CN103838089B - 确定掩模图案和曝光条件的方法以及计算机 - Google Patents
确定掩模图案和曝光条件的方法以及计算机 Download PDFInfo
- Publication number
- CN103838089B CN103838089B CN201310593722.8A CN201310593722A CN103838089B CN 103838089 B CN103838089 B CN 103838089B CN 201310593722 A CN201310593722 A CN 201310593722A CN 103838089 B CN103838089 B CN 103838089B
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- pattern
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- mask
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- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000011156 evaluation Methods 0.000 claims abstract description 45
- 230000000694 effects Effects 0.000 claims abstract description 35
- 238000009826 distribution Methods 0.000 claims abstract description 21
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000004364 calculation method Methods 0.000 claims abstract description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 49
- 230000003287 optical effect Effects 0.000 claims description 24
- 230000008859 change Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005286 illumination Methods 0.000 description 77
- 238000005457 optimization Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 19
- 238000010586 diagram Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 5
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- 238000012937 correction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 238000000342 Monte Carlo simulation Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012257363A JP6095334B2 (ja) | 2012-11-26 | 2012-11-26 | マスクパターンおよび露光条件を決定する方法、ならびにプログラム |
| JP2012-257363 | 2012-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103838089A CN103838089A (zh) | 2014-06-04 |
| CN103838089B true CN103838089B (zh) | 2017-01-18 |
Family
ID=50773012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310593722.8A Active CN103838089B (zh) | 2012-11-26 | 2013-11-21 | 确定掩模图案和曝光条件的方法以及计算机 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8958059B2 (enExample) |
| JP (1) | JP6095334B2 (enExample) |
| KR (1) | KR101689429B1 (enExample) |
| CN (1) | CN103838089B (enExample) |
| TW (1) | TWI539243B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5835968B2 (ja) * | 2011-07-05 | 2015-12-24 | キヤノン株式会社 | 決定方法、プログラム及び露光方法 |
| KR102006321B1 (ko) | 2014-04-14 | 2019-08-01 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 공정들에 대한 최적화의 흐름들 |
| TWI675259B (zh) * | 2014-05-30 | 2019-10-21 | 日商尼康股份有限公司 | 微影系統、模擬裝置、及圖案形成方法 |
| KR102404639B1 (ko) | 2015-02-02 | 2022-06-03 | 삼성전자주식회사 | 전자 빔 노광 방법 및 그를 포함하는 기판 제조 방법 |
| WO2016192964A1 (en) * | 2015-05-29 | 2016-12-08 | Asml Netherlands B.V. | Simulation of lithography using multiple-sampling of angular distribution of source radiation |
| US9588446B2 (en) * | 2015-05-29 | 2017-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Calibration apparatus and an adjustment method for a lithography apparatus |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3409493B2 (ja) * | 1995-03-13 | 2003-05-26 | ソニー株式会社 | マスクパターンの補正方法および補正装置 |
| JP2002329658A (ja) * | 2001-05-01 | 2002-11-15 | Fujitsu Ltd | 光近接効果補正方法 |
| TWI252516B (en) * | 2002-03-12 | 2006-04-01 | Toshiba Corp | Determination method of process parameter and method for determining at least one of process parameter and design rule |
| JP2004077837A (ja) * | 2002-08-19 | 2004-03-11 | Sony Corp | 設計パターンの補正方法 |
| JP2005049403A (ja) * | 2003-07-29 | 2005-02-24 | Seiko Epson Corp | 露光用マスク、光近接効果補正装置、光近接効果補正方法、半導体装置の製造方法および光近接効果補正プログラム |
| JP4351928B2 (ja) * | 2004-02-23 | 2009-10-28 | 株式会社東芝 | マスクデータの補正方法、フォトマスクの製造方法及びマスクデータの補正プログラム |
| JP2007086586A (ja) * | 2005-09-26 | 2007-04-05 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
| JP5071785B2 (ja) * | 2007-07-13 | 2012-11-14 | 独立行政法人産業技術総合研究所 | マスクパターン形成方法 |
| JP5404216B2 (ja) * | 2009-07-02 | 2014-01-29 | キヤノン株式会社 | 露光方法、露光装置及びデバイス製造方法 |
| NL2005523A (en) * | 2009-10-28 | 2011-05-02 | Asml Netherlands Bv | Selection of optimum patterns in a design layout based on diffraction signature analysis. |
| US8739079B2 (en) * | 2009-10-30 | 2014-05-27 | Canon Kabushiki Kaisha | Recording medium and determination method |
| JP5686567B2 (ja) * | 2010-10-19 | 2015-03-18 | キヤノン株式会社 | 露光条件及びマスクパターンを決定するプログラム及び方法 |
| KR101833017B1 (ko) * | 2011-02-15 | 2018-04-13 | 삼성전자 주식회사 | 포토 마스크의 제조 방법 |
-
2012
- 2012-11-26 JP JP2012257363A patent/JP6095334B2/ja active Active
-
2013
- 2013-11-06 TW TW102140283A patent/TWI539243B/zh active
- 2013-11-21 CN CN201310593722.8A patent/CN103838089B/zh active Active
- 2013-11-25 KR KR1020130143629A patent/KR101689429B1/ko active Active
- 2013-11-26 US US14/089,857 patent/US8958059B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US8958059B2 (en) | 2015-02-17 |
| US20140146311A1 (en) | 2014-05-29 |
| CN103838089A (zh) | 2014-06-04 |
| JP6095334B2 (ja) | 2017-03-15 |
| TW201421171A (zh) | 2014-06-01 |
| TWI539243B (zh) | 2016-06-21 |
| JP2014107331A (ja) | 2014-06-09 |
| KR20140067919A (ko) | 2014-06-05 |
| KR101689429B1 (ko) | 2016-12-23 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |