CN103779471B - 发光器件 - Google Patents
发光器件 Download PDFInfo
- Publication number
- CN103779471B CN103779471B CN201310491634.7A CN201310491634A CN103779471B CN 103779471 B CN103779471 B CN 103779471B CN 201310491634 A CN201310491634 A CN 201310491634A CN 103779471 B CN103779471 B CN 103779471B
- Authority
- CN
- China
- Prior art keywords
- electrode
- light emitting
- semiconductor layer
- conductive semiconductor
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120115802A KR101979944B1 (ko) | 2012-10-18 | 2012-10-18 | 발광소자 |
| KR10-2012-0115802 | 2012-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103779471A CN103779471A (zh) | 2014-05-07 |
| CN103779471B true CN103779471B (zh) | 2017-03-01 |
Family
ID=49378167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310491634.7A Expired - Fee Related CN103779471B (zh) | 2012-10-18 | 2013-10-18 | 发光器件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9660160B2 (https=) |
| EP (1) | EP2722899B1 (https=) |
| JP (1) | JP2014086728A (https=) |
| KR (1) | KR101979944B1 (https=) |
| CN (1) | CN103779471B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576862B (zh) * | 2014-12-24 | 2017-08-25 | 江苏巨晶新材料科技有限公司 | 一种基于铜衬底的氮化物led垂直芯片及其制备方法 |
| KR102419272B1 (ko) * | 2017-12-19 | 2022-07-11 | 엘지디스플레이 주식회사 | 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치 |
| CN108281540B (zh) * | 2018-01-26 | 2020-05-22 | 扬州乾照光电有限公司 | 一种热电分流垂直结构led芯片及其制作方法 |
| US11658460B2 (en) * | 2018-03-26 | 2023-05-23 | Lawrence Livermore National Security, Llc | Engineered current-density profile diode laser |
| KR102097865B1 (ko) * | 2018-05-04 | 2020-05-27 | 고려대학교 산학협력단 | 발광소자 |
| EP3748701A4 (en) * | 2018-07-09 | 2022-03-02 | Seoul Viosys Co., Ltd | LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURE THEREOF |
| JPWO2020100293A1 (ja) * | 2018-11-16 | 2021-09-24 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
| WO2020100295A1 (ja) * | 2018-11-16 | 2020-05-22 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
| WO2020100292A1 (ja) * | 2018-11-16 | 2020-05-22 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
| WO2020115851A1 (ja) * | 2018-12-06 | 2020-06-11 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
| CN110265520A (zh) * | 2019-07-02 | 2019-09-20 | 华南理工大学 | 优化电流分布的嵌入式电极结构led芯片及其制备方法 |
| KR102174004B1 (ko) * | 2020-03-31 | 2020-11-04 | 고려대학교 산학협력단 | 발광소자 |
| CN113363365B (zh) * | 2021-08-09 | 2021-11-05 | 南昌凯捷半导体科技有限公司 | 一种多电流通道倒装AlGaInPmini-LED芯片及其制备方法 |
| CN116314508A (zh) * | 2023-05-22 | 2023-06-23 | 江西兆驰半导体有限公司 | 一种高光效led外延片及其制备方法、led芯片 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6201265B1 (en) * | 1997-03-25 | 2001-03-13 | Sharp Kabushiki Kaisha | Group III-V type nitride compound semiconductor device and method of manufacturing the same |
| CN102024890A (zh) * | 2009-09-10 | 2011-04-20 | 纳普拉有限公司 | 发光二极管、发光装置、照明装置、显示器及信号灯 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536346A (ja) * | 1991-07-31 | 1993-02-12 | Sony Corp | 金属製フイールドエミツタの作製方法 |
| JPH11246289A (ja) * | 1998-03-02 | 1999-09-14 | Tokuyama Corp | メタライズされた窒化アルミニウム基板の製造方法 |
| JP2001176967A (ja) * | 1999-12-21 | 2001-06-29 | Nec Corp | 半導体装置及びその製造方法 |
| TW439304B (en) * | 2000-01-05 | 2001-06-07 | Ind Tech Res Inst | GaN series III-V compound semiconductor devices |
| US6611002B2 (en) | 2001-02-23 | 2003-08-26 | Nitronex Corporation | Gallium nitride material devices and methods including backside vias |
| US7233028B2 (en) * | 2001-02-23 | 2007-06-19 | Nitronex Corporation | Gallium nitride material devices and methods of forming the same |
| US6560006B2 (en) * | 2001-04-30 | 2003-05-06 | Agilent Technologies, Inc. | Two-dimensional photonic crystal slab waveguide |
| TWI270222B (en) * | 2005-10-07 | 2007-01-01 | Formosa Epitaxy Inc | Light emitting diode chip |
