CN103764323A - Surface-coated cutting tool - Google Patents

Surface-coated cutting tool Download PDF

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Publication number
CN103764323A
CN103764323A CN201280042290.5A CN201280042290A CN103764323A CN 103764323 A CN103764323 A CN 103764323A CN 201280042290 A CN201280042290 A CN 201280042290A CN 103764323 A CN103764323 A CN 103764323A
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layer
crystal grain
lower layer
upper layer
tool
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CN103764323B (en
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富田兴平
长田晃
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C23C16/029—Graded interfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/36—Carbonitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/403—Oxides of aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Provided is a surface-coated cutting tool whereby a hard coated layer exhibits excellent peeling resistance and chipping resistance during high-speed heavy-duty cutting and high-speed intermittent cutting. A surface-coated cutting tool formed by vapor deposition of a hard coated layer having a Ti compound layer as a lower layer and an a-Al2O3 layer as an upper layer; and wherein 30%-70% of the Al2O3 crystal particles immediately above the lower layer comprise (11-20)-orientated Al2O3 crystal particles, at least 45% of all the Al2O3 crystal particles in the upper layer comprise (0001)-oriented Al2O3 crystal particles, and, ideally, the uppermost surface layer of the lower layer comprises an oxygen-containing TiCN layer containing oxygen at 0.5-3 at.% across only a region of a depth of up to 500 nm, and the ratio between the number of oxygen-containing TiCN crystal particles in the uppermost surface layer of the lower layer and the number of Al2O3 crystal particles in the interface between the lower and upper layers is 0.01-0.5.

Description

Surface-coated cutting tool
Technical field
The present invention relates to a kind of surface-coated cutting tool (hereinafter referred to as coating tool) that demonstrates for a long time excellent wearability.In this coating tool, even if the high load capacity in high speed and high cutting depth or high feed speed etc. acts under the heavy cut condition of cutting edge, and at a high speed and interrupted impact load act on while carrying out the machining of various steel or cast iron etc. under the interrupted cut condition of cutting edge, hard coating layer is also brought into play excellent resistance to fissility and the resistance to cutter that collapses.
The application, according to advocating priority No. 2012-187859 in No. 2011-189003, patent application and on August 28th, 2012 of Japanese publication in the patent application of Japanese publication on August 31st, 2011, is applied at this by its content.
Background technology
In the past, known have a kind of conventionally the surperficial evaporation of the matrix (below these being referred to as to tool base) being formed by tungsten carbide (representing with WC below) base cemented carbide or titanium carbonitride (representing with TiCN below) based ceramic metal forms by below (a) and (b) coating tool of the hard coating layer of formation:
(a) lower layer is the one deck in carbide (representing with the TiC below) layer by Ti, nitride (representing with TiN below) layer, carbonitride (representing with TiCN below) layer, oxycarbide (representing with TiCO below) layer and carbon nitrogen oxide (representing with TiCNO below) layer or the two-layer above Ti compound layer forming;
(b) upper layer (is used Al below for have the alumina layer of α type crystalline texture under the state of chemical vapor deposition 2o 3layer represents).
But, although above-mentioned coating tool is in the past brought into play excellent wearability in the continuous cutting such as various steel or cast iron etc. or interrupted cut, but while being used in high speed heavy cut, high speed interrupted cut, easily there is peeling off of clad or collapse cutter, the problem shortening life tools in existence.
Therefore, for what suppress clad, peel off, collapse cutter, proposed the various coating tools that lower layer, upper layer are improved.
For example, as the correlation technique of improving lower layer, known have patent documentation 1 and a patent documentation 2.In the lower layer of the coating tool of recording in patent documentation 1, by reduce lower layer TiCN layer particle width and the surface of hard coating layer is made as to the raising that suitable surface roughness realizes resistance to impact, resistance to damaged property, wearability.And in the lower layer of the coating tool of recording in patent documentation 2, the TiCNO layer that formation thickness is at least 2 to 18 μ m is used as Ti compound layer.In this TiCNO layer, the face that X-ray diffraction peak is the strongest is (422) face or (311) face.And the oxygen amount in this TiCNO layer is 0.05 to 3.02 quality %.In the coating tool of recording in patent documentation 2, on the basis of said structure, by reducing TiCN crystal grain width, prevent the formation of coarse grains and the local protuberance on hard coating layer surface, and then seek to improve the intensity of TiCNO itself and the adhesiveness of lower layer and upper layer.
And as the correlation technique of improving upper layer, known have for example patent documentation 3 and a patent documentation 4.In the coating tool of recording in this patent documentation 3, by forming the Al of upper layer 2o 3the peak strength I(030 of layer (030) face during with X-ray diffraction) be greater than the peak strength I(104 of (104) face) Al 2o 3layer forms, thereby realizes the raising of wearability, resistance to damaged property.In the coating tool of recording in patent documentation 4, the Al of upper layer will be formed 2o 3layer is made as the double-layer structure consisting of lower layer and upper layer respectively.In addition, by field emission type SEM, measure the inclination angle that the normal of (0001) face becomes, for upper layer at 0 to 45 degree, while making inclination angle number of degrees distribution graph for lower layer in the scope of 45 to 90 degree, there is peak-peak in the inclination angle zoning of described upper layer within the scope of 0 to 15 degree, the total number of degrees in this zoning, inclination angle account for more than 50% ratio, on the other hand, there is peak-peak in the inclination angle zoning of described lower layer within the scope of 75 to 90 degree, the total number of degrees in this zoning, inclination angle account for more than 50% ratio, by being made as this double-layer structure, improve the resistance to cutter that collapses.
Patent documentation 1: Japanese Patent Publication 2007-260851 communique
Patent documentation 2: No. 3808648 description of Japan Patent
Patent documentation 3: No. 3291775 description of Japan Patent
Patent documentation 4: Japanese Patent Publication 2007-152491 communique
The high performance of topping machanism was day by day remarkable in recent years, and on the other hand, to the saving labourization of machining and energy-saving, even the requirement of cost degradation is very strong.Thereupon, the tendency that machining exists high speed more and high load capacity acts on cutting edge in the heavy cut of high cutting depth or high feed speed etc., interrupted cut etc.No problem while above-mentioned coating tool being in the past used in to continuous cutting under the usual conditions of steel or cast iron etc. or interrupted cut.But, while using above-mentioned coating tool in the past under high speed heavy cut, high speed interrupted cut condition, form the lower layer being formed by Ti compound layer of hard coating layer with by Al 2o 3the adhesion strength of the upper layer that layer forms is insufficient.Therefore, produce and to peel off, to collapse the Abnormal damages such as cutter between upper layer and lower layer, reach service life within a short period of time.
Summary of the invention
Therefore, the inventor etc. are from viewpoint described above, for improve the lower layer that formed by Ti compound layer with by Al 2o 3the adhesiveness of the upper layer that layer forms, prevents to peel off, collapse the Abnormal damages such as cutter thus, and the long lifetime in implementation tool life-span and conducting in-depth research.Its result obtains following opinion.
Coated, be formed with the lower layer that formed by Ti compound layer and by Al 2o 3in the coating tool of the upper layer that layer forms, by the Al directly over the most surface layer of control lower layer 2o 3the orientation of crystal grain, can reduce the density of the minute aperture at the interface that is formed at upper layer and lower layer, and can improve the adhesiveness of upper layer and lower layer.In addition, by controlling the Al of whole upper layer 2o 3the orientation of crystal grain, can maintain high temperature hardness and the elevated temperature strength of whole upper layer.By above-mentioned Al 2o 3the orientation of crystal grain is controlled, even if can obtain a kind of in being used in high load capacity/impact load and acting on the high speed heavy cut of cutting edge, high speed interrupted cut time, also can suppress to produce and peel off, collapse the Abnormal damages such as cutter between upper layer and lower layer, and in long-term use, bring into play the coating tool of excellent cutting ability.
The present invention completes according to above-mentioned opinion, and it has mode shown below.
(1) a kind of surface-coated cutting tool, it possesses the tool base consisting of tungsten carbide base carbide alloy or base titanium carbonitride, and evaporation is formed at the surperficial hard coating layer of described tool base, wherein, described hard coating layer has the surperficial lower layer that is formed at described tool base and is formed at the upper layer on described lower layer, (a) described lower layer consists of Ti compound layer, this Ti compound layer is by the carbide lamella of Ti, nitride layer, carbonitride layer, one deck in oxycarbide layer and carbon nitrogen oxide layer or two-layer above formation, and the average bed thickness of the total with 3 to 20 μ m, (b) described upper layer is by Al 2o 3layer forms, this Al 2o 3layer has the average bed thickness of 2 to 15 μ m, and under the state of chemical vapor deposition, there is α type crystalline texture, (c) preparation is with respect to the vertical instrument section abradant surface in described tool base surface, for the most surface layer of described lower layer and Al interface, described upper layer of described upper layer 2o 3crystal grain, use field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, during inclination angle that mensuration becomes with respect to the normal to a surface of described tool base as the normal of (11-20) face of the crystal plane of described crystal grain, described inclination angle is the Al of 0 to 10 degree 2o 3the shared area ratio of crystal grain is 30 to 70 area % of described measurement range area, (d) for the Al of whole upper layer 2o 3crystal grain, use field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, during inclination angle that mensuration becomes with respect to the normal to a surface of described tool base as the normal of (0001) face of the crystal plane of described crystal grain, this inclination angle is the Al of 0 to 10 degree 2o 3the shared area ratio of crystal grain is more than 45 area % of described measurement range area.
(2) surface-coated cutting tool of recording in above-mentioned (1), wherein, the most surface layer of described lower layer forms by having at least Ti carbonitride layer of bed thickness more than 500nm, only the interface from described Ti carbonitride layer and described upper layer along the depth areas till the bed thickness direction 500nm of described Ti carbonitride layer containing aerobic, the contained average oxygen content of described depth areas is 0.5 to 3 atom % of the total content of the contained Ti of described depth areas, C, N, O.
(3) surface-coated cutting tool of recording in above-mentioned (2), wherein, is forming the described Ti carbonitride layer of most surface layer of described lower layer and the interface of described upper layer, the Al directly over the most surface layer of described lower layer 2o 3number of die is 0.01 to 0.5 with respect to the ratio of the number of die of the described Ti carbonitride of the most surface layer of described lower layer.
In the coating tool of mode of the present invention (hereinafter referred to as coating tool of the present invention), in the lower layer most surface of hard coating layer, for example form containing oxygen TiCN layer, directly over interface, form (11-20) orientation Al of regulation area ratio 2o 3crystal grain, further forms (0001) orientation Al with regulation area ratio 2o 3the upper layer of crystal grain is as whole upper layer, controls thus the Al directly over the most surface layer of lower layer 2o 3the orientation of crystal grain and the Al of whole upper layer 2o 3the orientation of crystal grain.Further preferably, in coating tool of the present invention, lower layer possesses controlled number of die ratio with the interface of upper layer.Thus, can improve the lower layer of hard coating layer of coating tool and the adhesion strength between upper layer.Therefore, even at a high speed and high load capacity/impact load act on while carrying out the machining of various steel or cast iron etc. under the high speed heavy cut condition, high speed interrupted cut condition of cutting edge, coating tool of the present invention also demonstrates excellent elevated temperature strength and high temperature hardness, what also do not produce hard coating layer peels off, collapses cutter, in long-term use, is bringing into play cutting ability.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the section of the direction vertical with tool base surface in the surperficial coating tool of embodiments of the present invention.
Fig. 2 means tool base normal to a surface in the surperficial coating tool of embodiment of the present invention and Al as upper layer 2o 3the figure at the inclination angle that the normal of (11-20) face of the crystal plane of crystal grain becomes.
Fig. 3 is the schematic diagram at the interface of upper layer in the surperficial coating tool of embodiment of the present invention and lower layer.
Fig. 4 is tool base normal to a surface in the surperficial coating tool of embodiment of the present invention and Al as upper layer 2o 3the number of degrees distribution map at the inclination angle that the normal of (11-20) face of the crystal plane of crystal grain becomes.
Fig. 5 means the figure of chart of the area ratio measurement result of coating tool 10 of the present invention.
The specific embodiment
Embodiment to the coating tool of mode of the present invention describes.Especially, each layer of the hard coating layer 4 of the coating tool 1 of formation present embodiment is elaborated.
(a) Ti compound layer (lower layer):
As shown in Figure 1, Ti compound layer 3(for example, TiC layer, TiN layer, TiCN layer, TiCO layer and TiCNO layer) be as Al substantially 2o 3 layer 2 lower layer and existing, according to itself, possess excellent elevated temperature strength, to hard coating layer 4, give elevated temperature strength.In addition, Ti compound layer 3 all adheres to tool base 5, Al 2o 3any one in layer 2, has and maintains hard coating layer 4 with respect to the adhering effect of tool base 5.When the average bed thickness of total of this Ti compound layer 3 is less than 3 μ m, cannot give full play to above-mentioned effect.On the other hand, when the average bed thickness of total of this Ti compound layer 3 exceeds 20 μ m, especially in following high thermogenetic high speed heavy cut, high speed interrupted cut, easily cause thermoplastic distortion, it becomes the reason of eccentric wear.According to more than, the average bed thickness of the total of Ti compound layer 3 is decided to be in the scope of 3 to 20 μ m.
(b) the most surface layer of lower layer:
The most surface layer of the lower layer 3 in the present invention for example forms as follows.
That is, first, use common chemical evaporation plating device, evaporation forms one deck or the two-layer above various Ti compound layers that form (in addition, only evaporation forms TiCN layer) in TiC layer, TiN layer, TiCN layer, TiCO layer and TiCNO layer., equally use common chemical evaporation plating device thereafter,
Reacting gas forms (capacity %): 3 to 8% TiCl 4, 1.0 to 2.0% CH 3cN, 40 to 60% N 2, surplus H 2;
Reaction atmosphere temperature: 750 to 900 ℃;
Reaction atmosphere pressure: 6 to 10kPa
Condition under carry out chemical vapor deposition, for example form containing the TiCN(of aerobic hereinafter referred to as containing oxygen TiCN) layer is as the most surface layer of lower layer.
Now, during obtaining before finishing 5 minutes to 30 minutes of required evaporation time of regulation bed thickness, to become the mode of 1 to 5 capacity % with respect to overall reaction gas flow, add CO gas and carry out chemical vapor deposition, thus evaporation form the oxygen that only contains 0.5 to 3 atom % in the depth areas till bed thickness direction 500nm containing oxygen TiCN layer.
With regard to the most surface layer of the described lower layer 3 by forming containing oxygen TiCN layer, for example, in order to form preferred Al thereon 2o 3crystal grain (with reference to aftermentioned (d)), be preferably formed for bed thickness more than 500nm at least and further by forming containing oxygen TiCN layer as follows: at this containing in oxygen TiCN layer, only from this containing the oxygen that contain 0.5 to 3 atom % along the depth areas till should containing the bed thickness direction 500nm of oxygen TiCN layer the interface of oxygen TiCN layer and upper layer 2, and it is oxygen-free to exceed the depth areas of 500nm.
At this, by the average oxygen content at the depth areas place containing till the 500nm of oxygen TiCN layer be defined as be as above because, if in the region darker than 500nm of the depth direction along film containing aerobic, the tissue morphology of TiCN most surface becomes grain structure from columnar structure, and cannot make the Al directly over the most surface layer of lower layer 3 2o 3the orientation of crystal grain, (11-20) are orientated Al 2o 3crystal grain is (in addition, for (11-20) orientation Al 2o 3crystal grain is by aftermentioned) distribution become desirable orientation, distribution.
Just, when the average oxygen content till depth areas 500nm is less than 0.5 atom %, not only cannot expect the raising of upper layer 2 and the adhesive strength of lower layer TiCN, and cannot meet the Al directly over the most surface layer of lower layer 3 2o 3the orientation of crystal grain, (11-20) are orientated Al 2o 3the distribution of crystal grain.On the other hand, if the average oxygen content at this depth areas place exceeds 3 atom %, the upper layer Al directly over interface 2o 3in, (0001) orientation Al 2o 3crystal grain is (in addition, for (0001) orientation Al 2o 3crystal grain is by aftermentioned) shared area ratio is with respect to the Al of whole upper layer 2o 3the gross area will be less than 45 area %, the elevated temperature strength of upper layer 2 declines.
At this, average oxygen content refers to, by oxygen (O) the described TiCN layer of most surface layer from forming lower layer 3 and the interface of upper layer 2 along shared content in the total content of titanium (Ti), carbon (C), nitrogen (N) and the oxygen (O) of the depth areas till the bed thickness direction 500nm of this TiCN layer, use atom %(=O/(Ti+C+N+O) * 100) value of expression.
In addition, in the described patent documentation 2 of quoting as prior art, record a kind of surface-coated cutting tool that possesses following lower layer, in this lower layer, at least form TiCNO layer (thickness is 2 to 18 μ m) as Ti compound layer, and the oxygen amount of whole this TiCNO layer is made as to 0.05 to 3.02 quality %, but in the prior art, by reducing crystal grain width, prevent the coarse grains on hard coating layer surface, the formation of local protuberance, and seek to improve the intensity of TiCNO itself, adhesiveness with upper layer, but the orientation for upper layer, do not do any research.
Yet, in the present invention, at Al 2o 3in operation before nucleus generates,, in the mode of the oxygen that only makes from forming the TiCN layer of most surface layer of lower layer 3 and the interface of upper layer 2 to contain 0.5 to 3 atom % along the depth areas till the bed thickness direction 500nm of this TiCN layer, the state of oxidation of TiCN most surface is adjusted in advance.That is, at Al 2o 3in operation before karyogenesis, the jog of the crystal boundary on TiCN surface and crystal plane is carried out to relatively strong oxidation and generate α-Al 2o 3nucleus.So, at Al 2o 3in operation before nucleus generates, the state of oxidation by changing TiCN most surface, to form under the state making nucleus distribution, now, can be controlled crystalline orientation and the Al of TiCN 2o 3the orientation relationship of nucleus, and can on the crystal boundary on TiCN surface and the jog of crystal plane, generate (11-20) orientation Al 2o 3crystal grain.
In the lower layer (TiCNO layer) of the thickness of 2 to the 18 μ m that record in described patent documentation 2, in bed thickness direction, exceed till the depth areas (depth areas more than at least 2 μ m) of 500nm containing aerobic, therefore on this first, the present invention is different from above-mentioned prior art in essence.
(c) in above-mentioned (b), form containing oxygen TiCN layer the most surface layer as lower layer 3, but as shown below, also can form the most surface layer of the lower layer of other modes.
That is, with the situation of above-mentioned (b) similarly, first, use common chemical evaporation plating device, after evaporation forms the one deck or the two-layer above various Ti compound layers that form in TiC layer, TiN layer, TiCN layer, TiCO layer and TiCNO layer, the surface of the lower layer 3 that this evaporation is formed,
Reacting gas forms (capacity %): 0.1 to 1% AlCl 3, surplus H 2;
Atmosphere temperature: 750 to 900 ℃;
Atmosphere pressures: 6 to 10kPa;
Time: 1 to 5min
Condition under carry out AlCl 3gas etch, thereafter,
Reacting gas forms (capacity %): 5 to 10% CO, 5 to 10% NO, surplus H 2;
Atmosphere temperature: 750 to 900 ℃;
Atmosphere pressures: 6 to 10kPa;
Time: 1 to 5min
Condition under carry out the oxidation processes of the mist based on CO and NO, make α-Al 2o 3the nucleus that nucleus generates required Al compound is evenly dispersed in Ti compound layer most surface, thus can be at Al 2o 3in operation before karyogenesis, make α-Al 2o 3nucleus is evenly dispersed in Ti compound layer most surface.
(d) Al directly over the most surface layer of lower layer 2o 3crystal grain:
α-the Al surperficial or film forming in above-mentioned (c) containing oxygen TiCN layer of the oxygen that contains 0.5 to 3 atom % of film forming in above-mentioned (b) 2o 3the surface of the homodisperse Ti compound layer of nucleus, for example, exist
Reacting gas forms (capacity %): 1 to 5% TiCl 4, 10 to 30% H 2, surplus Ar;
Atmosphere temperature: 750 to 900 ℃;
Atmosphere pressures: 6 to 10kP a
Condition under implement TiCl 4gas etch is processed.
Then, device inside is made as to Ar atmosphere, temperature is made as 750 to 900 ℃, pressure and is made as 6 to 10kPa, and to installing after interior atmosphere purges,
Reacting gas forms (capacity %): 1 to 3% AlCl 3, 10 to 30% CO 2, surplus H 2;
Reaction atmosphere temperature: 960 to 1040 ℃;
Reaction atmosphere pressure: 6 to 10kPa;
Time: 5 to 30min
Condition under evaporating Al 2o 3, can directly over the most surface layer of lower layer 3, form thus (11-20) orientation Al 2o 3crystal grain accounts for the Al of 30 to 70 area % of measurement range area 2o 3crystal grain.
Al as upper layer 2 2o 3the normal 10 of (11-20) face 7 of the crystal plane of crystal grain 6 with respect to the inclination angle 11(of 9 one-tenth of tool base normals to a surface with reference to figure 2), can measure in the following order.
First, the preparation instrument section abradant surface (with reference to figure 1) vertical with respect to the surperficial coating tool matrix of present embodiment.Secondly, to be formed at the Al of above-mentioned (d) at (directly over the interface of upper layer and lower layer) directly over the most surface layer of lower layer 3 2o 3crystal grain is determination object, uses field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, thereby obtain and described Al 2o 3the relevant data of orientation of crystal grain 6.And, take these data as basis, mensuration as the normal 10 of (11-20) face of the crystal plane of described crystal grain with respect to the inclination angle 11(of 9 one-tenth of described tool base normals to a surface with reference to figure 2), and measure the crystal grain that this inclination angle is 0 to 10 degree (hereinafter referred to as " (11-20) orientation Al 2o 3crystal grain ") area ratio.
About formation (11-20) the orientation Al obtaining by said sequence 2o 3the area ratio of crystal grain, it is subject to following impact: in above-mentioned evaporation condition especially at TiCl 4in gas etch, the ratio of Ar gas is made as higher than H 2the impact of gas; In addition, at the Al in reaction time 5 to 30min 2o 3under evaporation condition, with respect to AlCl 3gas flow, relatively CO is set on highland 2the impact of gas flow.If (11-20) orientation Al 2o 3crystal grain is less than 30 area % of measurement range area, upper layer Al 2o 3longitudinal columnar structure of crystal grain 6 forms with heeling condition with respect to bed thickness direction, is no longer fine longitudinal columnar grain, upper layer Al 2o 3decline with the adhesive strength of lower layer 3.On the other hand, if (11-20) orientation Al 2o 3the ratio that exists of crystal grain exceeds 70 area %, upper layer Al 2o 3(0001) orientation Al 2o 3the area ratio of crystal grain (aftermentioned) is with respect to the Al of whole upper layer 2o 3the gross area of crystal grain will be less than 45 area %, upper layer Al 2o 3elevated temperature strength decline.
The Al of the upper layer of therefore, locating directly over the interface for upper layer 2 and lower layer 3 2o 3crystal grain 6, by (11-20) orientation Al 2o 3the ratio that exists of crystal grain is decided to be 30 to 70 area %.
(e) Al of upper layer 2o 3crystal grain:
Directly over the most surface layer of lower layer 3, evaporation forms the Al of above-mentioned (d) 2o 3after crystal grain, form under the following conditions the Al of upper layer 2o 3crystal grain.
That is, to the Al forming in above-mentioned (d) 2o 3crystal grain (that is, (11-20) orientation Al 2o 3there is the Al of 30 to 70 area % in crystal grain 2o 3crystal grain) surface,
Reacting gas forms (capacity %): 1 to 5% AlCl 3, surplus Ar;
Temperature: 960 to 1040 ℃;
Atmosphere pressures: 6 to 10kPa;
Time: 1 to 5min
Condition under carry out etch processes after,
Reacting gas forms (capacity %): 1 to 5% AlCl 3, 5 to 15 CO 2%, 1 to 5% HCl, 0.5 to 1% H 2s, surplus H 2;
Reaction atmosphere temperature: 960 to 1040 ℃;
Reaction atmosphere pressure: 6 to 10kPa;
Time: (until becoming target upper layer bed thickness)
Condition under carry out evaporation, can form by Al thus 2o 3the upper layer that layer forms, this Al 2o 3layer is by the fine longitudinal column Al growing substantially in parallel with bed thickness direction 2o 3crystal grain forms, and (0001) orientation Al 2o 3the area ratio of crystal grain is with respect to the Al of whole upper layer 2o 3more than crystal grain accounts for 45 area %.
The Al of above-mentioned (e) 2o 3crystal grain is along being grown to serve as fine longitudinal column Al with the direction of bed thickness direction almost parallel 2o 3crystal grain.And, for the Al of whole upper layer 2o 3crystal grain forms (0001) orientation Al 2o 3crystal grain.In above-mentioned evaporation condition, especially under Ar gas atmosphere, use AlCl 3after gas carries out etch processes, under Ar atmosphere, specially reaction unit inside is not purged, therefore, (0001) orientation Al 2o 3the area ratio of crystal grain is adsorbed in Al 2o 3the AlCl on surface 3the impact of the adsorbance of gas.
At formed (0001) orientation Al 2o 3the area ratio of crystal grain accounts for 45 area % when above, can maintain upper layer Al 2o 3high temperature hardness, elevated temperature strength, so in the present invention, by (0001) orientation Al of upper layer 2o 3more than the area ratio of crystal grain is decided to be 45 area %.
Above-mentioned (0001) orientation Al 2o 3the area ratio of crystal grain can obtain in the following order.First, the preparation instrument section abradant surface vertical with respect to the surperficial coating tool matrix 5 of present embodiment.Secondly, with the Al of whole upper layer 2o 3crystal grain is determination object, uses field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, thereby obtain and described Al 2o 3the relevant data of orientation of crystal grain.And, take these data as basis, measure the inclination angle 11 with respect to 9 one-tenth of described tool base normals to a surface as the normal 10 of (0001) face of the crystal plane of described crystal grain, and obtain the crystal grain that this inclination angle is 0 to 10 degree ((0001) orientation Al 2o 3the mensuration mean value of area ratio crystal grain).
In addition, if the bed thickness of whole upper layer is less than 2 μ m, cannot in long-term use, bring into play excellent elevated temperature strength and high temperature hardness, on the other hand, if exceed 15 μ m, easily produce and collapse cutter, therefore the bed thickness of upper layer is decided to be to 2 to 15 μ m.
The number of die ratio at lower layer and the interface of upper layer:
In present embodiment, by the Al locating directly over the most surface layer of lower layer 3 2o 3number of die is with respect to ratio (that is, (Al of the interface of upper layer 2 and lower layer 3 of the Ti compound crystal grain number of the most surface layer (can be any one in above-mentioned (b) middle Ti compound layer that contains formation in oxygen TiCN layer, above-mentioned (c) forming) of lower layer 3 2o 3the quantity of crystal grain)/(quantity of Ti compound crystal grain)) fix in 0.01 to 0.5 scope.If this value is less than 0.01, Al 2o 3it is too small that the size of crystal grain becomes relatively, and cause the concavo-convex associativity variation with the crystal plane of the Ti compound crystal grain of interface, the Al of upper layer 2 2o 3decline with the adhesive strength of lower layer 3, and easily produce hole.On the other hand, if this value exceeds 0.5, Al 2o 3it is excessive that the size of crystal grain becomes relatively, at the Al that forms upper layer 2 2o 3shi Rongyi forms hole, so the Al of upper layer 2 2o 3hardness, intensity decline, and decline with the adhesive strength of the Ti compound of lower layer.
Therefore, in the present embodiment, the Al by upper layer 2 with the upper layer 2 of the interface of lower layer 3 2o 3number of die is with respect to the ratio ((Al of the Ti compound crystal grain number of the most surface layer of lower layer 3 2o 3the quantity of crystal grain)/(quantity of Ti compound crystal grain)) fix on 0.01 to 0.5 scope.
The Al of preferred interfaces vicinity 2o 3the size of crystal grain 6 is 10nm to 50nm.
The figure that represents the structure of lower layer 3 and upper layer 2 shown in Fig. 1, represents the figure of upper layer 2 and the ratio of the number of die of the interface of lower layer 3 shown in Fig. 3.
Secondly, by embodiment, coating tool of the present invention is carried out to more specific description.
Embodiment
As material powder, preparation all has WC powder, TiC powder, ZrC powder, VC powder, TaC powder, NbC powder, the Cr of the average grain diameter of 1 to 3 μ m 3c 2powder, TiN powder and Co powder.These material powders are fitted in to the mix proportion shown in table 1, further add paraffin and in acetone ball milling mix 24 hours, after drying under reduced pressure, under the pressure of 98MPa, punch forming is the pressed compact of regulation shape.By this pressed compact in the vacuum of 5Pa, set point of temperature within the scope of with 1370 to 1470 ℃ keeps carrying out vacuum-sintering under the condition of 1 hour, after sintering, cutting blade is implemented the cutting edge reconditioning processing of R:0.07mm, produced respectively thus the tool base A to F of the WC base cemented carbide system with the indexable insert tip, throw away tip shape of stipulating in ISOCNMG160608.
And as material powder, the TiCN(for preparing all to have the average grain diameter of 0.5 to 2 μ m is TiC/TiN=50/50 by quality ratio) powder, Mo 2c powder, ZrC powder, NbC powder, TaC powder, WC powder, Co powder and Ni powder.These material powders are fitted in to the mix proportion shown in table 2, with ball mill, carry out 24 hours wet mixed, after being dried, under the pressure of 98MPa, pressed compact is carried out to punch forming.By this pressed compact in the blanket of nitrogen of 1.3kPa, with temperature: 1540 ℃ keep carrying out sintering under the condition of 1 hour, after sintering, cutting edge is partly implemented to width: 0.1mm, angle: the chamfering cutting edge reconditioning of 20 degree is processed, form thus the tool base a to f of the TiCN based ceramic metal system of the blade shapes with iso standard CNMG160608.
Then, these tool base A to F and tool base a to f are respectively charged in common chemical evaporation plating device, and produce respectively in the following order coating tool 1 to 7 of the present invention and 8 to 13.
(a) first, the formation condition of the TiCN layer with longitudinal growth crystalline structure that the l-TiCN in table 3(table 3 records in representing Japanese Patent Publication 6-8010 communique, the formation condition that represents in addition common granular crystal tissue), under the condition shown in, evaporation forms the Ti compound layer with the target bed thickness shown in table 8,9.
(b1) then, under the conditions shown in Table 4, the Ti compound layer of the most surface of lower layer is carried out to AlCl 3the oxidation processes of gas etch and the mist based on CO and NO.
(c) then, under the conditions shown in Table 6, to having implemented the surface of Ti compound layer of the processing of above-mentioned (b1), carry out TiCl 4gas etch is processed, and thereafter, with Ar gas, to installing inside, purges.
(d) then,, under three stage conditions shown in table 7, with the target bed thickness shown in table 8, form the Al of upper layer 2o 3layer, produces respectively coating tool 1 to 7 of the present invention thus.
And, after evaporation forms the Ti compound layer of target bed thickness in above-mentioned (a), produce respectively in the following order coating tool 8 to 13 of the present invention.
(b2) under the conditions shown in Table 5, the target bed thickness shown in table 9 of usining form as the most surface layer of lower layer containing oxygen TiCN layer (that is, only the depth areas till 500nm the surface from this layer contains 0.5 to 3 atom %(O/(Ti+C+N+O) * 100) oxygen).
Then, under the conditions shown in Table 6, with above-mentioned (c) similarly, TiCl is carried out in the surface containing oxygen TiCN layer forming in above-mentioned (b2) 4gas etch is processed, and thereafter, with Ar gas, to installing inside, purges.
Then, under three stage conditions shown in table 7, with above-mentioned (d) similarly, with target bed thickness shown in table 9, form the Al of upper layer 2o 3layer, produces respectively coating tool 8 to 13 of the present invention thus.
And take is relatively object, do not carry out above-mentioned operation (b1), (c) of the invention described above coating tool 1 to 7, other carry out film forming under the condition identical with coating tool 1 to 7 of the present invention, produce thus the comparison coating tool 1 to 7 shown in table 10.
In addition, for relatively, in the condition of above-mentioned operation (b2) that departs from the invention described above coating tool 8 to 13 (in table 5, with the present invention, represent outward) under make coating tool contain oxygen, and, similarly departing from the lower TiCl of enforcement of the condition of (c) (in table 6, representing with the outer condition of the present invention) 4gas etch is processed, and similarly at the lower Al of formation of the condition (in table 7, representing outward with the present invention) that departs from (d) 2o 3layer, other carry out film forming under the condition identical with coating tool 8 to 13 of the present invention, produce thus the comparison coating tool 8 to 13 shown in table 11.
In order to obtain the oxygen content being on purpose added in this Ti carbonitride layer,
Reacting gas forms (capacity %): 3 to 8% TiCl 4, 1.0 to 2.0% CH 3cN, 40 to 60% N 2, surplus H 2;
Reaction atmosphere temperature: 750 to 900 ℃;
Reaction atmosphere pressure: 6 to 10kPa
Condition under, chemical vapor deposition is carried out on surface to the tool base consisting of tungsten carbide base carbide alloy or base titanium carbonitride of preparing separately, thereby is formed with the not oxygen containing TiCN(in destination hereinafter referred to as the inevitable oxygen TiCN of containing with bed thickness more than 3 μ m) layer.For from this unavoidably containing the surface of oxygen TiCN layer along the oxygen content inevitably containing the dark region of bed thickness direction ratio 100nm, use auger electron spectroscopic analysis instrument, ratio by the total content of the Ti contained with respect to described depth areas, C, N, O is obtained, and the oxygen content of can not keeping away of obtaining in the accuracy rating at auger electron spectroscopic analysis instrument is decided to be to 0.5 atom %.
Then, for above-mentioned coating tool of the present invention 8 to 13 and comparison coating tool 8 to 13, use auger electron spectroscopic analysis instrument, the distance range of the thickness that is equivalent to Ti carbide lamella from the most surface of lower layer Ti carbonitride layer of the section abradant surface of coating tool is irradiated to the electron ray of diameter 10nm, measure Ti, C, N, the intensity of the Auger peak value of O, by the summation of these peak strengths, calculated the ratio of the Auger peak strength of O, and then obtain deduct inevitable oxygen content value as the oxygen content that forms the TiCN layer of this most surface layer, thus to forming the TiCN layer of the most surface layer of lower layer, obtain along the average oxygen content (=O/(Ti+C+N+O) * 100 at the depth areas place till the bed thickness direction 500nm of this TiCN layer) and the average oxygen content (=O/(Ti+C+N+O) * 100 that exceeds the depth areas place of 500nm).These values are shown in table 9,11.
And, for above-mentioned coating tool of the present invention 1 to 13 and comparison coating tool 1 to 13, with field emission type electron microscope and EBSD image device, identify the Al of the interface of lower layer and upper layer 2o 3the TiCN crystal grain of the most surface layer of crystal grain and lower layer, in the interface of lower layer and upper layer, measures the Al of 50 μ m width of the direction parallel with tool base 2o 3number of die and TiCN number of die, obtain (the Al of the interface of upper layer and lower layer thus 2o 3the ratio of the quantity of crystal grain)/(quantity of Ti compound crystal grain).
At this, the Al of the most surface of the interface of lower layer and upper layer 2o 3the identification of the Ti compound crystal grain of the most surface of crystal grain and lower layer, more specifically carries out as follows.
At described Al 2o 3in the situation of crystal grain, use field emission type SEM and EBSD image device, to being present in each crystal grain with hexagoinal lattice of the upper layer alumina layer in the measurement range of section abradant surface, irradiate electron ray, measure as (0001) face of the crystal plane of described crystal grain and the inclination angle that (10-10) normal of face becomes with respect to tool base normal to a surface.And, by the mensuration inclination angle of its result gained, obtained respectively each other and (10-10) the normal angle intersected with each other of face of normal of (0001) face of the mutual interface of adjacent crystal grain, and then, by the normal of described (0001) face each other and (10-10) the normal angle intersected with each other of face be that more than 2 degree situation is defined as crystal grain and identifies.
