CN103832013B - 叠层结构体、制造叠层结构体的方法、电子设备 - Google Patents

叠层结构体、制造叠层结构体的方法、电子设备 Download PDF

Info

Publication number
CN103832013B
CN103832013B CN201310586045.7A CN201310586045A CN103832013B CN 103832013 B CN103832013 B CN 103832013B CN 201310586045 A CN201310586045 A CN 201310586045A CN 103832013 B CN103832013 B CN 103832013B
Authority
CN
China
Prior art keywords
substrate
graphene
adhesive
laminated structure
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310586045.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103832013A (zh
Inventor
坂东雅史
清水圭辅
角野宏治
木村望
小林俊之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN103832013A publication Critical patent/CN103832013A/zh
Application granted granted Critical
Publication of CN103832013B publication Critical patent/CN103832013B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/753—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc. with polymeric or organic binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Position Input By Displaying (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
CN201310586045.7A 2012-11-26 2013-11-19 叠层结构体、制造叠层结构体的方法、电子设备 Active CN103832013B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012257095A JP6079166B2 (ja) 2012-11-26 2012-11-26 積層構造体の製造方法
JP2012-257095 2012-11-26

Publications (2)

Publication Number Publication Date
CN103832013A CN103832013A (zh) 2014-06-04
CN103832013B true CN103832013B (zh) 2017-07-07

Family

ID=50773110

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310586045.7A Active CN103832013B (zh) 2012-11-26 2013-11-19 叠层结构体、制造叠层结构体的方法、电子设备

Country Status (3)

Country Link
US (1) US9137892B2 (https=)
JP (1) JP6079166B2 (https=)
CN (1) CN103832013B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11097974B2 (en) 2014-07-31 2021-08-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
JP6335099B2 (ja) * 2014-11-04 2018-05-30 東芝メモリ株式会社 半導体装置および半導体装置の製造方法
US12338159B2 (en) 2015-07-30 2025-06-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
JP6830753B2 (ja) * 2015-10-02 2021-02-17 日東電工株式会社 積層体、タッチパネル、積層体形成キット、及び、透明導電性フィルムの屈曲耐性を向上する方法
KR102581899B1 (ko) 2015-11-04 2023-09-21 삼성전자주식회사 투명 전극 및 이를 포함하는 소자
JP6923555B2 (ja) 2016-01-12 2021-08-18 コーニング インコーポレイテッド 薄厚熱強化及び化学強化ガラス系物品
US11485673B2 (en) 2017-08-24 2022-11-01 Corning Incorporated Glasses with improved tempering capabilities
KR102650926B1 (ko) 2017-11-17 2024-03-27 인스티튜시오 카탈라나 드 르세르카 아이 에스투디스 아반카츠 직접 그래핀 전사 및 그래핀 기반 디바이스
TWI785156B (zh) 2017-11-30 2022-12-01 美商康寧公司 具有高熱膨脹係數及對於熱回火之優先破裂行為的非離子交換玻璃
CN108990260A (zh) * 2018-09-21 2018-12-11 江西新正耀光学研究院有限公司 透光线路板结构、电路板及透光线路板制造方法
CN109062451B (zh) * 2018-10-29 2021-06-25 重庆石墨烯研究院有限公司 一种新型柔性石墨烯触摸屏及其制备方法
EP3723122B1 (en) 2019-04-10 2023-02-15 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising a double layer structure
US12064938B2 (en) 2019-04-23 2024-08-20 Corning Incorporated Glass laminates having determined stress profiles and methods of making the same
CN110267372B (zh) * 2019-05-07 2022-02-01 宁波柔碳电子科技有限公司 一种石墨烯电加热复合件及其制造方法
CN116811379B (zh) 2019-08-06 2026-01-02 康宁股份有限公司 具有用于阻止裂纹的埋入式应力尖峰的玻璃层压体及其制造方法
CN113036410B (zh) * 2021-03-01 2022-08-09 北京无线电测量研究所 一种石墨烯天线的制作方法
US20220093681A1 (en) * 2021-12-03 2022-03-24 Intel Corporation Foldable low power displays

