WO2013041288A1 - Appareil de commande électrique à boîtier moulé - Google Patents

Appareil de commande électrique à boîtier moulé Download PDF

Info

Publication number
WO2013041288A1
WO2013041288A1 PCT/EP2012/065285 EP2012065285W WO2013041288A1 WO 2013041288 A1 WO2013041288 A1 WO 2013041288A1 EP 2012065285 W EP2012065285 W EP 2012065285W WO 2013041288 A1 WO2013041288 A1 WO 2013041288A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
molding compound
electrical control
contact
electrical
Prior art date
Application number
PCT/EP2012/065285
Other languages
German (de)
English (en)
Inventor
Sven Lamers
Reinhard Rieger
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN201280045912.XA priority Critical patent/CN103814440A/zh
Priority to KR1020147007230A priority patent/KR20140063713A/ko
Publication of WO2013041288A1 publication Critical patent/WO2013041288A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Definitions

  • Electrical control devices are used in different areas for
  • the circuit elements located in the control unit are in a housing.
  • the housing may e.g. cupped a circuit carrier with the
  • EP 1 396 885 B1 discloses a circuit carrier with circuit elements.
  • the circuit carrier is arranged on a base plate and surrounded by a mold housing.
  • thermo-mechanical stresses can occur inside the controller.
  • an electrical control unit is presented.
  • the control unit has a circuit carrier having a first surface and a second surface opposite the first surface
  • the circuit carrier is in a mold housing of a
  • both the first surface and the second surface are in direct thermal contact with the molding compound.
  • the idea of the present invention is based on surrounding the circuit carrier with the electrical components thereon with molding compound from all sides, so that the molding compound is distributed as symmetrically as possible on the first and second surfaces.
  • the arrangement of the molding compound directly on both sides of the circuit substrate can be dispensed with further large-scale components and thus on further Materialein.
  • a base plate used in the prior art can be omitted. This can reduce the number of components required. Further, in this way
  • thermo-mechanical stresses inside the electrical control unit A power loss of the electrical components can be due to the thermal contact of the molding compound to both surfaces of the
  • Heat conduction or heat radiation will be. This can contribute to more effective cooling of the controller.
  • the electrical control unit can be used for example in motor vehicles for the regulation of vehicle-specific processes.
  • the electrical control unit can be designed as a transmission control unit for motor vehicles.
  • the circuit carrier also referred to as a printed circuit substrate, can as
  • the circuit carrier may include alumina Al 2 O 3 , high temperature cofired ceramic (HTCC), low temperature cofired ceramic (HTCC), or a conventional printed circuit board (PCB).
  • HTCC high temperature cofired ceramic
  • HTCC low temperature cofired ceramic
  • PCB printed circuit board
  • the circuit carrier may be in the form of a plate with a first side or
  • first surface Surface and a second side or surface to be executed.
  • first surface one and preferably a plurality of electrical components is arranged.
  • electrical components also referred to as circuit elements, may be arranged on the second surface.
  • Circuit elements may e.g. be executed as "Central Processing Unit” (CPU), input and output circuits.
  • CPU Central Processing Unit
  • the mold housing consists of a molding compound, e.g. is made of resin-based plastic or thermosetting plastic.
  • the specific thermal conductivity of the molding compound may be greater than 1 watt / Kelvin and meters (W / Km).
  • the mold housing can enclose the complete circuit carrier with all electrical components.
  • the molding compound is located directly on all surfaces of the circuit substrate and on the
  • Control unit further comprises a support element which is executed the
  • circuit carrier through the mold housing with a support plate mechanically or to fix the circuit carrier during the molding process with respect to the support plate.
  • the carrier plate has the task of holding the circuit carrier in its geometric target position.
  • the support element may be designed as a contact frame with at least three bearing surfaces.
  • the contact frame also referred to as Maisticiansang or lead frame, is provided with a recess in the middle through which the circuit carrier is in contact with the molding compound from both sides.
  • the contact frame may comprise a conductive material.
  • the bearing surfaces may be, for example, the edges of the frame.
  • Circuit carrier so that the circuit carrier on the edges of
  • Support surfaces should be provided in the plane of the frame in the
  • At least three contact pins of the contact frame are designed as bearing surfaces. That the
  • Contact pins extend into the recess up to the circuit carrier and in particular up to the electrical components. In this way, the electrical components are contacted directly electrically and the bonding wires are at least partially dispensable.