The in the situation that of described Ti compound crystal grain, use field emission type SEM, to being present in each crystal grain on the top layer of Ti compound layer in the measurement range of section abradant surface, irradiate electron ray, measure the inclination angle that (001) face of crystal plane and the normal of (011) face as described crystal grain become with respect to tool base normal to a surface.And, by the mensuration inclination angle from its result gained, obtained respectively the mutual interface of adjacent crystal grain (001) face normal each other and the normal angle intersected with each other of (011) face, and then by the normal of above-mentioned (001) face each other and the normal of (011) face angle intersected with each other be that more than 2 degree situation is defined as crystal grain and identifies.
These values are shown in to table 8 to table 11.
In addition, for the Al directly over coating tool 1 to 13 of the present invention, the comparison lower layer of coating tool 1 to 13 and the interface of upper layer 2o 3the average-size of the minute aperture of crystal grain, quantity, used transmission electron microscope to observe and investigate with the section dark field of 50000 times.Average-size about the minute aperture with existing in the surperficial parallel air line distance 50 μ m width of tool base, minute aperture is drawn to the straight line parallel with tool base surface, calculate width between this straight line and the crosspoint in hole and become peaked crosspoint width as hole dimension, by described computing method, calculate the size in the hole existing in 50 μ m width, the average-size using these mean values as minute aperture.The quantity of minute aperture is calculated with the quantity that exists in 50 μ m width.
These values are shown in to table 8 to table 11.
Then, for the Al directly over the lower layer of hard coating layer and the interface of upper layer 2o 3, use field emission type SEM, measure in the following order (11-20) orientation Al 2o 3the area ratio of crystal grain.
First, by above-mentioned coating tool of the present invention 1 to 13, relatively coating tool 1 to 13 from the interface of lower layer and upper layer to the depth direction 0.3 μ m of upper layer and, along the measurement range (0.3 μ m * 50 μ m) of the section abradant surface of the direction 50 μ ms surperficial parallel with tool base, be set in the lens barrel of field emission type SEM.Secondly, use EBSD image device, to become the incident angle of 70 degree and the irradiation electric current of 1nA with described abradant surface, to being present in each crystal grain with hexagoinal lattice in the measurement range of described abradant surface, irradiate respectively the electron ray of the accelerating potential of 15kV, interval for the mensuration region of 0.3 * 50 μ m with 0.1 μ m/step, measures the inclination angle that the normal as (11-20) face of the crystal plane of described crystal grain becomes with respect to described tool base normal to a surface.According to this measurement result, ((11-20) is orientated Al to measure the crystal grain that described mensuration inclination angle is 0 to 10 degree 2o 3crystal grain) area ratio.
These values are shown in to table 8 to table 11.
The chart of the area ratio measurement result of coating tool 10 of the present invention shown in Fig. 4.
In addition, for coating tool 1 to 13 of the present invention, (0001) orientation Al of the whole upper layer of the hard coating layer of coating tool 1 to 13 relatively 2o 3the area ratio of crystal grain, is used field emission type SEM, with similarly above-mentioned, each crystal grain with hexagoinal lattice being present in the measurement range of this section abradant surface is irradiated to electron ray, the thus Al to whole upper layer 2o 3crystal grain, measures the inclination angle becoming with respect to the normal to a surface of described tool base as the normal of (0001) face of the crystal plane of described crystal grain, and measures the crystal grain that this inclination angle is 0 to 10 degree ((0001) orientation Al 2o 3crystal grain) area ratio.
In addition, in this said " whole upper layer ", refer to the measurement range till playing upper layer most surface from the interface of lower layer and upper layer, (11-20) orientation Al directly over interface 2o 3in the measurement range of crystal grain is also included within.These values are shown in to table 8 to table 11.
The chart of the area ratio measurement result of coating tool 10 of the present invention shown in Fig. 5.
And, use scanning electron microscope, thickness to each constituting layer of the hard coating layer of coating tool 1 to 13 of the present invention, comparison coating tool 1 to 13 is measured (vertical section mensuration), and result all demonstrates the average bed thickness substantially the same with target bed thickness (measuring the mean value of 5).
[table 1]
[table 2]
Figure BDA0000471048010000142
[table 3]
[table 4]
Figure BDA0000471048010000151
[table 5]
Figure BDA0000471048010000152
[table 6]
Figure BDA0000471048010000161
[table 7]
Figure BDA0000471048010000162
[table 8]
Figure BDA0000471048010000171
(note 1) number of die is than representing (A1 2o 3the value of number of die)/(Ti compound crystal grain number).
(note 2) fine holes distributes and represents hole dimension and every μ m 2hole there is quantity.
(note 3) is as shown in table 3, and the oxygen content of TiNO layer is 25 about atom %, and to compare nitrogen amount obviously many with TiCN layer, therefore distinguish dry table 8 containing oxygen TiCN layer.
[table 9]
Figure BDA0000471048010000181
(note 1) number of die is than representing (Al 2o 3the value of number of die)/(Ti chemical combination article grain number).
(note 2) fine holes distributes and represents hole dimension and every μ m 2hole there is quantity
(note 3) average oxygen content is that 0 atom % refers to and only testedly makes inevitable oxygen.