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541777B2 (ja) * 2000-03-15 2004-07-14 ソニーケミカル株式会社 異方性導電接続材料
US20050271574A1 (en) * 2004-06-03 2005-12-08 Jang Bor Z Process for producing nano-scaled graphene plates
US7449133B2 (en) * 2006-06-13 2008-11-11 Unidym, Inc. Graphene film as transparent and electrically conducting material
CN101896341B (zh) * 2007-12-11 2014-09-10 株式会社钟化 层压板、层压板的制造方法及挠性印刷线路板、挠性印刷线路板的制造方法
US20110186789A1 (en) * 2008-05-22 2011-08-04 The University Of North Carolina At Chapel Hill Synthesis of graphene sheets and nanoparticle composites comprising same
JP5266889B2 (ja) * 2008-06-04 2013-08-21 ソニー株式会社 光透過性導電体の製造方法
KR101935757B1 (ko) * 2009-03-16 2019-01-04 보르벡크 머터리얼스 코포레이션 강화된 중합체 물품
JP5395542B2 (ja) * 2009-07-13 2014-01-22 株式会社東芝 半導体装置
CN102656016B (zh) * 2009-10-16 2015-12-16 石墨烯广场株式会社 石墨烯卷对卷转印方法、由该方法制成的石墨烯卷及石墨烯卷对卷转印装置
WO2011063082A2 (en) * 2009-11-20 2011-05-26 3M Innovative Properties Company Surface-modified adhesives
JP5697069B2 (ja) * 2009-11-30 2015-04-08 独立行政法人物質・材料研究機構 グラフェントランジスタ
WO2011112589A1 (en) * 2010-03-08 2011-09-15 William Marsh Rice University Transparent electrodes based on graphene and grid hybrid structures
US20120328873A1 (en) * 2010-03-10 2012-12-27 Nitto Denko Corporation Optical pressure-sensitive adhesive sheet
JP5609307B2 (ja) 2010-06-22 2014-10-22 コニカミノルタ株式会社 透明導電性支持体
JP5664119B2 (ja) * 2010-10-25 2015-02-04 ソニー株式会社 透明導電膜、透明導電膜の製造方法、光電変換装置および電子機器
US10040683B2 (en) * 2010-11-17 2018-08-07 Sungkyunkwan University Foundation For Corporate Collaboration Multi-layered graphene sheet and method of fabricating the same
JP5691524B2 (ja) * 2011-01-05 2015-04-01 ソニー株式会社 グラフェン膜の転写方法および透明導電膜の製造方法
JP5887947B2 (ja) * 2011-03-28 2016-03-16 ソニー株式会社 透明導電膜、ヒータ、タッチパネル、太陽電池、有機ｅｌ装置、液晶装置および電子ペーパ
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
WO2012153674A1 (ja) * 2011-05-06 2012-11-15 独立行政法人産業技術総合研究所 透明導電膜積層体の製造方法および透明導電膜積層体
KR101878732B1 (ko) * 2011-06-24 2018-07-16 삼성전자주식회사 그래핀 기재 및 이를 채용한 투명전극과 트랜지스터
JP2013035699A (ja) * 2011-08-04 2013-02-21 Sony Corp グラフェン構造体、グラフェン構造体の製造方法、光電変換素子、太陽電池及び撮像装置
JP2013035716A (ja) * 2011-08-09 2013-02-21 Sony Corp グラフェン構造体及びグラフェン構造体の製造方法
CN103732709A (zh) * 2011-08-12 2014-04-16 3M创新有限公司 光学透明的导电粘合剂及由其制得的制品
KR101871295B1 (ko) * 2011-10-19 2018-08-03 삼성전자 주식회사 그래핀을 이용한 광 변조기
KR101952363B1 (ko) * 2012-04-03 2019-05-22 삼성전자주식회사 그래핀 반도체 소자 및 그 제조 방법, 그래핀 반도체 소자를 포함하는 유기 발광 표시 장치 및 기억 소자
WO2013168297A1 (ja) * 2012-05-11 2013-11-14 グラフェンプラットフォーム株式会社 グラフェン積層体の製造方法及びグラフェン積層体
US9363932B2 (en) * 2012-06-11 2016-06-07 Nanotek Instruments, Inc. Integrated graphene film heat spreader for display devices
WO2013186858A1 (ja) * 2012-06-12 2013-12-19 グラフェンプラットフォーム株式会社 グラフェン積層体およびグラフェン積層体の製造方法

Also Published As

Publication number Publication date
US9137892B2 (en) 2015-09-15
US20140146490A1 (en) 2014-05-29
JP6079166B2 (ja) 2017-02-15
CN103832013A (zh) 2014-06-04
JP2014104600A (ja) 2014-06-09

Similar Documents

Publication Publication Date Title
CN103832013B (zh) 叠层结构体、制造叠层结构体的方法、电子设备
CN106601382B (zh) 一种柔性透明导电膜的制备方法
US9098162B2 (en) Touch panel including graphene and method of manufacturing the same
CN103608872B (zh) 导电性层叠体、带图案布线的透明导电性层叠体、以及光学器件
JP6600550B2 (ja) 金属層積層透明導電性フィルムおよびそれを用いたタッチセンサ
CN102131743A (zh) 柔性玻璃基板的制造方法以及柔性玻璃基板
TW201212048A (en) Transparent electrically conductive substrate
CN104485279A (zh) 一种基于金属纳米网格的透明电极及其制备方法
JP2018531865A (ja) グラフェン膜の転写方法およびグラフェン膜を含む基板
CN102337513A (zh) 石墨烯透明导电薄膜的制备方法
US10073572B2 (en) Conductive structure and preparation method therefor
TW201219207A (en) Laminate body, panel for use in display device with support board, panel for use in display device, and display device
CN105741979B (zh) 柔性石墨烯导电薄膜的制备方法
CN108139823A (zh) 薄膜触控传感器及其制造方法
CN102208547B (zh) 一种柔性光电子器件用基板及其制备方法
CN108305705B (zh) 石墨烯复合薄膜及其制备方法和应用
CN106842732A (zh) 石墨烯电极及其制备方法、显示面板
CN110498613A (zh) 透明导电性玻璃
CN107278040A (zh) 一种在可延展柔性基底上制造电路的方法
CN102993995B (zh) 一种透明导电胶膜的制备方法
KR101657520B1 (ko) 터치 패널의 전극 형성 방법
CN111534802A (zh) 柔性复合膜及其制备方法、电子器件
CN109979642B (zh) 导电薄膜及其制备方法和应用
CN106098927B (zh) 一种三明治式柔性电容式压力传感器及其制备方法
KR20140139281A (ko) 플렉서블 터치스크린 패널의 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant