17 米卡多科技株式会社 加热型真空压力加工装置

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Publication number Priority date Publication date Assignee Title
JPS62156931A (ja) * 1985-12-28 1987-07-11 Ibiden Co Ltd 多層プリント配線板の製造方法及びこれに使用する装置
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2002217523A (ja) * 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
JP2002217221A (ja) * 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
JP4730652B2 (ja) * 2004-06-02 2011-07-20 ナガセケムテックス株式会社 電子部品の製造方法
JP5349432B2 (ja) * 2010-09-06 2013-11-20 日東電工株式会社 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655924A (zh) * 2002-05-30 2005-08-17 米卡多科技株式会社 加热型真空压力加工装置
CN1526534A (zh) * 2003-03-04 2004-09-08 三荣技研股份有限公司 层压装置以及层压方法

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JP6050103B2 (ja) 2016-12-21
CN103847096A (zh) 2014-06-11
JP2014107503A (ja) 2014-06-09
KR20140070347A (ko) 2014-06-10

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