CN103814440A - 具有模制壳体的电控制器 - Google Patents

具有模制壳体的电控制器 Download PDF

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Publication number
CN103814440A
CN103814440A CN201280045912.XA CN201280045912A CN103814440A CN 103814440 A CN103814440 A CN 103814440A CN 201280045912 A CN201280045912 A CN 201280045912A CN 103814440 A CN103814440 A CN 103814440A
Authority
CN
China
Prior art keywords
circuit carrier
molding compounds
support component
electric controller
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280045912.XA
Other languages
English (en)
Chinese (zh)
Inventor
S.拉默斯
R.里格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN103814440A publication Critical patent/CN103814440A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
CN201280045912.XA 2011-09-20 2012-08-03 具有模制壳体的电控制器 Pending CN103814440A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE201110083002 DE102011083002A1 (de) 2011-09-20 2011-09-20 Elektrisches Steuergerät mit Moldgehäuse
DE102011083002.2 2011-09-20
PCT/EP2012/065285 WO2013041288A1 (fr) 2011-09-20 2012-08-03 Appareil de commande électrique à boîtier moulé

Publications (1)

Publication Number Publication Date
CN103814440A true CN103814440A (zh) 2014-05-21

Family

ID=46679258

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280045912.XA Pending CN103814440A (zh) 2011-09-20 2012-08-03 具有模制壳体的电控制器

Country Status (4)

Country Link
KR (1) KR20140063713A (fr)
CN (1) CN103814440A (fr)
DE (1) DE102011083002A1 (fr)
WO (1) WO2013041288A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014201032A1 (de) 2014-01-21 2015-07-23 Zf Friedrichshafen Ag Elektrisches Steuergerät, Getriebe mit einem elektrischen Steuergerät und Verfahren zur Herstellung eines elektrischen Steuergeräts
DE102014209283A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014209282A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014226062A1 (de) 2014-12-16 2016-06-16 Zf Friedrichshafen Ag Positioniervorrichtung sowie Bauteil mit derselben
DE102021211642A1 (de) 2021-10-14 2023-04-20 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungshalbleiter, Mold-Modul und Verfahren

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
EP0350833A2 (fr) * 1988-07-11 1990-01-17 Fujitsu Limited Structure d'empaquetage de circuit intégré
US20090243082A1 (en) * 2008-03-26 2009-10-01 Zigmund Ramirez Camacho Integrated circuit package system with planar interconnect
TWI320594B (en) * 2006-05-04 2010-02-11 Cyntec Co Ltd Package structure
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3906767B2 (ja) 2002-09-03 2007-04-18 株式会社日立製作所 自動車用電子制御装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
EP0350833A2 (fr) * 1988-07-11 1990-01-17 Fujitsu Limited Structure d'empaquetage de circuit intégré
TWI320594B (en) * 2006-05-04 2010-02-11 Cyntec Co Ltd Package structure
US20090243082A1 (en) * 2008-03-26 2009-10-01 Zigmund Ramirez Camacho Integrated circuit package system with planar interconnect
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same

Also Published As

Publication number Publication date
WO2013041288A1 (fr) 2013-03-28
KR20140063713A (ko) 2014-05-27
DE102011083002A1 (de) 2013-03-21

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140521