CN103748976A - 具有唯一的电支承件的传感器 - Google Patents

具有唯一的电支承件的传感器 Download PDF

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CN103748976A
CN103748976A CN201280041181.1A CN201280041181A CN103748976A CN 103748976 A CN103748976 A CN 103748976A CN 201280041181 A CN201280041181 A CN 201280041181A CN 103748976 A CN103748976 A CN 103748976A
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housing
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sensor element
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T·菲舍尔
S·甘特奈尔
D·胡贝尔
J·席林格
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Continental Automotive Technologies GmbH
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Continental Teves AG and Co OHG
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Abstract

本发明涉及一种传感器，包括：至少一个传感器元件（1）；至少一个信号处理元件（2）；壳体（7），所述壳体具有至少一个固定件；以及用于传感器的电连接的电接口，其中，所述传感器具有电和机械连接的支承件（4），所述至少一个传感器元件（1）和信号处理元件（2）布置在该支承件上并与该支承件电连接，其中，所述支承件（4）也与所述电接口至少电连接。

Description

具有唯一的电支承件的传感器
技术领域
本发明涉及一种根据权利要求1的前序部分所述的传感器以及这种传感器在机动车中的应用。
背景技术
通常，微机械传感器元件或MEMS传感器元件和专用集成电路或者是ASIC——其首先设计为未封装的半导体器件——已经被作为所谓的“裸芯片”由生产商装配用以制成惯性传感器，该惯性传感器设计为可钎焊的构件，或设计为表面安装器件或者是所谓的“表面贴装器件（SurfaceMounted Device）”（SMD），该表面安装器件由壳体保护以防止环境影响并与外界接触。
这种SMD可直接钎焊在控制器（ECU、ACU）中的或卫星传感器的分离式壳体中的印刷电路板或者是“PCB”上。
发明内容
因此本发明的目的是，提出一种价廉的和/或紧凑的传感器。
根据本发明，该目的通过根据权利要求1所述的传感器实现。
该传感器优选具有一个唯一的支承件。
该支承件优选设计为引线框架。另选地，该支承件优选设计为印刷电路板或者是“PCB”。
电接口优选理解为插头以及另选地优选理解为电缆接头或电缆输出接口。
优选地，所述至少一个传感器元件和信号处理元件各自作为未封装的半导体器件布置在支承件上。未封装的半导体器件优选理解为功能结构由半导体材料制成的且没有自身的壳体的器件。未封装应理解为例如“硅封装”或封装在“晶片平面”上或者“裸芯片”。
优选地，所述传感器具有传递成型壳体，所述传递成型壳体完全地或至少部分地包围所述至少一个传感器元件、信号处理元件和支承件。特别地，在所述传递成型壳体内部，所述至少一个传感器元件和信号处理元件至少部分地由灌封材料或“球顶”覆盖。
优选地，所述传递成型壳体完全地或至少部分地由包覆成型壳体包围。
优选地，所述至少一个传感器元件设计为惯性传感器元件。
优选地，所述传感器设计为卫星传感器，特别设计为机动车传感器。
传递成型壳体优选理解为压注成型壳体或预成型壳体。
包覆成型壳体优选理解为注塑成型壳体或包覆成型壳体或由环氧树脂制成的壳体。
所述引线框架或者是导线框架优选具有至少一个装配平台（Bestückungsinsel），所述至少一个传感器元件和信号处理元件布置在该装配平台上。
所述至少一个传感器元件优选设计为微机械传感器元件，特别设计为微机械惯性传感器元件。
该传感器优选这样设计：包覆成型壳体具有两个部分：一个预制的壳体部分，支承件和与其相连的构件安装到该预制的壳体部分中；以及第二部分，所述预成型的壳体部分借助于包覆成型或包覆成型壳体与第二部分相连。这两个壳体部分特别优选地由注塑成型材料或包覆成型材料或环氧树脂制成。
该未封装的半导体器件优选借助于粘合剂固定或布置在支承件上。
适宜的是，该至少一个传感器元件以及信号处理元件和/或可选的其它电元件借助于接合或引线接合至少与该支承件和/或彼此之间电连接。
另外优选地，所述至少一个传感器元件以及信号处理元件和/或可选的其它电元件——特别是设计为“裸芯片”——的固定和电接触通过倒装技术来实现。此外特别优选在所述“裸芯片”的上方安装“焊料球”或钎焊球、“铜柱”或铜圆顶和/或钎焊板。之后将这种裸芯片、即未封装的半导体器件例如翻转地布置在引线框架或印刷电路板上或通过回流或热蒸汽进行钎焊。
该传感器优选具有一个或多个附加的电元件，例如至少一个电阻器和/或至少一个电容器和/或至少一个电感元件和/或至少一个另外的集成电路和/或至少一个变阻器。
传感器壳体、特别是外部壳体或包覆成型壳体优选具有一个、两个或更多个固定装置，所述固定装置特别设计为：该传感器能以螺纹连接方式固定。
所述电支承件优选与一个或多个压入针、即“压配合针”电接触。其中，实施该接触的区域被从包覆成型壳体或传递成型壳体分开。
另外优选地通过由可导电的和可钎焊的材料制成的钎焊销进行所述接触。这种销可具有任意横截面。典型的横截面为圆形或方形。其与PCB钎焊连接，即所谓的贯穿式安装（THT技术=通孔技术）。
优选的是，支承件借助于至少一个焊接针电接触，特别与电接口接触。
PCB在所述卫星传感器中的固定优选通过结构元件直接在壳体和盖子中进行（支撑柱、肋条、止动钩等）。可另选地对该PCB进行粘接或螺纹连接。
为了保护其免受环境影响，在将PCB安装到卫星传感器的壳体中之后，适宜地借助于灌封材料或借助于由金属或非金属材料制成的盖子将该壳体封闭。
此外，本发明还涉及这种传感器在机动车中的应用。
此外，本发明特别涉及一种价廉的和/或灵活的传感器制造方法。其中，首先将该电和机械连接的支承件与未封装的半导体器件以及可选的另外的电子器件进行装配。优选对该未封装的半导体器件和可选的另外的电子器件直接进行注塑包封（umspritzt），从而将其布置在传递成型壳体中。此外优选地，对该未封装的半导体器件和可选的另外的电子器件——在用传递成型壳体注塑包封之前——利用灌封材料或“球顶”进行覆盖，之后该灌封材料同样也被注入传递成型壳体中。
接着，由该部分成型的传感器借助于包覆成型注塑包封或包覆成型壳体和/或附加的预制的壳体选择性地产生/制造出可钎焊的构件或表面安装器件或者是所谓的“表面贴装器件（SMD）”形式的传感器或卫星传感器形式的传感器。
附图说明
在示意性的视图中：
图1和图2示出传感器的实施例，
图3和图4示出示例性的制造方法。
具体实施方式
图1在两个透视图中示出未加工的传感器（Roh-Sensor），该传感器具有作为支承件4的引线框架。该传感器包括两个粘接的传感器元件1和一个信号处理元件2，它们利用压接引线10电接触。传感器元件1以及信号处理元件2由传递成型壳体5包围或相应地注塑。引线框架4包括两个另外的注塑包封件作为传递成型壳体5。此外，引线框架与附加的电子器件8，例如“R”、“C”、“IC”二极管或至少一个变阻器进行装配。
图2举例示出了设计为表面安装器件或所谓的“表面贴装器件”（SMD）的传感器。该传感器具有布置在支承件4上的传感器元件1和信号处理元件2，该支承件例如设计为印刷电路板或“PCB”。印刷电路板4借助于压入针11电接触，其中接触区域与传感器的壳体、即包覆成型壳体7分开。在图2a)中，所述壳体在该接触区域中具有凹口/缺口，在图2b)中该接触区域布置在壳体7旁边。
根据图3说明了一种示例性的制造方法。替代两个传统的用于构造卫星传感器的封装步骤，仅还需要一个步骤——将“裸芯片”布置/装配在作为支承件的印刷电路板上，之后进行壳体的接触并形成壳体。在此省去了分离的SMD的构造，该SMD之后还必须额外地与支承件相连而且需要占据空间。
-对于PCB传感器和卫星传感器，裸芯片的构造技术和连接技术和倒装过程是相同的。在制造时可使用相同的前端设备。
-用于保护裸芯片的球顶和传递成型的制造过程是相同的。印刷电路板可完整地或部分地通过传递成型注塑包封。
在图4中示出的模块化的制造方法中优选可实现或包括两种主要方案/变型，例如示意性示出：
“板上”方案（SMD）：
对所述装配的引线框架与接触的裸芯片优选通过球顶或灌封材料或后续的传递成型或整体注塑包封工艺/后续注塑包封工艺，例如利用环氧树脂进行保护。形成了SMD，即表面安装器件，（表面贴装器件SurfaceMounted Device），该表面安装器件直接钎焊连接在控制器的PCB——印刷电路板或电子印刷电路板上。回流钎焊或热蒸气钎焊是适用的钎焊方法。
“卫星”方案（IS）：
优选通过球顶工艺或灌封和后续的传递成型或例如利用环氧树脂的整体/后续注塑包封工艺保护所述装配的引线框架与接触的裸芯片。
在此之前将接触针焊接在引线框架上，或者可另选地通过所谓的拼合或卷边安设电缆。
固定部分可放在模具中并共同进行注塑包封或后续安装，例如通过热镶嵌和/或超声波焊接。
之后可能有3个子方案：
a)利用壳体完全注塑包封所装配的引线框架。
b)利用打开的壳体部分地注塑包封所装配的引线框架并利用灌封和/或盖子封闭。该盖子可以由金属或非金属材料制成。
c)利用由塑料制成的保持器（所谓的载体）部分注塑包封所装配的引线框架并后续利用壳体进行完全的注塑包封。
所提出的方法和其方案或由此制造出的传感器例如具有下述优点：
-对于两个主方案来说，装配过程和接触以及对裸芯片的保护是相同的。
-替代传统的用于卫星（IS）的构造的两个封装步骤，仅还需要一个步骤（裸芯片→卫星产品）。省去了分离的SMD的构造。
-对于板上方案和卫星方案（SMD和IS）来说，裸芯片的构造技术和连接技术是相同的，也就是说相同的制造装置（前端设备）。
-用于保护裸芯片的球顶和传递成型制造过程是相同的。
-在引线框架上可附加地装配无保护的或有保护的（球顶和传递成型）无源元件，如根据图1示意性说明地。
-此外还可对该引线框架进行任意的模块化扩展，使其承载有附加线路连接，例如根据图1示意性说明地。该模块化扩展可以是额外的裸芯片（MEMS、ASIC）或其它构件（R、C、IC、二极管、变阻器、LED等）。
-可对所有模块进行保护或不进行保护（球顶+传递成型）。在相应的设计方案中，所有模块只需要一种模具（Mold-Werkzeug）保护。