  • the contact pins offer both an electrical contact and a support surface.
  • Support element as a spacer block, also referred to as equipped block executed.
  • the spacer block is arranged on the carrier plate and replaces the contact frame.
  • the circuit carrier can rest on at least three of the distance blocks.
  • the spacer blocks have an electrically conductive material and / or are coated with an electrically conductive material. In this way, the electrical components are contacted directly electrically and both the contact frame with the contact pins and the bonding wires are unnecessary.
  • the spacer blocks can be used both as a mechanical connection and as an electrical contact to the
  • Circuit carrier on a plane of symmetry The molding compound is distributed symmetrically with respect to a plane of symmetry of the circuit carrier to the first and second surfaces. In the plane of symmetry lies the largest extent of the circuit carrier. In an embodiment of the circuit carrier as a plate, the plane of symmetry runs, for example, parallel to the first and to the second surface of the circuit carrier.
  • the plane of symmetry is in particular a thermo-mechanical
  • Circuit board that also the extension of the circuit board disposed electrical components is taken into account.
  • the circuit carrier is arranged approximately in the thermo-mechanical axis of symmetry of the mold housing.
  • volume of molding compound above the circuit substrate is in thermal contact with the first surface and substantially corresponds to a second volume below the circuit substrate, with the second
  • Thermo-mechanical stresses due to different temperature-dependent coefficients of thermal expansion of the molding compound and the material of the circuit substrate act in this way symmetrically and bend, for example. Cracking before.
  • the molding compound covers the electrical component by a maximum of 0.5 mm.
  • the material of the molding compound is chosen such that the coefficient of thermal expansion of the molding compound as possible the coefficient of thermal expansion of
  • Circuit carrier corresponds or as little as possible deviates from this.
  • the coefficient of thermal expansion also referred to as the temperature coefficient, may e.g. be chosen so that the thermal expansion coefficient of the
  • Mold compound including its tolerances is greater than the
  • Thermal expansion coefficient of the circuit carrier including its Tolerances. The difference is as small as possible.
  • the thermal expansion coefficient of LTCC may be 5.5 ⁇ 0.5 ppm / K.
  • the thermal expansion coefficient of the molding compound can be 7 ⁇ 1 ppm / K.
  • a method for producing an electrical control device described above comprises the following steps: providing a circuit carrier having a first surface and a second surface opposite the first surface; Arranging at least one electrical component on the first surface; Positioning the circuit carrier on a support element which connects the circuit carrier mechanically and preferably also electrically to a carrier plate; Potting the circuit substrate with molding compound, so that the first surface and the second surface are in direct thermal contact with the molding compound.
  • Fig. 1 shows a cross section through an electrical control unit
  • Fig. 2 shows a plan view of a cross section through a control device according to an embodiment of the invention
  • Fig. 3 shows a running as a contact frame support element
  • Fig. 4 shows a cross section through an electrical control device according to another embodiment of the invention
  • Fig. 5 shows the arrangement of the electrical control device on a support plate
  • Fig. 6 shows different contacting variants of the electrical components All figures are merely schematic representations of devices according to the invention or of their components according to embodiments of the invention. In particular, distances and size relationships are not shown to scale in the figures. In the various figures, corresponding elements are provided with the same reference numbers.
  • the electrical control unit 1 has a circuit carrier 3, which is surrounded by a mold housing 11.
  • the circuit carrier 3 has a first
  • electrical components 9 e.g. a CPU arranged on the first surface 5
  • the electrical components 9 can be connected to other electrical elements outside of the control unit.
  • the mold housing 11 consists of a molding compound 13, in which the
  • Circuit substrate 3 is cast with the electrical components 9 thereon.
  • the first and the second surface 5, 7 are in direct thermal contact with the molding compound 13.
  • the molding compound 13 surrounds the circuit carrier 3 from all sides and is distributed symmetrically about a thermomechanical plane of symmetry 27.
  • the number of components of the electrical control unit 1 is kept minimal, in particular because of a base plate below the
  • Circuit carrier 3 can be dispensed with. Furthermore, by the
  • thermomechanical voltages between the circuit substrate 3 and molding compound 13 is reduced. Thanks to the direct thermal contact of the molding compound 13, a power loss of the electrical components 9 can be effectively delivered to all surfaces 5, 7 of the circuit substrate 3 by means of heat conduction or thermal radiation. This is in Fig. 1 by
  • Control unit 1 generated heat by the molding compound 13 by heat conduction directly into a heat sink, also referred to as "heatsink.”
  • the heat sink may be, for example, a support plate 19 and a valve plate (not shown in Fig. 1) 1 is shown by the arrows pointing upwards, and another part of the heat can be obtained by convection of a fluid the surfaces of the mold housing 11 are discharged via thermal radiation to the environment. Furthermore, another part of the heat can pass through
  • Heat conduction to the surrounding fluid e.g. Air or gear oil to be delivered.
  • a heat dissipation or heat dissipation over the entire surface of the circuit substrate 3 and the molding compound 13 is possible.
  • a cross section through the electrical control device is taken along a plane perpendicular to the plane shown in Fig. 1, i. parallel to
  • Circuit carrier 3 through the mold housing 11 passes through with a support plate 19 connects.
  • the support element is designed in FIG. 2 as a contact frame 21.
  • the electrical contact 37 is designed in the form of contact pins 23 on the contact frame 21.
  • the support element 15 can be designed as a spacer block 25, as shown in FIG. 6C.
  • the circuit carrier 3 may e.g. by means of
  • the contact frame 21 in Fig. 2 has at the corners bearing surfaces 17 (only one of which is shown) which serve to fix the circuit substrate 3 during the molding process.
  • In the center of the contact frame 21 is a
  • Circuit board 3 comes into contact.
  • FIG. 3 shows an enlarged detail of the contact frame 21 with the contact pins 23 and the support surface 17.
  • the contact pins are connected to one another by means of a support frame 39, also referred to as a dam bar.
  • Support frame 39 may also serve to seal a tool during the molding process and is punched free after the molding process.
  • the contour of the resting on the support surface 17 circuit substrate 3 is shown in dashed lines.
  • the support surface 17 may alternatively be replaced by the fact that the contact pins 23 extend to the circuit substrate 3 and at the same time as direct electrical contact and serve as a support surface 17. This is shown for example in FIG. 4.
  • FIG. 4 further illustrates that the molding compound 13 completely surrounds the circuit carrier 3 with the electrical components 9. Further, the molding compound 13 is distributed so that the volume of molding compound 13 above and below the
  • Circuit substrate 3 and in particular above and below the thermo-mechanical plane of symmetry 27 is almost equal. As a result, any emerging thermo-mechanical stresses act symmetrically on the circuit substrate 3. In particular, the "highest" of the electrical components 9 is covered by molding compound 13 by a maximum of 0.5 mm.
  • Direct contacting can e.g. by gluing, in particular by means of a silver conductive adhesive or by soldering on the first surface 5 and / or on the second surface 7.
  • a gearbox control unit can be due to the direct thermal contact of the molding compound 13 on all sides or surfaces 5, 7 of the circuit substrate 3, both a heat radiation in the transmission (upper arrows in Fig. 4) and the heat conduction on a component side, e.g. on the side of a support plate 19 (lower arrow in Fig. 4) for cooling the electrical
  • Control unit 1 can be used.
  • the support element 15 connects the circuit carrier 3 mechanically and preferably also electrically to a printed circuit board 29, also as a printed
  • Circuit board designates.
  • the circuit board 29 is on a
  • Support plate 19 is arranged. Between the electrical control unit 1 and the support plate 19 may be a fluid film, such as an oil film, of about 200 ⁇ .
  • the fluid film is indicated by dots in FIG. 5.
  • Fig. 6 are different Designationierungssectionn of
  • Circuit carrier 3 and the electrical components 9 shown.
  • Support surfaces 17 thereby provide a mechanical and at the same time an electrical contacting of the circuit carrier 3 by the mold housing 11.
  • contact pins 23 of a contact frame 21 are Z-shaped. These are applied to the circuit carrier 3 e.g. soldered to the solder 33. Outside the electrical control unit 1, the contact pins 21 are soldered to a circuit board 29 at the solder 33.
  • Fig. 6B is a QFN principle (Quad Fiat No Leads- principle) of
  • the housing housing 11 is designed with a gradation 31.
  • the contact frame 21 is further bent under the mold housing 11 and directly to a circuit board 29 below the
  • Fig. 6C shows a BGA (Ball Grid Array) principle of direct contacting.
  • the mechanical and electrical contacting of the circuit substrate 3 is ensured here via spacer block 25.
  • the mold housing 11 can have a gradation 31, as in FIG. 6B.
  • the spacer blocks 25 can be soldered on one side to the printed circuit board 29.
  • an epoxy underfill for sealing and fixing the electrical control unit 1 may be provided on the printed circuit board 29 and the spacer block 25.
  • the spacer blocks 25 may be e.g. about lxlxl mm have dimensions.