[table 10]
Figure BDA0000471048010000191
[table 11]
Figure BDA0000471048010000201
Secondly, for the various coating tools of above-mentioned coating tool of the present invention 1 to 13, comparison coating tool 1 to 13, under the state of leading section that is all fastened on instrument steel lathe tool with stationary fixture,
Workpiece: JISS45C is uniformly-spaced provided with 4 pods along its length;
Cutting speed: 350m/min.;
Cutting depth: 2mm;
Feed speed: 0.4mm/rev.;
Cutting time: 5 minutes
Condition (being called machining condition A) under carry out the dry type high speed interrupted cut test (common cutting speed is 300m/min.) of NI-CR-MO alloys steel,
The pole of workpiece: JISSNCM439;
Cutting speed: 370m/min.;
Cutting depth: 3.5mm;
Feed speed: 0.25mm/rev.;
Cutting time: 8 minutes
Condition (being called machining condition B) under carry out the dry type high speed heavy cut test (common cutting speed and cutting depth amount are respectively 250m/min., 2mm/rev.) of NI-CR-MO alloys steel, and
The pole of workpiece: JISFCD700;
Cutting speed: 320m/min.;
Cutting depth: 2.5mm;
Feed speed: 0.2mm/rev.;
Cutting time: 5 minutes
Condition (being called machining condition C) under carry out the high cutting depth cutting test of dry type high speed (common cutting speed and cutting depth amount are respectively 250m/min., 1.5mm) of spheroidal graphite cast-iron, in all cutting tests, all measure the wear of the tool flank width of cutting edge.
This measurement result is shown in Table 12.
[table 12]
Figure BDA0000471048010000221
(in table, ※ symbol represents that ※ ※ symbol represents due to collapsing the cutting time till cutter reaches service life of producing on hard coating layer because peeling off of producing on hard coating layer reaches the cutting time till service life)
Result shown in table 8,9,12 demonstrates following content.First, in coating tool 1 to 13 of the present invention, the Al directly over the interface of lower layer and upper layer 2o 3number of die is 0.01 to 0.5 with respect to the ratio containing oxygen TiCN crystal grain.And, (11-20) orientation Al 2o 3the Al of crystal grain directly over the interface of lower layer and upper layer 2o 3in crystal grain, shared area ratio is 30 to 70 area %.In addition, (0001) orientation Al 2o 3crystal grain is at the Al of whole upper layer 2o 3in crystal grain, shared area ratio is more than 45 area %.In coating tool 1 to 13 of the present invention, the minute aperture forming in upper layer there is negligible amounts, its size is less, therefore, even if following high heat to produce and high load capacity acts on while using under the high speed heavy cut condition of cutting edge or high speed interrupted cut condition that interrupted impact load acts on cutting edge, these hard coating layers also demonstrate excellent resistance to fissility and the resistance to cutter that collapses.
In addition, in coating tool 8 to 13 of the present invention, as the most surface layer of lower layer containing the oxygen TiCN layer oxygen that all only the depth areas till 500nm contains 0.5 to 3 atom %.
With respect to this, relatively clearly more known in coating tool 1 to 13, in the processing of high speed heavy cut, the processing of high speed interrupted cut, because hard coating layer produces to peel off and produce, collapse cutter and reach service life within a short period of time.
Utilizability in industry
As mentioned above, much less continuous cutting or the interrupted cut under the usual conditions of various steel or cast iron etc., even act on the high speed heavy cut of cutting edge, under the machining condition of this harshness of high speed interrupted cut at high load capacity, interrupted impact load, what coating tool of the present invention can not produce hard coating layer yet peels off, collapses cutter, in long-term use, bringing into play excellent cutting ability, therefore the high performance of corresponding topping machanism and the saving labourization of machining, energy-saving, cost degradation even fully contentedly.
Symbol description
1-coating tool, 2-upper layer (Al 2o 3layer), 3-lower layer (Ti compound layer), 4-hard coating layer, 5-tool base, 6-hexagonal crystal Al 2o 3crystal grain, 7-hexagonal crystal Al 2o 3(11-20) face of crystal grain, 8-tool base surface, 9-tool base normal to a surface, 10-hexagonal crystal Al 2o 3the normal of (11-20) face of crystal grain, the inclination angle that 11-(11-20) normal of face becomes with respect to tool base normal to a surface.

Claims (3)

1. a surface-coated cutting tool, possesses:
The tool base being formed by tungsten carbide base carbide alloy or base titanium carbonitride; And
Evaporation is formed at the surperficial hard coating layer of described tool base,
Described surface-coated cutting tool is characterised in that,
Described hard coating layer has the surperficial lower layer that is formed at described tool base and is formed at the upper layer on described lower layer,
(a) described lower layer consists of Ti compound layer, one deck in carbide lamella, nitride layer, carbonitride layer, oxycarbide layer and the carbon nitrogen oxide layer of Ti of this Ti compound layer or two-layerly form above, and the average bed thickness of the total with 3 to 20 μ m
(b) described upper layer is by Al 2o 3layer forms, this Al 2o 3layer has the average bed thickness of 2 to 15 μ m, and under the state of chemical vapor deposition, has α type crystalline texture,
(c) preparation is with respect to the vertical instrument section abradant surface in described tool base surface, for the most surface layer of described lower layer and the described Al interface of described upper layer, described upper layer 2o 3crystal grain, use field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, during inclination angle that mensuration becomes with respect to the normal to a surface of described tool base as the normal of (11-20) face of the crystal plane of described crystal grain, described inclination angle is the Al of 0 to 10 degree 2o 3the shared area ratio of crystal grain is 30 to 70 area % of described measurement range area,
(d) for the Al of whole upper layer 2o 3crystal grain, use field emission type SEM, each crystal grain with hexagoinal lattice being present in the measurement range of described instrument section abradant surface is irradiated to electron ray, during inclination angle that mensuration becomes with respect to the normal to a surface of described tool base as the normal of (0001) face of the crystal plane of described crystal grain, this inclination angle is the Al of 0 to 10 degree 2o 3the shared area ratio of crystal grain is more than 45 area % of described measurement range area.
2. surface-coated cutting tool according to claim 1, wherein,
The most surface layer of described lower layer forms by having at least Ti carbonitride layer of bed thickness more than 500nm,
Only the interface from described Ti carbonitride layer and described upper layer along the depth areas till the bed thickness direction 500nm of described Ti carbonitride layer containing aerobic,
The contained average oxygen content of described depth areas is 0.5 to 3 atom % of the total content of the contained Ti of described depth areas, C, N, O.
3. surface-coated cutting tool according to claim 2, wherein,
Forming the described Ti carbonitride layer of most surface layer of described lower layer and the interface of described upper layer, the Al directly over the most surface layer of described lower layer 2o 3number of die is 0.01 to 0.5 with respect to the ratio of the number of die of the described Ti carbonitride of the most surface layer of described lower layer.
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