Claims (10)

1.一种传感器，包括：至少一个传感器元件（1）；至少一个信号处理元件（2）；壳体（7），所述壳体具有至少一个固定件；以及用于传感器的电连接的电接口，其特征在于，所述传感器具有电和机械连接的支承件（4），所述至少一个传感器元件（1）和信号处理元件（2）布置在该支承件上并与该支承件电连接，其中，所述支承件（4）也与所述电接口至少电连接。
2.根据权利要求1所述的传感器，其特征在于，所述传感器具有一个唯一的支承件（4）。
3.根据权利要求1或2所述的传感器，其特征在于，所述支承件（4）设计为引线框架。
4.根据权利要求1或2所述的传感器，其特征在于，所述支承件（4）设计为印刷电路板。
5.根据权利要求1至4中至少一项所述的传感器，其特征在于，所述至少一个传感器元件（1）和信号处理元件（2）各自作为未封装的半导体器件布置在所述支承件（4）上。
6.根据权利要求1至5中至少一项所述的传感器，其特征在于，所述传感器具有传递成型壳体（5），所述传递成型壳体完全地或至少部分地包围所述至少一个传感器元件（1）、信号处理元件（2）和所述支承件（4）。
7.根据权利要求6所述的传感器，其特征在于，在所述传递成型壳体内部，所述至少一个传感器元件（1）和信号处理元件（2）至少部分地由灌封材料覆盖。
8.根据权利要求6或7所述的传感器，其特征在于，所述传递成型壳体（5）完全地或至少部分地由包覆成型壳体（7）包围。
9.根据权利要求1至8中至少一项所述的传感器，其特征在于，所述至少一个传感器元件（1）设计为惯性传感器元件。
10.根据权利要求1至9中至少一项所述的传感器，其特征在于，所述传感器设计为卫星传感器，特别设计为机动车传感器。
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