Abstract

L'invention concerne un appareil de commande électrique (1). L'appareil de commande électrique (1) comporte un porte-circuit (3) qui présente une première surface (5) et une deuxième surface (7) opposée à la première surface (5). Au moins un composant électrique (9) est disposé sur la première surface (5) du support de circuit (3). Le porte-circuit (3) est logé dans un boîtier moulé (11) composé d'une matière moulable (13). La première surface (5) de même que la deuxième surface (7) sont en contact thermique direct avec la matière moulable (13).
PCT/EP2012/065285 2011-09-20 2012-08-03 Appareil de commande électrique à boîtier moulé WO2013041288A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280045912.XA CN103814440A (zh) 2011-09-20 2012-08-03 具有模制壳体的电控制器
KR1020147007230A KR20140063713A (ko) 2011-09-20 2012-08-03 몰딩된 하우징을 구비한 전기 제어 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011083002.2 2011-09-20
DE201110083002 DE102011083002A1 (de) 2011-09-20 2011-09-20 Elektrisches Steuergerät mit Moldgehäuse

Publications (1)

Publication Number Publication Date
WO2013041288A1 true WO2013041288A1 (fr) 2013-03-28

Family

ID=46679258

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/065285 WO2013041288A1 (fr) 2011-09-20 2012-08-03 Appareil de commande électrique à boîtier moulé

Country Status (4)

Country Link
KR (1) KR20140063713A (fr)
CN (1) CN103814440A (fr)
DE (1) DE102011083002A1 (fr)
WO (1) WO2013041288A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014209282A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014209283A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014226062A1 (de) 2014-12-16 2016-06-16 Zf Friedrichshafen Ag Positioniervorrichtung sowie Bauteil mit derselben

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014201032A1 (de) 2014-01-21 2015-07-23 Zf Friedrichshafen Ag Elektrisches Steuergerät, Getriebe mit einem elektrischen Steuergerät und Verfahren zur Herstellung eines elektrischen Steuergeräts
DE102021211642A1 (de) 2021-10-14 2023-04-20 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungshalbleiter, Mold-Modul und Verfahren

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
EP0350833A2 (fr) * 1988-07-11 1990-01-17 Fujitsu Limited Structure d'empaquetage de circuit intégré
US20070257377A1 (en) * 2006-05-04 2007-11-08 Da-Jung Chen Package structure
EP1396885B1 (fr) 2002-09-03 2008-06-18 Hitachi, Ltd. Module de commandes électronique en résine moulée pour véhicule automobile
US20090243082A1 (en) * 2008-03-26 2009-10-01 Zigmund Ramirez Camacho Integrated circuit package system with planar interconnect
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
EP0350833A2 (fr) * 1988-07-11 1990-01-17 Fujitsu Limited Structure d'empaquetage de circuit intégré
EP1396885B1 (fr) 2002-09-03 2008-06-18 Hitachi, Ltd. Module de commandes électronique en résine moulée pour véhicule automobile
US20070257377A1 (en) * 2006-05-04 2007-11-08 Da-Jung Chen Package structure
US20090243082A1 (en) * 2008-03-26 2009-10-01 Zigmund Ramirez Camacho Integrated circuit package system with planar interconnect
US20110205706A1 (en) * 2010-02-25 2011-08-25 Mitsubishi Electric Corporation Resin-sealed electronic control device and method of fabricating the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014209282A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014209283A1 (de) 2014-05-16 2015-11-19 Zf Friedrichshafen Ag Elektrische Schaltungsanordnung mit Positionierungshilfe für Kabellitzen
DE102014226062A1 (de) 2014-12-16 2016-06-16 Zf Friedrichshafen Ag Positioniervorrichtung sowie Bauteil mit derselben

Also Published As

Publication number Publication date
CN103814440A (zh) 2014-05-21
DE102011083002A1 (de) 2013-03-21
KR20140063713A (ko) 2014-05-27

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