| EP2005488B1 (en) * | 2005-12-16 | 2013-07-31 | Samsung Display Co., Ltd. | Optical device and method of fabricating the same |
| CN100446288C (zh) * | 2006-08-01 | 2008-12-24 | 金芃 | 通孔垂直结构的半导体芯片及其制造方法 |
| JP5324076B2 (ja) * | 2007-11-21 | 2013-10-23 | シャープ株式会社 | 窒化物半導体用ショットキー電極および窒化物半導体装置 |
| KR101145299B1 (ko) * | 2008-12-22 | 2012-05-14 | 한국과학기술원 | 질화물/텅스텐 나노복합분말의 제조방법 및 그 방법에 의해 제조된 질화물/텅스텐 나노복합분말 |
| KR101020910B1 (ko) * | 2008-12-24 | 2011-03-09 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| KR20110008550A (ko) * | 2009-07-20 | 2011-01-27 | 삼성전자주식회사 | 발광 소자 및 그 제조 방법 |
| JP2011029548A (ja) * | 2009-07-29 | 2011-02-10 | Mitsubishi Electric Corp | 電磁波透過性加飾部品 |
| US8198107B2 (en) * | 2009-10-07 | 2012-06-12 | Edison Opto Corporation | Method for manufacturing light emitting diode assembly |
| US20110198609A1 (en) * | 2010-02-12 | 2011-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-Emitting Devices with Through-Substrate Via Connections |
| US8604498B2 (en) * | 2010-03-26 | 2013-12-10 | Tsmc Solid State Lighting Ltd. | Single phosphor layer photonic device for generating white light or color lights |
| KR101028327B1 (ko) | 2010-04-15 | 2011-04-12 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법 및 발광소자 패키지 |
| US20120241718A1 (en) | 2011-03-21 | 2012-09-27 | Walsin Lihwa Corporation | High performance light emitting diode |
| US8344392B2 (en) * | 2011-05-12 | 2013-01-01 | Epistar Corporation | Light-emitting element and the manufacturing method thereof |
-
2012
- 2012-10-18 KR KR1020120115802A patent/KR101979944B1/ko not_active Expired - Fee Related
-
2013
- 2013-10-17 EP EP13189140.0A patent/EP2722899B1/en not_active Not-in-force
- 2013-10-17 US US14/056,211 patent/US9660160B2/en active Active
- 2013-10-18 JP JP2013217084A patent/JP2014086728A/ja active Pending
- 2013-10-18 CN CN201310491634.7A patent/CN103779471B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6201265B1 (en) * | 1997-03-25 | 2001-03-13 | Sharp Kabushiki Kaisha | Group III-V type nitride compound semiconductor device and method of manufacturing the same |
| CN102024890A (zh) * | 2009-09-10 | 2011-04-20 | 纳普拉有限公司 | 发光二极管、发光装置、照明装置、显示器及信号灯 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140110742A1 (en) | 2014-04-24 |
| EP2722899B1 (en) | 2018-07-25 |
| KR101979944B1 (ko) | 2019-05-17 |
| EP2722899A3 (en) | 2015-11-18 |
| CN103779471A (zh) | 2014-05-07 |
| EP2722899A2 (en) | 2014-04-23 |
| US9660160B2 (en) | 2017-05-23 |
| KR20140049689A (ko) | 2014-04-28 |
| JP2014086728A (ja) | 2014-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103779471B (zh) | 发光器件 | |
| CN103996776B (zh) | 发光器件和发光器件封装 | |
| CN102169935B (zh) | 发光器件 | |
| JP6199948B2 (ja) | 発光素子、発光素子パッケージ | |
| KR101154709B1 (ko) | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템 | |
| CN103078032A (zh) | 发光器件 | |
| KR102175345B1 (ko) | 발광소자 및 조명시스템 | |
| CN102130265B (zh) | 发光器件、制造发光器件的方法、以及发光器件封装 | |
| CN106165127A (zh) | 发光器件和具有该发光器件的照明系统 | |
| KR20150010146A (ko) | 발광소자 및 조명시스템 | |
| CN101840983A (zh) | 发光器件、发光器件封装及包括发光器件封装的照明系统 | |
| US10008633B2 (en) | Light-emitting diode and lighting system | |
| US10510925B2 (en) | Light-emitting device and lighting system comprising same | |
| KR102200000B1 (ko) | 발광소자 및 조명시스템 | |
| CN103187496A (zh) | 发光器件 | |
| KR102445539B1 (ko) | 발광소자 및 조명장치 | |
| KR102153125B1 (ko) | 발광소자 및 조명시스템 | |
| KR102181429B1 (ko) | 발광소자 및 조명시스템 | |
| KR101734544B1 (ko) | 발광소자 패키지 | |
| CN105845799B (zh) | 发光器件和发光器件封装 | |
| KR102109131B1 (ko) | 발광소자 및 조명시스템 | |
| KR102181398B1 (ko) | 발광소자 및 조명시스템 | |
| KR102163967B1 (ko) | 발광소자 및 조명시스템 | |
| KR101829798B1 (ko) | 발광소자 | |
| KR101871498B1 (ko) | 발광소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210820 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG INNOTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170301 |